JPH09283540A - Chip pickup structure and chip pickup method for die bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the deterioration of the quality and simplify the maintenance and control. SOLUTION: This method is to pick up a semiconductor chip 52 adhered to a dicing sheet laid on a stage surface 2 and feeds it to a lead frame and comprises blowing air on the lower face of the dicing sheet 51 having the adhered chip 52 enough to bend the sheet 51 outwards until a part of the chip 52 peels off the sheet 51 and picking up the chip 52 being peeled by a pick up nozzle 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding in a semiconductor device manufacturing process, in which a semiconductor chip attached to a dicing sheet which is conveyed and arranged on a stage is picked up and supplied onto a lead frame. The present invention relates to a chip pickup structure and method in an apparatus.

[0002]

2. Description of the Related Art FIGS. 6 to 9 show an example of a die bonding apparatus. FIGS. 6 to 8 are longitudinal side views schematically showing the structure of the main part of the die bonding apparatus with different operating times, and FIG. FIG.

6 to 9, reference numeral 51 is a film-shaped vinyl dicing sheet, and a plurality of semiconductor chips 52 are provided on the dicing sheet 51.
Are adhered to each other and attached at regular intervals.

Reference numeral 61 denotes a cylindrical pickup stage, on which the dicing sheet 51 is sequentially fed. Further, the upper surface facing the dicing sheet 51 (hereinafter, this surface is referred to as "stage surface 62") is closed. On the stage surface 62, an opening 63 having a size corresponding to the chip 52 is provided in a portion of the dicing sheet 51 where the chip 52 passes, and outside the opening 63, a position corresponding to the dicing sheet 51 is provided. Four sheet suction holes 64 are provided. The inside of the stage 61 has a structure capable of vacuuming.

In addition, a push-up member 65 is arranged in the stage 61 so as to correspond to the opening 63. On the upper surface of the push-up member 65, four push-up pins 66 having sharpened tips are provided concentrically at substantially equal intervals. In addition, in general, the tip shape of the push-up pin 66 has a curved surface of 25 μm to 250 μm, and a superhard material or diamond is used as the material. Further, the push-up member 65 is movable in the vertical direction by means (not shown), and has a structure in which the push-up pin 66 can be pushed upward from the stage surface 62 through the opening 63 when moved upward. Has become.

On the other hand, outside the stage 61, above the stage surface 62, a pickup nozzle 67 (see FIG. 8) is arranged corresponding to the opening 63. The pickup nozzle 67 can be moved in the vertical direction (Z-axis direction) and the horizontal direction (X-Y axis direction) by means (not shown), and the chip 52 is vacuum-sucked and chucked at the center. Air vent holes 68 are formed.

Next, the operation of this pickup structure will be described. First, the dicing sheet 51 includes the push-up member 6
5 is lowered and the push-up pin 66 is retracted into the stage 61, the chip 52 is moved on the stage 61 for each pitch where the chips 52 are arranged. An arrow 70 in FIGS. 6 and 9 indicates a moving direction of the dicing sheet 51. After the movement, the chip 52 is placed on the opening 63 and the dicing sheet 51 also covers the sheet suction holes 64 (see FIGS. 6 and 9).
Further, the pickup nozzle 67 is also moved upward and is arranged at a position where it does not hinder the conveyance of the dicing sheet 51.

When the movement of the dicing sheet 51 for one pitch is completed, the inside of the stage 61 is evacuated, whereby the dicing sheet 5 is passed through the sheet suction holes 64.
1 is vacuum-adsorbed and held on the stage surface 62. Then, the push-up member 65 is moved upward. As this movement progresses, first the push-up pin 66 is moved to the dicing sheet
1. The dicing sheet 5 that is in contact with the lower surface of the chip 52 via 1 and then vacuum-held on the stage surface 62.
The push-up pin 1 pushes out 1 and the chip 52 is lifted to a predetermined position while peeling the chip 52 from the dicing sheet 51 (see FIG. 7).

Next, the pick-up nozzle 67 is lowered and the tip 52 is pushed up by the push-up pin 66.
To be vacuum-sucked (see FIG. 8). The chip 52 thus vacuum-adsorbed is conveyed to a lead frame (not shown) and supplied to a predetermined position such as a die pad.

[0010]

However, in the above-described conventional chip pickup method, the following (1)
There were problems as described in (3). (1) When the chip 52 is pushed up by the push-up pin 66, the back surface of the chip 52 may be scratched and damaged, which may cause chip cracking, which may lead to deterioration in quality. (2) If the thrust height of the push-up pin 66 and the descending amount of the pickup nozzle 67 are not sufficiently adjusted, the pickup nozzle 67 does not sufficiently suck the chip 52 or the pickup nozzle 67 causes the chip 52 to fall. There is a risk of scratching the corners of the surface of the chip, scratching the back surface of the chip 52 with the push-up pin 66, or damaging the push-up pin 66. (3) Management by damage and wear of the push-up pin 66 Or
Periodical replacement is required and maintenance is troublesome.

The present invention has been made in view of the above problems, and an object of the present invention is to prevent the deterioration of quality and simplify the maintenance and management of a chip pickup in a die bonding apparatus. It is to provide a structure and a method.

[0012]

In order to achieve the above-mentioned object, the present invention is characterized in that the following technical means are taken as its structure. That is, in a chip pickup structure in a die bonding apparatus that picks up a semiconductor chip attached to a dicing sheet arranged on a stage and supplies it onto a lead frame, it corresponds to a portion where the chip is attached. Air is blown onto the lower surface of the dicing sheet to cause a part of the dicing sheet to float above the stage and be curved outward, and an air blowing unit that separates a part of the chip from the dicing sheet with this curvature, and Pickup means for picking up the chip in the middle of peeling and supplying it onto the lead frame is provided.

In order to achieve the above object, the present invention is characterized by the following technical means.
That is, in a chip pick-up method in a die bonding apparatus that picks up a semiconductor chip attached to a dicing sheet arranged on a stage and supplies it to a lead frame, the dicing sheet to which the chip is attached is Air is blown to the lower surface to bend the dicing sheet to the outside to peel off a part of the chip from the dicing sheet,
The chip in the middle of peeling is picked up by a pick-up means.

According to this, air is blown to the lower surface of the dicing sheet to which the chip is attached to bend the dicing sheet outward, and a part of the chip is peeled off due to the bending of the dicing sheet. You can pick up the chips without using them.
Therefore, damage to the chip due to the push-up pin and the pickup nozzle can be eliminated. Further, it is not necessary to replace the push-up pin due to breakage or wear of the push-up pin, which is required in the conventional method, and periodical replacement.

[0015]

1 to 4 show a main structure of a die bonding apparatus according to an embodiment of the present invention.
FIGS. 1 to 3 are vertical side views schematically showing the structure of the main part of the structure with different operating times, and FIG. 4 is a top view of FIG. In addition,
In this embodiment, the same as the conventional device shown in FIGS. 6 to 9,
An example is shown in which a plurality of chips 52, which are adhered to a film-shaped vinyl dicing sheet 51 and are regularly attached at substantially equal intervals, are picked up one by one. Therefore, the dicing sheet and the chips have the same reference numerals as those shown in FIGS. 6 and 9.

In FIGS. 1 to 4, reference numeral 1 is a pickup stage, on which the dicing sheet 51 is sequentially moved. More specifically, the stage 1 is formed in a double cylinder shape having an inner cylindrical portion 1A and an outer cylindrical portion 1B that are concentrically arranged, and has an inner cylindrical portion 1A and an outer cylindrical portion 1B at the upper end. The space between them is closed by an upper lid (hereinafter, the upper surface of this upper lid is referred to as "stage surface 2"), and the inner cylindrical portion 1A has an open structure. Further, the inner cylindrical portion 1A constitutes an air blowing means, and is connected to an air compressor (not shown) capable of blowing high pressure air. On the contrary,
The outer cylindrical portion 1B is connected to an air bleeder (not shown) (hereinafter referred to as "stage side air bleeder"), and constitutes a sheet suction means on the stage surface 2 4
Two sheet suction holes 4 are provided, and the lower surface of the dicing sheet 51 can be vacuum-sucked onto the stage surface 2 through the suction holes 4.

On the other hand, outside the stage 1, above the stage surface 2, a pickup nozzle 7 (see FIG. 1) as a pickup means is arranged corresponding to the opened inner cylindrical portion 1A. . The pickup nozzle 7 can be moved in the vertical direction (Z-axis direction) and the horizontal direction (X-Y axis direction) by means (not shown), and the chip 52 is vacuum-sucked and chucked at the center. The air bleeding hole 8 communicating with the air bleeding device (hereinafter, referred to as "pickup side air bleeding device") is formed.

Next, the operation of this pickup structure will be described. First, while the driving of the air compressor leading to the inner cylindrical portion 1A and the stage side air venting device leading to the outer cylindrical portion 1B are stopped, the pickup nozzle 7
Is also moved upward and is arranged at a position where it does not hinder the movement of the dicing sheet 51.
Is moved on the stage 1 for each pitch at which is arranged. 2 and 4, the arrow 20 indicates the moving direction of the dicing sheet 51. After the movement, the chip 52 is placed on the open end of the inner cylindrical portion 1A, and the dicing sheet 51 also covers the sheet suction holes 4 (see FIGS. 2 and 4).

When the movement of the dicing sheet 51 for one pitch is completed, the stage side air bleeding device is driven to make the inside of the outer cylindrical portion 1B negative pressure, and the dicing sheet 51 is sucked onto the stage surface 2 through the sheet suction holes 4. Retained. 1 and 3, the arrow 9 indicates that the inside of the outer cylindrical portion 1B has a negative pressure so that the dicing sheet 5
The direction of the adsorption holding force acting on No. 1 is shown. A little later than this, high-pressure air is blown into the inner cylindrical portion 1A from the air compressor side, and the high-pressure air is blown to the lower surface of the dicing sheet 51. Then, the portion of the dicing sheet 51 corresponding to the inner cylindrical portion 1A floats from the stage surface 2 due to the pressure of air, and bends in a state of bulging outward (upward). Then, due to this bending, a part of the chip 52 is separated from the dicing sheet 51. FIG. 3 (and FIG. 1) thus shows the chip 5
2 shows a state in which a part of 2 is separated from the dicing sheet 51. 1 and 3, the arrow 1
0 indicates the direction in which the high-pressure air is blowing.

Then, the pick-up nozzle 7 is lowered and brought into contact with the dicing sheet 51 and the chip 52 which is lifted up from the stage surface 2, and this is sucked in vacuum by driving the pick-up side air bleeding device (see FIG. 1). The chip 52 thus vacuum-adsorbed is conveyed to a lead frame (not shown) and supplied to a predetermined position such as a die pad.

Therefore, according to the structure of this embodiment,
The dicing sheet 5 is prepared by floating the chip 52 from the stage surface 2 without using the push-up pin used in the conventional structure.
Since it can be peeled off from No. 1, damage to the chip 52 due to the push-up pin, which has been a problem in the past, can be eliminated. Thereby, the quality can be improved. Further, since the tip 52 is floated by the pressure of air, even if the lowered pick-up nozzle 7 hits relatively violently, this impact force can be absorbed by the air pressure, and the tip 52 may be damaged. Can be prevented. further,
Maintenance and management is also simplified because the push-up pin, which has been required in the conventional method, does not need to be replaced due to damage or wear, and regular replacement is required.

FIG. 5 is a vertical cross-sectional side view of the essential structure of a die bonding apparatus shown as a modification of the present invention. FIG.
In FIG. 1, the same reference numerals as those in FIGS. 1 to 4 indicate the same parts as those in FIGS. In the structure of the modified example shown in FIG. 5, a sheet suction hole is not provided in the upper lid (stage surface 2) that closes the space between the inner cylindrical portion 1A and the outer cylindrical portion 1B at the upper end of the stage 1. In addition, the structure is such that the stage side air bleeding device provided through the outer cylindrical portion 1B is also eliminated. Instead, inside the outer cylindrical portion 1B, the stage surface 2
A heater 11 is provided adjacent to, and the stage surface 2 is warmed by the heat generated by the heater 11, and the dicing sheet 51 arranged on the stage surface 2 is softened so as to be easily deformed.

In this structure, high-pressure air is blown into the inner cylindrical portion 1A from the air compressor side, and when this high-pressure air is blown to the lower surface of the dicing sheet 51, the portion of the dicing sheet 51 corresponding to this inner cylindrical portion 1A. Is lifted from the stage surface by the pressure of air and bends outward (upward). In this case, since the dicing sheet 51 is softened by the heat, only the portion to which the air is blown rises, and the periphery thereof hangs down. As a result, a part of the chip 52 corresponding to the inner cylindrical portion 1A is peeled off from the dicing sheet 51. FIG. 5 shows a state in which a part of the chip 52 is peeled off from the dicing sheet 51 in this way. Then, the operation thereafter is the same as that in the case of one embodiment. Therefore, in the case of this modification, it is possible to omit the structure in which the periphery of the portion of the dicing sheet 51 on which the air is blown is held by vacuum suction.

[0024]

As described above, according to the present invention,
Since the chip can be picked without using the push-up pin, damage to the chip due to the push-up pin and the pickup nozzle, which has been a problem in the past, can be eliminated, and the quality can be improved. Further, since it is not necessary to replace the push-up pin due to damage or wear of the push-up pin, which is required in the conventional method, and periodical replacement, it is possible to expect effects such as easy maintenance.

[Brief description of drawings]

FIG. 1 is a vertical side view showing an example of one embodiment of the present invention.

FIG. 2 is a vertical cross-sectional side view showing an example of one embodiment of the present invention with a different operating time from the case of FIG.

FIG. 3 is a vertical sectional side view showing an example of the embodiment of the present invention in which the operating time is changed from that in the case of FIGS.

FIG. 4 is a top view of FIG. 2;

FIG. 5 is a vertical sectional side view showing a modified example of the present invention.

FIG. 6 is a vertical sectional side view showing an example of a conventional device.

FIG. 7 is a vertical cross-sectional side view showing an example of a conventional device with a different operating time from the case of FIG.

FIG. 8 is a vertical cross-sectional side view showing an example of a conventional device with the operating time changed from that in the case of FIGS. 6 and 7.

FIG. 9 is a top view of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 stage 1A inner cylinder part (air blowing means) 1B outer cylinder part 2 stage surface 4 sheet suction hole (sheet suction means) 7 pickup nozzle (pickup means) 11
Heater 51 Dicing sheet 52 Chip

Claims (6)

[Claims] 1. A chip pickup structure in a die bonding apparatus in which a semiconductor chip attached to a dicing sheet arranged on a stage is picked up and supplied onto a lead frame, and a portion to which the chip is attached. Corresponding to the above, the air is blown onto the lower surface of the dicing sheet to cause a part of the dicing sheet to float above the stage and be curved outward, and an air blowing means for separating a part of the chip from the dicing sheet by this curvature. And a pickup means for picking up the chip in the middle of the peeling and supplying it onto the lead frame, a chip pickup structure in a die bonding apparatus. 2. A sheet adsorbing means for adsorbing and holding the outside of a portion of the dicing sheet, which is curved by the air blowing means, onto the stage.
A chip pick-up structure in the die bonding apparatus according to. 3. The chip pickup structure in the die bonding apparatus according to claim 1, further comprising means for heating the upper surface of the stage. 4. A chip pick-up method in a die bonding apparatus for picking up a semiconductor chip attached to a dicing sheet arranged on a stage and supplying it onto a lead frame, wherein the chip is attached. Air is blown to the lower surface of the dicing sheet to bend the dicing sheet outward so that a part of the chip is peeled from the dicing sheet, and the chip in the middle of peeling is picked up by a pickup means. Pick-up method in a die bonding apparatus. 5. The die bonding apparatus according to claim 4, wherein the outside of the curved portion of the dicing sheet is vacuum-sucked and held on the stage when the air is blown by the air blowing means. Chip pickup method. 6. The chip pickup method according to claim 4, wherein the upper surface of the stage is heated so that the dicing sheet is softened by heat generated from the stage.