JPH09278813A - Photopolymerization initiator, energy radiation-curable composition containing the same and cured product thereof - Google Patents
Photopolymerization initiator, energy radiation-curable composition containing the same and cured product thereofInfo
- Publication number
- JPH09278813A JPH09278813A JP11441896A JP11441896A JPH09278813A JP H09278813 A JPH09278813 A JP H09278813A JP 11441896 A JP11441896 A JP 11441896A JP 11441896 A JP11441896 A JP 11441896A JP H09278813 A JPH09278813 A JP H09278813A
- Authority
- JP
- Japan
- Prior art keywords
- group
- formula
- atom
- represented
- sulfonium salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003999 initiator Substances 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 title claims description 34
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims abstract description 15
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 9
- 125000005843 halogen group Chemical group 0.000 claims abstract description 8
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims abstract description 7
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 6
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 4
- 125000004093 cyano group Chemical group *C#N 0.000 claims abstract description 4
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims abstract description 3
- 229910052796 boron Inorganic materials 0.000 claims abstract 3
- 229910052785 arsenic Inorganic materials 0.000 claims abstract 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 125000004185 ester group Chemical group 0.000 claims description 4
- 125000001033 ether group Chemical group 0.000 claims description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 125000006307 alkoxy benzyl group Chemical group 0.000 claims description 2
- 125000005036 alkoxyphenyl group Chemical group 0.000 claims description 2
- 125000006177 alkyl benzyl group Chemical group 0.000 claims description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 claims description 2
- 125000002946 cyanobenzyl group Chemical group 0.000 claims description 2
- 125000004802 cyanophenyl group Chemical group 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000006502 nitrobenzyl group Chemical group 0.000 claims description 2
- 125000006501 nitrophenyl group Chemical group 0.000 claims description 2
- 125000004437 phosphorous atom Chemical group 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical group [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 125000006575 electron-withdrawing group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 abstract 3
- 150000002367 halogens Chemical class 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- -1 coatings Substances 0.000 description 39
- 239000003822 epoxy resin Substances 0.000 description 21
- 229920000647 polyepoxide Polymers 0.000 description 21
- 238000000576 coating method Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 238000004040 coloring Methods 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 125000002947 alkylene group Chemical group 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229960000834 vinyl ether Drugs 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000012954 diazonium Substances 0.000 description 4
- 238000000921 elemental analysis Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- YFPJFKYCVYXDJK-UHFFFAOYSA-N Diphenylphosphine oxide Chemical compound C=1C=CC=CC=1[P+](=O)C1=CC=CC=C1 YFPJFKYCVYXDJK-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010538 cationic polymerization reaction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 150000003462 sulfoxides Chemical class 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- LVEYOSJUKRVCCF-UHFFFAOYSA-N 1,3-bis(diphenylphosphino)propane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCCP(C=1C=CC=CC=1)C1=CC=CC=C1 LVEYOSJUKRVCCF-UHFFFAOYSA-N 0.000 description 2
- GVYKABJIEOOUOX-UHFFFAOYSA-N 1-fluoro-4-(4-fluorophenyl)sulfinylbenzene Chemical compound C1=CC(F)=CC=C1S(=O)C1=CC=C(F)C=C1 GVYKABJIEOOUOX-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- QYGNFNURXBPNIB-UHFFFAOYSA-N butylphosphonoylbenzene Chemical compound CCCCP(=O)C1=CC=CC=C1 QYGNFNURXBPNIB-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229940125904 compound 1 Drugs 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 1
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- UEIPWOFSKAZYJO-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-[2-(2-ethenoxyethoxy)ethoxy]ethane Chemical compound C=COCCOCCOCCOCCOC=C UEIPWOFSKAZYJO-UHFFFAOYSA-N 0.000 description 1
- OCSDGBACNGEIKD-UHFFFAOYSA-N 1-(diphenylphosphorylmethyl)-4-methylbenzene Chemical compound C1=CC(C)=CC=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 OCSDGBACNGEIKD-UHFFFAOYSA-N 0.000 description 1
- KJGYFISADIZFEL-UHFFFAOYSA-N 1-chloro-4-(4-chlorophenyl)sulfinylbenzene Chemical compound C1=CC(Cl)=CC=C1S(=O)C1=CC=C(Cl)C=C1 KJGYFISADIZFEL-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- LEDPSBGADKSDKI-UHFFFAOYSA-N 1-methoxy-4-(4-methoxyphenyl)sulfinylbenzene Chemical compound C1=CC(OC)=CC=C1S(=O)C1=CC=C(OC)C=C1 LEDPSBGADKSDKI-UHFFFAOYSA-N 0.000 description 1
- CQGBFMMLGHGFSA-UHFFFAOYSA-N 1-methoxy-4-phenylphosphonoylbenzene Chemical compound C1=CC(OC)=CC=C1P(=O)C1=CC=CC=C1 CQGBFMMLGHGFSA-UHFFFAOYSA-N 0.000 description 1
- MJWNJEJCQHNDNM-UHFFFAOYSA-N 1-methyl-4-(4-methylphenyl)sulfinylbenzene Chemical compound C1=CC(C)=CC=C1S(=O)C1=CC=C(C)C=C1 MJWNJEJCQHNDNM-UHFFFAOYSA-N 0.000 description 1
- QORAVNMWUNPXAO-UHFFFAOYSA-N 2,2',4,4'-tetrachlorobiphenyl Chemical group ClC1=CC(Cl)=CC=C1C1=CC=C(Cl)C=C1Cl QORAVNMWUNPXAO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BCJVBDBJSMFBRW-UHFFFAOYSA-N 4-diphenylphosphanylbutyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCCCP(C=1C=CC=CC=1)C1=CC=CC=C1 BCJVBDBJSMFBRW-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- QKZFGNRLABBFFA-UHFFFAOYSA-N C1(=CC=CC=C1)P(CC(N(CC(C)C)CC(C)C)=O)=O Chemical compound C1(=CC=CC=C1)P(CC(N(CC(C)C)CC(C)C)=O)=O QKZFGNRLABBFFA-UHFFFAOYSA-N 0.000 description 1
- JNVSHALFPVGANN-UHFFFAOYSA-N C1COCOC1.O=C1CCCCC1 Chemical compound C1COCOC1.O=C1CCCCC1 JNVSHALFPVGANN-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JJHHIJFTHRNPIK-UHFFFAOYSA-N Diphenyl sulfoxide Chemical compound C=1C=CC=CC=1S(=O)C1=CC=CC=C1 JJHHIJFTHRNPIK-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 229910013870 LiPF 6 Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- ZQFLNHZIQFSHEE-UHFFFAOYSA-N butyl-[2-[butyl(phenyl)phosphanyl]ethyl]-phenylphosphane Chemical compound C(CCC)P(CCP(C1=CC=CC=C1)CCCC)C1=CC=CC=C1 ZQFLNHZIQFSHEE-UHFFFAOYSA-N 0.000 description 1
- GVKSGPCACPWHLD-UHFFFAOYSA-N butyl-[4-[butyl(phenyl)phosphanyl]butyl]-phenylphosphane Chemical compound C=1C=CC=CC=1P(CCCC)CCCCP(CCCC)C1=CC=CC=C1 GVKSGPCACPWHLD-UHFFFAOYSA-N 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- RLOQFEGOGISNCB-UHFFFAOYSA-N cyclohexyl-[2-[cyclohexyl(phenyl)phosphanyl]ethyl]-phenylphosphane Chemical compound C1CCCCC1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1CCCCC1 RLOQFEGOGISNCB-UHFFFAOYSA-N 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- LLBVMZNNSOEOEQ-UHFFFAOYSA-N diphenyl(phenylsulfanyl)sulfanium Chemical compound C1(=CC=CC=C1)S[S+](C1=CC=CC=C1)C1=CC=CC=C1 LLBVMZNNSOEOEQ-UHFFFAOYSA-N 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940052303 ethers for general anesthesia Drugs 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000002070 germicidal effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000005537 sulfoxonium group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003553 thiiranes Chemical class 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、新規な特定の構造
を有するスルホニウム塩、それからなる光重合開始剤、
これを含有するエネルギー線の照射により硬化が可能な
エネルギー線硬化性組成物及びその硬化物に関する。The present invention relates to a novel sulfonium salt having a specific structure, a photopolymerization initiator comprising the same,
The present invention relates to an energy ray-curable composition containing the composition, which can be cured by irradiation with energy rays, and a cured product thereof.
【0002】[0002]
【従来の技術】光重合性組成物は印刷インキ、塗料、コ
ーティング、液状レジストインキ等の分野において、省
エネルギー、省スペース、無公害性等の要請から盛んに
研究され、実用化が検討されてきた。しかしこれらの研
究の大部分は二重結合のラジカル重合反応に基づくもの
であった。カチオン重合性物質、例えばエポキシ樹脂
は、物性的には優れた材料であるが光重合をさせること
は困難で、今までアクリル変性することにより二重結合
を導入した材料が主に使用されている。2. Description of the Related Art Photopolymerizable compositions have been actively studied in the fields of printing inks, paints, coatings, liquid resist inks, etc. from the demands of energy saving, space saving, and non-polluting properties, and their practical use has been studied. . However, most of these studies were based on radical polymerization reactions of double bonds. Cationic polymerizable substances, such as epoxy resins, are excellent materials in physical properties, but are difficult to photopolymerize. Until now, materials with double bonds introduced by acrylic modification have been mainly used. .
【0003】[0003]
【発明が解決しようとする課題】光によりエポキシ樹脂
を硬化されるのに、例えば米国特許第3794576号
には感光性芳香族ジアゾニウム塩を光重合開始剤として
使用し光照射により光重合開始剤を分解し、ルイス酸を
放出することによりエポキシ樹脂を重合する方法が提案
されている。しかしながら芳香族ジアゾニウム塩は光分
解によりルイス酸と同時に窒素ガスを放出し、そのため
にエポキシ樹脂の膜厚が15μ以上になると塗膜が発泡
し、厚塗りの用途には適しない。更に、又、エポキシ樹
脂との混合物は光が存在しない時でも、徐々に硬化が進
行する等、保存安定性に問題があり、一液性の組成物と
はいえない。上記のジアゾニウム塩系開始剤の欠点を克
服すべく、種々検討がなされ、厚塗り性及び保存安定性
の改良された技術として芳香族スルホニウム塩系や芳香
族ヨードニウム塩系開始剤及びそれらを含有する硬化性
樹脂組成物が特公昭52−14278号公報、特公昭5
2−14277号公報、特開昭54−53181号公
報、特公昭59−19581号公報等に開示されてい
る。しかしながら、これらの芳香族オニウム塩を含有す
る組成物はジアゾニウム塩に比較し硬化性が乏しいとい
う欠点を有し、又芳香族スルホニウム塩の場合は、硬化
物の臭気が問題となっていた。かかる欠点を克服するべ
く、特開昭56−55420号公報等に、特定の基を有
する芳香族スルホニウム塩が提案されている。しかし、
上記の欠点は、いくらか解消されるものの十分ではな
い。又、光重合組成物の使用される分野が拡大するにつ
れて、市場の要求に対応するために、新規な光重合開始
剤、それを含有する組成物の提供は重要である。In order to cure an epoxy resin by light, for example, US Pat. No. 3,794,576 discloses a method in which a photosensitive aromatic diazonium salt is used as a photopolymerization initiator and the photopolymerization initiator is irradiated with light. A method of polymerizing an epoxy resin by decomposing and releasing a Lewis acid has been proposed. However, aromatic diazonium salts release nitrogen gas at the same time as Lewis acid by photolysis, and when the film thickness of the epoxy resin becomes 15 μm or more, the coating film foams and is not suitable for thick coating applications. Furthermore, the mixture with the epoxy resin has a problem in storage stability such that curing gradually proceeds even when no light is present, and cannot be said to be a one-part composition. In order to overcome the drawbacks of the above diazonium salt-based initiator, various studies have been made, and aromatic sulfonium salt-based or aromatic iodonium salt-based initiators and the like containing them as techniques for improving thick coating properties and storage stability The curable resin composition is disclosed in JP-B-52-14278, JP-B-5-14278.
These are disclosed in, for example, JP-A-2-14277, JP-A-54-53181, and JP-B-59-19581. However, compositions containing these aromatic onium salts have the disadvantage of being less curable than diazonium salts, and in the case of aromatic sulfonium salts, the odor of the cured product has been a problem. In order to overcome such a drawback, an aromatic sulfonium salt having a specific group is proposed in JP-A-56-55420 and the like. But,
The above disadvantages are somewhat eliminated but not sufficient. In addition, as the field of use of the photopolymerizable composition expands, it is important to provide a novel photopolymerization initiator and a composition containing the same in order to meet market requirements.
【0004】[0004]
【課題を解決するための手段】本発明者らは、前記の課
題を解決するため鋭意研究の結果、新規な光重合開始剤
を開発し、これを用いた組成物は、保存安定性、相容
性、硬化性に優れ、その硬化物は着色が少ないエネルギ
ー線硬化性組成物を提供することに成功した。すなわ
ち、本発明は、 (1)式(1)As a result of earnest research to solve the above-mentioned problems, the present inventors have developed a novel photopolymerization initiator, and a composition using the same has a long storage stability and a good phase stability. We have succeeded in providing an energy ray-curable composition having excellent compatibility and curability, and the cured product of which has little coloring. That is, the present invention provides:
【0005】[0005]
【化5】 Embedded image
【0006】{式中、Xは式(2)で示される基In the formula, X is a group represented by the formula (2)
【0007】[0007]
【化6】 [Chemical 6]
【0008】(式中、R6 〜R15は、それぞれ水素原
子、ハロゲン原子、ニトロ基、アルコキシ基、C1 〜C
20の構造中に、水酸基、エーテル基、エステル基、(メ
タ)アクリロイル基、エポキシ基あるいはアリル基を有
していても良い脂肪族基、フェニル基、フェノキシ基お
よびチオフェノキシ基のいずれかから選択された基であ
る。) R1 、R2 及びR3 は、それぞれC1 〜C20の構造中に
エーテル基、エステル基、カルバモイル基を有していて
も良い脂肪族基、シクロヘキシル基、ハロゲン化フェニ
ル基、シアノフェニル基、ニトロフェニル基、アルキル
フェニル基、アルコキシフェニル基、ベンジル基、ハロ
ゲン化ベンジル基、シアノベンジル基、ニトロベンジル
基、アルキルベンジル基、アルコキシベンジル基及び式
(3)で示される基、(In the formula, R 6 to R 15 are each a hydrogen atom, a halogen atom, a nitro group, an alkoxy group, and C 1 to C.
In the structure of 20 , selected from a hydroxyl group, an ether group, an ester group, a (meth) acryloyl group, an epoxy group or an aliphatic group which may have an allyl group, a phenyl group, a phenoxy group and a thiophenoxy group. It is a group that has been ) R 1 , R 2 and R 3 are each an ether group, an ester group, an aliphatic group which may have a carbamoyl group in the structure of C 1 to C 20 , a cyclohexyl group, a halogenated phenyl group and a cyanophenyl group. A group, a nitrophenyl group, an alkylphenyl group, an alkoxyphenyl group, a benzyl group, a halogenated benzyl group, a cyanobenzyl group, a nitrobenzyl group, an alkylbenzyl group, an alkoxybenzyl group and a group represented by the formula (3),
【0009】[0009]
【化7】 Embedded image
【0010】(式中、R16、水素原子、C1 〜C5 のア
ルキル基、C1 〜C5 のアルコキシ基、ニトロ基及びシ
アノ基のいずれかから選択された基であり、Xは式
(1)中のXと同一である。)のいずれかから選択され
た基であり、R4 及びR5 は、それぞれ水素原子、で示
されるスルホニウム塩。 (2)これら塩からなる光重合開始剤(B)及び (3)カチオン重合性物質(A)と(2)項記載の光重
合開始剤(B)を含有することを特徴とするエネルギー
線硬化性組成物及びその硬化物に関する。(Wherein R 16 is a hydrogen atom, a C 1 -C 5 alkyl group, a C 1 -C 5 alkoxy group, a nitro group or a cyano group, and X is a group The same as X in (1).), Wherein R 4 and R 5 are each a hydrogen atom. (2) A photopolymerization initiator (B) comprising these salts, (3) a cationically polymerizable substance (A), and the photopolymerization initiator (B) according to the item (2), which are energy ray-curable. Composition and a cured product thereof.
【0011】本発明で用いるカチオン重合性物質(A)
としては、例えば、エポキシ樹脂、スチレン、ビニルエ
ーテル等のカチオン重合性ビニル化合物、更にはスピロ
オルソエステル、ビシクロオルソエステル、スピロオル
ソカーボナートのような環状エーテル類が挙げられる。
エポキシ樹脂としては、従来、公知の芳香族エポキシ樹
脂、脂環式エポキシ樹脂、脂肪族エポキシ樹脂、更には
エポキシド単量体類、エピサルファイド単量体類が挙げ
られる。ここで、芳香族エポキシ樹脂として例示すれ
ば、少なくとも1個の芳香族核を有する多価フェノール
またはそのアルキレンオキサイド付加体のポリグリシジ
ルエーテルであって、例えばビスフェノールA、ビスフ
ェノールF、ビスフェノールS等のビスフェノール化合
物またはビスフェノール化合物のアルキレンオキサイド
(例えば、エチレンオキサイド、プロピレンオキサイ
ド、ブチレンオキサイド等)付加体とエピクロロヒドリ
ンとの反応によって製造されるグリシジルエーテル類、
ノボラック型エポキシ樹脂類(例えば、フェノール・ノ
ボラック型エポキシ樹脂、クレゾール・ノボラック型エ
ポキシ樹脂、臭素化フェノール・ノボラック型エポキシ
樹脂等)、トリスフェノールメタントリグリシジルエー
テル等が挙げられる。また、脂環式エポキシ樹脂とし
て、具体的な例としては、3,4−エポキシシクロヘキ
シルメチル−3,4−エポキシシクロヘキサンカルボキ
シレート、ビス−(3,4−エポキシシクロヘキシルメ
チル)アジペート、2−(3,4−エポキシシクロヘキ
シル−5,5−スピロー3,4−エポキシ)シクロヘキ
サノン−メタ−ジオキサン、ビス(2,3−エポキシシ
クロペンチル)エーテル、EHPE−3150(ダイセ
ル化学工業株式会社製、脂環式エポキシ樹脂、軟化点7
1℃)等が挙げられる。Cationic polymerizable substance (A) used in the present invention
Examples thereof include cationically polymerizable vinyl compounds such as epoxy resin, styrene and vinyl ether, and cyclic ethers such as spiroorthoester, bicycloorthoester and spiroorthocarbonate.
Examples of the epoxy resin include conventionally known aromatic epoxy resins, alicyclic epoxy resins, aliphatic epoxy resins, epoxide monomers, and episulfide monomers. Here, when the aromatic epoxy resin is exemplified, it is a polyglycidyl ether of a polyhydric phenol having at least one aromatic nucleus or an alkylene oxide adduct thereof, for example, bisphenols such as bisphenol A, bisphenol F and bisphenol S. Glycidyl ethers produced by reacting an alkylene oxide (eg, ethylene oxide, propylene oxide, butylene oxide, etc.) adduct of a compound or bisphenol compound with epichlorohydrin;
Examples thereof include novolac type epoxy resins (for example, phenol / novolac type epoxy resin, cresol / novolac type epoxy resin, brominated phenol / novolac type epoxy resin, etc.) and trisphenolmethane triglycidyl ether. Specific examples of the alicyclic epoxy resin include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, bis- (3,4-epoxycyclohexylmethyl) adipate, and 2- (3 , 4-Epoxycyclohexyl-5,5-spiro 3,4-epoxy) cyclohexanone-meta-dioxane, bis (2,3-epoxycyclopentyl) ether, EHPE-3150 (manufactured by Daicel Chemical Industries, Ltd., alicyclic epoxy resin) , Softening point 7
1 ° C.).
【0012】更に脂肪族エポキシ樹脂の例としては、脂
肪族多価アルコールまたはそのアルキレンオキサイド付
加物のポリグリシジルエーテルがあり、その代表例とし
ては、1,4−ブタンジーオルのジグリシジルエーテ
ル、1,6−ヘキサンジオールのジグリシジルエーテ
ル、グリセリンのトリグリシジルエーテル、トリメチロ
ールプロパンのトリグリシジルエーテル、ポリエチレン
グリコールのジグリシジルエーテル、プロピレングリコ
ールのジグリシジルエーテル、エチレングリコール、プ
ロピレングリコール、グリセリン等の脂肪族多価アルコ
ールに1種または2種以上のアルキレンオキサイド(エ
チレンオキサイド、プロピレンオキサイド)を付加する
ことにより得られるホリエーテルポリオールのポリグリ
シジルエーテルが挙げられる。更にエポキシド単量体類
の例としては、脂肪族高級アルコールのモノグリシジル
エーテルやフェノール、クレゾール、ブチルフェノール
またはこれらにアルキレンオキサイドを付加することに
より得られるポリエーテルアルコールのモノグリシジル
エーテル等が挙げられる。Further, examples of the aliphatic epoxy resin include polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof, and typical examples thereof are diglycidyl ethers of 1,4-butanediol and 1,6. -Diglycidyl ether of hexanediol, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, diglycidyl ether of polyethylene glycol, diglycidyl ether of propylene glycol, aliphatic polyhydric alcohols such as ethylene glycol, propylene glycol, and glycerin Examples of the polyglycidyl ether of a polyol obtained by adding one or more alkylene oxides (ethylene oxide, propylene oxide) to It is. Further, examples of the epoxide monomers include monoglycidyl ethers of aliphatic higher alcohols, phenol, cresol, butylphenol, and monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxide thereto.
【0013】カチオン重合性ビニル化合物としては、例
えば、トリエチレングリコールジビニルエーテル、テト
ラエチレングリコールジビニルエーテル、シクロヘキサ
ン−1,4−ジメチロールジビニルエーテル、1,4−
ブタンジオールジビニルエーテル、As the cationically polymerizable vinyl compound, for example, triethylene glycol divinyl ether, tetraethylene glycol divinyl ether, cyclohexane-1,4-dimethylol divinyl ether, 1,4-
Butanediol divinyl ether,
【0014】[0014]
【化8】 Embedded image
【0015】及びAnd
【0016】[0016]
【化9】 Embedded image
【0017】等が挙げられる。また、これらカチオン重
合性有機材料は単独でも2種以上の混合物でもかまわな
い。And the like. These cationically polymerizable organic materials may be used alone or as a mixture of two or more.
【0018】本発明で用いる一般式(1)で表されるス
ルホニウム塩としては、例えば、一般式(6)で表され
るホスフィン化合物あるいは、一般式(7)で表される
ホスフィンオキサイド化合物The sulfonium salt represented by the general formula (1) used in the present invention is, for example, a phosphine compound represented by the general formula (6) or a phosphine oxide compound represented by the general formula (7).
【0019】[0019]
【化10】 Embedded image
【0020】(式中、R1 〜R5 は、前記一般式(1)
中のR1 〜R5 と同一である。)(In the formula, R 1 to R 5 are represented by the general formula (1)
It is the same as R 1 to R 5 therein. )
【0021】[0021]
【化11】 Embedded image
【0022】(式中、R1 〜R5 は、前記一般式(1)
の中のR1 〜R5 ど同一である。)と置換または非置換
ジフェニルスルホキシド化合物を公知のスルホニウム塩
の生成反応を利用する方法(以下1)法という)、2)
相当する置換及び非置換のスルホニウム塩をあらかじめ
合成し、その後、置換基を変換、導入する方法(以下
2)法という)のいずれかにより合成することができ
る。先ず1)法を具体的に説明する。式(7)と式
(8)で表されるホスフィン化合物(具体例としては、
例えば、1,2−ビス(ジフェニルホスフィノ)エタ
ン、1,3−ビス(ジフェニルホスフィノ)プロパン、
1,4−ビス(ジフェニルホスフィノ)ブタン、1,2
−ビス(n−ブチルフェニルホスフィノ)エタン1,3
−ビス(n−ブチルフェニルホスィノ)プロパン、1,
4−ビス(n−ブチルフェニルホスフィノ)ブタン)、
1−(n−ブチルフェニルホスフィノ)−4−(ジ−n
−ブチルホスフィノ)ブタン、1−(ジフェニルホスフ
ィノ)−4−(ジベンジルホスフィノ)ブタン、1−
(メタトリルフェニルフェニルホスフィノ)−4−(ジ
メタトリルホスフィノ)ブタン、1−(パラトリルフェ
ニルフェニルホスフィノ)−3−(パラトリルフェニル
ホスフィノ)プロパン、1−(4−メトキシフェニルフ
ェニルホスフィノ)−2−(4−メトキシフェニルフェ
ニルホスフィノ)エタン、1−(シクロヘキシルフェニ
ルホスフィノ)−2−(シクロヘキシルフェニルホスフ
ィノ)エタン、1−(4−ニトロフェニルフェニルホス
フィノ)−4−(4−ニトロフェニルフェニルホスフィ
ノ)ブタン、1−(メタシアオフェニルフェニルホスフ
ィノ)−3−(メタシアノフェニルフェニルホスフィ
ノ)プロパン、1−(4−メチルベンジルフェニルホス
フィノ)−4−(4−メチルベンジルフェニルホスフィ
ノ)ブタン等)およびホスフィンオキサイド化合物(具
体例としては、例えば、1,2−エタンビス(ジフェニ
ルホスフィンオキサイド)、1,3−プロパンビス(ジ
フェニルホスフィンオキサイド)、1,4−ブタンビス
(ジフェニルホスフィンオキサイド)、1,2−エタン
ビス(n−ブチルフェニルホスフィンオキサイド)、
1,3−プロパンビス(n−ブチルフェニルホスフィン
オキサイド)、1,4−ブタンビス(n−ブチルフェニ
ルホスフィンオキサイド)、ブタン−1−n−ブチルフ
ェニルホスフィンオキサイド−4−ジn−ブチルホスフ
ィンオキサイド、ブタン−1−ジフェニルホスフィンオ
キサイド−4−ジベンジルホスフィンオキサイド、ブタ
ン−1−メタトリルフェニルフェニルホスフィンオキサ
イド−4−ジメタトリルホスフィンオキサイド、プロパ
ン−1−メタトリルフェニルフェニルホスフィンオキサ
イド−3−ジメタトリルホスフィンオキサイド、1,3
−プロパンビス(パラトリルフェニルフェニルホスフィ
ンオキサイド)、1,2−エタンビス(4−メトキシフ
ェニルフェニルホスフィンオキサイド)、1,2−エタ
ンビス(シクロキシルフェニルホスフィンオキサイ
ド)、1,4−ブタンビス(4−ニトロフェニルフェニ
ルホスフィンオキサイド)、1,3−プロパンビス(メ
タシアノフェニルフェニルホスフィンオキサイド)、
1,4−ブタンビス(4−メチルベンジルフェニルフェ
ニルホスフィンオキサイド)、1,4−ブタンビス
(N,N−ジイソブチルカルバモイルメチルフェニルホ
スフィンオキサイド等を挙げることができる。)と置換
または非置換ジフェニルスルホキシド化合物(例えば、
ジフェニルスルホキシド、4,4′−ジフルオロジフェ
ニルスルホキシド、2,2′−ジフルオロジフェニルス
ルホキシド、3,3′−ジフルオロジフェニルスルホキ
シド、4,2′−ジフルオロジフェニルスルホキシド、
4,4′−ジブロムジフェニルスルホキシド、4,4′
−ジクロロジフェニルスルホキシド、2,2′,4,
4′−テトラクロロジフェニルスルホキシド、4,4′
−ジメチルジフェニルスルホキシド、4,4′−ジエチ
ルジフェニルスルホキシド、4,4′−ジメトキシジフ
ェニルスルホキシド、4−メチルチオジフェニルスルホ
キシド、4−フェニルチオジフェニルスルホキシド等)
を公知の方法、例えば、脱水剤(例えば、五酸化リン、
無水酢酸、濃硫酸等)と溶媒として、メタンスルホン酸
やパーフルオロメタンスルホン酸等を用いて通常常温〜
100℃で縮合反応を行ない、次いでこれらの反応液を
式(4)、式(5)又は式(6)をアニオン部分とする
アルカリ金属塩(例えば、NaSbF6、NaPF6 、NaAsF6、Na
BF6 、NaSbF5OH、KSbF6 、KPF6、KAsF6 、KSbF5OH 、Li
B(C6F5)4 、Li B(C6H4CF3)4、Li BF2(C6F5)2 、Li B(C
6H3F2)4 等)の水溶液に滴下し、スルホニウム塩を得る
ことができる。上記に記載したスルホニウム塩を得る工
程で一般式(7)で表されるホスフィン化合物中のリン
原子は、酸化されホスフィンオキサイドになるのであ
る。一般式(7)で表されるホスフィン化合物からスル
ホニウム塩を得る工程では副生成物がやや多く、好まし
くは、一般式(8)で表されるホスフィンオキサイド化
合物を出発原料とする方法である。(In the formula, R 1 to R 5 are represented by the general formula (1)
R 1 to R 5 are the same. ) And a substituted or unsubstituted diphenyl sulfoxide compound using a known reaction for forming a sulfonium salt (hereinafter referred to as method 1)), 2)
The corresponding substituted or unsubstituted sulfonium salt can be synthesized in advance, and then can be synthesized by any of the methods of converting and introducing a substituent (hereinafter referred to as method 2). First, the method 1) will be specifically described. The phosphine compounds represented by the formulas (7) and (8) (as specific examples,
For example, 1,2-bis (diphenylphosphino) ethane, 1,3-bis (diphenylphosphino) propane,
1,4-bis (diphenylphosphino) butane, 1,2
-Bis (n-butylphenylphosphino) ethane 1,3
-Bis (n-butylphenylphosino) propane, 1,
4-bis (n-butylphenylphosphino) butane),
1- (n-butylphenylphosphino) -4- (di-n
-Butylphosphino) butane, 1- (diphenylphosphino) -4- (dibenzylphosphino) butane, 1-
(Metarylphenylphenylphosphino) -4- (dimetarylphenylphosphino) butane, 1- (paratolylphenylphenylphosphino) -3- (paratolylphenylphosphino) propane, 1- (4-methoxyphenylphenyl Phosphino) -2- (4-methoxyphenylphenylphosphino) ethane, 1- (cyclohexylphenylphosphino) -2- (cyclohexylphenylphosphino) ethane, 1- (4-nitrophenylphenylphosphino) -4- (4-Nitrophenylphenylphosphino) butane, 1- (methacyaophenylphenylphosphino) -3- (methacyanophenylphenylphosphino) propane, 1- (4-methylbenzylphenylphosphino) -4- ( 4-methylbenzylphenylphosphino) butane) and Phosphine oxide compounds (specific examples include 1,2-ethanebis (diphenylphosphine oxide), 1,3-propanebis (diphenylphosphine oxide), 1,4-butanebis (diphenylphosphine oxide), 1,2-ethanebis (N-butylphenylphosphine oxide),
1,3-propanebis (n-butylphenylphosphine oxide), 1,4-butanebis (n-butylphenylphosphine oxide), butane-1-n-butylphenylphosphine oxide-4-din-butylphosphine oxide, butane -1-Diphenylphosphine oxide-4-dibenzylphosphine oxide, butane-1-metatrylphenylphenylphosphine oxide-4-dimetatrylphosphine oxide, propane-1-metatrylphenylphenylphosphine oxide-3-dimetatrylphosphine Oxide, 1,3
-Propanebis (paratolylphenylphenylphosphine oxide), 1,2-ethanebis (4-methoxyphenylphenylphosphine oxide), 1,2-ethanebis (cycloxylphenylphosphine oxide), 1,4-butanebis (4-nitrophenyl) Phenylphosphine oxide), 1,3-propanebis (methacyanophenylphenylphosphine oxide),
1,4-butanebis (4-methylbenzylphenylphenylphosphine oxide), 1,4-butanebis (N, N-diisobutylcarbamoylmethylphenylphosphine oxide, etc.) and a substituted or unsubstituted diphenylsulfoxide compound (eg, ,
Diphenyl sulfoxide, 4,4'-difluorodiphenyl sulfoxide, 2,2'-difluorodiphenyl sulfoxide, 3,3'-difluorodiphenyl sulfoxide, 4,2'-difluorodiphenyl sulfoxide,
4,4'-dibromodiphenyl sulfoxide, 4,4 '
-Dichlorodiphenyl sulfoxide, 2,2 ', 4,
4'-tetrachlorodiphenyl sulfoxide, 4,4 '
-Dimethyldiphenylsulfoxide, 4,4'-diethyldiphenylsulfoxide, 4,4'-dimethoxydiphenylsulfoxide, 4-methylthiodiphenylsulfoxide, 4-phenylthiodiphenylsulfoxide, etc.)
A known method, for example, a dehydrating agent (for example, phosphorus pentoxide,
(Acetic anhydride, concentrated sulfuric acid, etc.) and methanesulfonic acid, perfluoromethanesulfonic acid, etc. as a solvent are usually used at room temperature to
Condensation reaction is performed at 100 ° C., and then these reaction liquids are alkali metal salts (eg, NaSbF 6 , NaPF 6 , NaAsF 6 , Na) whose formula (4), formula (5) or formula (6) is an anion moiety.
BF 6 , NaSbF 5 OH, KSbF 6 , KPF 6 , KAsF 6 , KSbF 5 OH, Li
B (C 6 F 5 ) 4 , Li B (C 6 H 4 CF 3 ) 4 , Li BF 2 (C 6 F 5 ) 2 , Li B (C
The sulfonium salt can be obtained by dropping it into an aqueous solution of 6 H 3 F 2 ) 4 etc.). In the step of obtaining the sulfonium salt described above, the phosphorus atom in the phosphine compound represented by the general formula (7) is oxidized to be phosphine oxide. In the step of obtaining a sulfonium salt from the phosphine compound represented by the general formula (7), a large amount of by-products are present, and the phosphine oxide compound represented by the general formula (8) is preferably used as a starting material.
【0023】2)法を具体的に説明する。1)法で合成
したスルホニウム塩、例えば式(9)2) The method will be specifically described. A sulfonium salt synthesized by the method 1), for example, the formula (9)
【0024】[0024]
【化12】 [Chemical 12]
【0025】(但し、式中R1 〜R5 は式(1)中のR
1 〜R5 と同一でAはハロゲン原子、nは1〜10、Z
は前記式(4)、式(5)または式(6)で示され
る。)で示される化合物等の公知の方法、例えば、塩基
性化合物(例えば、水酸化ナトリウム、水酸化カリウ
ム、炭酸カリウム等)の存在下、大過剰のモノ又はポリ
アルコール類(例えば、メタノール、エタノール、カル
ビトール、エチレングリコール、ポリエチレングリコー
ル、プロピレングリコール、グリセリン、トリメチロー
ルプロパン、1,4−ブタンジオール、グリシドール、
2−ヒドロキシエチル((メタ)アクリレート、2−ヒ
ドロキシプロピル(メタ)アクリレート、アリルアルコ
ール等)を通常室温〜150℃で、必要に応じて、ジメ
チルスルホキシド等の有機溶剤の存在下反応させること
により、前記ハライド化合物のハライド部が例えば(However, in the formula, R 1 to R 5 are R in the formula (1).
The same as 1 to R 5 , A is a halogen atom, n is 1 to 10, Z
Is represented by the above formula (4), formula (5) or formula (6). ) Known methods for compounds such as, for example, basic compounds (for example, sodium hydroxide, potassium hydroxide, potassium carbonate, etc.), in the presence of a large excess of mono- or polyalcohols (for example, methanol, ethanol, Carbitol, ethylene glycol, polyethylene glycol, propylene glycol, glycerin, trimethylolpropane, 1,4-butanediol, glycidol,
2-hydroxyethyl ((meth) acrylate, 2-hydroxypropyl (meth) acrylate, allyl alcohol, etc.) is usually reacted at room temperature to 150 ° C. in the presence of an organic solvent such as dimethyl sulfoxide, if necessary, The halide part of the halide compound is, for example,
【0026】[0026]
【化13】 Embedded image
【0027】[0027]
【化14】 Embedded image
【0028】[0028]
【化15】 Embedded image
【0029】[0029]
【化16】 Embedded image
【0030】等の置換基に変換された硼酸塩を得ること
ができる。一般式(1)で示される化合物の代表例とし
ては、次表1の化合物を挙げることかできるが、これら
に限定されるものではない。It is possible to obtain a borate converted into a substituent such as. As typical examples of the compound represented by the general formula (1), the compounds shown in Table 1 below can be mentioned, but the invention is not limited thereto.
【0031】[0031]
【表1】 [Table 1]
【0032】本発明の硬化性組成物は、100重量部の
カチオン重合性物質(A)に対して通常0.01〜20
重量部により好ましくは0.1〜10重量部の前記の式
(1)で示されるスルホニウム塩(B)を必須の成分と
するが適当な割合は、カチオン重合性物質やエネルギー
線の種類、照射量、所望の硬化時間、温度、湿度、塗膜
厚などさまざまな要因を考慮することによって決定され
る。カチオン重合性物質へのスルホニウム塩の溶解を容
易にするため、あらかじめスルホニウム塩を溶剤類(例
えば、プロピレンカーボネート、カルビトール、カルビ
トールアセテート、ブチロラクトン等)に溶解し使用す
ることができる。本発明の硬化性組成物は、カチオン重
合性物質及びスルホニウム塩を混合、溶解あるいは混練
等の方法により調製することができる。The curable composition of the present invention is usually 0.01 to 20 with respect to 100 parts by weight of the cationically polymerizable substance (A).
More preferably, 0.1 to 10 parts by weight of the sulfonium salt (B) represented by the above formula (1) is used as an essential component, but a suitable ratio is a cationically polymerizable substance, the type of energy beam, and irradiation. It is determined by considering various factors such as amount, desired curing time, temperature, humidity, coating thickness. In order to facilitate the dissolution of the sulfonium salt in the cationically polymerizable substance, the sulfonium salt can be used by dissolving it in a solvent (eg, propylene carbonate, carbitol, carbitol acetate, butyrolactone) in advance. The curable composition of the present invention can be prepared by a method such as mixing, dissolving or kneading a cationically polymerizable substance and a sulfonium salt.
【0033】本発明の硬化性組成物は、紫外線等のエネ
ルギー線を照射することにより0.1秒〜数分後に指触
乾燥状態あるいは溶媒不溶性の状態に硬化することかで
きる。適当なエネルギー線としては、スルホニウム塩ま
たはスルホキソニウム塩の分触を誘発するエネルギーを
有する限りいかなるものでもよいが、好ましくは、高、
低圧水銀ランプ、キセノンランプ、殺菌灯、レーザー光
などから得られる2000オングストローム〜7000
オングストロームの波長を有する電磁波エネルギーや電
子線、X線、放射線等の高エネルギー線を使用する。エ
ネルギー線への暴露は、エネルギー線の強度によるが、
通常は0.1秒〜10秒程度で十分である。しかし比較
的厚い塗装物についてはそれ以上の時間をかけるのが好
ましい。エネルギー線照射後0.1秒〜数分後には、ほ
とんどの組成物はカチオン重合により指触乾燥するが、
カチオン重合反応を促進するために加熱を併用すること
も場合によっては好ましい。本発明の組成物には、さら
にカチオン重合を損わない範囲で希釈のための溶剤や、
改質のための非反応性の樹脂や(メタ)アクリル酸エス
テル化合物(例えば、ビスフェノールA型エポキシ樹
脂、ノボラック型エポキシ樹脂等のエポキシ樹脂と(メ
タ)アクリル酸の反応物であるエポキシ(メタ)アクリ
レート、ウレタン(メタ)アクリレート、ポリエステル
ポリ(メタ)アクリレート等のオリゴマーや、2−ヒド
ロキシ(メタ)アクリレート、1,6−ヘキサンジオー
ルジ(メタ)アクリレート、1,9−ノナンジオールジ
(メタ)アクリレート、トリメチロールプロパントリ
(メタ)アクリレート、ペンタエリスリトールトリ(メ
タ)アクリレート等のモノマー等)を配合することがで
きる。(メタ)アクリル酸エステル化合物を使用する場
合には、光ラジカル重合開始剤(例えば、1−ヒドロキ
シシクロヘキシルフェニルケトン、アセトフェノンジメ
チルケタール、ベンゾイルメチルエーテル等)を使用す
るのが好ましい。また例えば、電気特製を改良する目的
などのため有機カルボン酸や酸無水物を使用したり、あ
るいはゴム弾性をもたせるなどの目的でポリマールその
他の可とう性プレポリマーを混合することができる。The curable composition of the present invention can be cured to a touch-free state or a solvent-insoluble state after 0.1 seconds to several minutes by irradiating with energy rays such as ultraviolet rays. Suitable energy rays may be any as long as they have an energy that induces the separation of the sulfonium salt or the sulfoxonium salt, but are preferably high,
2000 angstrom to 7000 obtained from low-pressure mercury lamp, xenon lamp, germicidal lamp, laser beam, etc.
Electromagnetic energy having a wavelength of Å, high energy rays such as electron beams, X-rays, and radiations are used. Exposure to energy rays depends on the intensity of the energy rays,
Generally, about 0.1 to 10 seconds is sufficient. However, it is preferable to spend more time on a relatively thick coated object. After 0.1 seconds to several minutes after irradiation with energy rays, most compositions dry to the touch by cationic polymerization,
In some cases, it is also preferable to use heating in combination to promote the cationic polymerization reaction. In the composition of the present invention, a solvent for dilution as far as the cationic polymerization is not impaired,
A non-reactive resin for modification or a (meth) acrylic acid ester compound (for example, an epoxy (meth) that is a reaction product of an epoxy resin such as a bisphenol A type epoxy resin or a novolac type epoxy resin and (meth) acrylic acid) Oligomer such as acrylate, urethane (meth) acrylate, polyester poly (meth) acrylate, 2-hydroxy (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate , Monomers such as trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, etc.) can be blended. When a (meth) acrylate compound is used, it is preferable to use a photoradical polymerization initiator (for example, 1-hydroxycyclohexyl phenyl ketone, acetophenone dimethyl ketal, benzoyl methyl ether, etc.). Further, for example, an organic carboxylic acid or an acid anhydride may be used for the purpose of improving electric specialty, or a polymer or other flexible prepolymer may be mixed for the purpose of imparting rubber elasticity.
【0034】本発明の組成物は、通常透明な液状として
使用されるものであるが、用途によっては不活性な顔
料、染料、充填剤、静電防止剤、難燃剤、消泡剤、流動
調整剤、増感剤、促進剤、光安定剤等を混合して用いら
れる。本発明の組成物は金属、木材、ゴム、プラスチッ
ク、ガラス、セラミック製品等に使用することができ
る。さらに本発明の具体的な用途としては、塗料、コー
ティング剤、インキ、レジスト、液状レジスト、接着
剤、成形材料、注型材料、パテ、ガラス繊維含浸剤、目
止め剤等が挙げられる。The composition of the present invention is usually used as a transparent liquid, but depending on the use, it may be an inert pigment, dye, filler, antistatic agent, flame retardant, antifoaming agent, flow control agent. Used as a mixture of agents, sensitizers, accelerators, light stabilizers and the like. The composition of the present invention can be used for metal, wood, rubber, plastic, glass, ceramic products and the like. Further, specific applications of the present invention include paints, coatings, inks, resists, liquid resists, adhesives, molding materials, casting materials, putties, glass fiber impregnating agents, fillers, and the like.
【0035】[0035]
【実施例】以下、本発明の実施例により具体的に説明す
る。なお、実施例中の部は、重量部である。EXAMPLES The present invention will be specifically described below with reference to examples. Parts in Examples are parts by weight.
【0036】(式(1)で表されるスルホニウム塩の合
成例) 実施例1 1,4−ブタンビス(シクロヘキサンフェニルホスフィ
ンオキサイド)9.4部、4,4′−ジフルオロジフェ
ニルスルホキシド10部、無水酢酸10部及び濃硫酸5
0部を仕込み、60℃に加熱し約5時間反応を行ない、
次いでこの反応液を水800部で希釈し、不溶解物をろ
別し水層にKSbF6 11.5部を添加し、次に25% NaO
H 水溶液でpHを7まで中和し白色の析出物をろ別し、
白色析出物を溶剤(アセトン20部とメタノール80部
の混合溶剤)200部に溶解し、次にこれに水200部
を加え析出物をろ別、乾燥し白色固体19.3部を得
た。得られた生成物の融点は175〜178℃で元素分
析値は次のとおりであった。 元素 実測値(重量%) 計算値(重量%) 炭素 45.15 45.11 水素 3.95 3.93 イオウ 4.62 4.63 リン 4.49 4.47 アンチモン 17.56 17.59 フッ素 21.94 21.95 この製造方法に基づいて構造式(Synthesis Example of Sulfonium Salt Represented by Formula (1)) Example 1 9.4 parts of 1,4-butanebis (cyclohexanephenylphosphine oxide), 10 parts of 4,4'-difluorodiphenyl sulfoxide, acetic anhydride 10 parts and concentrated sulfuric acid 5
Charge 0 parts, heat to 60 ° C. and react for about 5 hours,
Then, the reaction solution was diluted with 800 parts of water, the insoluble matter was filtered off, and 11.5 parts of KSbF 6 was added to the aqueous layer, and then 25% NaO was added.
The pH is neutralized to 7 with an aqueous H 2 solution and the white precipitate is filtered off.
The white precipitate was dissolved in 200 parts of a solvent (mixed solvent of 20 parts of acetone and 80 parts of methanol), 200 parts of water was added thereto, and the precipitate was filtered and dried to obtain 19.3 parts of a white solid. The melting point of the obtained product was 175 to 178 ° C, and the elemental analysis values were as follows. Element Measured value (% by weight) Calculated value (% by weight) Carbon 45.15 45.11 Hydrogen 3.95 3.93 Sulfur 4.62 4.63 Phosphorus 4.49 4.47 Antimony 17.56 17.59 Fluorine 21 .94 21.95 Structural formula based on this manufacturing method
【0037】[0037]
【化17】 Embedded image
【0038】のスルホニウム塩を得た。A sulfonium salt of was obtained.
【0039】実施例2 ブタン−1−n−ブチルフェニルホスフィンオキサイド
−4−ジn−ブチルホスフィンオキサイド10部、4,
4′−ジフルオロジフェニルスルホキシド6.0部及び
濃硫酸50部を仕込み、60℃に加熱し5時間反応を行
ない、次いでこの反応液を水800部で希釈し不溶解物
をろ別し水層にKPF64.8部を添加し、次に25% NaO
H 水溶液でpHを7まで中和し白色の析出物をろ別し、
白色析出物を溶剤(アセトン20部とメタノール80部
の混合溶剤)200部に溶解し、これに水200部を加
え、白色固体13部を得た。得られた生成物の融点は1
56〜159℃で元素分析値は次のとおりであった。 元素 実測値(重量%) 計算値(重量%) 炭素 58.02 57.98 水素 6.85 6.81 イオウ 4.57 4.55 リン 13.22 13.19 フッ素 21.56 21.58 この製造方法に基づいて構造式Example 2 Butane-1-n-butylphenylphosphine oxide-4-di-n-butylphosphine oxide 10 parts, 4,
4.0 parts of 4'-difluorodiphenyl sulfoxide and 50 parts of concentrated sulfuric acid were charged, the mixture was heated to 60 ° C. and reacted for 5 hours, then the reaction solution was diluted with 800 parts of water and the insoluble matter was filtered off to form an aqueous layer. Add 4.8 parts KPF 6 then 25% NaO
The pH is neutralized to 7 with an aqueous H 2 solution and the white precipitate is filtered off.
The white precipitate was dissolved in 200 parts of a solvent (a mixed solvent of 20 parts of acetone and 80 parts of methanol), and 200 parts of water was added to this to obtain 13 parts of a white solid. The melting point of the obtained product is 1
The elemental analysis values at 56 to 159 ° C. were as follows. Element Measured value (wt%) Calculated value (wt%) Carbon 58.02 57.98 Hydrogen 6.85 6.81 Sulfur 4.57 4.55 Phosphorus 13.22 13.19 Fluorine 21.56 21.58 This production Structural formula based on method
【0040】[0040]
【化18】 Embedded image
【0041】のスルホニウム塩を得た。A sulfonium salt of was obtained.
【0042】実施例3 実施例1で得た化合物10部、水酸化ナトリウム0.8
部、エチレングリコール100部を仕込み、60℃で2
4時間反応し、その後水中に注ぎ込み析出した白色固体
をろ過、乾燥し、常温で固体の生成物を得た。生成物の
構造式は下記のものであり元素分析の結果は計算値にほ
ぼ一致した。Example 3 10 parts of the compound obtained in Example 1, 0.8 sodium hydroxide
Part, 100 parts of ethylene glycol were charged, and 2 at 60 ° C
After reacting for 4 hours, it was poured into water and the precipitated white solid was filtered and dried to obtain a solid product at room temperature. The structural formula of the product is shown below, and the results of elemental analysis were in good agreement with the calculated values.
【0043】[0043]
【化19】 Embedded image
【0044】実施例4 実施例2で得たスルホニウム塩20部をアセトン200
部に溶解させたものに、アセトン200部中にテトラキ
ス(ペンタフルオロフェニル)硼酸リチウム19.5部
を含有させた溶液を添加し、この混合物を48時間、2
5℃で攪拌し、次いで生成したLiPF6 を除去するために
ろ過した。アセトンを蒸発させて、白色固体30部を得
た。得られた生成物の融点は166〜170℃で元素分
析値は次のとおりであった。 元素 実測値(重量%) 計算値(重量%) 炭素 53.64 53.61 水素 3.72 3.69 イオウ 2.45 2.47 リン 4.79 4.77 硼酸 0.83 0.83 フッ素 32.13 32.16 この製造方法に基づいて構造式Example 4 20 parts of the sulfonium salt obtained in Example 2 was added to 200 parts of acetone.
A solution of 19.5 parts of lithium tetrakis (pentafluorophenyl) borate in 200 parts of acetone was added to the solution dissolved in 1 part of the mixture, and the mixture was stirred for 2 hours for 2 hours.
Stir at 5 ° C. and then filter to remove the LiPF 6 formed. The acetone was evaporated to give 30 parts of a white solid. The melting point of the obtained product was 166 to 170 ° C., and the elemental analysis values were as follows. Element Measured value (wt%) Calculated value (wt%) Carbon 53.64 53.61 Hydrogen 3.72 3.69 Sulfur 2.45 2.47 Phosphorus 4.79 4.77 Boric acid 0.83 0.83 Fluorine 32 .13 32.16 Structural formula based on this manufacturing method
【0045】[0045]
【化20】 Embedded image
【0046】のスルホニウム塩を得た。 (組成物の実施例) 実施例5〜8、比較例1〜4 表2に示す配合組成(数値は重量部である。)に従って
エネルルギー線硬化性組成物を配合し、混合溶解した。
これを、アルミテストパネル上に5μの厚さに塗布し、
高圧水銀灯(80w/cm2 )で8cmの距離から紫外
線を照射し、硬化させた。調整された組成物の透明性、
保存安定性、指触乾燥性、硬化塗膜の光沢、着色につい
て試験した。それらの結果を表2に示す。A sulfonium salt of was obtained. (Examples of Compositions) Examples 5 to 8 and Comparative Examples 1 to 4 The energy ray curable compositions were compounded according to the compounding compositions (numerical values are parts by weight) shown in Table 2, and mixed and dissolved.
Apply this to an aluminum test panel to a thickness of 5μ,
Ultraviolet rays were irradiated from a distance of 8 cm with a high-pressure mercury lamp (80 w / cm 2 ) to cure. Transparency of the tuned composition,
The storage stability, the dryness to the touch, the gloss of the cured coating, and the coloring were tested. Table 2 shows the results.
【0047】透明性:組成物の透明性を目視判定した。 ○・・・・完全に透明である。 △・・・・わずかににごりあり。 ×・・・・白ダクしている。 ××・・・・すぐに分離する。 保存安定性:組成物を40℃で3ケ月間保存し、安定性
を調査した。 ○・・・・全く変化していない △・・・・やや増粘している ×・・・・ゲル化している 指触乾燥性:指触乾燥するまでの照射量(mJ/cm2) を測
定した。 光沢:指触乾燥すするまでの照射量(mJ/cm2) を照射し
た後、硬化塗膜の表面を目視判定した。 ○・・・・光沢が良好である △・・・・ややくもりがある ×・・・・全く光沢がない 着色:塗布面に1000mJ/cm2照射した後、硬化塗膜の
着色の状態を観察した。 ○・・・・全く着色がない △・・・・わずかに着色あり ×・・・・着色あり ××・・・・着色が強いTransparency: The transparency of the composition was visually determined. ○ ・ ・ ・ ・ It is completely transparent. △ ・ ・ ・ ・ Slightly cloudy. × ・ ・ ・ ・ White is dull. XX ・ ・ ・ ・ Separate immediately. Storage stability: The composition was stored at 40 ° C. for 3 months, and the stability was investigated. ○ ・ ・ ・ No change at all △ ・ ・ ・ ・ Slightly thickened × ・ ・ ・ ・ Gelled Touch dryness: The irradiation dose (mJ / cm 2 ) until touch dryness It was measured. Gloss: The surface of the cured coating film was visually evaluated after irradiation with the irradiation amount (mJ / cm 2 ) until it was dried to the touch. ○ ・ ・ ・ ・ Gloss is good △ ・ ・ ・ ・ Slightly cloudy × ・ ・ ・ ・ No gloss at all Coloring: After irradiating the coated surface at 1000 mJ / cm 2 , observe the coloring state of the cured coating film did. ○ ・ ・ ・ ・ No coloration △ ・ ・ ・ ・ Slightly colored × ・ ・ ・ ・ Colored ×× ・ ・ ・ ・ Colored strongly
【0048】[0048]
【表2】 表2 実施例 比較例 5 6 7 8 1 2 3 4 実施例1で得た光重合開始剤 1.5 実施例2で得た光重合開始剤 1.5 実施例3で得た光重合開始剤 1.5 実施例4で得た光重合開始剤 1.5 化合物1 *1 1.5 1.5 化合物2 *2 1.5 1.5 ポリエステルジビニルエーテル*3 50 50 50 50 シクロヘキサンジメチロールジビニル エーテル 50 50 50 50 セロキサイド2021 *4 80 80 80 80 EHPE−3150 *5 20 20 20 20 透明性 ○ ○ ○ ○ ○ ××○ ×× 保存安定性 ○ ○ ○ ○ ○ ──○ ── 指触乾燥性(mJ/cm2) 20 15 20 10 75 − 35 − 光沢 ○ ○ ○ ○ ○ ──○ ── 着色 ○ ○ ○ ○ × ──× ──Table 2 Examples Comparative Examples 5 6 7 8 1 2 3 4 Photopolymerization Initiator Obtained in Example 1.5 1.5 Photopolymerization Initiator Obtained in Example 2 1.5 Photopolymerization Initiator Obtained in Example 3 1.5 Photopolymerization initiator obtained in Example 4 1.5 Compound 1 * 1 1.5 1.5 Compound 2 * 2 1.5 1.5 Polyester divinyl ether * 3 50 50 50 50 Cyclohexane dimethylol divinyl ether 50 50 50 50 Celoxide 2021 * 4 80 80 80 80 EHPE-3150 * 5 20 20 20 20 Transparency ○ ○ ○ ○ ○ × × ○ × × Storage stability ○ ○ ○ ○ ○ ── ○ ── Dryness to the touch (mJ / cm 2 ) 20 15 20 10 75 − 35-Gloss ○ ○ ○ ○ ○ ── ○ ── Coloring ○ ○ ○ ○ × ── × ──
【0049】注) *1 化合物1:ジフェニル−4−
チオフェノキシフェニルスルホニウムヘキサフルオロホ
スフェート *2 化合物2:4,4′−ビス〔ビスフェニルスルホ
ニオ〕フェニルスルフィドビスヘキサフルオロホスフェ
ート *3 ポリエステルジビニルエーテル:構造式Note) * 1 Compound 1: Diphenyl-4-
Thiophenoxyphenylsulfonium hexafluorophosphate * 2 Compound 2: 4,4'-bis [bisphenylsulfonio] phenyl sulfide bishexafluorophosphate * 3 Polyester divinyl ether: Structural formula
【0050】[0050]
【化21】 [Chemical 21]
【0051】*4 セロキサイド 2021:ダイセル
化学工業(株)製、脂環式エポキシ樹脂 *5 EHPE−3150:ダイセル化学工業(株)
製、脂環式エポキシ樹脂 表2の結果から明らかなように、本発明の光重合開始剤
を含有した組成物は、相容性、保存安定性に優れ、透明
で硬化性に優れ、硬化塗膜の光沢が良好であり、硬化塗
膜の着色も小さい。* 4 Celoxide 2021: Daicel Chemical Industries, Ltd., alicyclic epoxy resin * 5 EHPE-3150: Daicel Chemical Industries, Ltd.
Production, alicyclic epoxy resin As is clear from the results in Table 2, the composition containing the photopolymerization initiator of the present invention has excellent compatibility and storage stability, is transparent and has excellent curability, and is a cured coating. The gloss of the film is good and the coloring of the cured coating is small.
【0052】[0052]
【発明の効果】本発明の光重合開始剤を含有したエネル
ギー線硬化性組成物は、相容性、保存安定性に優れ、透
明で硬化性に優れ、硬化塗膜の光沢が良好で、硬化塗膜
の着色も小さく、優れた物性の硬化物をあたえる。The energy ray-curable composition containing the photopolymerization initiator of the present invention is excellent in compatibility and storage stability, is transparent and has excellent curability, and has a good gloss of a cured coating film and is cured. Coloring of the coating film is also small, giving a cured product with excellent physical properties.
Claims (4)
子、ニトロ基、アルコキシ基、C1 〜C20の構造中に、
水酸基、エーテル基、エステル基、(メタ)アクリロイ
ル基、エポキシ基あるいは、アリル基を有していても良
い脂肪族基、フェニル基、フェノキシ基およびチオフェ
ノキシ基のいずれかから選択された基である。)であ
り、R1 ,R2 及びR3 は、それぞれC1 〜C20の構造
中にエーテル基、エステル基、カルバモイル基を有して
いても良い脂肪族基、シクロヘキシル基、ハロゲン化フ
ェニル基、シアノフェニル基、ニトロフェニル基、アル
キルフェニル基、アルコキシフェニル基、ベンジル基、
ハロゲン化ベンジル基、シアノベンジル基、ニトロベン
ジル基、アルキルベンジル基、アルコキシベンジル基及
び式(3)で示される基、 【化3】 (式中、R16は、水素原子、C1 〜C5 のアルキル基、
C1 〜C5 のアルコキシ基、ニトロ基及びシアノ基のい
ずれかから選択された基であり、Xは式(1)中のXと
同一である。)のいずれかから選択された基であり、R
4 及びR5 は、それぞれ水素原子、C1 〜C5 のアルキ
ル基、C1 〜C5 のアルコキシ基、ニトロ基及びシアノ
基のいずれかから選択された基であり、nは1〜10、
mは1〜4、Zは式(4)、式(5)または式(6) 【化4】 (式中、Mは、リン原子、ホウ素原子、ヒ素原子または
アンチモン原子であり、Qはハロゲン原子であり、pは
4〜6の整数であり、Bはホウ素原子、a及びbは0〜
4の範囲の整数であり、ここでa+bは4であり、記号
Yは、aが0〜3である場合にはハロゲン原子(塩素又
は弗素)を表わし、また、aが0〜2である場合にはO
H基を表わすこともできる。RはCF3 、NO2 、CN
等のような少なくとも1個の電子吸引基で置換されたフ
ェニル基又は少なくとも2個のハロゲン原子(特に弗
素)で置換されたフェニル基を表わす。)}で示される
スルホニウム塩。(1) Formula (1) Xwherein X is a group represented by the formula (2) (Wherein, R 6 to R 15 each represent a hydrogen atom, a halogen atom, a nitro group, an alkoxy group, or a C 1 to C 20 structure;
A group selected from a hydroxyl group, an ether group, an ester group, a (meth) acryloyl group, an epoxy group, or an aliphatic group which may have an allyl group, a phenyl group, a phenoxy group and a thiophenoxy group. . And R 1 , R 2 and R 3 are each an ether group, an ester group, an aliphatic group which may have a carbamoyl group in the structure of C 1 to C 20 , a cyclohexyl group and a halogenated phenyl group. , Cyanophenyl group, nitrophenyl group, alkylphenyl group, alkoxyphenyl group, benzyl group,
A halogenated benzyl group, a cyanobenzyl group, a nitrobenzyl group, an alkylbenzyl group, an alkoxybenzyl group and a group represented by the formula (3): (In the formula, R 16 is a hydrogen atom, a C 1 to C 5 alkyl group,
It is a group selected from a C 1 to C 5 alkoxy group, a nitro group and a cyano group, and X is the same as X in the formula (1). ) Is a group selected from
4 and R 5 are each a group selected from a hydrogen atom, a C 1 to C 5 alkyl group, a C 1 to C 5 alkoxy group, a nitro group and a cyano group, and n is 1 to 10,
m is 1 to 4, Z is formula (4), formula (5) or formula (6) (In the formula, M is a phosphorus atom, a boron atom, an arsenic atom or an antimony atom, Q is a halogen atom, p is an integer of 4 to 6, B is a boron atom, and a and b are 0 to 0.
Is an integer in the range of 4, where a + b is 4, the symbol Y represents a halogen atom (chlorine or fluorine) when a is 0 to 3, and when a is 0 to 2 Is O
It can also represent an H group. R is CF 3 , NO 2 , CN
Represents a phenyl group substituted with at least one electron-withdrawing group or a phenyl group substituted with at least two halogen atoms (especially fluorine). )} The sulfonium salt shown by these.
らなる重合開始剤(B)2. A polymerization initiator (B) comprising a sulfonium salt represented by the formula (1).
の光重合開始剤(B)を含有することを特徴とするエネ
ルギー線硬化性組成物。3. An energy ray-curable composition comprising a cationically polymerizable substance (A) and the photopolymerization initiator (B) according to claim 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11441896A JPH09278813A (en) | 1996-04-12 | 1996-04-12 | Photopolymerization initiator, energy radiation-curable composition containing the same and cured product thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11441896A JPH09278813A (en) | 1996-04-12 | 1996-04-12 | Photopolymerization initiator, energy radiation-curable composition containing the same and cured product thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09278813A true JPH09278813A (en) | 1997-10-28 |
Family
ID=14637216
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JP11441896A Pending JPH09278813A (en) | 1996-04-12 | 1996-04-12 | Photopolymerization initiator, energy radiation-curable composition containing the same and cured product thereof |
Country Status (1)
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JP (1) | JPH09278813A (en) |
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EP1849808A4 (en) * | 2005-02-17 | 2012-10-03 | Asahi Kasei Chemicals Corp | Cationically curable composition and cured product thereof |
JP5084497B2 (en) * | 2005-02-17 | 2012-11-28 | 旭化成ケミカルズ株式会社 | Cationic curable composition and cured product thereof |
WO2011040531A1 (en) | 2009-10-01 | 2011-04-07 | 日立化成工業株式会社 | Material for organic electronics, organic electronic element, organic electroluminescent element, display element using organic electroluminescent element, illuminating device, and display device |
WO2011132702A1 (en) | 2010-04-22 | 2011-10-27 | 日立化成工業株式会社 | Organic electronic material, polymerization initiator and thermal polymerization initiator, ink composition, organic thin film and production method for same, organic electronic element, organic electroluminescent element, lighting device, display element, and display device |
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