JPH10145064A - Highly radiative thermal conduction component - Google Patents
Highly radiative thermal conduction componentInfo
- Publication number
- JPH10145064A JPH10145064A JP29276096A JP29276096A JPH10145064A JP H10145064 A JPH10145064 A JP H10145064A JP 29276096 A JP29276096 A JP 29276096A JP 29276096 A JP29276096 A JP 29276096A JP H10145064 A JPH10145064 A JP H10145064A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- conductive sheet
- high heat
- heat transfer
- transfer component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、基板上に配置され
た発熱体と冷却部品との間に配置され、前記発熱体から
発生した熱を前記冷却部品に伝えるための高放熱性伝熱
部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating heat transfer component which is disposed between a heating element disposed on a substrate and a cooling component and transmits heat generated from the heating element to the cooling component. About.
【0002】[0002]
【従来の技術】近年、回路基板に実装される電子部品の
高密度集積化が進み、電子部品の発熱量が増大している
ことから、発熱体である電子部品を伝熱部品により冷却
部品に接触させて電子部品の性能を熱から保護すること
が行われている。また一般に、回路基板に電子部品が実
装された状態では電子部品の高さが異なる場合が多いの
で、電子部品の高さばらつきを吸収できる伝熱部品が要
求されている。2. Description of the Related Art In recent years, electronic components mounted on a circuit board have been integrated at a high density, and the amount of heat generated by the electronic components has been increasing. The performance of electronic components is protected from heat by making contact. In general, when electronic components are mounted on a circuit board, the electronic components often have different heights. Therefore, a heat transfer component capable of absorbing variations in height of the electronic components is required.
【0003】図6に、従来の、高さばらつき吸収可能な
伝熱部品の模式的断面図を示す。従来の伝熱部品は図6
に示すように、ピストン101をばね102により保持
するケーシング103からなる。ピストン101は一部
がケーシング103に開口された穴に収容されて、この
穴底に固定されたばね102により吊り下げ支持されて
いる。ピストン101の位置は、はんだ104で基板1
05上に実装されたLSIチップ106と対応してい
る。そして、伝熱部品のケーシング103は熱伝導グリ
ス107を介して、冷却水108が循環する冷却部品で
ある冷却プレート109と接続されている。FIG. 6 is a schematic sectional view of a conventional heat transfer component capable of absorbing height variations. Figure 6 shows a conventional heat transfer component.
As shown in FIG. 3, the casing 101 includes a casing 103 that holds a piston 101 by a spring 102. Part of the piston 101 is accommodated in a hole opened in the casing 103, and is suspended and supported by a spring 102 fixed to the bottom of the hole. The position of the piston 101 is determined by
05 corresponds to the LSI chip 106 mounted on the LSI chip. The casing 103 of the heat transfer component is connected via a heat conductive grease 107 to a cooling plate 109 which is a cooling component through which cooling water 108 circulates.
【0004】このような構成により、複数のLSIチッ
プ106からの発熱は、たとえLSIチップ106に高
さばらつきがあっても、各チップ106に押し付けられ
たピストン101を通り、さらにはピストン101から
僅かなギャップ110を通ってケーシング103、熱伝
導グリス107、冷却プレート109の順に伝えられ
る。With such a configuration, heat generated from the plurality of LSI chips 106 passes through the pistons 101 pressed against the respective chips 106 even if the LSI chips 106 vary in height. The heat is transmitted to the casing 103, the heat conductive grease 107, and the cooling plate 109 in this order through the gap 110.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、図6に
示した従来技術による伝熱部品では、発熱体に直接接触
したピストンと、冷却部品に接続されたケーシングとの
間にギャップが存在するため、熱抵抗が大きく冷却効率
が悪いという問題点がある。また、この問題点を改善す
るためにギャップにヘリウムガス等の冷媒を封入する方
法もあるが、封止手段が必要となるため高価になってし
まう。However, in the heat transfer component according to the prior art shown in FIG. 6, there is a gap between the piston in direct contact with the heating element and the casing connected to the cooling component. There is a problem that heat resistance is large and cooling efficiency is poor. In order to solve this problem, there is a method in which a coolant such as helium gas is filled in the gap. However, since a sealing means is required, it becomes expensive.
【0006】そこで本発明の目的(課題)は、上記従来
技術の問題点に鑑み、安価で高熱伝導性の伝熱部品を提
供することにある。SUMMARY OF THE INVENTION An object (object) of the present invention is to provide an inexpensive and high-thermal-conductivity heat transfer component in view of the above-mentioned problems of the prior art.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明の高放熱性伝熱部品は、基板に実装された高さ
の異なる複数の発熱体の位置に対応して貫通孔又はくぼ
みが形成された板状の冷却部品と、撓んだ状態で前記貫
通孔又はくぼみを覆うように前記冷却部品に密着固定さ
れた高熱伝導性シート状素材と、前記貫通孔又はくぼみ
に通され、前記冷却部品を用いて固定された弾性手段に
より吊り下げ支持されたピストンと、を備え、前記高熱
伝導性シート状素材を前記ピストンによって前記発熱体
に押し付けてなることを特徴とする。In order to achieve the above object, a high heat radiation heat transfer component according to the present invention comprises a through hole or a recess corresponding to the position of a plurality of heating elements having different heights mounted on a substrate. Formed plate-shaped cooling component, a high heat conductive sheet material tightly fixed to the cooling component so as to cover the through-hole or depression in a bent state, and passed through the through-hole or depression, And a piston suspended and supported by elastic means fixed using the cooling component, wherein the highly heat conductive sheet material is pressed against the heating element by the piston.
【0008】前記高熱伝導性シート状素材は複数枚重ね
られていることや、前記ピストンの位置で交わるように
して2方向以上に配設されていることが好ましい。[0008] It is preferable that a plurality of the high thermal conductive sheet materials are stacked, and that the materials are arranged in two or more directions so as to intersect at the position of the piston.
【0009】前記弾性手段はコイルばね又は板ばねであ
ることが好ましい。Preferably, the elastic means is a coil spring or a leaf spring.
【0010】(作用)上記のとおりの発明では、弾性手
段で吊り下げ支持されたピストンによって、板状の冷却
部品の面に撓んだ状態で密着固定された高熱伝導性シー
ト状素材を、基板上の発熱体に押し付けることにより、
基板上に実装された発熱体に高さばらつきがあっても、
弾性手段のストロークと高熱伝導性シート状素材の撓み
によって、高さの異なる発熱体の各々は常に高熱伝導性
シート状素材と密着された状態になる。このような密着
状態では、発熱体から発生した熱は高熱伝導性シート状
素材のみの伝熱経路を通じて冷却部品に伝えられる。そ
のため、熱伝導性の高い伝熱部品となる。(Function) In the invention as described above, the highly thermally conductive sheet material, which is tightly fixed to the surface of the plate-shaped cooling component in a bent state by the piston suspended and supported by the elastic means, is provided on the substrate. By pressing on the heating element above,
Even if the heating element mounted on the board has a height variation,
Due to the stroke of the elastic means and the bending of the high heat conductive sheet material, each of the heating elements having different heights is always in close contact with the high heat conductive sheet material. In such a close contact state, the heat generated from the heating element is transmitted to the cooling component through the heat transfer path of only the high heat conductive sheet material. Therefore, a heat transfer component having high heat conductivity is obtained.
【0011】[0011]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。Embodiments of the present invention will be described below with reference to the drawings.
【0012】図1は本発明の高放熱性伝熱部品の一実施
形態を模式的に表した断面図、図2は図1に示した伝熱
部品における放熱時の熱の流れを説明するための図であ
る。FIG. 1 is a cross-sectional view schematically showing one embodiment of the high heat radiation heat transfer component of the present invention, and FIG. 2 is a view for explaining the flow of heat during heat radiation in the heat transfer component shown in FIG. FIG.
【0013】本形態の高放熱性伝熱部品は図1に示すよ
うに、熱伝導性の良い金属板、例えば銅板板、アルミニ
ュウム合金板等よりなる冷却部品である放熱板1を有す
る。この放熱板1は従来技術のように内部に冷却水が循
環するものでも良い。As shown in FIG. 1, the heat-radiating heat transfer component of this embodiment has a heat-dissipating plate 1 which is a cooling component made of a metal plate having good heat conductivity, for example, a copper plate or an aluminum alloy plate. The heat radiating plate 1 may be one in which cooling water circulates as in the prior art.
【0014】放熱板1には、実装基板2に実装された高
さの異なる複数の発熱体3a,3bの位置に対応して貫
通孔又はくぼみが形成されている。放熱板1の実装基板
2側の面には、撓んだ状態の高熱伝導性シート状素材6
が前記貫通孔又はくぼみを覆うように押さえ板7又は接
着剤等により密着固定されている。この高熱伝導性シー
ト状素材6は、例えばカーボングラファイトや銅箔等が
挙げられる。放熱板1の貫通孔又はくぼみの各々にはピ
ストン4が通されて、放熱板1を用いて固定された弾性
手段であるばね5により吊り下げ支持されている。そし
て、吊り下げ支持されたピストン4の各々によって、放
熱板1の実装基板2側の面に撓んだ状態で密着固定され
た高熱伝導性シート状素材6が、実装基板2上の発熱体
3a,3bに押し付けられている。The radiator plate 1 has through holes or depressions corresponding to the positions of the plurality of heating elements 3a and 3b having different heights mounted on the mounting board 2. On the surface of the heat sink 1 on the side of the mounting board 2, a highly heat conductive sheet material 6 in a bent state is provided.
Is tightly fixed by a holding plate 7 or an adhesive so as to cover the through hole or the depression. Examples of the high heat conductive sheet material 6 include carbon graphite and copper foil. A piston 4 is passed through each of the through holes or depressions of the heat sink 1, and is suspended and supported by a spring 5 which is an elastic means fixed using the heat sink 1. Then, the high thermal conductive sheet material 6 tightly fixed in a bent state to the surface of the heat sink 1 on the mounting board 2 side by each of the suspended and supported pistons 4 forms the heating element 3 a on the mounting board 2. , 3b.
【0015】上記の構成では、実装基板2上の発熱体3
a,3bに高さばらつきがあっても、ばね5のストロー
クと高熱伝導性シート状素材6の撓みによって、発熱体
3a,3bは常に高熱伝導性シート状素材6と密着され
た状態になる。このような密着状態においては図2に示
すように、発熱体3a,3bから発生した熱は高熱伝導
性シート状素材6を通じて放熱板1に伝えられる。この
ように本形態は伝熱経路が高熱伝導性シート状素材6の
みであるので、熱抵抗が極めて小さく放熱効率が高い部
品となる。In the above configuration, the heating element 3 on the mounting board 2
Even if the heights a and 3b vary, the heating elements 3a and 3b are always kept in close contact with the high heat conductive sheet material 6 by the stroke of the spring 5 and the bending of the high heat conductive sheet material 6. In such a close contact state, as shown in FIG. 2, heat generated from the heating elements 3a and 3b is transmitted to the heat radiating plate 1 through the highly heat conductive sheet material 6. As described above, in the present embodiment, since the heat transfer path is only the high heat conductive sheet material 6, the heat resistance is extremely low and the heat radiation efficiency is high.
【0016】次に、上述の実施形態に基づく種々の変形
例について、図3乃至図5を参照して説明するが、これ
らの図においては図1及び図2に示したものと同一の構
成部品には同一符号を用いている。Next, various modifications based on the above-described embodiment will be described with reference to FIGS. 3 to 5. In these drawings, the same components as those shown in FIGS. Have the same reference numerals.
【0017】図3は本発明の高放熱性伝熱部品の一実施
形態に基づく第1変形例を模式的に表した断面図であ
る。この図に示すように、上述の実施形態の高放熱性伝
熱部品は、高熱伝導性シート状素材6を複数枚重ねる事
により、放熱性を向上させたものであっても良い。FIG. 3 is a sectional view schematically showing a first modified example based on one embodiment of the high heat radiation heat transfer component of the present invention. As shown in this figure, the high heat dissipation heat transfer component of the above-described embodiment may have improved heat dissipation by stacking a plurality of high heat conductivity sheet-like materials 6.
【0018】図4は本発明の高放熱性伝熱部品の一実施
形態に基づく第2変形例の特徴部を示す断面図である。
この図に示すように、上述の実施形態の高放熱性伝熱部
品は、高熱伝導性シート状素材6をピストン4の先端面
で交わるようにして2方向以上に引き出す事により、高
熱伝導性シート状素材6を放熱板1に接着する際の放熱
板1との接触面積を増やして放熱性を向上させたもので
あっても良い。FIG. 4 is a sectional view showing a characteristic portion of a second modified example based on one embodiment of the high heat radiation heat transfer component of the present invention.
As shown in this figure, the heat-radiating heat-transfer component of the above-described embodiment is configured such that the highly heat-conductive sheet material 6 is drawn out in two or more directions so as to intersect at the tip end surface of the piston 4 so that the high heat-conductive sheet The heat radiation may be improved by increasing the contact area with the heat radiating plate 1 when the shape material 6 is bonded to the heat radiating plate 1.
【0019】図5は本発明の高放熱性伝熱部品の一実施
形態に基づく第3変形例を模式的に表した断面図であ
る。この図に示すように、上述の実施形態の高放熱性伝
熱部品は、弾性手段であるコイル状のばね5を板ばね1
5に変更する事により、伝熱部品全体の高さを低くした
ものであっても良い。FIG. 5 is a sectional view schematically showing a third modified example based on one embodiment of the high heat radiation heat transfer component of the present invention. As shown in this drawing, the heat-radiating heat-transfer component of the above-described embodiment is configured such that the coil-shaped spring 5 serving as the elastic means is connected to the leaf spring 1.
By changing to 5, the height of the entire heat transfer component may be reduced.
【0020】[0020]
【発明の効果】以上説明したように本発明は、基板上の
発熱体に対応して貫通孔又はくぼみが形成された板状の
冷却部品と、撓んだ状態で前記貫通孔又はくぼみを覆う
ように前記冷却部品に密着固定された高熱伝導性シート
状素材と、前記貫通孔又はくぼみに通され、前記冷却部
品を用いて固定された弾性手段により吊り下げ支持され
たピストンと、を備え、前記高熱伝導性シート状素材を
前記ピストンによって前記発熱体に押し付けてなる高放
熱性伝熱部品を構成したことにより、発熱体に高さばら
つきがあっても各発熱体に常に高熱伝導性シート状素材
を密着させることができる。そして、発熱体から発生し
た熱の伝熱経路は高熱伝導性シート状素材を通って冷却
部品に伝わる経路となるため、熱伝導性の高い伝熱部品
となり、また、構造が簡単なので安価である。As described above, according to the present invention, a plate-shaped cooling component having a through hole or a depression formed corresponding to a heating element on a substrate, and covering the through hole or the depression in a bent state. Highly heat-conductive sheet-like material tightly fixed to the cooling component, and a piston that is passed through the through-hole or the recess and is suspended and supported by elastic means fixed using the cooling component, The high heat conductive sheet-shaped material is pressed against the heating element by the piston to constitute a high heat radiation heat transfer component, so that even if the heating element has a height variation, each heat generating element always has a high heat conductive sheet shape. The material can be adhered. The heat transfer path of the heat generated from the heating element is a path that is transmitted to the cooling component through the high heat conductive sheet material, so that the heat transfer component has high heat conductivity, and the structure is simple and inexpensive. .
【図1】本発明の高放熱性伝熱部品の一実施形態を模式
的に表した断面図である。FIG. 1 is a cross-sectional view schematically showing one embodiment of a high heat radiation heat transfer component of the present invention.
【図2】図1に示した伝熱部品における放熱時の熱の流
れを説明するための図である。FIG. 2 is a view for explaining the flow of heat during heat dissipation in the heat transfer component shown in FIG.
【図3】本発明の高放熱性伝熱部品の一実施形態に基づ
く第1変形例を模式的に表した断面図である。FIG. 3 is a cross-sectional view schematically showing a first modified example based on one embodiment of the high heat radiation heat transfer component of the present invention.
【図4】本発明の高放熱性伝熱部品の一実施形態に基づ
く第2変形例の特徴部を示す断面図である。FIG. 4 is a cross-sectional view showing a characteristic portion of a second modified example based on one embodiment of the high heat dissipation heat transfer component of the present invention.
【図5】本発明の高放熱性伝熱部品の一実施形態に基づ
く第3変形例を模式的に表した断面図である。FIG. 5 is a cross-sectional view schematically showing a third modified example based on one embodiment of the high heat radiation heat transfer component of the present invention.
【図6】従来の、高さばらつき吸収可能な伝熱部品を含
む冷却装置を示す模式的断面図である。FIG. 6 is a schematic cross-sectional view showing a conventional cooling device including a heat transfer component capable of absorbing height variations.
1 放熱板 2 実装基板 3、3a、3b 発熱体 4 ピストン 5 ばね 6 高熱伝導性シート状素材 7 押さえ板 15 板ばね REFERENCE SIGNS LIST 1 heat sink 2 mounting board 3, 3 a, 3 b heating element 4 piston 5 spring 6 high heat conductive sheet material 7 holding plate 15 leaf spring
───────────────────────────────────────────────────── フロントページの続き (72)発明者 菅井 勝士 東京都練馬区旭町1丁目32番1号 株式会 社アドバンテスト内 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Katsushi Sugai 1-32-1, Asahimachi, Nerima-ku, Tokyo Advantest Co., Ltd.
Claims (4)
熱体の位置に対応して貫通孔又はくぼみが形成された板
状の冷却部品と、 撓んだ状態で前記貫通孔又はくぼみを覆うように前記冷
却部品に密着固定された高熱伝導性シート状素材と、 前記貫通孔又はくぼみに通され、前記冷却部品を用いて
固定された弾性手段により吊り下げ支持されたピストン
と、を備え、 前記高熱伝導性シート状素材を前記ピストンによって前
記発熱体に押し付けてなる高放熱性伝熱部品。1. A plate-shaped cooling component having through holes or depressions formed corresponding to the positions of a plurality of heating elements having different heights mounted on a substrate, and the through holes or depressions being bent. A high heat conductive sheet-like material tightly fixed to the cooling component so as to cover, and a piston that is passed through the through hole or the recess and is suspended and supported by elastic means fixed using the cooling component. A highly heat-radiating heat transfer component formed by pressing the highly heat-conductive sheet material against the heating element by the piston.
ねられている請求項1に記載の高放熱性伝熱部品。2. The high heat radiation heat transfer component according to claim 1, wherein a plurality of the high heat conductive sheet materials are stacked.
トンの位置で交わるようにして2方向以上に配設されて
いる請求項1に記載の高放熱性伝熱部品。3. The high heat radiation heat transfer component according to claim 1, wherein the high heat conductive sheet material is disposed in two or more directions so as to intersect at the position of the piston.
ある請求項1に記載の高放熱性伝熱部品。4. The high heat radiation heat transfer component according to claim 1, wherein said elastic means is a coil spring or a leaf spring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29276096A JPH10145064A (en) | 1996-11-05 | 1996-11-05 | Highly radiative thermal conduction component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29276096A JPH10145064A (en) | 1996-11-05 | 1996-11-05 | Highly radiative thermal conduction component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10145064A true JPH10145064A (en) | 1998-05-29 |
Family
ID=17785986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29276096A Withdrawn JPH10145064A (en) | 1996-11-05 | 1996-11-05 | Highly radiative thermal conduction component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10145064A (en) |
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WO2005018291A3 (en) * | 2003-08-12 | 2005-10-13 | Delphi Tech Inc | Thermally enhanced electronic module with self-aligning heat sink |
JP2007165685A (en) * | 2005-12-15 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Electronic device |
JP2009026870A (en) * | 2007-07-18 | 2009-02-05 | Denso Corp | Electronic device and manufacturing method thereof |
JP2009071149A (en) * | 2007-09-14 | 2009-04-02 | Hitachi High-Technologies Corp | High-frequency power generating device |
WO2021150041A1 (en) * | 2020-01-21 | 2021-07-29 | 삼성전자 주식회사 | Electronic device having shielding structure and heat dissipation structure |
CN113573541A (en) * | 2020-04-28 | 2021-10-29 | 联想(新加坡)私人有限公司 | Heat transport device and electronic apparatus |
-
1996
- 1996-11-05 JP JP29276096A patent/JPH10145064A/en not_active Withdrawn
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005018291A3 (en) * | 2003-08-12 | 2005-10-13 | Delphi Tech Inc | Thermally enhanced electronic module with self-aligning heat sink |
US6999317B2 (en) * | 2003-08-12 | 2006-02-14 | Delphi Technologies, Inc. | Thermally enhanced electronic module with self-aligning heat sink |
JP2005197668A (en) * | 2003-12-11 | 2005-07-21 | Matsushita Electric Ind Co Ltd | Heat dissipating structural body of electronic apparatus |
JP2007165685A (en) * | 2005-12-15 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Electronic device |
JP2009026870A (en) * | 2007-07-18 | 2009-02-05 | Denso Corp | Electronic device and manufacturing method thereof |
JP2009071149A (en) * | 2007-09-14 | 2009-04-02 | Hitachi High-Technologies Corp | High-frequency power generating device |
WO2021150041A1 (en) * | 2020-01-21 | 2021-07-29 | 삼성전자 주식회사 | Electronic device having shielding structure and heat dissipation structure |
CN113573541A (en) * | 2020-04-28 | 2021-10-29 | 联想(新加坡)私人有限公司 | Heat transport device and electronic apparatus |
JP2021174913A (en) * | 2020-04-28 | 2021-11-01 | レノボ・シンガポール・プライベート・リミテッド | Heat transportation device and electronic device |
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