JPH0917601A - Electronic component and its mounting method - Google Patents
Electronic component and its mounting methodInfo
- Publication number
- JPH0917601A JPH0917601A JP16492895A JP16492895A JPH0917601A JP H0917601 A JPH0917601 A JP H0917601A JP 16492895 A JP16492895 A JP 16492895A JP 16492895 A JP16492895 A JP 16492895A JP H0917601 A JPH0917601 A JP H0917601A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- conductive paste
- adhesive
- substrate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Details Of Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子回路基板へ実装を
行う電子部品とその実装方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted on an electronic circuit board and a mounting method thereof.
【０００２】[0002]
【従来の技術】近年、環境保護の観点から、はんだ材料
（Ｓｎ−Ｐｂ系合金）中に含まれる鉛に関心が注がれて
いる。はんだ材料中に使用される鉛の量は、鉛全体の使
用量に比して少ない（１％未満）が、はんだ材料として
鉛が使用されている電子機器の廃棄物が酸性雨にさらさ
れると、有害物質である鉛が大量に溶出し地下水を汚染
するため、環境問題を引き起こす要因となっている。そ
のため、電子機器の回路形成用材料として、はんだ材料
に代替できる材料が求められているが、現状では未だ有
効な材料が開発されず、例えば図５に示すように、電子
部品８は鉛を含有したはんだ合金９により接合されてい
る。現在その代替材料の候補として、銅、ニッケル、
銀、銀／パラジウム等の粉体をエポキシ樹脂等のバイン
ダー中に分散させた導電性ペーストの利用が検討されて
いる。この導電性ペーストは印刷機やディスペンサーに
より供給され、接点同士が接続された状態で熱硬化を行
い、部品の接合が行われる。2. Description of the Related Art In recent years, attention has been paid to lead contained in a solder material (Sn-Pb alloy) from the viewpoint of environmental protection. The amount of lead used in the solder material is less than the total amount of lead used (less than 1%), but when the waste of electronic equipment that uses lead as the solder material is exposed to acid rain. However, a large amount of lead, which is a harmful substance, elutes and pollutes groundwater, causing environmental problems. Therefore, as a material for forming a circuit of an electronic device, a material that can substitute for a solder material is required, but at present, an effective material has not been developed. For example, as shown in FIG. 5, the electronic component 8 contains lead. It is joined by the solder alloy 9. Currently, copper, nickel,
The use of a conductive paste in which a powder of silver, silver / palladium or the like is dispersed in a binder such as an epoxy resin has been studied. The conductive paste is supplied by a printing machine or a dispenser, and thermosetting is performed in a state where the contacts are connected to each other to join the components.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前述の
ように導電性ペーストを用いた場合、接合部分の強度は
従来のはんだ材料に比して弱く、恒温恒湿試験やヒート
サイクル試験等の信頼性評価結果においても充分な結果
は得られない。そのため、強度を補強するため接合部の
まわりを封止材などで封止する必要があり、はんだ付け
と比較すると工程が増えてリードタイムが長くなるとい
う問題点を有していた。However, when the conductive paste is used as described above, the strength of the joint is weaker than that of the conventional solder material, and the reliability of constant temperature and humidity test and heat cycle test is improved. The evaluation results are not sufficient. Therefore, in order to reinforce the strength, it is necessary to seal the periphery of the joint with a sealing material or the like, and there is a problem in that the number of steps is increased and the lead time becomes longer as compared with soldering.
【０００４】本発明は上記従来の問題点を解決するもの
で、従来のはんだ付けと同様のプロセスで導電性ペース
トによる接合を行うことができ、かつはんだ付けと同様
の信頼性を得ることを目的とする。また環境に有害な鉛
を使用せずに電子回路基板を製造することを目的とす
る。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to perform bonding with a conductive paste in the same process as the conventional soldering and to obtain the same reliability as the soldering. And Another object is to manufacture electronic circuit boards without using lead, which is harmful to the environment.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
に、本発明の電子部品は、電子部品の電極以外の表面
に、接着剤との接合強度を高める表面処理を施してい
る。また、本発明の電子部品の実装方法は、導電ペース
トにより電子部品の電極と基板のランドを接合し、電極
以外の表面と基板を接着剤で接合するものである。In order to achieve this object, in the electronic component of the present invention, the surface of the electronic component other than the electrodes is subjected to a surface treatment for increasing the bonding strength with the adhesive. Further, the method for mounting an electronic component of the present invention is to bond the electrode of the electronic component and the land of the substrate with a conductive paste, and bond the surface other than the electrode and the substrate with an adhesive.
【０００６】[0006]
【作用】本発明によれば、導電ペーストにより電子部品
の電極と基板のランドを接合し、電極以外の表面と基板
を接着剤で接着することにより、高い接合信頼性を得る
ことができる。また、電子部品の電極以外の表面に、接
着剤との接着強度を高める表面処理を施しているため、
接合信頼性を一層高めることができる。According to the present invention, high bonding reliability can be obtained by bonding the electrodes of the electronic component and the lands of the substrate with the conductive paste and bonding the surface other than the electrodes to the substrate with the adhesive. In addition, since the surface of the electronic parts other than the electrodes is subjected to surface treatment to increase the adhesive strength with the adhesive,
Bonding reliability can be further enhanced.
【０００７】また、導電性ペースト、および接着剤の硬
化をリフロー炉で行うことができるため、従来のはんだ
付け工法および設備により実装を行うことができる。Further, since the conductive paste and the adhesive can be cured in the reflow furnace, the conventional soldering method and equipment can be used for mounting.
【０００８】[0008]
【実施例】以下、本発明の実施例を説明する。 （実施例１）図１は本発明の実施例に用いる電子部品の
斜視図であり、１は電子部品、２は電極、３はシランカ
ップリング剤の塗布等の表面処理を施した電極表面であ
る。図２は本発明の実施例における基板の斜視図であ
り、４は基板、５はランドである。図３は本発明の実施
例における基板に導電ペーストと接着剤を形成した状態
の斜視図であり、６は接着剤、７は導電ペーストであ
る。図４は本発明の実施例における基板に電子部品を実
装した状態の斜視図である。Embodiments of the present invention will be described below. (Embodiment 1) FIG. 1 is a perspective view of an electronic component used in an embodiment of the present invention, in which 1 is an electronic component, 2 is an electrode, 3 is an electrode surface which has been subjected to a surface treatment such as application of a silane coupling agent. is there. FIG. 2 is a perspective view of a substrate in the embodiment of the present invention, and 4 is a substrate and 5 is a land. FIG. 3 is a perspective view showing a state in which a conductive paste and an adhesive are formed on a substrate in the embodiment of the present invention, 6 is an adhesive and 7 is a conductive paste. FIG. 4 is a perspective view showing a state in which electronic components are mounted on the substrate according to the embodiment of the present invention.
【０００９】図１から図４に基づいて本発明の実施例を
説明する。まず、図２に示されている基板４のランド５
上に、図３に示されているように導電ペースト７を形成
し、ランドとランドの間に熱硬化型接着剤６を形成す
る。このとき導電ペースト７と熱硬化型接着剤６はどち
らを先に形成してもよいが、熱硬化接着剤６を導電ペー
スト７よりも高く形成したほうがよい。また、導電ペー
スト７を形成するランド５は、従来例のように導電ペー
ストがフィレット形成をしないため、従来のはんだ付け
の際に設定するフィレット９を考慮したランドサイズに
する必要がない。そのため、ランド５は従来より小さく
することができ、基板の高密度化を行うことができる。An embodiment of the present invention will be described with reference to FIGS. 1 to 4. First, the land 5 of the substrate 4 shown in FIG.
As shown in FIG. 3, a conductive paste 7 is formed on the top of the conductive paste 7 and a thermosetting adhesive 6 is formed between the lands. At this time, either the conductive paste 7 or the thermosetting adhesive 6 may be formed first, but it is better to form the thermosetting adhesive 6 higher than the conductive paste 7. Further, since the conductive paste does not form a fillet as in the conventional example, the land 5 forming the conductive paste 7 does not need to have a land size in consideration of the fillet 9 set in the conventional soldering. Therefore, the land 5 can be made smaller than the conventional one, and the density of the substrate can be increased.
【００１０】次に図１に示すようなシランカップリング
剤による表面処理を施した電子部品１を、部品装着機に
より図４に示すように、基板４の上に形成された導電ペ
ースト７と熱硬化型接着剤６の上に装着する。このとき
導電ペースト７と熱硬化型接着剤６が混じり合わないよ
うに塗布量と装着条件が設定される。部品装着後の基板
をリフロー炉に投入し、熱硬化型接着剤６と導電ペース
ト７の硬化を行う。電子部品１の電極表面３に塗布され
たシランカップリング剤は、接着材と化学結合により結
合し、両者の接着強度を高めることができる。また、接
着強度を高める手段として、コロナ放電処理による表面
処理方法を採用しても同等の接着強度を得ることができ
る。このとき、リフロープロファイルは使用する材料の
硬化特性に合わせて適宜作製される。例えば、接着剤の
熱硬化収縮率を導電ペーストの熱硬化収縮率よりも大き
く設定しておくことにより、リフロー工程において電子
部品１の電極２が導電ペースト７を押しつける状態にな
るため、電気伝導率および接合強度の確保が可能とな
る。Next, as shown in FIG. 4, the electronic component 1 surface-treated with a silane coupling agent as shown in FIG. 1 and a conductive paste 7 formed on a substrate 4 and heat are applied by a component mounting machine as shown in FIG. It is mounted on the curable adhesive 6. At this time, the application amount and the mounting condition are set so that the conductive paste 7 and the thermosetting adhesive 6 do not mix with each other. The substrate after mounting the components is put into a reflow oven, and the thermosetting adhesive 6 and the conductive paste 7 are cured. The silane coupling agent applied to the electrode surface 3 of the electronic component 1 can be chemically bonded to the adhesive to increase the adhesive strength between them. Moreover, even if a surface treatment method by corona discharge treatment is adopted as a means for increasing the adhesive strength, the same adhesive strength can be obtained. At this time, the reflow profile is appropriately prepared according to the curing characteristics of the material used. For example, by setting the heat curing shrinkage of the adhesive to be larger than the heat curing shrinkage of the conductive paste, the electrode 2 of the electronic component 1 is in a state of pressing the conductive paste 7 in the reflow process, so that the electrical conductivity is increased. And it becomes possible to secure the bonding strength.
【００１１】[0011]
【発明の効果】本発明によれば、鉛フリーで回路基板の
製作ができるとともに、導電ペーストにより電子部品の
電極と基板のランドを接合し、電極以外の表面と基板を
接着剤で接着することにより、高い強度で部品保持がで
きるため接合信頼性を向上することができる。According to the present invention, a lead-free circuit board can be manufactured, the electrodes of the electronic component and the lands of the board are joined by a conductive paste, and the surface other than the electrodes is bonded to the board with an adhesive. As a result, the parts can be held with high strength, so that the joint reliability can be improved.
【００１２】また、電子部品の電極以外の表面に、接着
剤との接着強度を高める表面処理を施しているため、接
合信頼性を一層高めることができる。また、導電性ペー
スト、および接着剤の硬化をリフロー炉で行うことがで
きるため、従来のはんだ付け工法および設備により実装
を行うことができる。さらに、従来のはんだ付けの際に
設定するフィレットを形成しないためランドサイズを小
さくすることができ、基板の高密度化に対応することが
できる。Further, since the surface of the electronic component other than the electrodes is subjected to a surface treatment for increasing the adhesive strength with the adhesive, the joint reliability can be further enhanced. Further, since the conductive paste and the adhesive can be cured in the reflow furnace, the mounting can be performed by the conventional soldering method and equipment. Further, since the fillet that is set in the conventional soldering is not formed, the land size can be reduced, and the high density of the board can be dealt with.
【図１】本発明の実施例における電子部品である。FIG. 1 is an electronic component according to an embodiment of the present invention.
【図２】本発明の実施例における電子回路基板である。FIG. 2 is an electronic circuit board according to an embodiment of the present invention.
【図３】本発明の実施例における導電ペーストと接着剤
の形成状態を示す模式図である。FIG. 3 is a schematic diagram showing a formation state of a conductive paste and an adhesive in an example of the present invention.
【図４】本発明の実施例における電子部品装着後の状態
を示す模式図である。FIG. 4 is a schematic diagram showing a state after mounting an electronic component according to the embodiment of the invention.
【図５】従来例における電子部品装着、リフロー後の状
態を示す模式図である。FIG. 5 is a schematic view showing a state after electronic component mounting and reflow in a conventional example.
１ 電子部品（チップコンデンサ） ２ 電極 ３ 表面処理を施した電極表面 ４ 基板 ５ ランド ６ 熱硬化型接着剤 ７ 導電ペースト ８ 従来の電子部品（チップコンデンサ） ９ フィレット 1 Electronic Component (Chip Capacitor) 2 Electrode 3 Electrode Surface with Surface Treatment 4 Substrate 5 Land 6 Thermosetting Adhesive 7 Conductive Paste 8 Conventional Electronic Component (Chip Capacitor) 9 Fillet
Claims (6)
の接着強度を高める表面処理を施したことを特徴とする
電子部品。1. An electronic component, wherein the surface of the electronic component other than the electrodes is subjected to a surface treatment for increasing the adhesive strength with an adhesive.
シランカップリング剤の塗布によって行われることを特
徴とする請求項１に記載の電子部品。2. The electronic component according to claim 1, wherein the surface treatment for increasing the adhesive strength with the adhesive is performed by applying a silane coupling agent.
コロナ放電処理によって行われることを特徴とする請求
項１に記載の電子部品。3. The electronic component according to claim 1, wherein the surface treatment for increasing the adhesive strength with the adhesive is performed by corona discharge treatment.
板のランドを接合し、電極以外の表面と基板を接着剤で
接着することを特徴とする電子部品の実装方法。4. A method of mounting an electronic component, comprising bonding an electrode of an electronic component and a land of a substrate with a conductive paste, and bonding a surface other than the electrode and the substrate with an adhesive.
の接合強度を高める表面処理を施した電子部品を使用す
ることを特徴とする請求項４に記載の電子部品の実装方
法。5. The method of mounting an electronic component according to claim 4, wherein the electronic component is surface-treated to enhance the bonding strength with an adhesive on the surface of the electronic component other than the electrode.
熱硬化収縮率よりも大きいことを特徴とする請求項４に
記載の電子部品の実装方法。6. The mounting method for an electronic component according to claim 4, wherein the thermosetting shrinkage of the adhesive is larger than the thermosetting shrinkage of the conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16492895A JPH0917601A (en) | 1995-06-30 | 1995-06-30 | Electronic component and its mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16492895A JPH0917601A (en) | 1995-06-30 | 1995-06-30 | Electronic component and its mounting method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004208618A Division JP2004297093A (en) | 2004-07-15 | 2004-07-15 | Electronic component and packaging method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0917601A true JPH0917601A (en) | 1997-01-17 |
Family
ID=15802513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16492895A Pending JPH0917601A (en) | 1995-06-30 | 1995-06-30 | Electronic component and its mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0917601A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6326239B1 (en) | 1998-04-07 | 2001-12-04 | Denso Corporation | Mounting structure of electronic parts and mounting method of electronic parts |
| JP2006344870A (en) * | 2005-06-10 | 2006-12-21 | Toppan Printing Co Ltd | Resistance element and method of adjusting resistance value thereof |
| US7180007B2 (en) * | 2003-06-06 | 2007-02-20 | Matsushita Electric Industrial Co., Ltd. | Electronic circuit device and its manufacturing method |
| JP2009044180A (en) * | 1999-01-11 | 2009-02-26 | Panasonic Corp | Printed board, electrical appliance, and method for recycling wastes of the same |
| CN113056113A (en) * | 2020-07-31 | 2021-06-29 | 广州立景创新科技有限公司 | Method for manufacturing electronic component module |
-
1995
- 1995-06-30 JP JP16492895A patent/JPH0917601A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6326239B1 (en) | 1998-04-07 | 2001-12-04 | Denso Corporation | Mounting structure of electronic parts and mounting method of electronic parts |
| JP2009044180A (en) * | 1999-01-11 | 2009-02-26 | Panasonic Corp | Printed board, electrical appliance, and method for recycling wastes of the same |
| US7180007B2 (en) * | 2003-06-06 | 2007-02-20 | Matsushita Electric Industrial Co., Ltd. | Electronic circuit device and its manufacturing method |
| JP2006344870A (en) * | 2005-06-10 | 2006-12-21 | Toppan Printing Co Ltd | Resistance element and method of adjusting resistance value thereof |
| CN113056113A (en) * | 2020-07-31 | 2021-06-29 | 广州立景创新科技有限公司 | Method for manufacturing electronic component module |
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