JPH0927715A - Dielectric multilayered substrate having integrated microwave circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the electric power loss, to improve the transmission efficiency, and to reduce the size and weight by integrating an antenna part and a transmitting and receiving circuit part and then shortening a transmission line. SOLUTION: On one surface of the dielectric three-layered substrate, the antenna part (inverted F type micrstrip line antenna) 18 is formed and connected to the transmitting and receiving circuit part 19 through the intermediary of a through hole 16. A matching circuit (M/C) is used as the circuit part 19 and then the frequency band of the antenna can be varied. Further, the dielectric constant of the dielectric of the dielectric three-layered substrate is made higher to reduce the size and weigh. Further, the circuit part 19 of the integrated microwave circuit is composed of a power amplification art, an antenna common-use part, and the matching circuit part and mounted directly on the multi-layered substrate in one body, so the transmission line can be shortened, the number of pads can be decreased, and the electric power loss becomes reducible. Further, the circuit part 19 is constituted on the opposite side of the three- layered substrate from the antenna part 18, so mutually interference is never caused.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric multilayer substrate having a power amplifier, an antenna duplexer, a matching circuit and a microwave circuit in which an antenna is integrated, which are used in a portable telephone device.

[0002]

2. Description of the Related Art Conventionally, a transmission / reception circuit of a mobile phone has a power amplifier, an antenna duplexer, and a matching circuit mounted on a circuit board by soldering, and the antenna is connected to the board through a power supply terminal or a coaxial cable. It is installed in the case.

[0003]

However, in the transmission / reception circuit of the above-mentioned conventional mobile phone, since the circuit pattern of the board, the pads, the discrete parts, etc. are connected by solder, the transmission line as a whole is very long. Therefore, the power loss becomes large. Further, there is a problem that it is difficult to reduce the size and weight due to the weight of each component.

The present invention has been made to solve the above problems.
An object of the present invention is to provide a dielectric multilayer substrate having an integrated microwave circuit that can reduce power loss due to shortening of a transmission line and can be reduced in size and weight.

[0005]

In order to achieve the above object, the present invention provides: (1) In a dielectric multilayer substrate having an integrated microwave circuit of a mobile phone device, at least three conductor layers and A multi-layer substrate composed of at least two dielectric layers sandwiched therebetween, an aerial part using a microstrip line formed on one surface of the multi-layer substrate, and directly mounted on the other surface of the multi-layer substrate. A transmission / reception circuit section is provided.

(2) In the dielectric multilayer substrate having the integrated microwave circuit as described in (1) above, the antenna part is an inverted F type microstrip antenna. (3) In the dielectric multilayer substrate having the integrated microwave circuit according to (1) or (2), the layer next to the conductor layer forming the antenna of the multilayer substrate forms a ground layer. It was done.

(4) In the dielectric multilayer substrate having the integrated microwave circuit as described in (1), (2) or (3) above, the transmission / reception circuit section has a power amplifier section, an antenna duplexer section, and a matching circuit section. And a frequency band can be controlled by this matching circuit section. (5) In the dielectric multilayer substrate having the integrated microwave circuit according to (1), (2), (3) or (4) above,
Through holes are used for supplying power to the antenna and connecting the microstrip antenna.

(6) The above (1), (2), (3),
In the dielectric multilayer substrate having the integrated microwave circuit as described in (4) or (5), the height of the antenna part can be controlled by the dielectric constant of the substrate.

[0009]

[Action]

(1) According to the dielectric multilayer substrate having the integrated microwave circuit of claim 1, the antenna line and the transmission / reception circuit unit are integrated, so that the transmission line is shortened as compared with the conventional transmission / reception system. It is possible to reduce power loss, improve transmission efficiency, and reduce size and weight.

Further, since the transmission / reception circuit section is formed on the opposite side of the antenna section of the dielectric three-layer substrate, mutual interference does not occur. (2) According to the dielectric multilayer substrate having the integrated microwave circuit of claim 2, the antenna part is an inverted F-type microstrip antenna, and is grounded at the intermediate layer.
It is possible to reliably prevent interference between the antenna section and the transmission / reception circuit section.

(3) According to the dielectric multilayer substrate having the integrated microwave circuit of the third aspect, the layer next to the conductor layer constituting the antenna of the multilayer substrate constitutes the ground layer. Therefore, it has a simple structure and is compact.
It is possible to eliminate the interference between the antenna section and the transmission / reception circuit section. (4) According to the dielectric multilayer substrate having the integrated microwave circuit of claim 4, the transmission / reception circuit section includes a power amplifier section, an antenna duplexer section, and a matching circuit section, and the matching circuit section provides a frequency band. Since it is controllable, it is possible to easily control the frequency band.

(5) According to the dielectric multilayer substrate having the integrated microwave circuit of the fifth aspect, through holes are used for supplying power to the antenna section and connecting the microstrip antenna section, which is compact. It is possible to obtain a dielectric multilayer substrate having a simple integrated microwave circuit. (6) According to the dielectric multilayer substrate having the integrated microwave circuit according to claim 6, since the height of the antenna can be controlled by the permittivity of the substrate, the frequency band used for the mobile phone device can be controlled. Accordingly, it is possible to obtain a dielectric multilayer substrate having an integrated microwave circuit with optimum dimensions.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view of a dielectric three-layer substrate having an integrated microwave circuit according to the first embodiment of the present invention. In FIG. 1, a three-layer dielectric substrate 1 includes three conductor layers including an upper surface conductor layer 2, an intermediate conductor layer 3 and a lower surface conductor layer 4, and an upper surface conductor layer 2 and an intermediate conductor layer 3 thereof.
2 composed of a first dielectric layer 5 sandwiched between them, an intermediate conductor layer 3 and a second dielectric layer 6 sandwiched between a lower surface conductor layer 4
Layers of dielectric layers. The intermediate conductor layer 3 is a ground layer.

The lower surface conductor layer 4 of the three-layer dielectric substrate 1 is composed of a transmission / reception circuit section (pattern) 7, and the transmission / reception circuit section 7 is a power amplifier section (PA) directly mounted and an antenna duplexer. Unit (Dup), matching circuit unit (M / C), and the like. Further, the antenna 8 is formed on the upper surface conductor layer 2 of the dielectric three-layer substrate 1, and here the antenna 8 constitutes an inverted F-type microstrip line antenna.

The antenna part (inverted F-type microstrip line antenna) 8 and the transmission / reception circuit part 7 are the dielectric three-layer substrate 1
Is formed by etching the conductor foils on both sides. By separating the antenna section 8 and the transmitter / receiver circuit section 7 on both sides and providing the ground plane on the intermediate conductor layer 3, the influence of the radio wave radiated from the antenna section 7 and the leakage radio wave from the directly mounted parts of the transmitter / receiver circuit section 6 This is a very effective method because they are not affected by each other.

The method of manufacturing the integrated microwave circuit according to the first embodiment of the present invention will be described below. FIG. 2 is a sectional view and a flow chart of a manufacturing process of a dielectric three-layer substrate having an integrated microwave circuit according to the first embodiment of the present invention. (1) First, in step S1, the double-sided conductor foil-clad substrate 10 in which the conductor foils 11 and 12 are formed on both surfaces of the dielectric substrate is formed.

(2) Next, in step S2, a ground pattern 11A is formed by etching the ground surface side, here the conductor foil 11. (3) Next, in step S3, the lower surface of the dielectric substrate 13 having the conductor foil 14 formed on the upper surface thereof is pressure-bonded to the ground pattern 11A surface side of the double-sided conductor foil-clad substrate 10 to produce a dielectric three-layer substrate 15. To do.

(4) Next, in step S4, through holes 16 are formed in the dielectric three-layer substrate 15, and through hole plating 17 is performed on the inner surface thereof. (5) Next, in step S5, the dielectric three-layer substrate 1
5 Conductive foil 14 and conductive foil 12 on both sides are etched,
Antenna part (inverted F type microstrip line antenna) 1
8 and a transmitting / receiving circuit section 19 are formed.

(6) Finally, in step S6, resist processing is performed to obtain the dielectric three-layer substrate 15 of the integrated microwave circuit. By mounting components on this dielectric three-layer substrate, an antenna integrated microwave circuit using the dielectric three-layer substrate can be obtained. FIG. 3 is a configuration diagram of a microstrip line antenna of an integrated microwave circuit formed on a dielectric three-layer substrate according to the first embodiment of the present invention. FIG. 3B is a top view of the body type microwave circuit, and FIG. 3B is a sectional view taken along the line AA ′ of FIG.

As shown in these figures, an antenna part (inverse F type microstrip line antenna) 18 is formed on one surface of a dielectric three-layer substrate, and the through hole 1
It is connected to the transmission / reception circuit section 19 via 6. The operating frequency of the antenna can be easily changed by the dimensions of a, b, c, d shown in FIGS. 3 (a) and 3 (b).

Further, by using a matching circuit (M / C) for the transmission / reception circuit section 19, the frequency band of the antenna can be changed. Further, by making the dielectric material of the dielectric three-layer substrate have a high dielectric constant, it is possible to further reduce the size and weight. FIG. 4 is a configuration diagram of a transmission / reception circuit section of an integrated microwave circuit of a dielectric three-layer substrate showing a first embodiment of the present invention.

As shown in this figure, the power amplifier section 19
A, the antenna duplexer section 19B and the matching circuit section 19C are directly mounted on the multilayer substrate. As a result, the transmission line can be shortened and the number of pads can be reduced, so that the power loss can be reduced and the size and weight can be reduced.

In the first embodiment described above, the inverted F-type microstrip antenna is used as the antenna.
Other embodiments can be shown as other antennas. FIG.
FIG. 6 is a configuration diagram of a dielectric multilayer substrate having an integrated microwave circuit showing a second embodiment of the present invention, showing a cross section of an inverted L-type antenna. FIG. 6 shows various antennas that are shortened in a meandering manner.

In FIG. 5, the dielectric three-layer substrate 21 includes an upper surface conductor layer 22, an intermediate conductor layer 23, and a lower surface conductor layer 24.
And a first dielectric layer 25 sandwiched between the upper surface conductor layer 22 and the intermediate conductor layer 23, and a sandwiched between the intermediate conductor layer 23 and the lower surface conductor layer 24. It is composed of two dielectric layers including the second dielectric layer 26. The intermediate conductor layer 23 is a ground layer.

The lower surface conductor layer 24 of the dielectric three-layer substrate 21 is composed of a transmission / reception circuit section (pattern) 27, and the transmission / reception circuit section 27 is directly mounted on the power amplification section (P).
A), antenna duplexer section (Dup), matching circuit section (M /
C) etc. Further, the antenna 28 is formed on the upper surface conductor layer 22 of the dielectric three-layer substrate 21, and here the antenna 28 constitutes an inverted L-shaped microstrip line antenna.

Further, as shown in FIG. 6, it is also possible to use an inverted L-type or inverted F-type antenna which is shortened in a meandering shape.
That is, as shown in FIG. 6 (a), a crank-shaped microstrip line antenna 28A or
As shown in (b), a zigzag-shaped microstrip line antenna 28B is used, or as shown in FIG. 6 (c), a wavy-shaped microstrip line antenna 28C is used. Good.

FIG. 7 is a block diagram of a dielectric multilayer substrate having an integrated microwave circuit showing a third embodiment of the present invention, and FIG. 8 shows various antennas thereof. In FIG. 7, the dielectric three-layer substrate 31 includes three conductor layers including an upper surface conductor layer 32, an intermediate conductor layer 33, and a lower surface conductor layer 34, and between the upper surface conductor layer 32 and the intermediate conductor layer 33. The sandwiched first dielectric layer 35, intermediate conductor layer 33 and lower surface conductor layer 34
The second dielectric layer 36 is sandwiched between the two dielectric layers. The intermediate conductor layer 33 is a ground layer.

Lower surface conductor layer 34 of the dielectric three-layer substrate 31
Is composed of a transmission / reception circuit section (pattern) 37, and the transmission / reception circuit section 37 is composed of a power amplifier section (PA) directly mounted, an antenna duplexer section (Dup), a matching circuit section (M / C), and the like. ing. Further, the upper surface conductor layer 32 of the dielectric three-layer substrate 31 has an antenna part 38 extending outward.

The antenna 38 may be a monopole antenna 38A, as shown in FIG.
As shown in FIG. 8B, a crank-shaped microstripline antenna 38B is used, or as shown in FIG. 8C, a zigzag-shaped microstripline antenna 3 is used.
8C, or as shown in FIG. 8D, a corrugated microstripline antenna 38D,
As shown in (e), a microstripline antenna 38E having a hybrid structure of a straight line and a crank can be used.

FIG. 9 is a block diagram of a dielectric multilayer substrate having an integrated microwave circuit showing a fourth embodiment of the present invention.
In this figure, the dielectric three-layer substrate 41 includes a three-layer conductor layer including an upper surface conductor layer 42, an intermediate conductor layer 43, and a lower surface conductor layer 44, and between the upper surface conductor layer 42 and the intermediate conductor layer 43. The sandwiched first dielectric layer 45 and the intermediate conductor layer 4
3 and the lower dielectric layer 4 sandwiched between the lower surface conductor layers 44
6 and two dielectric layers. The intermediate conductor layer 43 is a ground layer.

The lower surface conductor layer 44 of the dielectric three-layer substrate 41 is composed of a transmission / reception circuit section (pattern) 47, and the transmission / reception circuit section 47 is directly mounted on the power amplification section (P).
A), antenna duplexer section (Dup), matching circuit section (M /
C) etc. Further, the antenna 48 is formed on the upper surface conductor layer 42 of the dielectric three-layer substrate 41, and the antenna 48 here constitutes an inverted F-type microstrip line antenna.

Further, the transmission / reception circuit section 47 includes the power amplifier 4
7A, the antenna duplexer 47B, and the matching circuit 47C may be composed of discrete parts. In all of the above-mentioned embodiments, the dielectric three-layer substrate has been described, but it goes without saying that a dielectric multilayer substrate having three or more layers can be used. Further, the present invention is not limited to the above-described embodiments, and various modifications are possible based on the gist of the present invention, and these are not excluded from the scope of the present invention.

[0033]

As described above, according to the present invention, the following effects can be obtained. (1) According to the invention described in claim 1, by integrating the antenna section and the transmission / reception circuit section, as compared with the conventional transmission / reception system, the transmission line is shortened to reduce the power loss and improve the transmission efficiency. The size and weight can be reduced.

Furthermore, since the transmission / reception circuit section is formed on the opposite side of the antenna section of the three-layer dielectric substrate, they do not interfere with each other. (2) According to the second aspect of the invention, the antenna section is an inverted F-type microstrip antenna, and grounding is performed in the intermediate layer, whereby interference between the antenna section and the transmission / reception circuit section can be reliably prevented. .

(3) According to the third aspect of the invention, since the layer next to the conductor layer forming the antenna of the multilayer substrate forms the ground layer, the structure is simple and compact. In addition, it is possible to eliminate the interference between the antenna section and the transmission / reception circuit section. (4) According to the invention of claim 4, the transmission / reception circuit section includes a power amplifier section, an antenna duplexer section, and a matching circuit section.
Since the frequency band can be controlled by this matching circuit unit, the frequency band can be easily controlled.

(5) According to the invention of claim 5, through holes are used for feeding the antenna and connecting the microstrip antenna. Therefore, the dielectric having a compact integrated microwave circuit is used. A multilayer substrate can be obtained. (6) According to the invention described in claim 6, since the height of the antenna can be controlled by the dielectric constant of the substrate, the integrated microwave having the optimum size according to the frequency band used in the mobile phone device. A dielectric multilayer substrate having a circuit can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a dielectric three-layer substrate having an integrated microwave circuit according to a first embodiment of the present invention.

FIG. 2 is a sectional view and a flow chart of a manufacturing process of a dielectric three-layer substrate having an integrated microwave circuit according to the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a microstrip line antenna of an integrated microwave circuit formed on a dielectric three-layer substrate showing the first embodiment of the present invention.

FIG. 4 is a configuration diagram of a transmission / reception circuit unit of an integrated microwave circuit of a dielectric three-layer substrate showing the first embodiment of the present invention.

FIG. 5 is a configuration diagram of a dielectric multilayer substrate having an integrated microwave circuit according to a second embodiment of the present invention.

FIG. 6 is a diagram showing an inverted L-type or inverted F-type antenna obtained by shortening the integrated microwave circuit according to the second embodiment of the present invention in a meandering shape.

FIG. 7 is a configuration diagram of a dielectric multilayer substrate having an integrated microwave circuit according to a third embodiment of the present invention.

FIG. 8 is a diagram showing various antennas of an integrated microwave circuit showing a third embodiment of the present invention.

FIG. 9 is a configuration diagram of a dielectric multilayer substrate having an integrated microwave circuit according to a fourth embodiment of the present invention.

[Explanation of symbols]

1, 15, 21, 31, 41 Dielectric three-layer substrate 2, 22, 32, 42 Upper surface conductor layer 3, 23, 43 Intermediate conductor layer 4, 24, 34, 44 Lower surface conductor layer 5, 25, 45 1st dielectric layer 6,26,46 2nd dielectric layer 7,19,27,37,47 Transmission / reception circuit part 8,18,28,38,48 Antenna part 10 Double-sided conductor foil-clad substrate 11,12,14 Conductor foil 11A Ground pattern 13 Dielectric substrate 16 Through hole 17 Through hole plating 19A Power amplifier part 19B Antenna duplexer part 19C Matching circuit part 28A, 38B Crank-shaped microstrip line antenna 28B, 38C Zigzag microstrip line antenna 28C , 38D Wave-shaped microstrip line Antenna 38A Monopole antenna 38E Straight line and crank type Hybrid structure microstrip line antenna 47A power amplifier 47B antenna duplexer 47C matching circuit

Claims (6)

[Claims] 1. A dielectric multilayer substrate having an integrated microwave circuit for a mobile phone device, comprising: (a) a multilayer substrate composed of at least three conductor layers and at least two dielectric layers sandwiched therebetween. And (b) an antenna part using a microstrip line formed on one surface of the multilayer substrate, and (c) a transceiver circuit part directly mounted on the other surface of the multilayer substrate. And a dielectric multilayer substrate having an integrated microwave circuit. 2. The dielectric multilayer substrate having an integrated microwave circuit according to claim 1, wherein the antenna part is an inverted F-type microstrip antenna, and a dielectric multilayer having an integrated microwave circuit. substrate. 3. The dielectric multilayer substrate having the integrated microwave circuit according to claim 1, wherein the layer next to the conductor layer forming the antenna of the multilayer substrate forms a ground layer. A dielectric multilayer substrate having an integrated microwave circuit characterized by: 4. The dielectric multilayer substrate having the integrated microwave circuit according to claim 1, 2 or 3, wherein the transmitting / receiving circuit section includes a power amplifier section, an antenna duplexer section, and a matching circuit section. A dielectric multilayer substrate having an integrated microwave circuit configured to control a frequency band by a section. 5. The dielectric multilayer substrate having the integrated microwave circuit according to claim 1, wherein a through hole is used for supplying power to the antenna and connecting the microstrip antenna. And a dielectric multilayer substrate having an integrated microwave circuit. 6. A dielectric multilayer substrate having an integral microwave circuit according to claim 1, 2, 3, 4 or 5, wherein the height of the antenna part can be controlled by the permittivity of the substrate. A dielectric multilayer substrate having a microwave circuit.