JPH09212303A - Photoconductor and optical position detector - Google Patents

Photoconductor and optical position detector

Info

Publication number
JPH09212303A
JPH09212303A JP1869596A JP1869596A JPH09212303A JP H09212303 A JPH09212303 A JP H09212303A JP 1869596 A JP1869596 A JP 1869596A JP 1869596 A JP1869596 A JP 1869596A JP H09212303 A JPH09212303 A JP H09212303A
Authority
JP
Japan
Prior art keywords
light
receiving
light emitting
emitting
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1869596A
Other languages
Japanese (ja)
Other versions
JP3682109B2 (en
Inventor
Takashi Kiou
孝志 鬼王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOWA BIJIYUARU SYST KK
Dowa Holdings Co Ltd
Original Assignee
DOWA BIJIYUARU SYST KK
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DOWA BIJIYUARU SYST KK, Dowa Mining Co Ltd filed Critical DOWA BIJIYUARU SYST KK
Priority to JP1869596A priority Critical patent/JP3682109B2/en
Publication of JPH09212303A publication Critical patent/JPH09212303A/en
Application granted granted Critical
Publication of JP3682109B2 publication Critical patent/JP3682109B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To gain an enough distance between a light emitting element and a receiving element by adopting miniaturized chip type light emitting and receiving elements with a low output. SOLUTION: Chip type light emitting elements 32 and chip type light receiving elements 33 are mutually opposedly loaded on a substrate 31 in a plane. A frame-like photoconductor 21 for guiding light is fitted to the substrate 31. The photoconductor 21 is integrally formed and many slits for preventing the diffusion and creeping of light and removing a transmission loss are formed in the outer periphery of the photoconductor 21 and light emitting parts 15 and light receiving parts 16 are formed by the slits 22. Reflection parts 23 are formed on respective light emitting and receiving parts 15, 16 so that light from the light emitting element 32 is made incident from the lower face of the light emitting part 15 and the incident light is received by the light receiving element 33 from the lower face of the light receiving part 16. Gap parts 25 for reducing the intrusion of disturbant light into the photoconductor 21 are formed on the ways between the light emitting and receiving parts 15, 16, one face of each gap part 25 is formed in a curved surface 26 to form a light converging part 24 for converging light upon the light emitting and receiving parts 15, 16.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は光学的タッチパネル
に使用する導光体及び光学的位置検出装置に係り、特
に、受発光量は少ないが、部品の実装コスト、装置厚み
に有利になるチップタイプの受発光素子の使用を可能と
し、装置の省電力化、耐外来ノイズ化、さらには大型サ
イズ化をも可能にしたものに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light guide used in an optical touch panel and an optical position detecting device, and more particularly to a chip type which has a small amount of received and emitted light but is advantageous in mounting cost of parts and device thickness. The present invention makes it possible to use the light emitting / receiving element, reduce the power consumption of the device, reduce external noise, and increase the size.

【0002】[0002]

【従来の技術】図7に示すように、一対の発光素子2と
受光素子3とを所定距離離間し、これを複数対配置させ
て検出パネル1を構成し、各一対の発光素子2と受光素
子3を順次走査して各発光素子2から対応する受光素子
3に向けて発光された光の物体4による遮光の有無を検
出することにより、光学的タッチパネル表面5上の物体
4の位置または有無を検出する光学的位置検出装置が知
られている。
2. Description of the Related Art As shown in FIG. 7, a pair of light emitting elements 2 and light receiving elements 3 are separated by a predetermined distance, and a plurality of pairs are arranged to form a detection panel 1. The position or presence or absence of the object 4 on the optical touch panel surface 5 is detected by sequentially scanning the elements 3 and detecting whether or not the light emitted from each light emitting element 2 toward the corresponding light receiving element 3 is blocked by the object 4. There is known an optical position detecting device for detecting the.

【0003】前記検出パネル1に配置される受発光素子
2、3には、図8に示すような比較的大型で受発光量の
大きな略紡錘形タイプの受発光素子6(図8(a)、
(b))や、側面に受発光部のあるサイドビュータイプ
の受発光素子7(図8(c))といったリード端子8を
有するディスクリートタイプが一般的に使用されてい
る。
As shown in FIG. 8, the light receiving and emitting elements 2 and 3 arranged on the detection panel 1 are of a relatively spindle type and a large spindle type light receiving and emitting element 6 (FIG. 8A,
(B)) or a side-view type light emitting / receiving element 7 (FIG. 8 (c)) having a light emitting / receiving portion on its side surface is generally used as a discrete type having a lead terminal 8.

【0004】しかし、ステムに搭載されたベアチップが
樹脂封止されて形成されたディスクリートタイプの受発
光素子6、7は、受発光量が大きいため受発光素子間距
離を大きくとれるが、リード端子8を基板9に設けた孔
に挿通したうえで半田付けする必要があるため、基板9
への取り付けが面倒であり、部品の実装コストがかか
る。また、外径が大きいため、実装厚みが厚くなり、薄
形化には不向きであり、装置を小形化できない。さらに
電力消費が大きいため、ポータブル用途に利用できな
い。
However, in the discrete type light emitting / receiving elements 6 and 7 formed by resin-sealing the bare chip mounted on the stem, the distance between the light emitting / receiving elements is large because the amount of light emitting / receiving is large, but the lead terminal 8 is used. Since it is necessary to insert the solder into the holes provided in the board 9 and then solder it,
It is troublesome to attach to, and the mounting cost of parts is high. Further, since the outer diameter is large, the mounting thickness becomes thick, which is not suitable for thinning, and the device cannot be downsized. Furthermore, it consumes a large amount of power and cannot be used for portable applications.

【0005】そこで近年、小形用として、図9に示すよ
うな、受発光量の小さなチップタイプの受発光素子10
が使用され始めた。このチップタイプの受発光素子10
は、リードを有さず基板9に直に面実装できるため実装
面及び薄形化に有利であり、また小形、小電力であるた
め装置の小形化が可能となり、電池駆動によってポータ
ブル用途にも使用できる。また、ディスクリートタイプ
のようにリードを折り曲げなくても、取付け面を選ぶこ
とができ、容易に受発光面を横向きにしたり(図9
(a))、上向きにしたりすることができる(図9
(b))。
Therefore, in recent years, as a small-sized device, as shown in FIG. 9, a chip-type light emitting / receiving element 10 having a small amount of emitted light is emitted.
Started to be used. This chip type light emitting / receiving element 10
Is advantageous in terms of mounting surface and thinning because it has no leads and can be directly surface-mounted on the substrate 9, and it is possible to downsize the device due to its small size and low power consumption. Can be used. Further, unlike the discrete type, the mounting surface can be selected without bending the leads, and the light emitting / receiving surface can be easily laid sideways (see FIG. 9).
(A)), and can be turned upward (Fig. 9)
(B)).

【0006】なお、通常、赤外の受発光素子を使用する
が、可視光波長成分も無視できないため、実使用では、
図10に示すように可視光カットフィルタ13を受発光
素子10の前面に配置したり、覆うような構造として、
可視光に反応しないようにしている。
Although an infrared light emitting / receiving element is usually used, the visible light wavelength component cannot be ignored, so in actual use,
As shown in FIG. 10, the visible light cut filter 13 is arranged on the front surface of the light receiving and emitting element 10 or has a structure in which it is covered.
I try not to react to visible light.

【0007】[0007]

【発明が解決しようとする課題】ところで、チップタイ
プの受発光素子には、同じチップタイプでも、凹面鏡1
1にベアチップ12を取り付けた凹面鏡付タイプの受発
光素子(図9(c))と、そうでないベアチップ12の
みからなるベアタイプ(図9(d))の受発光素子とが
ある。凹面鏡付は光出力がある程度大きいため、小形装
置に最適であるが、構造上非常にコスト高となる上、特
に受発光量の大きいものを選別する必要がある。また、
これに対して凹面鏡付でないものは、より小形で安価で
あり非常に魅力的であるが、凹面鏡付に比べて光出力が
かなり弱いため、検出可能なレベルの光信号を得るため
に対向させる受発光素子間の距離を小さくせざるを得
ず、そのような小さな距離では、小形位置検出装置とい
えども、必要な広さのタッチパネル面積を確保できな
い。特に、図9(b)に示すように受発光面を上向きに
して光を反射させ、対向する受発光素子に到るようにす
る場合には、光量のロスが発生するため、ベアタイプで
は装置の実用化が難しかった。
By the way, in the chip type light receiving and emitting element, even if the same chip type is used, the concave mirror 1
There is a concave-mirror-equipped type light emitting / receiving element (FIG. 9 (c)) in which the bare chip 12 is attached to the No. 1 and a bare type (FIG. 9 (d)) receiving / emitting element that includes the bare chip 12 only. Since the optical output with a concave mirror is large to some extent, it is optimal for a small device, but it is very expensive in structure, and it is necessary to select one with a particularly large amount of light emission and reception. Also,
On the other hand, the one without the concave mirror is more attractive because it is smaller and cheaper, but its optical output is considerably weaker than that with the concave mirror, so that it is opposed to receive a light signal of a detectable level. There is no choice but to reduce the distance between the light emitting elements, and even such a small position detection device cannot secure a necessary touch panel area with such a small distance. In particular, as shown in FIG. 9B, when the light emitting / receiving surface is directed upward and light is reflected to reach the opposing light emitting / receiving element, a light amount loss occurs. Was difficult to put into practical use.

【0008】さらに、凹面鏡付のものにせよ、凹面鏡付
でないベアチップにせよ、チップタイプでは、ディスク
リートタイプと比較して光量がかなり小さいので、発光
素子から受光素子に到る光路で拡散や外乱の影響を大き
く受けるため、それに耐える光出力の大きな発光素子
や、受光能力の大きな受光素子を選別する必要が生じ、
その選別作業が非常に面倒であり、歩留りも悪い。ま
た、可視光カットフィルタを別個に必要とするため、厚
み面でチップタイプのもつ利点が生かされない。そし
て、対向する受発光素子間の距離の長い大型装置への対
応もできなかった。
Further, the amount of light in the chip type is considerably smaller than that in the discrete type whether it is a bare chip with a concave mirror or a bare chip without a concave mirror, so that the influence of diffusion or disturbance on the optical path from the light emitting element to the light receiving element. Therefore, it is necessary to select a light emitting element with a large light output that withstands it or a light receiving element with a large light receiving ability,
The sorting work is very troublesome and the yield is poor. Further, since the visible light cut filter is separately required, the advantage of the chip type in terms of thickness cannot be utilized. In addition, it has not been possible to cope with a large-sized device in which the distance between the light receiving and emitting elements facing each other is long.

【0009】本発明の目的は、上述した従来技術の問題
点を解消して、受発光量は小さいが、実装コスト、装置
厚みに有利な小形チップタイプの受発光素子を採用しな
がら、受発光素子間に十分な距離をとれ、実用に耐える
ことができるようにした導光体及び光学的位置検出装置
を提供することにある。
An object of the present invention is to solve the above-mentioned problems of the prior art and to receive and emit light while adopting a small chip type light emitting and receiving element which is small in light emitting and receiving amount but advantageous in mounting cost and device thickness. An object of the present invention is to provide a light guide body and an optical position detecting device which can maintain a sufficient distance between elements and can be put to practical use.

【0010】[0010]

【課題を解決するための手段】第1の発明は、光学式タ
ッチパネル表面の周囲に装着され使用光の波長に対して
透明な枠状の導光体であって、発光素子からの光を導い
て対向する受光部へ放射する発光部と、該発光部からの
光を入射して受光素子へ導く受光部とを複数対一体形成
し、少なくとも発光部と受光部との境界に発光部から受
光部への光の回り込みを防止するスリットを形成し、上
記発光部に受光部へ放射する光を集光し、上記受光部に
受光素子へ導く光を集光する集光部をそれぞれ一体に設
けたものである。第1の発明のように、発光素子からの
光を導いて対向する受光部へ放射する発光部と、発光部
からの光を入射して受光素子へ導く受光部とを複数対一
体形成していると、これらを分離して形成する場合に比
較して、構成を簡素化することができ、製造も容易とな
る。また、少なくとも発光部と受光部との境界にスリッ
トを設けている場合には、発光部から出た光が導光体を
通って反対側の受光部に回り込むのをスリットで規制す
ることによって、回り込み光が受光素子と結合して誤動
作するのを有効に防止することができる。この場合、ス
リットを各発光部間及び各受光部間にも設けると、発光
部単位、及び受光部単位での光の拡散をスリットによっ
て規制できるので、受光部から対応する発光部に到る光
量の低下を有効に防止することができる。
A first aspect of the present invention is a frame-shaped light guide that is mounted around the surface of an optical touch panel and is transparent to the wavelength of light used, and guides light from a light emitting element. And a plurality of pairs of light-receiving units that emit light from the light-emitting units and guide light from the light-emitting units to the light-receiving elements are integrally formed, and the light-receiving units receive light at least at the boundary between the light-emitting units. A slit is formed to prevent light from sneaking into the light-receiving part, and the light-emitting part is provided with a light-collecting part that collects the light emitted to the light-receiving part and the light-receiving part collects the light to be guided to the light-receiving element. It is a thing. As in the first invention, a plurality of pairs of a light emitting portion that guides the light from the light emitting element and emits the light to the opposite light receiving portion and a light receiving portion that receives the light from the light emitting portion and guides the light to the light receiving element are integrally formed. In this case, the structure can be simplified and the manufacturing becomes easy as compared with the case where they are formed separately. Further, when a slit is provided at least at the boundary between the light emitting unit and the light receiving unit, by restricting the light emitted from the light emitting unit from passing through the light guide to the light receiving unit on the opposite side with the slit, It is possible to effectively prevent the wraparound light from malfunctioning due to coupling with the light receiving element. In this case, if slits are also provided between the light emitting units and between the light receiving units, the diffusion of light in each light emitting unit and each light receiving unit can be regulated by the slit, so that the light amount from the light receiving unit to the corresponding light emitting unit can be controlled. Can be effectively prevented.

【0011】また、発光部に受光部へ放射する光を集光
し、受光部に受光素子へ導く光を集光する集光部をそれ
ぞれ一体に設けていると、集光部により集光した光を発
光部から受光部に効率よく放射できるので、光量を落と
すことなく光を受光部に送ることができるとともに、発
光部から対向する受光部に到る過程で拡散した光を受光
部に入射した後、集光部により効率よく集光することが
できる。したがって、光出力の小さなチップタイプの発
光素子を使用しても、特に光出力の大きな発光素子や、
受光能力の大きな受光素子を選別する必要がない。また
検出光量が大きくとれるので発光部と受光部間の距離を
延ばすことができ、小形のチップタイプの受発光素子を
使用しながら、大型サイズの光学的位置検出装置にも適
用することができる。
Further, if the light emitting portion is provided with a light collecting portion for collecting the light emitted to the light receiving portion and the light receiving portion for collecting the light guided to the light receiving element, the light collecting portion collects the light. Since light can be efficiently radiated from the light emitting unit to the light receiving unit, the light can be sent to the light receiving unit without reducing the light amount, and the light diffused in the process from the light emitting unit to the opposite light receiving unit is incident on the light receiving unit. After that, the light can be efficiently collected by the light collecting unit. Therefore, even if a chip type light emitting element with a small light output is used, a light emitting element with a particularly large light output,
There is no need to select a light receiving element having a large light receiving ability. Further, since a large amount of detected light can be obtained, the distance between the light emitting portion and the light receiving portion can be extended, and the invention can be applied to a large size optical position detecting device while using a small chip type light receiving and emitting element.

【0012】第2の発明は、光学式タッチパネル表面の
周囲に装着され使用光の波長に対して透明な枠状の導光
体であって、発光素子からの光を導いて対向する受光部
へ放射する発光部と、該発光部からの光を入射して受光
素子へ導く受光部とを複数対一体形成し、少なくとも発
光部と受光部との境界に発光部から受光部への光の回り
込みを防止するスリットを形成し、上記発光部及び受光
部に、発光部または受光部に侵入した外乱光を屈折させ
て発光部または受光部外に逃すために屈折率の異なる層
を介在させるための空隙部を形成し、該空隙部の内側面
を曲面にして、発光部側空隙部の一側に受光部へ放射す
る光を集光し、受光部側空隙部の一側に受光素子へ導く
光を集光する集光部をそれぞれ一体に設けたものであ
る。
A second aspect of the present invention is a frame-shaped light guide that is mounted around the surface of the optical touch panel and is transparent to the wavelength of the light used, and guides light from the light emitting element to the opposite light receiving portion. A plurality of pairs of a light-emitting portion that emits light and a light-receiving portion that receives light from the light-emitting portion and guides the light to the light-receiving element are integrally formed, and light wraps around from the light-emitting portion to the light-receiving portion at least at the boundary between the light-emitting portions. To form a slit for preventing the light emitting portion and the light receiving portion from interposing a layer having a different refractive index in order to refract the disturbance light that has entered the light emitting portion or the light receiving portion and to escape it to the outside of the light emitting portion or the light receiving portion. A cavity is formed, and the inner surface of the cavity is formed into a curved surface, and the light emitted to the light receiving section is condensed on one side of the light emitting section side cavity and is guided to the light receiving element on one side of the light receiving section side cavity. The light collecting portions that collect light are integrally provided.

【0013】第2の発明のように、発光部及び受光部
に、発光部または受光部に侵入した外乱光を屈折させて
発光部または受光部外に逃すために屈折率の異なる層を
介在させるための空隙部を形成している場合には、空隙
部が太陽光等の外乱光の入光を抑えるため、外乱光が、
光源である発光素子に影響を与えたり、受光素子に受光
されたりすることが少なくなるため、外乱光による誤動
作を生じにくくすることができる。また、空隙部の内側
面をレンズ効果をもつ曲面にして、発光部側空隙部の一
側に受光部へ放射する光を集光し、受光部側空隙部の一
側に受光素子へ導く光を集光する集光部をそれぞれ一体
に設けている場合には、空隙部の形成と同時に集光部を
形成することができるので、構成及び製造の簡素化を図
ることができる。
As in the second aspect of the invention, the light emitting portion and the light receiving portion are provided with layers having different refractive indexes in order to refract the disturbance light that has entered the light emitting portion or the light receiving portion and to escape it to the outside of the light emitting portion or the light receiving portion. In the case of forming a void portion for, because the void portion suppresses the entry of ambient light such as sunlight, the ambient light is
Since it is less likely that the light emitting element as a light source is affected or the light receiving element receives the light, a malfunction due to ambient light can be less likely to occur. In addition, the inner surface of the cavity is curved to have a lens effect, and the light emitted to the light receiving section is condensed on one side of the light emitting section side cavity and is guided to the light receiving element on one side of the light receiving section side cavity. When the light collecting portions that collect light are integrally provided, the light collecting portions can be formed at the same time when the voids are formed, so that the configuration and the manufacturing can be simplified.

【0014】第3の発明は、第2の発明において、上記
発光部の発光面または受光部の受光面を構成する導光体
の内側面に、外乱光を反射させて外乱光が発光部または
受光部に入るのを防止するためのテーパを形成したもの
である。
In a third aspect based on the second aspect, the ambient light is reflected on the inner side surface of the light guide forming the light emitting surface of the light emitting portion or the light receiving surface of the light receiving portion so that the ambient light emits the light. The taper is formed to prevent it from entering the light receiving portion.

【0015】第3の発明のように、導光体の発光部また
は受光部の内側面に、外乱光を反射させて外乱光が発光
部または受光部に入るのを防止するためのテーパを形成
している場合には、外乱光による誤動作がより生じにく
い。
As in the third aspect of the invention, a taper is formed on the inner surface of the light emitting portion or the light receiving portion of the light guide to reflect the ambient light and prevent the ambient light from entering the light emitting portion or the light receiving portion. When it does, malfunction due to ambient light is less likely to occur.

【0016】またこのテーパは、発光部から発光した光
が広がり、受発光面を構成する導光体の内側面に反射
し、受光部に入る光路をなくしている。
Further, this taper spreads the light emitted from the light emitting portion, reflects the light on the inner surface of the light guide forming the light receiving and emitting surface, and eliminates the optical path entering the light receiving portion.

【0017】第4の発明は、第1ないし第3の発明の導
光体おいて、該導光体にさらに、発光部の下面に設けた
発光素子から発光部に入射した光を反射して対向する受
光部に向ける反射部、及び受光部に入射した光を反射し
て受光部の下面に設けた受光素子に向ける反射部をそれ
ぞれ一体に設けたものである。
A fourth aspect of the present invention is the light guide according to any one of the first to third aspects, wherein the light guide further reflects light incident on the light emitting section from a light emitting element provided on the lower surface of the light emitting section. The reflecting portion facing the opposite light receiving portion and the reflecting portion reflecting the light incident on the light receiving portion toward the light receiving element provided on the lower surface of the light receiving portion are integrally provided.

【0018】第4の発明のように、発光部の下面に設け
た発光素子から発光部に入射した光を反射して対向する
受光部へ放射し、または受光部に入射した光を反射して
受光部の下面に設けた受光素子に導く反射部をそれぞれ
一体に設けている場合には、発光素子及び受光素子と導
光体とを重ねることができ、発光素子及び受光素子が導
光体からはみ出さないので、発光素子及び受光素子を導
光体からはみ出して導光体の側面から光を入射させる場
合に比較して、装置を小形化できる。また、反射部を導
光体に一体に形成するので、構成を簡素化することがで
きる。
As in the fourth aspect of the invention, the light incident on the light emitting portion from the light emitting element provided on the lower surface of the light emitting portion is reflected and radiated to the opposite light receiving portion, or the light incident on the light receiving portion is reflected. When the reflecting portions that lead to the light receiving element provided on the lower surface of the light receiving portion are integrally provided, the light emitting element and the light receiving element can be overlapped with the light guide body, and the light emitting element and the light receiving element are separated from the light guide body. Since the light emitting element and the light receiving element do not protrude, the device can be downsized as compared with the case where the light emitting element and the light receiving element protrude from the light guide body and light is incident from the side surface of the light guide body. Moreover, since the reflecting portion is formed integrally with the light guide, the configuration can be simplified.

【0019】第5の発明は、第1の発明ないし第4の発
明において、材質にアクリル樹脂、ABS樹脂、ポリカ
ーボネートなどの赤外光に対して透明な樹脂を使用した
ものである。第5の発明で規定したような樹脂を使用す
ることにより、導光体を安価に一体成形でき、また赤外
光の伝達ロスを低減できる。
A fifth aspect of the invention is the same as the first to fourth aspects of the invention, wherein a material transparent to infrared light, such as acrylic resin, ABS resin, or polycarbonate, is used as the material. By using the resin as defined in the fifth invention, the light guide body can be inexpensively integrally molded, and the infrared light transmission loss can be reduced.

【0020】第6の発明は、複数個の発光素子と受光素
子とを対向させるように光学式タッチパネル表面の周囲
に配置して、発光素子から受光素子に到る光を遮光する
ことにより物体の位置または有無を検出する光学的位置
検出装置において、上記光学式タッチパネル表面の周囲
に枠状に取り付けられ、光学式タッチパネル表面の周囲
に配置される上記複数個の発光素子と受光素子とをチッ
プタイプで構成して、これらを面状に実装した基板と、
該基板上に装着される第1の発明ないし第4の発明の導
光体とを備えたものである。
According to a sixth aspect of the invention, a plurality of light emitting elements and light receiving elements are arranged around the surface of the optical touch panel so as to face each other, and the light from the light emitting elements to the light receiving elements is shielded so that the object An optical position detecting device for detecting a position or presence / absence, wherein the plurality of light emitting elements and light receiving elements mounted in a frame shape around the surface of the optical touch panel and arranged around the surface of the optical touch panel are chip type. And a board on which these are mounted in a plane,
The light guide according to any one of the first to fourth inventions mounted on the substrate.

【0021】第6の発明のように、発光素子と受光素子
とをチップタイプで構成し、これらを基板に面状に実装
している場合には、発光素子と受光素子とをディスクリ
ートタイプで構成し、そのリードを半田付けして立体的
に実装する場合に比較して、実装が容易で低コスト化が
図れ、しかも平面的となるため実装厚みを薄くでき、装
置の小形化が図れる。また、集光部を有する導光体に光
が導かれるので、光出力が弱く集光力の小さなチップタ
イプの受発光素子を用いても、伝達ロスを少なくし、検
出光量を増加することができるので、受発光素子間の距
離を延ばすことができる。
As in the sixth aspect, when the light emitting element and the light receiving element are formed in a chip type and these are mounted on a substrate in a planar manner, the light emitting element and the light receiving element are formed in a discrete type. However, as compared with the case where the leads are soldered and mounted three-dimensionally, the mounting is easy and the cost can be reduced, and since it is planar, the mounting thickness can be reduced and the device can be downsized. Further, since the light is guided to the light guide body having the light collecting portion, even if a chip type light emitting / receiving element having a weak light output and a small light collecting power is used, the transmission loss can be reduced and the detected light amount can be increased. Therefore, the distance between the light emitting and receiving elements can be extended.

【0022】[0022]

【発明の実施の形態】以下に本発明の実施の形態につい
て説明する。図1は本実施の形態の光学的位置検出装置
の分解図であり、(a)は導光体の平面図、(b)は基
板の平面図である。図2は導光体の要部の斜視図であ
る。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. 1A and 1B are exploded views of the optical position detecting device according to the present embodiment, FIG. 1A is a plan view of a light guide, and FIG. 1B is a plan view of a substrate. FIG. 2 is a perspective view of a main part of the light guide.

【0023】光学式位置検出装置は、光学式タッチパネ
ル表面30の周囲に枠状に取り付けられる基板31と、
基板31上に重ねて装着される光を導く導光体21とか
ら主に構成される。
The optical position detecting device comprises a substrate 31 mounted in a frame shape around the surface 30 of the optical touch panel,
It is mainly composed of a light guide 21 that guides light that is mounted on the substrate 31 in an overlapping manner.

【0024】四角枠形状をもつ基板31には、光学式タ
ッチパネル表面の周囲に配置されるべき複数個の発光素
子32と受光素子33とが実装される。図示例では上辺
及び左辺に発光素子32が実装され、これらに対向する
下辺及び右辺に受光素子33が実装される。受発光素子
32、33は、凹面鏡なしのベアチップタイプで構成さ
れ、これらが受発光面を上にして、基板31に面状に実
装される。受発光素子32、33にチップタイプを使用
して面状に基板31に実装しているので、実装が容易で
低コスト化が図れ、しかも平面的となり実装厚みを薄く
できる。なお、受発光素子32、33には赤外域のもの
を使う。
A plurality of light emitting elements 32 and light receiving elements 33 to be arranged around the surface of the optical touch panel are mounted on the substrate 31 having a rectangular frame shape. In the illustrated example, the light emitting elements 32 are mounted on the upper side and the left side, and the light receiving elements 33 are mounted on the lower side and the right side opposite to them. The light emitting / receiving elements 32, 33 are of a bare chip type without a concave mirror, and these are mounted in a planar manner on the substrate 31 with the light emitting / receiving surface facing upward. Since the light emitting / receiving elements 32 and 33 are mounted on the substrate 31 in a planar shape by using a chip type, the mounting is easy and the cost can be reduced, and the mounting becomes flat and the mounting thickness can be reduced. The light emitting / receiving elements 32 and 33 used are those in the infrared region.

【0025】導光体21は、光学式タッチパネル表面3
0の周囲に装着するために、基板31と同じく、四角枠
状に形成され、赤外光に対して透明な材質、例えばアク
リル樹脂、ABS樹脂、ポリカーボネート等で形成され
る。
The light guide 21 is provided on the surface 3 of the optical touch panel.
In order to mount it around 0, it is formed in a rectangular frame shape like the substrate 31, and is made of a material transparent to infrared light, such as acrylic resin, ABS resin, or polycarbonate.

【0026】この導光体21には、その外周に複数のス
リット22が繰返し設けられ、スリット22間に、発光
素子32からの光を導いて対向する受光部16へ放射す
る複数の発光部15と、発光部15からの光を入射して
受光素子33へ導く複数の受光部16とが形づくられる
ようになっている。スリット22は、発光部15から受
光部16への光の回り込みを防止するとともに、各発光
部15及び各受光部16での光の拡散を防止する。な
お、スリット22は、発光部15側では深く、受光部1
6側では浅くしてあるため、導光体21の形状は左右対
称にはなっていない。
A plurality of slits 22 are repeatedly provided on the outer periphery of the light guide body 21, and a plurality of light emitting portions 15 for guiding the light from the light emitting element 32 between the slits 22 and radiating the light to the light receiving portions 16 facing each other. Then, a plurality of light receiving portions 16 that guide the light from the light emitting portion 15 to the light receiving element 33 are formed. The slits 22 prevent the light from wrapping around from the light emitting unit 15 to the light receiving unit 16 and prevent the diffusion of light in each light emitting unit 15 and each light receiving unit 16. The slit 22 is deep on the side of the light emitting unit 15,
Since it is shallow on the 6 side, the shape of the light guide 21 is not symmetrical.

【0027】スリット22に光の回り込み防止機能だけ
をもたせるのであれば、スリット22は、少なくとも発
光部15と受光部16との境界、すなわち図1(a)に
示したA、Bの2箇所に形成すれば足りる。これは各一
対の発光素子32と受光素子33とを順次走査していく
ので、発光部間、受光部間での光の回り込みは考慮しな
くてもよいためである。
If the slit 22 is provided with only the light sneak-in prevention function, the slit 22 is provided at least at the boundary between the light emitting portion 15 and the light receiving portion 16, that is, at two points A and B shown in FIG. It only needs to be formed. This is because each pair of the light emitting element 32 and the light receiving element 33 is sequentially scanned, and it is not necessary to consider the wraparound of light between the light emitting portions and between the light receiving portions.

【0028】発光部15には、発光部15の下面に配置
する発光素子32から発光部15に入射した光を90°
の角度で反射して、タッチパネル表面30と平行な向き
に変え、対向する受光部16へ放射する反射部23が一
体に設けられる。また受光部16にも、受光部16に入
射した光を90°の角度で反射して、受光部16の下面
に配置する受光素子33に向ける反射部23を一体に設
けてある。これらの反射部23は、外側に突出した格好
になっている発光部15及び受光部16の端面を、斜め
にカットすることにより形成することができる。必要で
あれば、カット面に反射膜を塗布してもよい。
The light emitting section 15 receives 90 ° of light incident on the light emitting section 15 from the light emitting element 32 arranged on the lower surface of the light emitting section 15.
Is integrally provided with the reflecting portion 23 that reflects at an angle of, changes to a direction parallel to the touch panel surface 30, and radiates to the facing light receiving portion 16. Further, the light receiving section 16 is also integrally provided with a reflecting section 23 that reflects the light incident on the light receiving section 16 at an angle of 90 ° and directs the light to the light receiving element 33 disposed on the lower surface of the light receiving section 16. These reflection parts 23 can be formed by obliquely cutting the end faces of the light emitting part 15 and the light receiving part 16 that are projected outwardly. If necessary, a reflective film may be applied to the cut surface.

【0029】また、導光体21の発光部15及び受光部
16の光路の途中に、発光部15または受光部16に侵
入した外乱光を屈折させて発光部15または受光部16
の外に逃すために屈折率の異なる層を介在させるための
空隙部25を形成してある。空隙部25は、空隙部25
の内側に形成される内枠36を導光体21と接続してお
くために、不連続に形成してある。この空隙部25には
導光体21を構成する材質よりも屈折率の小さな空気層
または他の層を介在させるとよい。
Further, the disturbance light entering the light emitting portion 15 or the light receiving portion 16 is refracted in the middle of the optical paths of the light emitting portion 15 and the light receiving portion 16 of the light guide 21 to refract the light emitting portion 15 or the light receiving portion 16.
A void portion 25 is formed to allow a layer having a different refractive index to intervene in order to escape to the outside. The void 25 is the void 25
In order to keep the inner frame 36 formed on the inside of the light guide 21 connected, it is formed discontinuously. It is advisable to interpose an air layer or another layer having a smaller refractive index than the material forming the light guide 21 in the void portion 25.

【0030】この空隙部25を構成する壁面のうち、外
側の面を曲面26にしてレンズ効果をもたせ、発光部側
空隙部25の一側に、対向する受光部16へ放射する光
を集光し、受光部側空隙部25の一側に受光素子33へ
導く光を集光する集光部24をそれぞれ一体に設ける。
導光体21に集光部24を設けて散乱防止と集光を行な
い、検出光量を増やすようにしたので、凹面鏡をもたな
いベアタイプの微弱光素子でも対向する受発光素子間の
距離を実用範囲で延ばすことが可能となる。また、受発
光素子の受発光量の多いものを選択する必要もなくな
る。特に、凹面鏡付受発光素子を使用すれば、さらに距
離を延ばすことができるので、小形の検出装置にとどま
らず、大型の検出装置にも適用することができるように
なる。
Out of the wall surfaces forming the void 25, the outer surface is formed into a curved surface 26 so as to have a lens effect, and the light emitted to the light receiving portion 16 facing the light emitting portion 16 is condensed on one side of the light emitting portion side void 25. Then, the light collecting section 24 that collects the light guided to the light receiving element 33 is integrally provided on one side of the light receiving section side void 25.
Since the light guide body 21 is provided with the light collecting portion 24 to prevent scattering and collect light and increase the amount of detected light, even the bare type weak light element having no concave mirror can reduce the distance between the light receiving and emitting elements facing each other. It can be extended within a practical range. Further, it is not necessary to select a light emitting / receiving element having a large light receiving / emitting amount. In particular, by using the light emitting / receiving element with a concave mirror, the distance can be further extended, so that the present invention can be applied not only to a small detection device but also to a large detection device.

【0031】空隙部25の曲面26は、これと対向する
平面29と同様に鏡面仕上とする。また、発光部側の集
光部24の焦点が受光部16の受光面28に、受光部側
の集光部24の焦点が受光素子33にそれぞれ形成され
るように、各曲面26の曲率を決定する。なお、図示例
では、発光部15の発光面27または受光部16の受光
面28を構成する導光体21の内側面は、光路と垂直に
なるようにカットしてある。
The curved surface 26 of the void 25 is mirror-finished like the flat surface 29 facing it. Further, the curvature of each curved surface 26 is set so that the focal point of the light-collecting section 24 on the light-emitting section side is formed on the light-receiving surface 28 of the light-receiving section 16 and the focal point of the light-collecting section 24 on the light-receiving section side is formed on the light-receiving element 33. decide. In the illustrated example, the inner side surface of the light guide body 21 forming the light emitting surface 27 of the light emitting section 15 or the light receiving surface 28 of the light receiving section 16 is cut so as to be perpendicular to the optical path.

【0032】以上説明した光学的位置検出装置の要部構
成の斜視図を示したのが図2である。同図に示すよう
に、導光体21は、その受発光部15、16の反射部2
3側の下面に受発光素子32、33が配置されるよう
に、基板31上に接着など適宜の手段により装着され
る。また、導光体21に空隙部25が形成されることに
より、空隙部25の内側に連続した内枠36が形成され
るが、この内枠36は導光体21の補強、及びタッチパ
ネル表面の周囲の目隠しになる。なお、導光体21は射
出成形などにより一体形成する。
FIG. 2 shows a perspective view of the main configuration of the optical position detecting device described above. As shown in the figure, the light guide body 21 includes a reflection portion 2 of the light emitting / receiving portions 15 and 16.
The light emitting / receiving elements 32, 33 are mounted on the substrate 31 by an appropriate means such as bonding so that the light emitting / receiving elements 32, 33 are arranged on the lower surface on the 3 side. Further, by forming the void portion 25 in the light guide body 21, a continuous inner frame 36 is formed inside the void portion 25. The inner frame 36 reinforces the light guide body 21 and the touch panel surface. It becomes a blindfold around you. The light guide 21 is integrally formed by injection molding or the like.

【0033】さて、上述したような基板31に導光体2
1を装着した本実施の形態の光学式位置検出装置におい
て、基板31に実装された発光素子32から出た上向き
の光は、図3に矢印で示すように、導光体21の発光部
15の下面から導光体21に入射する。導光体21に入
射した光は反射部23で反射して90°向きを変えら
れ、集光部24に導かれて集光される。この集光部24
とスリット22とが相俟って光の散乱を防止する。した
がって、微弱光でも十分大きな光量を取り出すことがで
きる。集光部24で集光された光は、空隙部25を通っ
て発光部15の発光面27から一度導光体21を出て受
光部16に向けて放射される。受光部16の受光面28
より再び導光体21に入射した光は、空隙部25を通過
して反射部23に到り、ここで反射して90°向きを変
えられ、受光部16の下面から出射して、受光部16の
下面に配置されている受光素子33で検出される。
Now, the light guide 2 is formed on the substrate 31 as described above.
In the optical position detecting device of the present embodiment equipped with No. 1, upward light emitted from the light emitting element 32 mounted on the substrate 31 is emitted from the light emitting unit 15 of the light guide body 21 as shown by an arrow in FIG. The light enters the light guide 21 from the lower surface of the. The light that has entered the light guide 21 is reflected by the reflection section 23, is changed in direction by 90 °, and is guided to the light collection section 24 to be collected. This light collecting part 24
Together with the slit 22, the light is prevented from being scattered. Therefore, a sufficiently large amount of light can be extracted even with weak light. The light condensed by the condensing unit 24 passes through the void 25, exits the light guide 21 from the light emitting surface 27 of the light emitting unit 15, and is emitted toward the light receiving unit 16. Light receiving surface 28 of light receiving unit 16
The light that has entered the light guide body 21 again passes through the void portion 25, reaches the reflecting portion 23, is reflected here, is redirected by 90 °, and is emitted from the lower surface of the light receiving portion 16 to be received. It is detected by the light receiving element 33 arranged on the lower surface of 16.

【0034】ここで、外乱光20が同図に示す角度で、
受光部16の受光面28より受光部16に入った場合に
は、その光は空隙部25によって曲げらるので、受光素
子33に到る前に、受光部15から出てしまう。このた
め、空隙部25がない場合のように、導光体21に入射
した外乱光20が導光体21の上下面で反射を繰返して
受光素子33に届いてしまうようなことが少なくなり、
その結果、外乱光による誤動作を低減できる。なお、こ
の効果は、発光部15においても言えることであり、発
光部15に入射した外乱光20が光源である発光素子3
2に影響を与えることが少なくなる。
Here, the disturbance light 20 has an angle shown in FIG.
When the light enters the light receiving portion 16 from the light receiving surface 28 of the light receiving portion 16, the light is bent by the void portion 25, so that the light exits from the light receiving portion 15 before reaching the light receiving element 33. Therefore, unlike the case where there is no space 25, the ambient light 20 that has entered the light guide 21 is less likely to be repeatedly reflected on the upper and lower surfaces of the light guide 21 and reach the light receiving element 33.
As a result, malfunction due to ambient light can be reduced. Note that this effect can also be applied to the light emitting unit 15, and the ambient light 20 incident on the light emitting unit 15 is the light emitting element 3 that is a light source.
2 is less affected.

【0035】また、受発光素子32、33の上部は導光
体21の発光部15及び受光部16で覆われているの
で、上方から来る外乱光は発光部15及び受光部16に
より遮光され、直接受発光素子32、33に外乱光が入
射することがないので、この点からも外乱光による誤動
作を低減することができる。
Further, since the upper portions of the light emitting / receiving elements 32 and 33 are covered with the light emitting portion 15 and the light receiving portion 16 of the light guide 21, ambient light coming from above is shielded by the light emitting portion 15 and the light receiving portion 16. Since ambient light does not directly enter the light emitting / receiving elements 32 and 33, malfunctions due to ambient light can be reduced also from this point.

【0036】以上述べたように本実施の形態によれば、
受発光素子を導光体で覆って光を導光体で導くようにし
たので、従来のような可視光カットフィルタを必要とし
ない。また、水平方向の光の向きを垂直方向に変える反
射部、光の拡散を防止する光路を形成するためのスリッ
ト、光を集光する集光部、外乱光の侵入を軽減する空隙
部等を一体形成した導光体を使用することにより光の伝
達ロスをなくし、かつ集光することにより検出光量を増
やし、しかも外乱光の侵入を軽減できるようにしたの
で、受発光素子に受発光量の少ない低出力で小形のベア
チップタイプを採用することができ、導光体を使用しな
い従来例と比較して、実装コストの低減、薄形化、小形
かつ安価な装置を作ることができる。また低電力である
ため電池駆動が可能となり、ポータブル用途にも使用で
きる。また、特に凹面鏡を有するチップタイプの受発光
素子を用いれば、より大きな受発光量が得られて受発光
間の距離が取れるので、チップタイプの受発光素子であ
りながら、より大型の検出装置にも適用することができ
る。
As described above, according to the present embodiment,
Since the light emitting / receiving element is covered with the light guide to guide the light through the light guide, a visible light cut filter as in the prior art is not required. In addition, a reflector that changes the direction of light in the horizontal direction to a vertical direction, a slit that forms an optical path that prevents the diffusion of light, a condenser that collects light, a void that reduces the intrusion of ambient light, etc. By using an integrally formed light guide, the transmission loss of light can be eliminated, and the amount of detected light can be increased by converging light, and the intrusion of ambient light can be reduced. It is possible to employ a small bare chip type with a low output, and to reduce the mounting cost, make the device thinner, and make it smaller and cheaper than the conventional example that does not use a light guide. Also, since it has low power, it can be driven by a battery and can be used for portable applications. Further, particularly when a chip type light emitting / receiving element having a concave mirror is used, a larger amount of light emitting / receiving light can be obtained and a distance between the light emitting / receiving elements can be set, so that even a chip type light receiving / emitting element can be used in a larger detection device. Can also be applied.

【0037】なお、上述した実施の形態では、発光部1
5の発光面27または受光部16の受光面28を構成す
る導光体21の両内側面を、光路と垂直になるようにカ
ットしたが、図4に示すように、対向する内側面が断面
ハの字になるように、斜めにカットして内側面にテーパ
34を形成するとよい。このようにテーパ34を形成す
ると、上方から導光体21に入り込む外乱光の光量をよ
り有効に減らすことができる。
In the above-described embodiment, the light emitting section 1
Although both inner side surfaces of the light guide body 21 constituting the light emitting surface 27 of No. 5 or the light receiving surface 28 of the light receiving unit 16 are cut so as to be perpendicular to the optical path, as shown in FIG. It is preferable that the taper 34 is formed on the inner surface by obliquely cutting so as to form a V shape. By forming the taper 34 in this way, the amount of ambient light entering the light guide 21 from above can be reduced more effectively.

【0038】また、図6のように対向する内側面が断面
ハの字の逆になるようにカットして内側面にテーパ34
を形成すると、発光部から発光した光が広がり、発光部
と垂直方向のテーパに反射し、受光部に入る光量を低減
させることが可能である。
Further, as shown in FIG. 6, the inner surfaces facing each other are cut so that the cross-section thereof has an inverted V shape, and the inner surfaces are tapered 34.
By forming, the light emitted from the light emitting portion spreads and is reflected by the taper in the direction perpendicular to the light emitting portion, and the amount of light entering the light receiving portion can be reduced.

【0039】また、上述した実施の形態では受発光部1
5、16に空隙部25を設けるようにしたが、図5に示
すように、外乱光防止機能は低下するけれども、空隙部
25を省略し、内枠の内側面にレンズ効果のある曲面を
形成することにより内枠を集光部24としてもよい。
Further, in the above-described embodiment, the light emitting / receiving unit 1
Although the voids 25 are provided in Nos. 5 and 16, as shown in FIG. 5, although the ambient light preventing function is deteriorated, the voids 25 are omitted and a curved surface having a lens effect is formed on the inner surface of the inner frame. By doing so, the inner frame may be used as the light collecting unit 24.

【0040】また、上述した実施の形態では、受発光部
15、16の端面に反射部23を設けて、光を導光体2
1の下面から入射させ、導光体21の下面に出射するよ
うにしたが、図6に示すように、受発光部15、16の
端面を垂直カットとして反射部を設けないようにしても
よい。その場合には、受発光素子32、33は、導光体
21の下面ではなく、端面と対向する位置に配置する必
要がある。これによれば導光体21と受発光素子32、
33が同一面上に来るので、受発光素子32、33を導
光体21の下面に配置したものよりも、装置の外径は大
きくなるが、厚みを薄くすることができる。
Further, in the above-described embodiment, the reflecting portion 23 is provided on the end faces of the light emitting / receiving portions 15 and 16 so that the light guide 2 can receive light.
Although the light is incident from the lower surface of No. 1 and emitted to the lower surface of the light guide 21, as shown in FIG. 6, the end faces of the light emitting / receiving units 15 and 16 may be vertically cut and the reflecting unit may not be provided. . In that case, the light emitting / receiving elements 32 and 33 need to be arranged not at the lower surface of the light guide body 21 but at the position facing the end surface. According to this, the light guide 21 and the light emitting / receiving element 32,
Since 33 is on the same surface, the device can have a smaller outer diameter than the device in which the light emitting / receiving elements 32 and 33 are arranged on the lower surface of the light guide 21, but the thickness can be reduced.

【0041】また、同図に示すように、タッチパネル表
面30を保護するために、タッチパネル表面30を覆う
接触パネル35を、受発光部15、16よりも一段低く
ダウンセットして導光体21と一体に形成するようにし
てもよい。
Further, as shown in the figure, in order to protect the touch panel surface 30, the contact panel 35 covering the touch panel surface 30 is down-set by one step lower than the light emitting / receiving sections 15 and 16 and the light guide 21. It may be formed integrally.

【0042】なお、本実施の形態による導光体は左右非
対称としたが、使い勝手をよくするために、左右対称に
形成してもよい。
Although the light guide according to the present embodiment is left-right asymmetrical, it may be formed left-right symmetrically for the sake of convenience.

【0043】本発明は、例えば交通用ナビゲーションシ
ステムの光学式位置検出装置に最適である。
The present invention is most suitable for an optical position detecting device of a navigation system for traffic, for example.

【0044】[0044]

【実施例】次の仕様の光学式位置検出装置を作製した。Example An optical position detector having the following specifications was produced.

【0045】 ・チップタイプ発光ダイオード:スタンレー社製、型番AN1102W 外形3mm(W)×1.5mm(H)×1.5mm(D) 出力0.8mW/Sr( 放射強度) ・チップタイプ受光ダイオード:スタンレー社製、型番PS110W 外形3mm(W)×2mm(H)×1.5mm(D) 感度3.5mA(光電流) ・導光体の寸法:縦113.7mm ×横144.2mm ×厚さ3mm ・導光体の材質:三菱レーヨン社製、アクリライト ・受発光素子を実装した基板上に導光体を装着した全厚さ:6.1mm これによりベアチップタイプの受発光素子でも、受発光
素子間に十分な距離をとれ、実用に耐えることが確認で
きた。
-Chip type light emitting diode: Stanley, model number AN1102W Outline 3mm (W) x 1.5mm (H) x 1.5mm (D) Output 0.8mW / Sr (radiation intensity) -Chip type light receiving diode: Stanley , Model number PS110W External dimensions 3mm (W) × 2mm (H) × 1.5mm (D) Sensitivity 3.5mA (photocurrent) ・ Light guide size: 113.7mm length × 144.2mm width × 3mm thickness ・ Light guide material : Made by Mitsubishi Rayon Co., Ltd. Acrylite ・ The total thickness of the light guide mounted on the substrate on which the light emitting / receiving elements are mounted: 6.1 mm This allows a sufficient distance between the light emitting / receiving elements even for bare chip type light emitting / receiving elements. It was confirmed that it could be put to practical use.

【0046】[0046]

【発明の効果】本発明の導光体によれば、集光部、空隙
部、反射部などを導光体に一体形成するようにしたの
で、構造が簡単で、光の伝達ロスを低減できる。また、
集光部を設けたので検出光量を増すことができる。ま
た、スリットを設けた場合には、光の光の回り込みや拡
散を有効に防止することができる。また、空隙部やテー
パを設けた場合には、外乱光の導光体への入射を軽減で
きる。そして、反射部を設けた場合には、受発光素子と
導光体とを上下に重ねることができるので、装置の小形
化を図ることができる。
According to the light guide body of the present invention, since the light collecting portion, the void portion, the reflecting portion and the like are formed integrally with the light guide body, the structure is simple and the light transmission loss can be reduced. . Also,
Since the condensing unit is provided, the amount of detected light can be increased. Further, when the slit is provided, it is possible to effectively prevent the light from wrapping around or diffusing. Further, when the void portion and the taper are provided, it is possible to reduce the incidence of disturbance light on the light guide body. When the reflecting portion is provided, the light emitting / receiving element and the light guide can be vertically stacked, so that the device can be downsized.

【0047】また、上記導光体を使用した本発明の光学
的位置検出装置によれば、ワンタッチで組立ができる。
また、装置の薄形化、実装コストの低減、及び小形、低
電力化が図れる。また、電池駆動が可能となりポータブ
ル用途にも使用できる。さらに受発光部間の距離が取れ
るので、受発光量の小さなチップタイプの受発光素子を
用いた場合でも大型検出装置に適用できる。
Further, according to the optical position detecting device of the present invention using the above-mentioned light guide, it is possible to assemble with one touch.
Further, the device can be made thinner, the mounting cost can be reduced, and the device can be made compact and have low power consumption. In addition, it can be driven by batteries and can be used for portable applications. Further, since the distance between the light receiving and emitting portions can be made large, even when a chip type light emitting and receiving element with a small light emitting and receiving amount is used, it can be applied to a large-sized detection device.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態の光学的位置検出装置の分
解図であり、(a)は導光体の平面図、(b)は基板の
平面図である。
FIG. 1 is an exploded view of an optical position detection device according to an embodiment of the present invention, (a) is a plan view of a light guide, and (b) is a plan view of a substrate.

【図2】本実施の形態の導光体の要部の斜視図である。FIG. 2 is a perspective view of a main part of the light guide according to the present embodiment.

【図3】本実施の形態の光学的位置検出装置の光路の説
明図である。
FIG. 3 is an explanatory diagram of an optical path of the optical position detecting device according to the present embodiment.

【図4】他の実施の形態による光学的位置検出装置の導
光体の発光面または受光面にテーパを付けたときの外乱
光の説明図である。
FIG. 4 is an explanatory diagram of ambient light when a light emitting surface or a light receiving surface of a light guide of an optical position detecting device according to another embodiment is tapered.

【図5】他の実施の形態の導光体の要部の斜視図であ
る。
FIG. 5 is a perspective view of a main part of a light guide according to another embodiment.

【図6】他の実施の形態の光学的位置検出装置の要部の
斜視図である。
FIG. 6 is a perspective view of a main part of an optical position detecting device according to another embodiment.

【図7】従来例の光学的位置検出装置の平面図である。FIG. 7 is a plan view of a conventional optical position detecting device.

【図8】従来例のディスクリートタイプの受発光素子の
説明図である。
FIG. 8 is an explanatory diagram of a discrete type light receiving / emitting element of a conventional example.

【図9】従来例のチップタイプの受発光素子の説明図で
ある。
FIG. 9 is an explanatory diagram of a chip-type light emitting / receiving element of a conventional example.

【図10】従来例の受発光素子を可視光カットフィルタ
で覆った説明図である。
FIG. 10 is an explanatory diagram in which a light emitting / receiving element of a conventional example is covered with a visible light cut filter.

【符号の説明】 21 導光体 22 スリット 23 反射部 24 集光部 25 空隙部 26 曲面 27 発光面 28 受光面 30 光学式タッチパネル面 31 基板 32 発光素子 33 受光素子[Explanation of Codes] 21 Light Guide 22 Slit 23 Reflecting Part 24 Condensing Part 25 Gap 26 Curved Surface 27 Light Emitting Surface 28 Light Receiving Surface 30 Optical Touch Panel Surface 31 Substrate 32 Light Emitting Element 33 Light Receiving Element

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】光学式タッチパネル表面の周囲に装着され
使用光の波長に対して透明な枠状の導光体であって、 発光素子からの光を導いて対向する受光部へ放射する発
光部と、該発光部からの光を入射して受光素子へ導く受
光部とを複数対一体形成し、 少なくとも発光部と受光部との境界に発光部から受光部
への光の回り込みを防止するスリットを形成し、 上記発光部に受光部へ放射する光を集光し、上記受光部
に受光素子へ導く光を集光する集光部をそれぞれ一体に
設けたことを特徴とする導光体。
1. A frame-shaped light guide, which is mounted around the surface of an optical touch panel and is transparent to the wavelength of light used, and which guides light from a light emitting element and radiates the light to an opposite light receiving section. And a plurality of pairs of light-receiving portions that enter the light from the light-emitting portion and guide the light to the light-receiving element, and a slit that prevents light from wrapping around from the light-emitting portion to the light-receiving portion at least at the boundary between the light-emitting portion and the light-receiving portion. And a light-collecting part that collects light emitted to the light-receiving part in the light-emitting part, and collects light guided to the light-receiving element in the light-receiving part.
【請求項2】光学式タッチパネル表面の周囲に装着され
使用光の波長に対して透明な枠状の導光体であって、 発光素子からの光を導いて対向する受光部へ放射する発
光部と、該発光部からの光を入射して受光素子へ導く受
光部とを複数対一体形成し、 少なくとも発光部と受光部との境界に発光部から受光部
への光の回り込みを防止するスリットを形成し、 上記発光部及び受光部に、発光部または受光部に侵入し
た外乱光を屈折させて発光部または受光部外に逃すため
に屈折率の異なる層を介在させるための空隙部を形成
し、 該空隙部の内側面を曲面にして、発光部側空隙部の一側
に受光部へ放射する光を集光し、受光部側空隙部の一側
に受光素子へ導く光を集光する集光部をそれぞれ一体に
設けたことを特徴とする導光体。
2. A light guide in the form of a frame, which is mounted around the surface of an optical touch panel and is transparent to the wavelength of light used, and which guides light from a light emitting element and radiates the light to an opposite light receiving portion. And a plurality of pairs of light-receiving portions that enter the light from the light-emitting portion and guide the light to the light-receiving element, and a slit that prevents light from wrapping around from the light-emitting portion to the light-receiving portion at least at the boundary between the light-emitting portion and the light-receiving portion. And forming a void portion in the light emitting portion and the light receiving portion for interposing a layer having a different refractive index in order to refract the ambient light that has entered the light emitting portion or the light receiving portion and escape it to the outside of the light emitting portion or the light receiving portion. Then, the inner surface of the void is curved so that the light emitted to the light receiving unit is condensed on one side of the light emitting unit side void and the light guided to the light receiving element is condensed on one side of the light receiving unit side void. The light guide body is characterized in that each of the light collecting portions is provided integrally.
【請求項3】請求項2に記載の導光体において、上記発
光部の発光面または受光部の受光面を構成する導光体の
内側面に、外乱光を反射させて外乱光が発光部または受
光部に入るのを防止するためのテーパを形成した導光
体。
3. The light guide according to claim 2, wherein ambient light is reflected by the inner surface of the light guide forming the light emitting surface of the light emitting portion or the light receiving surface of the light receiving portion, and the ambient light is emitted by the light emitting portion. Alternatively, a light guide body having a taper formed to prevent it from entering the light receiving portion.
【請求項4】請求項1ないし3のいずれかに記載の導光
体おいて、該導光体にさらに、 発光部の下面に設けた発光素子から発光部に入射した光
を反射して対向する受光部に向ける反射部、及び受光部
に入射した光を反射して受光部の下面に設けた受光素子
に向ける反射部をそれぞれ一体に設けた導光体。
4. The light guide according to claim 1, wherein the light guide further opposes by reflecting light incident on the light emitting section from a light emitting element provided on the lower surface of the light emitting section. A light guide body integrally provided with a reflecting section for directing light to the light receiving section and a reflecting section for reflecting light incident on the light receiving section and directing it to a light receiving element provided on the lower surface of the light receiving section.
【請求項5】請求項1ないし4のいずれかに記載の導光
体において、材質がアクリル樹脂、ABS樹脂、ポリカ
ーボネートなどの赤外光に対して透明な樹脂である導光
体。
5. The light guide according to claim 1, wherein the material is a resin transparent to infrared light, such as acrylic resin, ABS resin, or polycarbonate.
【請求項6】複数個の発光素子と受光素子とを対向させ
るように光学式タッチパネル表面の周囲に配置して、発
光素子から受光素子に到る光を遮光することにより物体
の位置または有無を検出する光学的位置検出装置におい
て、 上記光学式タッチパネル表面の周囲に枠状に取り付けら
れ、光学式タッチパネル表面の周囲に配置される上記複
数個の発光素子と受光素子とをチップタイプで構成し
て、これらを面状に実装した基板と、 該基板上に装着される請求項1ないし5のいずれかに記
載の導光体とを備えた光学的位置検出装置。
6. A plurality of light emitting elements and a light receiving element are arranged around the surface of the optical touch panel so as to face each other, and the light from the light emitting element to the light receiving element is shielded so as to detect the position or presence or absence of the object. In an optical position detecting device for detecting, the plurality of light emitting elements and light receiving elements, which are mounted in a frame shape around the surface of the optical touch panel and are arranged around the surface of the optical touch panel, are configured in a chip type. An optical position detecting device comprising: a substrate on which these are mounted in a planar shape; and the light guide according to claim 1, which is mounted on the substrate.
JP1869596A 1996-02-05 1996-02-05 Light guide and optical position detection device Expired - Lifetime JP3682109B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1869596A JP3682109B2 (en) 1996-02-05 1996-02-05 Light guide and optical position detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1869596A JP3682109B2 (en) 1996-02-05 1996-02-05 Light guide and optical position detection device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004152192A Division JP3926808B2 (en) 2004-05-21 2004-05-21 Light guide and optical position detection device

Publications (2)

Publication Number Publication Date
JPH09212303A true JPH09212303A (en) 1997-08-15
JP3682109B2 JP3682109B2 (en) 2005-08-10

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ID=11978772

Family Applications (1)

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