JPH09180980A - Semiconductor device manufacturing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing system which is capable of supplying semiconductor devices of high reliability quickly and easily. SOLUTION: CRT terminals 1 to 5 through which data such as specifications for the ROM of an IC chip are inputted are provided corresponding to customers. CPUs 6 to 9 form an electron beam lithography data file 10, a production control data file 11, and a quality control data file 12 basing on the data inputted through the CRT terminals 1 to 5, and the data files 10, 11, and 12 are transferred in order of the priority to one of semiconductor device manufacturing lines 13 to 15. Data such as specifications for the ROM of an IC chip are more easily and quickly processed through this system than the other systems through which data are sent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing system, and more particularly to a semiconductor device manufacturing system manufactured by a plurality of processes including an exposure process in which an exposure pattern is changed according to customer specifications.

[0002]

2. Description of the Related Art Conventionally, an IC chip (gate array) having a ROM section whose wiring pattern is changed according to the customer's specification request and a common circuit section created regardless of the customer's specification request has been produced. ing.

FIG. 5 is a block diagram showing a conventional manufacturing system for such an IC chip. RO of IC chip
The specifications of the M section are EPROM 51 and magnetic tape (MT) 5
2 is stored and sent from the CRT terminal 53 or is directly input to the processing CPU 54 from the CRT terminal 53. CPU 54 for processing
Reads the contents of the EPROM 51 and the magnetic tape 52 and processes them, or processes the contents input from the CRT terminal 53 and writes the specifications of the ROM section to the magnetic tape 55.
The magnetic tape 55 is conveyed to the CAD CPU 56.

The CAD CPU 56 reads the specifications of the ROM section from the magnetic tape 55 and generates data for creating a photomask used in the photolithography process of the ROM section based on the read specifications of the ROM section. Write on the magnetic tape 57. The magnetic tape 57 is conveyed to the photomask manufacturing line 58.

On the other hand, order information such as the number of IC chips, delivery date, customer name, etc. is transmitted by telephone 59 or directly input from the CRT terminal 60 to the production / quality CPU 61. The order information transmitted by telephone 59 is input to the production / quality CPU 61 at the CRT terminal. Production / quality CPU 61
Generates data required for production control (priority, created product type, model name, quantity, shipping destination, shipping date, etc.) and data required for quality control based on the input order information, and then creates a document 6
Print out to 2. The document 62 includes a photomask manufacturing line 58 and semiconductor device manufacturing lines 64 to
It is shipped to 66, ....

The photomask manufacturing line 58 creates a photomask 63 according to the data written on the magnetic tape 57 and the data written on the document 62. The photomask 63 is created by, for example, an electron beam exposure apparatus controlled by the data read from the magnetic tape 57. The photomask 63 is shipped to any of the semiconductor device manufacturing lines 64-66, ... According to the contents of the document 62.

As shown in FIG. 6, the semiconductor device manufacturing line 64 includes a plurality (11 in the figure) of photolithography processes. The ninth step of these steps is a step of forming a wiring pattern of the ROM portion of the IC chip. In this ninth step, according to the contents of the document 62, the photomask 6
3 is set in the exposure apparatus. In the exposure apparatus, as shown in FIG. 7, the semiconductor wafer 67 coated with the photoresist is exposed to ultraviolet rays through the photomask 63, and the wiring pattern of the ROM portion is formed on the surface of the semiconductor wafer 67. The other steps are steps for forming the common circuit portion of the IC chip. The IC chip manufactured on the semiconductor device manufacturing line 64 is packaged and tested and delivered to the customer. Other semiconductor device manufacturing lines 65, 66,
Also has the same configuration as the semiconductor device manufacturing line 64.

[0008]

Since the conventional IC chip manufacturing system is configured as described above, there are various problems.

That is, since the customer's ordering method is not unified and the specifications of the ROM section and order information are sent by various methods, the processing CPU 54 and the production / quality CP are sent.
The process in U61 is complicated, and this process requires a lot of time. Also, it was not easy to manage order priorities.

Further, the semiconductor device manufacturing lines 64-66,
In this case, since the photomask 63 and the document 62 are sent separately, the worker has to find out the photomask 63 designated by the document 62, and this work is complicated.

Further, the data in the ROM portion is the magnetic tape 6
Since it was exchanged via 5, 67, it took a lot of time to exchange the data. Further, since the writing / reading of the data was performed many times, the reliability of the data was not sufficient.

Therefore, a main object of the present invention is to provide a semiconductor device manufacturing system capable of rapidly and easily supplying a highly reliable semiconductor device.

[0013]

A semiconductor device manufacturing system according to the present invention is a semiconductor device manufacturing system manufactured by a plurality of processes including an exposure process in which an exposure pattern is changed according to a customer's specification request. , An input terminal, an arithmetic processing unit, and a production line. The input terminal is provided corresponding to each customer, and is used for inputting information including the specifications and quantity of semiconductor devices requested by the corresponding customer. The arithmetic processing unit, based on the information input to the input terminal, data necessary for the exposure process,
Data necessary for production and quality control of semiconductor devices are generated and transmitted. The manufacturing line manufactures a semiconductor device according to the data transmitted from the arithmetic processing unit.

In this semiconductor device manufacturing system, an input terminal is provided for each customer, and information including the specifications and quantity of the semiconductor device is input only from this input terminal. Therefore, it becomes possible to process such information quickly and easily as compared with the conventional method in which the information including the specification and quantity of the semiconductor device is sent by various methods such as EPROM, magnetic tape, and input terminal. It will also be easier to manage the priority of.

Further, since the data required for the exposure process and the data required for production and quality control are transmitted together from the arithmetic processing unit to the manufacturing line, these data are sent separately as compared with the conventional case. , The manufacturing work becomes easier.

Further, since the data is directly transmitted from the arithmetic processing unit to the manufacturing line, it is possible to speed up the data transfer and improve the reliability of the data as compared with the conventional case where the data is sent by the magnetic tape.

Also preferably, the manufacturing line includes a beam emitting device and a scanning device. The beam emitting device emits an electron or ion beam. The scanning device, according to the data necessary for the exposure process transmitted from the arithmetic processing unit,
The surface of the semiconductor wafer is scanned with the beam emitted from the beam emitting device, and an exposure pattern is drawn on the semiconductor wafer. In this case, since the photomask is not required in the exposure process (ROM process), the manufacturing work is simplified and the manufacturing work is simplified as compared with the conventional method in which the worker finds and sets the photomask each time a new semiconductor device is manufactured. Speeding up is achieved.

Also preferably, the manufacturing line includes a beam emitting device and a scanning device. The beam emitting device emits an electron or ion beam. The scanning device scans the beam emitted from the beam emitting device onto the mask substrate surface according to the data necessary for the exposure process transmitted from the arithmetic processing device to perform microfabrication on the mask substrate to form a photomask used in the exposure process. create. In this case, the exposure process (RO
Since the required photomask is manufactured in the manufacturing line in the (M step), the manufacturing work can be simplified and speeded up as compared with the conventional method in which the photomask is manufactured in the photomask manufacturing line and transported to the semiconductor device manufacturing line. Planned.

[0019]

1 is a block diagram showing the configuration of an IC chip manufacturing system according to an embodiment of the present invention. Referring to FIG. 1, in this IC chip manufacturing system, the specifications of the ROM section of the IC chip are processed by a CPU for processing.
CRT terminals 1 to 4 for inputting to 6 are provided in or near offices of domestic and overseas customers. The customer may input the specifications of the ROM section according to the display on the screens of the CRT terminals 1-4. This input method is
Standardized for all CRT terminals 1-4 ,. The processing CPU 6 collectively manages the input specifications of the ROM section and transmits the specifications of the ROM section to the CAD CPU 7.

The CAD CPU 7 generates an electron beam drawing data file 10 based on the specifications of the ROM section transmitted from the processing CPU 6, and the data file 10
Is transmitted to the CPU 9 for transmission. The electron beam drawing data file 10 includes data such as product name, process name, drawing method, and mark position.

On the other hand, order information such as the number of IC chips to be produced, delivery date, customer name, etc. is input from the same or different CRT terminals 1 to 4 for inputting the specifications of the ROM section. To be done. Production / quality CPU8 is CR
The production control data file 11 and the quality control data file 12 are generated based on the order information input from the T terminals 5, ... And these data files 11, 12 are transmitted to the transmission CPU 9.

The production management data file 11 includes data such as product name, process name, production quantity, delivery date, shipping destination, customer name, package model name, warehouse date, warehouse warehouse name and the like.
The quality control data file 12 includes data such as dimension data, film thickness data, and electrical characteristic request data.
The transmission CPU 9 uses these data files 10-12.
Are transmitted to any of the semiconductor device manufacturing lines 13 to 15, ...

As shown in FIG. 2, the semiconductor device manufacturing line 13 includes a plurality (11 in the figure) of photolithography processes. Of these, the ninth step is the ROM of the IC chip
This is a step of forming a partial wiring pattern. In this ninth step, the electron beam is scanned in accordance with the contents of the electron beam drawing data file 10, and an exposure pattern is drawn on the surface of the semiconductor wafer 67 coated with the photoresist.

More specifically, as shown in FIG. 3, the semiconductor device manufacturing line 13 includes a host computer 16,
Transmission CPU 17, manufacturing CPU 18, production CPU 1
9, an inspection CPU 20, a manufacturing apparatus 21, a terminal 22 and an inspection apparatus 23.

The data files 10 to 12 transmitted from the transmission CPU 9 are temporarily stored in the memory of the host computer 16 via the transmission CPU 17. The host computer 16 stores the data files 10 to 12 extracted from the memory in order of priority in the manufacturing CPU 18 and the production CPU 1.
9 and the CPU 20 for quality, and the data files 11 and 12 are given to the CPUs 25 and 27 of the subsequent lines 24 and 26, respectively.

The manufacturing CPU 18 uses the data file 10
The manufacturing apparatus 21 is controlled according to the contents of 1 to 12, and the steps shown in FIG. 2 are executed to manufacture an IC chip. Manufacturing equipment 2
As shown in FIG. 4, 1 includes an electron beam exposure apparatus 21a that executes the ninth step of FIG. Electron beam exposure apparatus 2
1a is a control interface 31, a moving table 32 on which a semiconductor wafer 67 coated with a photoresist is placed, a motor 33 and an autoloader 34 for rotating and moving the moving table 32, a position of the moving table 32, that is, And a laser interferometer 35 for detecting the position of the semiconductor wafer 67.

The electron beam exposure device 21a includes an electron gun 36 for emitting an electron beam and an electromagnetic lens 37 for narrowing the beam diameter of the electron beam emitted from the electron gun 36.
And an EOS power supply 38 for supplying electric power to the electron gun 36 and the electromagnetic lens 37.

The electron beam exposure device 21a also includes a blanking electrode 39 for blanking the electron beam.
And a deflection electrode 40 for deflecting the electron beam. The control interface 31 controls the electron beam and the moving table 32 according to the content of the data file 10 given from the manufacturing CPU 18, and the semiconductor wafer 6
7 The exposure pattern of the ROM part is directly drawn on the surface. That is, in this manufacturing system, the photomask 63 of FIG. 6 in the conventional manufacturing system is replaced with the electron beam drawing data file 10 as shown in FIG.

Further, the production CPU 19 controls the production of the production line 13 according to the contents of the data files 10 to 12, and displays the production status on the terminal 22.
In addition, the inspection CPU 20 uses the data files 10 to 12
In accordance with the contents of the above, the inspection device 23 inspects the IC chip manufactured by the manufacturing device 21 to perform quality control of the manufacturing line 13. The other semiconductor device manufacturing lines 14, 15, ... Are the same as the semiconductor device manufacturing line 13.

Next, the operation of the IC chip manufacturing system shown in FIGS. 1 to 4 will be described. CR by customer
Specifications of the ROM section of the IC chip input from the T terminals 1 to 4, ... Are converted into an electron beam drawing data file 10 by the processing CPU 6 and the CAD CPU 7.
It is transmitted to the transmission CPU 9. Also, CR by customer
Order information, such as the number of IC chips to be created, input from the same or different CRT terminals 5, ...
The production / quality CPU 8 converts the data into a production control data file 11 and a quality control data file 12 and transmits the data to the transmission CPU 9. Data file 10
.. to 12 are transmitted by the transmission CPU 9 to any of the semiconductor device manufacturing lines 13 to 15 in order of priority. The data files 10 to 12 are the semiconductor device manufacturing line 13
.. are transmitted to each of the manufacturing CPU 18, the production CPU 19 and the inspection CPU 20. Manufacturing equipment 21
The electron beam exposure apparatus 21a included in FIG. 1 draws the exposure pattern of the ROM portion on the semiconductor wafer 67 according to the data file 10 given from the CPU 18. CP for production
The U19 and the inspection CPU 20 use the data file 10
.., the production and quality control of the semiconductor device manufacturing lines 13 to 15 ,. Semiconductor device manufacturing line 1
The IC chips manufactured in 3 to 15, ... Are delivered to the customer.

In this embodiment, C is provided for each customer.
The RT terminals 1-5, ... Are provided, and the CRT terminals 1-5 ,.
Since the specifications of the ROM section of the IC chip and the order information are input from only the specification, the specifications of the ROM section of the IC chip are sent by various methods such as EPROM 51, magnetic tape 52, CRT terminal 53, and telephone 59. As compared with the conventional method, the processing such as the specifications of the ROM section of the IC chip can be performed quickly and easily. It also facilitates order priority management.

Since the data required for the ROM process and the data required for production and quality control are transmitted together to the semiconductor device manufacturing lines 13-15, ..., These data are sent separately. In comparison with the conventional method, the manufacturing work can be simplified.

Since data is transferred between the CPUs 6 to 9 and the semiconductor device manufacturing lines 13 to 15, through a dedicated line, data is transferred between the CPUs 54 and 56 and the photomask manufacturing line 58 on the magnetic tape. 5
As compared with the conventional method performed in Nos. 5 and 57, the speed of data transfer and the reliability of data can be improved.

Further, since the photomask 63 is not required in the ROM process, the manufacturing work can be simplified and speeded up as compared with the conventional method in which the operator finds the photomask 63 according to the instruction of the document 62 and sets it in the exposure apparatus. Planned. Further, since the exposure is performed by the electron beam exposure apparatus 21a, the precision of the exposure is significantly improved as compared with the conventional case where the exposure is performed through the photomask 63.

In this embodiment, the example in which the ROM process is controlled by the data file 10 has been described. However, the data file 10 is controlled by the R process.
The process is not limited to the OM process, and any process may be used as long as it is changed according to the customer's request. For example,
The data file 10 may control the slicing process of the master slice.

Further, in this embodiment, the exposure pattern is drawn by the electron beam, but the exposure pattern is not limited to this, and the exposure pattern may be drawn by the ion beam or the laser beam.

Further, in this embodiment, the electron beam is scanned in accordance with the contents of the data file 10 to form the exposure pattern of the ROM portion on the semiconductor wafer 67. However, the mask substrate is finely processed by the electron beam to perform the ROM process. The photomask 63 used may be created. In this case, the photomask 63 is used, but since the photomask 63 is created in the semiconductor device manufacturing lines 13 to 15 in order of priority, the photomask 63 is created in the photomask manufacturing line 58. Production line 64
The manufacturing work can be simplified and speeded up as compared with the conventional method of being transported to.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an IC chip manufacturing system according to an embodiment of the present invention.

FIG. 2 is a process diagram of the semiconductor device manufacturing line shown in FIG.

FIG. 3 is a block diagram showing a configuration of the semiconductor device manufacturing line shown in FIG.

4 is a block diagram showing a configuration of an electron beam exposure apparatus included in the manufacturing apparatus shown in FIG.

FIG. 5 is a block diagram showing a configuration of a conventional IC chip manufacturing system.

6 is a process diagram of the semiconductor device manufacturing line shown in FIG.

FIG. 7 is a drawing for explaining the ninth step shown in FIG.

[Explanation of symbols]

1 to 5,53 CRT terminal, 6,54 CPU for processing,
7,56 CAD CPU, 8,61 Production / quality C
PU, 9, 17 CPU for transmission, 10 electron beam drawing data file, 11 production management data file,
12 Quality control data files, 13-15, 64-
66 semiconductor device manufacturing line, 16 host computer, 18 manufacturing CPU, 19 production CPU, 20
Inspection CPU, 21 Manufacturing equipment, 21a Electron beam exposure equipment, 22 Terminal, 23 Inspection equipment, 24,26 Rear line, 25,27 CPU, 31 Control interface, 32 Moving table, 33 Motor, 34 Autoloader, 35 Laser interference Total, 36 Electron gun, 37
Electromagnetic lens, 38 EOS power supply, 39 blanking electrode, 40 deflection electrode, 51 EPROM, 52, 5
5,57 Magnetic tape, 58 Photomask manufacturing line, 59 Telephone, 62 documents, 63 Photomask, 6
7 Semiconductor wafer.

Claims (3)

[Claims] 1. A semiconductor device manufacturing system manufactured by a plurality of processes including an exposure process in which an exposure pattern is changed according to a customer's specification request, the system being provided for each customer and requested by the corresponding customer. An input terminal for inputting information including specifications, quantity, etc. of the semiconductor device, data necessary for the exposure process, and production and quality control of the semiconductor device based on the information input to the input terminal An arithmetic processing unit that generates and transmits data necessary for
A semiconductor device manufacturing system, comprising: a manufacturing line for manufacturing the semiconductor device according to data transmitted from the arithmetic processing unit. 2. The manufacturing line comprises a beam emitting device for emitting an electron or ion beam, and a semiconductor device for emitting a beam emitted from the beam emitting device according to data necessary for the exposure process transmitted from the arithmetic processing unit. The semiconductor device manufacturing system according to claim 1, further comprising a scanning device that scans a surface of the wafer and draws the exposure pattern on the semiconductor wafer. 3. The manufacturing line masks a beam emitted from the beam emitting apparatus according to a beam emitting apparatus for emitting an electron or ion beam, and data required for the exposure process transmitted from the arithmetic processing unit. The semiconductor device manufacturing system according to claim 1, further comprising a scanning device for scanning the surface of the substrate and finely processing the mask substrate to form a photomask used in the exposure step.