JPH09281145A - Inspecting jig with anisotropic conductive material and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspecting jig improved in the alignment of a material to be inspected and the jig without remaining an inspecting mark on the electrode of the material in the inspection of wiring circuit board. SOLUTION: In a wiring circuit board, an inspecting terminal electrode is formed on one surface of an insulating board, a wiring circuit 13 is formed on the other surface, and the electrode is electrically connected to the circuit 13. In this case, an inspecting jig having anisotropic conductive material is formed by forming at least one or more loop-like wires 14 on the electrode of the circuit board 1, forming an insulating resin layer of the thickness of the height or more of the wires 14, and then removing the surface resin of the resin layer until the wires 14 are exposed, and using the ends of the exposed wire 14 as inspecting electrodes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting substrate, a semiconductor integrated circuit element mounting substrate, and a semiconductor device inspection jig.

[0002]

2. Description of the Related Art In recent years, the number of input / output terminal electrodes of semiconductor devices has increased in response to the demand for higher functionality and higher performance of electronic equipment, and the pitch thereof has become finer. Conventionally, electrical inspection of a printed circuit board typified by a semiconductor device mounting board,
The needle-shaped electrode was brought into contact with the electrode portion of the wiring board to ensure electrical continuity.

[0003]

In the conventional method for inspecting a wired circuit board, a high-definition, high-density represented by a board for a multi-chip module (a method for accommodating a plurality of integrated circuit elements in a semiconductor device) is used. It is difficult to deal with the printed circuit board of. Further, in the conventional inspection method, since the needle-shaped electrode is brought into contact with the substrate, there is a problem that an inspection mark remains on the substrate after the inspection. Moreover, it is very difficult to align the inspection object and the inspection jig.

[0004]

In order to solve the above problems in the present invention, first, in claim 1, a terminal electrode for inspection is provided on one surface of an insulating substrate and a wiring circuit is provided on the other surface. In the printed circuit board in which the terminal electrode is electrically connected to the wiring circuit, at least one loop-shaped wire is formed on the terminal electrode of the printed circuit board, and the loop-shaped wire is formed. After forming an insulating resin layer having a thickness equal to or higher than the height, the surface resin of the insulating resin layer is removed until the loop-shaped wire is exposed, and the tip of the exposed loop-shaped wire is used as an inspection electrode. And an inspection jig having an anisotropic conductive material.

Further, in claim 2, the following (a)
The method for manufacturing an inspection jig having an anisotropic conductive material according to claim 1, which comprises a series of steps (d) to (d). (A) A step of forming a metal film having good bonding properties on the terminal electrodes of the printed circuit board. (B) A step of forming at least one loop-shaped wire by wire bonding on the metal film formed on the terminal electrode. (C) A step of forming the insulating resin layer having a thickness equal to or higher than the height of the loop-shaped wire on the terminal electrode on which the loop-shaped wire is formed. (D) A step of removing the surface resin of the insulating resin layer until the loop wire is exposed.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. FIG. 1 shows a partial sectional view of an inspection jig of the present invention, FIGS. 2A to 2D show partial sectional views showing a manufacturing process of an embodiment of the inspection jig of the present invention, and FIG. ) ~ (C)
The perspective view which shows the manufacturing process of the Example of the inspection jig of this invention is shown in FIG.

A terminal electrode 10 for inspection is formed on one surface of a double-sided copper-clad laminate, and a wiring circuit 13 is formed on the other surface thereof.
The terminal electrode 10 and the wiring circuit 13 are electrically connected to each other through the through hole 12 to produce the wiring circuit board 1 (FIG. 2A).
reference).

Electroless nickel plating and gold plating are performed to form a metal film having good bonding properties on the terminal electrode 10 of the printed circuit board 1. First, a nickel film is formed on the terminal electrode 10 by using electroless nickel plating. The plating thickness is preferably about 1 μm. Next, the electroless gold plating solution (ELG
B511: made by Uemura Kogyo Co., Ltd.) for 10 minutes to form a gold plating film of 0.1 μm, and the terminal electrode 10
A metal film composed of a two-layer film of a nickel plating film and a gold plating film is formed on top.

A gold wire is bonded to the metal film on the terminal electrode 10 of the printed circuit board 1 using a wire bonding machine (UTC-50: manufactured by Shinkawa Co., Ltd.) to form a plurality of loop-shaped wires 14. Individually formed (see FIG. 2B and FIG. 3A).

After forming the loop-shaped wire 14, an insulating resin (provimer: manufactured by Ciba-Geigy Co., Ltd.) is coated on the printed circuit board by a curtain coater or the like,
Form the insulating resin layer 15 (FIG. 2C and FIG. 3B)
reference). The insulating resin layer 15 is set to a thickness such that the loop-shaped wire 14 is completely covered with the insulating resin.

After the insulating resin layer 15 is formed, the resin layer is ground by a grinder until the loop-shaped wire 14 is exposed to obtain an inspection jig having the tip portion 14a of the loop-shaped wire as an inspection electrode ( 2 (d) and 3 (c)).

In the inspection jig of the present invention, the anisotropic conductive material formed on the insulating resin layer of the terminal electrode is used to obtain contact with the electrode (for ball grid array) of the object to be inspected. High-definition, with no inspection marks left on the electrodes of the inspection object
It can be used for inspection of high-density wiring boards. Further, since a plurality of anisotropic conductive materials are used, even if a slight misalignment occurs, any one of the anisotropic conductive materials comes into contact with the electrode of the object to be inspected, so that the alignment accuracy is eased. It

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the accompanying drawings.

A glass epoxy insulating substrate 11 having a thickness of 1
Using a double-sided copper-clad laminate having a copper foil of 8 μm attached, the copper foils on both sides are patterned by a photolithography process to form a terminal electrode 10 on one surface and a wiring circuit 13 on the other surface. The wiring circuit board 1 in which the terminal electrodes 10 and the wiring circuit 13 are electrically connected through the through holes 12
Was produced (see FIG. 2A).

Electroless nickel plating and gold plating are performed in order to form a metal film having good bonding properties on the terminal electrodes 10 of the printed circuit board 1. First, the printed circuit board 1 is degreased with an alkaline degreasing liquid (A-screen: Okuno Chemical Industries Co., Ltd.) at 70 ° C. for 30 minutes and washed. Then, it was pickled with a 10% by volume hydrochloric acid solution for 30 seconds to obtain a palladium chloride solution (hydrochloric acid 5% by volume + palladium chloride 0.
Soak for 3 seconds in 3 g / l) and wash. Then 90
Electroless nickel plating solution (Nimden LP
X: 1 by soaking in Uemura Kogyo Co., Ltd. for 10 minutes
A μm thick nickel film was formed. Next, an electroless gold plating solution heated to 90 ° C. (ELGB511: Uemura Industry Co., Ltd.)
0.1 μm gold-plated film was formed by immersing the metal film into a metal film consisting of a two-layer film of a nickel-plated film and a gold-plated film on the terminal electrode 10.

A wire bonding machine (UTC-50: Shinkawa Co., Ltd.) is formed on the metal film on the terminal electrode 10 of the printed circuit board 1.
A gold wire by bonding to form a plurality of loop-shaped wires 14 (see FIGS. 2B and 3A).
reference).

After the loop-shaped wire 14 is formed, an insulating resin (Photonice: manufactured by Toray Industries, Inc.) is coated on the printed circuit board several times by a spin coater to completely cover the tip of the loop-shaped wire 14. Insulated resin layer 15
Was formed (see FIG. 2 (c) and FIG. 3 (b)).

After forming the insulating resin layer 15, the resin layer is polished by a grinder until the loop-shaped wire 14 is exposed to remove the insulating resin on the surface, and the tip portion 14a of the loop-shaped wire is used as an inspection electrode. Inspection jig was completed (Fig. 2
(D) and FIG.3 (c)).

[0019]

In the inspection jig of the present invention, the anisotropic conductive material formed on the insulating resin layer of the terminal electrode is used to obtain contact with the electrode (for ball grid array) of the object to be inspected. It was possible to inspect a high-definition and high-density wiring board without making an inspection mark on the electrode of the inspection object. Further, since a plurality of anisotropic conductive materials are used, even if a slight misalignment occurs, any one of the anisotropic conductive materials comes into contact with the electrode of the object to be inspected, so that the alignment accuracy is eased. It was

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing the manufacturing process of the embodiment of the present invention.

FIG. 3 is a perspective view showing a manufacturing process according to an embodiment of the present invention.

[Explanation of symbols]

 1 ... Wiring circuit board 11 ... Insulating board 12 ... Through hole 13 ... Wiring circuit 14 ... Loop wire 14a ... Loop wire tip 15 ... Insulating resin Layer 15a ... Insulating resin layer after surface resin removal

Claims (2)

[Claims] 1. A terminal electrode for inspection is formed on one surface of an insulating substrate, and a wiring circuit is formed on the other surface, and the terminal electrode is electrically connected to the wiring circuit through a through hole. In the wired circuit board, at least one loop-shaped wire is formed on the terminal electrode of the wired circuit board, and an insulating resin layer having a thickness equal to or greater than the height of the loop-shaped wire is formed and then the loop-shaped wire is formed. An inspection jig having an anisotropic conductive material, characterized in that the surface resin of the insulating resin layer is removed until the wire is exposed, and the tip of the exposed loop-shaped wire is used as an inspection electrode. 2. A method of manufacturing an inspection jig having an anisotropic conductive material according to claim 1, comprising the following series of steps (a) to (d). (A) A step of forming a metal film having good bonding properties on the terminal electrodes of the printed circuit board. (B) A step of forming at least one loop-shaped wire by wire bonding on the metal film formed on the terminal electrode. (C) A step of forming the insulating resin layer having a thickness equal to or higher than the height of the loop-shaped wire on the terminal electrode on which the loop-shaped wire is formed. (D) A step of removing the surface resin of the insulating resin layer until the loop wire is exposed.