JPH09223897A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of shortening tact time required for changing nozzles for vacuum-attracting electronic components and thereby capable of improving mount efficiency. SOLUTION: A nozzle 10 is inserted and stocked into a hole 12 formed in a folder 11 of a nozzle stocker 5. The folder 11 is supported by a rod 14 of a cylinder 13. A transfer head 9 moves to a position above the nozzle stocker 5. The head 9 stores the nozzle 10 in the hole 12 and picks up another nozzle 10 by moving vertically. In this case, the rod 14 of the cylinder 13 is protruded to thereby raise the folder 11. By so doing, it is possible to shorten the stroke of vertical movement of the moving head 9 required for changing nozzles and to thus shorten tact time required for changing nozzles.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for transferring and mounting electronic components on a substrate.

[0002]

2. Description of the Related Art An electronic component mounting apparatus is designed so that an electronic component provided in a parts feeder is vacuum-sucked by a nozzle of a transfer head, picked up, and transferred and mounted on a substrate positioned in a positioning portion. In the parts feeder,
Equipped with various sizes of electronic components of different types,
Therefore, the nozzle of the transfer head is automatically replaced according to the type of electronic component to be picked up. For this reason, this type of electronic component mounting apparatus is equipped with a nozzle stocker in which various types of nozzles are stocked, and the transfer head moves above the nozzle stocker and performs vertical movements there to automatically move the nozzles. It is designed to be exchanged.

[0003]

In this type of electronic component mounting apparatus, the transfer head moves between the parts feeder and the substrate to transfer and mount the electronic components provided in the parts feeder onto the substrate. However, in the moving path of the transfer head, there are components that are arranged at relatively high positions such as the components that form the positioning portion of the substrate, and nozzles that project downward from the transfer head are In order to avoid hitting high-positioned parts, the moving path of the transfer head is set to a considerably high position.

Therefore, as described above, when the transfer head moves above the nozzle stocker and moves up and down there to perform automatic nozzle replacement, the stroke of the up and down operation of the transfer head becomes considerably long. The tact time required for the automatic replacement of the device also becomes long, and there is a problem in that the mounting efficiency of electronic components does not increase. Especially when there are many types of electronic components to be mounted on the board, the nozzles are frequently replaced.In such a case, the long takt time required for automatic nozzle replacement means that the electronic components can be mounted efficiently. It is extremely disadvantageous.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus capable of shortening the tact time required for automatic nozzle replacement and increasing the mounting efficiency of electronic components.

[0006]

To this end, an electronic component mounting apparatus according to the present invention comprises a positioning portion for a substrate, a nozzle stocker arranged between the positioning portion and a parts feeder,
The vertical movement means for moving the nozzle up and down, and the transfer head for transferring and mounting the electronic component provided in the parts feeder on the substrate positioned in the positioning portion are provided.

[0007]

According to the present invention having the above-described structure, when the transfer head moves above the nozzle stocker in order to replace the nozzle, the vertical movement means is driven to raise the nozzle stocker. This makes it possible to shorten the vertical stroke of the transfer head for replacing the nozzle,
The tact time can be shortened and the nozzle can be replaced at high speed.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a nozzle stocker provided in the electronic component mounting apparatus, and FIG. 3 is a partial sectional view of the electronic component mounting apparatus. Is.

In FIG. 1, a guide rail 2 is installed at the center of the upper surface of a base 1, and a substrate 3 is positioned on the guide rail 2. That is, the guide rail 2 serves as a positioning portion for the board 3. A large number of parts feeders 4 are arranged side by side on both sides of the guide rail 2. Each parts feeder 4 is equipped with various types of electronic components. A nozzle stocker 5 and a recognition unit 6 are arranged between the guide rail 2 and the parts feeder 4.

A pair of left and right Y tables 7 are installed on the base 1, and an X table 8 is installed on the Y table 7. Inside the Y table 7 and the X table 8,
A moving mechanism such as a feed screw is built in. A transfer head 9 is held on the X table 8. When the X table 8 and the Y table 7 are driven, the transfer head 9 moves to X
The electronic parts of the parts feeder 4 are transferred and mounted on the board 3. As shown in FIGS. 2 and 3,
The transfer head 9 is provided with three nozzles 10, and the electronic components are vacuum-sucked and held by the lower end portions of the respective nozzles 10. Further, inside the transfer head 9, a nozzle holding portion 9a that detachably holds the nozzle 10 and a vertical movement mechanism that causes the nozzle 10 (nozzle holding portion 9a) to perform vertical movement, and the nozzle 10 (nozzle holding portion 9a). It has a built-in rotating mechanism that rotates the shaft around its axis. The vertical movement mechanism and the rotation mechanism are well-known mechanisms, and their explanations are omitted.

In FIG. 2, the nozzle stocker 5 mainly comprises a rectangular holder 11. A large number of holes 12 are formed in the holder 11, and a large number of nozzles 10 are inserted and held in each hole 12 in a horizontal row. The holder 11 is supported by the rod 14 of the cylinder 13, and rises when the rod 14 projects and descends when the rod 14 withdraws. That is, the cylinder 13 serves as a means for moving the nozzle stocker 5 up and down.

A locking member 15 having a hook-shaped cross section is mounted on the shoulder portion of the holder 11. A cylinder 16 is attached to an end surface of the holder 11, and a rod 17 of the cylinder 16 is attached to the locking member 1.
5. Therefore, when the rod 17 is projected and retracted, the locking member 15 moves forward and backward with respect to the holder 11. The nozzle 10 has a collar portion 18. Normally, the rod 17 of the cylinder 16 is retracted so that the upper side 15a of the locking member 15 is located on the holder 11, and in this state, the upper side 15a is located on the edge of the flange 18. Rod 17
When is protruded, the upper side 15a retracts to the side of the holder 11, thereby opening the collar portion 18. Reference numeral 10a denotes a held portion formed on the upper portion of the nozzle 10, which is detachably held by the nozzle holding portion 9a. Note that the configuration in which the nozzle holding portion 9a detachably holds the held portion 10a is well known, and therefore the description thereof is omitted.

Brackets 20 are provided on both end surfaces of the holder 11,
21 are erected. A light emitting element 23 is mounted on the inner surface of the bracket 20, and a light receiving element 24 is mounted on the inner surface of the bracket 21. The light emitted from the light emitting element 23 is incident on the light receiving element 24, and its optical path L passes above the held portion 10a of the nozzle 10 which is accommodated in the holder 11 aligned in a horizontal row. Therefore nozzle 1
When the stock state is abnormal due to, for example, 0 floating from the holder 11, the optical path L is set to the held portion 10a of the nozzle 10.
The light is blocked by, and the light does not enter the light receiving element 24. Thereby, the abnormality of the stock state of the nozzle 10 can be detected.

In FIG. 3, a belt 30 of a belt conveyor that conveys the substrate 3 and a clamper 31 that clamps and fixes the substrate 3 from the left and right are provided above the guide rail 2. Reference numeral 32 denotes a pressing piece having a hook-shaped cross section that presses the upper surface of the side portion of the substrate 3 from above, and the lower end portion thereof is connected to an arm 35 to which a rod 34 of a cylinder 33 is attached. Therefore, when the rod 34 retracts, the pressing piece 3
2 descends and presses the upper surface of the substrate 3. In this way, the electronic component P is mounted on the substrate 3 by the transfer head 9 while the substrate 3 is being held down. Further, when the rod 34 projects, the pressing piece 32 rises and the pressing state of the substrate 3 is released. In this released state, the substrate 3 is conveyed by the conveyor 30.

The height H1 of the upper surface of the substrate 3 (that is, the mounting level of the electronic component P) and the height H of the upper surface of the parts feeder 4
2 (that is, the pickup level of the electronic component P) is almost equal. H3 is the level of the upper surface of the uppermost member among the members positioned between the substrate 3 and the parts feeder, and in the present embodiment, the upper surface of the pressing piece 32 corresponds to this. H4 is the level of the upper surface of the uppermost member of the members that move up and down together with the holder 11 (including the nozzle 10 held by the holder 11), and in the present embodiment, the upper surfaces of the brackets 20 and 21 are the same. Hits. H5
Is the lower limit level H of the lifting stroke of the nozzle holding portion 9a.
5 In the present embodiment, the nozzle holding portion 9a can be lowered to the height at which the lower end portion of the nozzle 10 held by the nozzle holding portion 9a contacts the upper surface H1 of the substrate 3.

Q is the locus of the lower end of the nozzle 10 of the transfer head 9 for transferring and mounting the electronic component P provided on the parts feeder 4 on the substrate 3. This locus Q is the nozzle 1
The electronic component P sucked and held at the lower end of 0 is the pressing piece 32.
The height H3 of the upper surface of the pressing piece 32 is set to be considerably higher so as not to collide with. Further, in the state where the rod 14 of the cylinder 13 is retracted and the holder 11 is in the lowered position, the height H4 of the upper surfaces of the brackets 20 and 21 is set to be slightly lower than the height H3 of the pressing piece 32. The electronic component P sucked and held by the nozzle 10 of the transfer head 9 which moves in Q does not collide with the nozzle 10 stocked in the nozzle stocker 5 and the upper ends of the brackets 20 and 21. As described above, the nozzle 10
The moving path (trajectory Q) of is set to be quite high.

The electronic component mounting apparatus is constructed as described above, and its operation will be described below. In FIG. 1, when the X table 8 and the Y table 7 are driven, the transfer head 9 moves above the parts feeder 4, and the nozzle 10 moves up and down there so that the parts feeder 4 moves.
The electronic component P provided in the above is vacuum-sucked to the lower end portion of the nozzle 10 and picked up.

Next, the transfer head 9 moves above the recognition unit 6 and recognizes the position of the electronic component P vacuum-sucked to the lower end of the nozzle 10. Next, the transfer head 9 moves above a predetermined coordinate of the substrate 3, and the nozzle 10 again moves up and down there to mount the electronic component P on the substrate 3.
During the above operation, the nozzle stocker 5 is retracted to the lowered position shown by the solid line in FIG. 3 so as not to hinder the movement of the nozzle 10 of the transfer head 9.

When the nozzle 10 held by the transfer head 9 is replaced, the transfer head 9 moves above the nozzle stocker 5. Along with this, the rod 14 of the cylinder 13
Project and the holder 11 rises to the position shown by the chain line in FIG. At this time, in the holder 11, the held portion 10a of the nozzle 10 held by the holder 11 is changed to the nozzle holding portion 9a.
To a position higher than the lower limit level H5 of. Then, the nozzle holding portion 9a of the transfer head 9 descends, and the used nozzle 10 held by the nozzle holding portion 9a is inserted into the hole 12. In this case, the locking member 15 is located laterally (right in the drawing) so as not to hinder the insertion operation of the nozzle 10 into the hole 12.
Have retired to. Next, the nozzle holder 9a rises,
At this time, the rod 17 of the cylinder 16 is retracted,
The upper side 15a of the locking member 15 is located on the edge of the collar portion 18 inserted into the hole portion 12, and therefore the collar portion 18 is formed.
The nozzle 10 held by the upper side 15a is the nozzle holding portion 9
It is forcibly separated from a and only the nozzle holding portion 9a rises.

After the nozzle 10 is collected in the hole 12 as described above, the transfer head 9 is then moved to the nozzle stocker 5
Then, the new nozzle 10 is held by moving above the desired nozzle 10 and performing the vertical movement again by the nozzle holding portion 9a. In this case, the upper side 15a of the locking member 15 is withdrawn laterally so that the nozzle holding portion 9a does not obstruct the pick-up of the newly held nozzle 10.

When the automatic replacement of the nozzle 10 is completed as described above, the transfer head 9 resumes the work of mounting the electronic component P on the substrate 3, and the rod 14 of the cylinder 13
Is retracted, and the nozzle stocker 5 descends to the position shown by the solid line in FIG.

[0022]

According to the present invention, since the nozzle stocker for stocking the nozzle is provided with the vertical moving means, the nozzle stocker can be raised when the nozzle is replaced. Therefore, the stroke of the vertical movement of the transfer head for nozzle replacement can be shortened, and the takt time required for nozzle replacement can be shortened, so that the mounting efficiency of electronic components can be increased.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a nozzle stocker provided in the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is a partial sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 2 Guide rail (positioning part of board) 3 Board 4 Parts feeder 5 Nozzle stocker 7 Y table 8 X table 9 Transfer head 10 Nozzle 11 Holder 12 Hole 13 Cylinder 15 Locking member 16 Cylinder

Claims (1)

[Claims] 1. A positioning part of a substrate, a nozzle stocker arranged between the positioning part and a parts feeder, a vertical moving means for moving the nozzle stocker up and down, and an electronic component provided in the parts feeder. An electronic component mounting apparatus comprising: a transfer head that transfers and mounts the substrate on the substrate positioned by the positioning unit.