JPH09174263A - Method and device for removing insulating film of covered wire - Google Patents

Method and device for removing insulating film of covered wire

Info

Publication number
JPH09174263A
JPH09174263A JP7350530A JP35053095A JPH09174263A JP H09174263 A JPH09174263 A JP H09174263A JP 7350530 A JP7350530 A JP 7350530A JP 35053095 A JP35053095 A JP 35053095A JP H09174263 A JPH09174263 A JP H09174263A
Authority
JP
Japan
Prior art keywords
laser light
coated wire
insulating coating
insulating film
covered wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7350530A
Other languages
Japanese (ja)
Inventor
Mitsuo Ishikawa
光男 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyachi Technos Corp
Original Assignee
Miyachi Technos Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyachi Technos Corp filed Critical Miyachi Technos Corp
Priority to JP7350530A priority Critical patent/JPH09174263A/en
Publication of JPH09174263A publication Critical patent/JPH09174263A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)

Abstract

PROBLEM TO BE SOLVED: To efficiently remove the insulating film from the wound part of a covered wire and improve the automation, productivity and working quality. SOLUTION: In the first stage of pulsed laser irradiation process, a pulsed laser beam LBQP with a high peak value is irradiatingly scanned, which is outputted in pulse oscillation using a Q-switch, in X-Y direction to the area 30 irradiated by the laser beam in the wound part 26 of a covered wire. By this scanning irradiation, an insulating film 14b is directly fractured and stripped by laser energy in the part 32 on which the pulsed laser beam LBQP is made incident, exposing a conductor 14a. Next, in the second stage of continuous wave laser irradiation process, a continuous wave laser beam LBCW is irradiatingly scanned in X-Y direction to the area 30 irradiated by the laser beam in the wound part 26 of the covered wire. By this scanning irradiation, in the wound part 26 of the covered wire, the heat from the laser energy is transferred through the conductor 14a to the area 34 unirradiated by the laser beam in the periphery or the rear side of the irradiated area 30, so that the insulating film 14b is stripped by heat even in the unirradiated area 34, exposing the conductor 14a.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0010】[0010]

【発明の属する技術分野】本発明は、被覆線の巻き付け
部から絶縁被膜を除去するための方法および装置に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for removing an insulating coating from a wound portion of a coated wire.

【0020】[0020]

【従来の技術】被覆線は、銅等の導体をポリイミド、ポ
リウレタンまたはエナメル等の絶縁材で被覆してなる電
線である。一般に、電気部品等においてこのような被覆
線を棒状、柱状または板状の導体端子にしっかりと接続
するときには、被覆線の一端部を端子に巻き付けたの
ち、この巻き付け部から絶縁被膜を除去して導体を露出
せしめ、この導体露出部を半田付けで端子に接合するよ
うにしている。
2. Description of the Related Art A covered wire is an electric wire formed by covering a conductor such as copper with an insulating material such as polyimide, polyurethane or enamel. Generally, when firmly connecting such a coated wire to a rod-shaped, column-shaped, or plate-shaped conductor terminal in an electric component or the like, wind one end of the coated wire around the terminal, and then remove the insulating coating from the wound portion. The conductor is exposed, and the exposed conductor is soldered to the terminal.

【0030】図9に、被覆線の巻き付け部から絶縁被膜
を除去される電気部品(被加工物)の一例としてソレノ
イド・コイルを示す。
FIG. 9 shows a solenoid coil as an example of an electric component (workpiece) from which the insulating coating is removed from the wound portion of the covered wire.

【0040】このソレノイド・コイル10は、角筒状の
中空ボビン12の外周に被覆線14を密に巻回してな
る。この被覆線14は、細い銅線14aをたとえばポリ
エステルからなる絶縁被膜14bで被覆した電線であ
る。ボビン12の上端に一体形成された四角形のフラン
ジ部16の上面縁部に2つの支持ブロック18,20が
適当な間隔を置いて固定配置され、それぞれの支持ブロ
ック18,20の一側面より棒状の導体端子22,24
が水平方向に突出している。被覆線14の一端部(巻始
め端部)26は一方の端子22に巻き付けられ、他端部
(巻終り端部)28は他方の端子24に巻き付けられて
いる。この被覆線14の巻き付け工程は従来周知の巻線
装置(図示せず)により行われる。そして、巻き付けの
後に、巻き付け部26,28から絶縁被膜を除去するた
めの処理が行われる。
The solenoid coil 10 is formed by densely winding a covered wire 14 on the outer periphery of a hollow bobbin 12 having a rectangular tube shape. The covered wire 14 is an electric wire in which a thin copper wire 14a is covered with an insulating coating 14b made of polyester, for example. Two support blocks 18 and 20 are fixedly arranged at appropriate intervals on the upper surface edge of a rectangular flange portion 16 integrally formed on the upper end of the bobbin 12, and one side surface of each support block 18 and 20 has a rod shape. Conductor terminals 22, 24
Project horizontally. One end (winding end) 26 of the covered wire 14 is wound around one terminal 22, and the other end (winding end) 28 is wound around the other terminal 24. The winding process of the covered wire 14 is performed by a conventionally known winding device (not shown). Then, after the winding, a process for removing the insulating coating from the winding portions 26 and 28 is performed.

【0050】上記のような被覆線の巻き付け部から絶縁
被膜を除去するために、従来は、被覆線巻き付け部をダ
イヤモンド材等で罫描いて絶縁被膜を機械的に剥離する
方法か、被覆線巻き付け部に薬品を塗って絶縁被膜を化
学的に分解する方法を用いていた。
In order to remove the insulating coating from the wound portion of the coated wire as described above, conventionally, the coated wire winding portion is marked with a diamond material or the like and the insulating coating is mechanically peeled, or the coated wire winding is performed. A chemical was applied to the area to chemically decompose the insulating coating.

【0060】このような罫描処理および薬品処理のいず
れも手作業で行われるため、時間と手間がかかり、生産
性が低かった。罫描処理を機械化することは可能である
が、罫描位置ないし範囲を調整するのが難しいうえ、1
つの電気部品(被加工物)に異なる形状・サイズの被覆
線巻き付け部が数箇所ある場合には、それらの巻き付け
部に1対1に対応させて複数台の罫描(剥離)機を設置
しなければならないという不便もある。
Since both the line drawing process and the chemical process are manually performed, it takes time and labor, and the productivity is low. Although it is possible to mechanize the line drawing process, it is difficult to adjust the line drawing position or range, and
If there are several covered wire winding parts with different shapes and sizes on one electrical part (workpiece), install multiple scoring (peeling) machines in a one-to-one correspondence with those winding parts. There is also the inconvenience of having to do it.

【0070】ところで、最近は、被覆線の絶縁被覆除去
処理にレーザを使用する方法の研究開発が進んでおり、
種々の提案がなされている。この種のレーザには、高分
子絶縁物を分解して除去するのに適した紫外線を発生す
るエキシマレーザが多く用いられている。しかしなが
ら、エキシマレーザは、レーザ光の当たらない被覆線の
裏面部分では絶縁材(被膜)が分解しにくいという欠点
がある。かかるエキシマレーザの欠点を解決するため
に、被覆線の後方(裏側)に凹面鏡を配置し、この凹面
鏡でレーザ光を反射させて被覆線の裏面の絶縁被膜にも
レーザ光を照射するようにした方法が特開平7−782
5で開示されている。
By the way, recently, research and development of a method of using a laser for the insulation coating removal treatment of a coated wire have progressed,
Various proposals have been made. As this type of laser, an excimer laser that generates ultraviolet rays suitable for decomposing and removing a polymer insulator is often used. However, the excimer laser has a drawback that the insulating material (coating) is difficult to decompose on the back surface of the covered wire that is not exposed to the laser light. In order to solve the drawbacks of the excimer laser, a concave mirror is arranged at the rear (back side) of the covered wire, and the concave mirror reflects the laser light so that the insulating film on the back surface of the covered wire is also irradiated with the laser light. The method is JP-A-7-782.
5 are disclosed.

【0080】また、エキシマレーザに代えて赤外線領域
のレーザ光を使用し、このレーザ光の光エネルギーによ
り被覆線の絶縁被膜を加熱して、溶融・蒸発により被膜
を除去する方法も提案されている。
A method has also been proposed in which laser light in the infrared region is used in place of the excimer laser, the insulating coating of the coated wire is heated by the light energy of this laser light, and the coating is removed by melting and evaporation. .

【0090】たとえば、特開平6−141432で開示
されている方法では、炭酸ガスレーザによる連続波レー
ザ光(波長10.6μm)をスポットに集光して被覆線
の絶縁被膜に照射し、絶縁被膜に吸収された炭酸ガスレ
ーザ光のエネルギーにより絶縁被膜を溶融・蒸発して除
去するようにしている。また、特開平6−141432
で開示されている方法では、パルスYAGレーザ光(波
長1.064μm)を一定角度内で回転する1枚の反射
ミラーで反射させることにより、パルスYAGレーザ光
の集光点を被覆線の絶縁被膜上で直線的に一定距離移動
させ、集光点の移動の長さだけ絶縁被膜を剥離するよう
にしている。
For example, in the method disclosed in JP-A-6-141432, a continuous wave laser beam (wavelength: 10.6 μm) generated by a carbon dioxide gas laser is focused on a spot to irradiate the insulating coating of the coated wire, and the insulating coating is applied to the insulating coating. The energy of the absorbed carbon dioxide laser light is used to melt and evaporate and remove the insulating coating. In addition, JP-A-6-141432
In the method disclosed in (1), the pulse YAG laser light (wavelength 1.064 μm) is reflected by a single reflecting mirror that rotates within a fixed angle, so that the focal point of the pulse YAG laser light is covered with an insulating film of a covered wire. The insulating coating is peeled off by the length of the movement of the converging point by linearly moving it by a certain distance.

【0100】[0100]

【発明が解決しようとする課題】上記したように、被覆
線の巻き付け部の絶縁被膜を除去するための従来方法で
ある罫描処理および薬品処理は、作業が面倒で、時間と
手間がかかり、生産性が低いという問題がある。
As described above, the conventional method for removing the insulating coating on the wound portion of the coated wire, such as the scoring process and the chemical treatment, is laborious, time-consuming, and labor-intensive. There is a problem of low productivity.

【0110】一方、従来のレーザ式絶縁被膜除去方法は
いずれも、被覆線の直線的な端部の絶縁被膜を除去する
ためのもので、レーザ光を照射した部分の絶縁被膜を除
去することができても、レーザ光の照射を受けない部分
の絶縁被膜を有効に除去することはできない。たとえ
ば、図9に示すような被加工物10において、被覆線1
4の巻き付け部26,28と端子22,29との間で良
好な半田接合ないし電気的接続を得るには、絶縁被膜除
去処理で被覆線巻き付け部26,28の内側面の絶縁被
膜を十分に除去する必要がある。しかるに、従来の方法
によれば、レーザ光の照射が実質上不可能な被覆線巻き
付け部26,28の内側面では絶縁被膜が除去されない
で残るため、良好な半田付けができないという問題があ
る。
On the other hand, all the conventional laser type insulating film removing methods are for removing the insulating film at the linear end of the covered wire, and the insulating film at the portion irradiated with the laser beam can be removed. Even if it is possible, it is not possible to effectively remove the portion of the insulating coating that is not irradiated with the laser beam. For example, in the workpiece 10 as shown in FIG. 9, the covered wire 1
In order to obtain a good solder joint or electrical connection between the winding parts 26, 28 of FIG. 4 and the terminals 22, 29, the insulating film removal treatment should sufficiently remove the insulating film on the inner surface of the covered wire winding parts 26, 28. Need to be removed. However, according to the conventional method, the insulating coating remains on the inner side surfaces of the covered wire winding portions 26 and 28 where the irradiation of the laser light is substantially impossible, so that good soldering cannot be performed.

【0120】本発明は、かかる問題点に鑑みてなされた
もので、被覆線の巻き付け部から絶縁被膜を効率良く除
去でき、自動化と生産性および加工品質の向上に有利な
被覆線の絶縁被膜除去方法および装置を提供することを
目的とする。
The present invention has been made in view of the above problems, and is capable of efficiently removing the insulating coating from the winding portion of the coated wire, which is advantageous for automation and improvement of productivity and processing quality. It is an object to provide a method and a device.

【0130】[0130]

【課題を解決するための手段】上記の目的を達成するた
めに、本発明のうちで請求項1記載の発明は、導体を絶
縁材で被覆してなる被覆線の巻き付け部から前記絶縁材
を少なくとも部分的に除去する被覆線の絶縁被膜除去方
法において、前記被覆線の巻き付け部の絶縁被膜を除去
すべき領域の少なくとも一部にパルスレーザ光をX−Y
方向に走査させて照射するパルスレーザ光照射工程と、
前記パルスレーザ照射工程の終了後に、前記絶縁被膜を
除去すべき領域の少なくとも一部に連続波レーザ光をX
−Y方向に走査させて照射する連続波レーザ光照射工程
とを含むことを特徴とする。
In order to achieve the above object, the invention according to claim 1 of the present invention is characterized in that the insulating material is wound from a winding portion of a covered wire formed by coating a conductor with an insulating material. In a method of removing an insulating film of a covered wire, which is at least partially removed, pulse laser light is applied to at least a part of a region of the wound portion of the covered wire where the insulating film is to be removed.
Pulsed laser light irradiation step of scanning and irradiating in a direction,
After completion of the pulsed laser irradiation step, X-rays of continuous wave laser light are applied to at least a part of the region where the insulating film should be removed.
A continuous wave laser light irradiation step of irradiating by scanning in the −Y direction.

【0140】また、請求項2記載の発明は、請求項1記
載の発明の方法において、前記パルスレーザ光がQスイ
ッチを用いて発振出力されるQスイッチパルスレーザ光
であることを特徴とする。
The invention according to claim 2 is the method according to claim 1, wherein the pulsed laser light is a Q-switched pulsed laser light oscillated and output using a Q-switch.

【0150】また、請求項3記載の発明は、請求項1ま
たは2記載の発明の方法において、前記被膜線の絶縁被
膜除去処理期間の少なくとも一部の期間を含む所定の期
間中に前記被覆線の絶縁被膜を除去すべき領域の少なく
とも一部に所定の温度の熱風を吹き付ける熱風吹付け工
程を含むことを特徴とする。
The invention according to claim 3 is the method of the invention according to claim 1 or 2, wherein the coated wire is included in a predetermined period including at least a part of an insulating film removal treatment period of the coated wire. The method is characterized by including a hot air blowing step of blowing hot air of a predetermined temperature to at least a part of the region where the insulating coating is to be removed.

【0160】請求項4記載の発明は、導体を絶縁材で被
覆してなる被覆線の巻き付け部から前記絶縁材を少なく
とも部分的に除去する被覆線の絶縁被膜除去装置におい
て、Qスイッチによるパルス発振出力のパルスレーザ光
と連続波のレーザ光とを切り換えて選択的に出力するレ
ーザ発振手段と、前記レーザ発振手段からのレーザ光を
入射させて、そのレーザ光を前記被覆線巻き付け部側に
向けて反射し、かつ前記被覆線の絶縁被膜を除去すべき
領域の少なくとも一部に対して第1の方向に走査させる
第1の走査ミラー手段と、前記第1の走査ミラー手段か
らのレーザ光を入射させて、そのレーザ光を前記被覆線
の絶縁被膜を除去すべき領域の少なくとも一部に向けて
反射し、かつ前記被覆線の絶縁被膜を除去すべき領域の
少なくとも一部に対して前記第1の方向とは直交する第
2の方向に走査させる第2の走査ミラー手段とを含むこ
とを特徴とする。
According to a fourth aspect of the present invention, there is provided a device for removing an insulating film of a coated wire, wherein a conductor is coated with an insulating material, at least partially removing the insulating material from a wound portion of the coated wire. A laser oscillating means for selectively outputting an output pulsed laser light and a continuous wave laser light, and a laser light from the laser oscillating means are incident to direct the laser light to the covered wire winding portion side. A laser beam from the first scanning mirror means and a first scanning mirror means that reflects in a first direction and scans at least a part of the area of the coated wire where the insulating coating is to be removed. The laser beam is made incident and reflected toward at least a part of the region of the coated wire where the insulating coating is to be removed, and is reflected on at least a part of the region where the insulating coating of the coated wire is to be removed. Characterized in that the said first direction and including a second scan mirror means for scanning in a second direction orthogonal.

【0170】また、請求項5記載の発明は、請求項4記
載の発明の装置において、前記被覆線の絶縁被膜を除去
すべき領域の少なくとも一部に所定温度の熱風を吹き付
ける熱風供給手段をさらに有することを特徴とする。
Further, the invention of claim 5 is the apparatus of the invention of claim 4, further comprising hot air supply means for blowing hot air of a predetermined temperature to at least a part of a region of the coated wire where the insulating film is to be removed. It is characterized by having.

【0180】[0180]

【発明の実施の形態】以下、添付図を参照して本発明の
一実施例を説明する。
DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the accompanying drawings.

【0190】本発明の絶縁被膜除去方法は、パルスレー
ザ光照射工程および連続波レーザ光照射工程の2段階の
工程からなる。第1段階のパルスレーザ光照射工程で
は、ピーク出力(尖頭値)の極めて高いQスイッチ方式
のパルスレーザ光を用いてレーザエネルギーにより直接
的にレーザ光照射領域の絶縁被膜を除去する。そして、
第2段階の連続波レーザ光照射工程では、連続波レーザ
光を用いて熱伝導による加熱でレーザ光非照射領域の絶
縁被膜を除去する。
The insulating film removing method of the present invention comprises two steps, a pulse laser beam irradiation step and a continuous wave laser beam irradiation step. In the pulse laser light irradiation step of the first stage, the insulating coating in the laser light irradiation region is directly removed by the laser energy using the Q switch type pulse laser light having an extremely high peak output (peak value). And
In the continuous wave laser light irradiation step of the second stage, the insulating film in the laser light non-irradiated region is removed by heating by heat conduction using continuous wave laser light.

【0200】本発明の絶縁被膜除去方法の具体例を図1
および図2を参照して説明する。図1に示す被処理対象
(被加工物)は、図9のソレノイド・コイル10の被覆
線14の巻き付け部26である。
A specific example of the method for removing an insulating film of the present invention is shown in FIG.
This will be described with reference to FIG. The object to be processed (workpiece) shown in FIG. 1 is the winding portion 26 of the covered wire 14 of the solenoid coil 10 of FIG.

【0210】図1に示すように、本実施例においては、
被覆線巻き付け部26の外側面の一部の領域(この例で
は上面部)に適当な面積(広がり)を有するレーザ光照
射領域30を設定する。そして、第1段階のパルスレー
ザ光照射工程では尖頭値の高いQスイッチ方式のパルス
レーザ光LBQPを該レーザ光照射領域30にスキャン照
射してレーザ光照射部分付近の絶縁被膜14bをレーザ
エネルギーで直接破壊して剥離する。次に、第2段階の
連続波レーザ光照射工程では、連続波レーザ光LBCWを
該レーザ光照射領域30に所定時間持続的にスキャン照
射して導体14aを介してレーザ光照射領域30の周囲
のレーザ光非照射領域へ熱を伝えてその領域の絶縁被膜
14bまでも加熱で剥離するようにしている。
As shown in FIG. 1, in the present embodiment,
A laser beam irradiation region 30 having an appropriate area (spread) is set in a part of the outer surface of the covered wire winding portion 26 (upper surface portion in this example). Then, in the pulse laser light irradiation step of the first stage, the pulsed laser light LBQP of the Q-switch type having a high peak value is scan-irradiated to the laser light irradiation region 30 to apply laser energy to the insulating coating 14b near the laser light irradiation portion. Direct destruction and peeling. Next, in the continuous wave laser light irradiation step of the second stage, continuous wave laser light LBCW is continuously scan-irradiated to the laser light irradiation region 30 for a predetermined time to irradiate the periphery of the laser light irradiation region 30 via the conductor 14a. Heat is transmitted to the laser light non-irradiated area, and even the insulating coating 14b in that area is peeled by heating.

【0220】このように、本実施例では、レーザ光LB
QP,LBCWをレーザ光照射領域30に対してX−Y方向
に走査させている。したがって、相当の広がりを有する
レーザ光照射領域30をスキャン照射するため、被覆線
巻き付け部26(28)の位置合わせに多少の誤差があ
っても、被覆線巻き付け部26(28)の外側面の相当
の部分にレーザ光LBQP,LBCWを照射することが可能
であり、安定確実に絶縁被膜除去処理を行うことができ
る。
As described above, in this embodiment, the laser light LB is
The laser light irradiation region 30 is scanned with QP and LBCW in the XY directions. Therefore, since the laser light irradiation region 30 having a considerable spread is scanned and irradiated, even if there is some error in the alignment of the covered wire winding portion 26 (28), the outside surface of the covered wire winding portion 26 (28) is It is possible to irradiate a considerable portion with the laser beams LBQP and LBCW, and it is possible to perform the insulating film removal treatment in a stable and reliable manner.

【0230】ここで、図2につき、本実施例におけるレ
ーザ光照射工程の作用をより詳しく説明する。
The operation of the laser beam irradiation step in this embodiment will be described in more detail with reference to FIG.

【0240】図2の(A) に示すように、第1段階のパル
スレーザ光照射工程では、Qスイッチを用いてパルス発
振出力させた尖頭値の高いパルスレーザ光LBQPを、被
覆線巻き付け部26のレーザ光照射領域30にX−Y方
向でスキャン照射する。このスキャン照射は、通常は1
回で足りるが、絶縁被膜14bの材質や膜厚およびレー
ザ出力、パルス周期等に応じて複数回繰り返されてもよ
い。この結果、パルスレーザ光LBQPが入射した部分3
2では、絶縁被膜14bがレーザ・エネルギーにより直
接破壊されて剥がれ、導体14aが露出する。
As shown in FIG. 2A, in the pulse laser light irradiation step of the first step, the pulsed laser light LBQP having a high peak value which is pulse-oscillated and output by using the Q switch is used. The laser light irradiation region 30 of 26 is scanned and irradiated in the XY directions. This scan exposure is usually 1
Although the number of times is sufficient, it may be repeated a plurality of times depending on the material and thickness of the insulating coating 14b, the laser output, the pulse period, and the like. As a result, the portion 3 where the pulsed laser light LBQP is incident
In No. 2, the insulating coating 14b is directly broken by the laser energy and peeled off to expose the conductor 14a.

【0250】このように、被覆線14の巻き付け部26
に対するパルスレーザ光LBQPのスキャン照射は、巻き
付け部26の導体14aを露出させる罫描きの作用があ
る。
In this way, the winding portion 26 of the covered wire 14
The scanning irradiation of the pulsed laser light LBQP with respect to the line has the effect of marking the conductor 14a of the winding portion 26.

【0260】この例では、線径0.5mmφのエナメル
線からなる被覆線14を1mm角の端子22に巻き付け
た被覆線巻き付け部26に対して、X方向の長さ2m
m、Y方向の長さ1.5mmのレーザ光照射領域30を
設定し、平均出力5W、繰返し周波数2kHzのQスイ
ッチパルスレーザ光LBQPを走査速度を75mm/sで
照射した。
In this example, the covered wire winding portion 26, in which the covered wire 14 made of an enamel wire having a wire diameter of 0.5 mmφ is wound around the terminal 22 of 1 mm square, has a length of 2 m in the X direction.
A laser beam irradiation region 30 having a length of 1.5 mm in the m and Y directions was set, and a Q switch pulse laser beam LBQP having an average output of 5 W and a repetition frequency of 2 kHz was irradiated at a scanning speed of 75 mm / s.

【0270】次に、図2の(A) に示すように、第2段階
の連続波レーザ光照射工程では、連続波レーザ光LBCW
を被覆線巻き付け部26のレーザ光照射領域30にスキ
ャン照射させる。このスキャン照射は、連続波レーザ光
LBCWをX−Y方向に走査することで行われる。このス
キャン照射では、連続波レーザ光LBCWがレーザ光照射
領域30に継続的に照射されることにより、被覆線巻き
付け部26においてレーザ・エネルギーの熱が導体14
aを伝わってレーザ光照射領域30の周囲または裏側の
レーザ光非照射領域34に回り、レーザ光非照射領域3
4でも絶縁被膜14bが熱で剥がれ、導体14aが露出
する。
Next, as shown in FIG. 2A, in the continuous wave laser light irradiation step of the second stage, continuous wave laser light LBCW is used.
Is scanned and irradiated onto the laser light irradiation region 30 of the covered wire winding portion 26. This scanning irradiation is performed by scanning the continuous wave laser beam LBCW in the X-Y directions. In this scan irradiation, the continuous wave laser light LBCW is continuously irradiated to the laser light irradiation region 30, so that the heat of the laser energy is applied to the conductor 14 in the covered wire winding portion 26.
The laser light non-irradiation area 3 is transmitted around the laser light non-irradiation area 30 around the laser light irradiation area 30 or on the back side.
Also in No. 4, the insulating coating 14b is peeled off by heat and the conductor 14a is exposed.

【0280】この例では、連続波レーザ光LBCWのレー
ザ出力を17W、走査速度を75mm/sとした。
In this example, the laser output of the continuous wave laser light LBCW is 17 W and the scanning speed is 75 mm / s.

【0290】このようにして、被覆線巻き付け部26の
レーザ光照射領域30およびその周囲のレーザ光非照射
領域34から絶縁被膜14bを剥離する。他方の被覆線
巻き付け部28についても、上記と同様の処理を施すこ
とで、絶縁被膜14bを除去する。
In this way, the insulating coating 14b is peeled off from the laser light irradiation region 30 of the covered wire winding portion 26 and the laser light non-irradiation region 34 around it. The insulating coating 14b is removed by performing the same processing as above on the other covered wire winding portion 28.

【0300】上記のような絶縁被膜除去処理を終了した
後に、両被覆線巻き付け部26,28をフラックス槽お
よび半田槽に順次浸漬する。半田漕から引き上げると、
両被覆線巻き付け部26,28の露出した導体14a,
14aと端子24,26との間に半田が覆い被さるよう
にして接合し、半田付けが出来上がる。
After the insulating film removing process as described above is completed, both the coated wire winding parts 26 and 28 are successively immersed in the flux bath and the solder bath. When you pull it up from the solder bath,
The exposed conductor 14a of both covered wire winding portions 26, 28,
Solder is completed by joining the 14a and the terminals 24 and 26 so as to cover the solder.

【0310】本実施例の絶縁被膜除去方法によれば、被
覆線巻き付け部26においてレーザ光LBQP,LBCWが
照射されない内側領域(端子22の外周面と対向する領
域)でも絶縁被膜14bが効果的に除去されて導体14
aが露出するため、半田付け工程において被覆線巻き付
け部26,28を半田槽に浸漬した際に巻き付け部26
の内側領域の露出導体14aと端子24,26との間に
相当な量の半田が付着し、良好な半田接合が得られる。
According to the insulating film removing method of the present embodiment, the insulating film 14b is effectively applied even in the inner region (the region facing the outer peripheral surface of the terminal 22) where the laser beams LBQP and LBCW are not irradiated in the covered wire winding portion 26. Conductor removed 14
Since a is exposed, when the covered wire winding portions 26, 28 are immersed in the solder bath in the soldering process, the winding portion 26
A considerable amount of solder adheres between the exposed conductor 14a and the terminals 24, 26 in the inner region of the, and good solder joint can be obtained.

【0320】本実施例における被覆線の絶縁被膜除去処
理において、上記したようなレーザ光LBQP,LBCWの
スキャン照射と併せて熱風の吹き付けを行うと、絶縁被
膜の除去効果が一層高められる。たとえば絶縁被膜除去
工程の始めから、図3に示すように、被覆線巻き付け部
26(28)のレーザ光照射領域30付近に熱風36を
吹き付けると、被覆線巻き付け部26(28)における
熱引きが少なくなり、軟化または溶解した絶縁被膜14
bの剥離が促進され、一層効果的に絶縁被膜14bが除
去される。
In the insulating film removing treatment of the covered wire in the present embodiment, when the hot air is blown together with the scanning irradiation of the laser beams LBQP and LBCW as described above, the insulating film removing effect is further enhanced. For example, as shown in FIG. 3, when hot air 36 is blown from the beginning of the insulating film removing step to the vicinity of the laser light irradiation region 30 of the covered wire winding portion 26 (28), heat is removed from the covered wire winding portion 26 (28). Reduced, softened or melted insulation coating 14
The peeling of b is promoted, and the insulating coating 14b is more effectively removed.

【0330】本実施例における熱風の吹き付けは、絶縁
被膜を熱分解させるには至らず、軟化させる程度に止め
るのが肝要である。絶縁被膜が熱分解すると、有機化合
物が炭化したりして、却って除去し難くなるからであ
る。絶縁被膜が熱分解する温度は被膜の組成によって異
なるが、安全を見て熱風の温度を50゜C〜150゜に
選ぶのが望ましい。
It is essential that the blowing of hot air in this embodiment is stopped to such an extent that it does not cause thermal decomposition of the insulating coating but softens it. This is because when the insulating coating is thermally decomposed, the organic compound is carbonized and is rather difficult to remove. The temperature at which the insulating film thermally decomposes varies depending on the composition of the film, but it is desirable to select the temperature of hot air from 50 ° C to 150 ° C for safety.

【0340】熱風は、絶縁被覆除去作業の全期間に亘っ
て吹き付けるのが好ましいが、作業期間中の一部の期間
に吹き付けても効果がある。また、熱風の吹き付けをパ
ルスレーザ光LBQPのスキャン照射工程の前から開始し
て、被覆線巻き付け部26(28)を予熱しておくと、
温風効果を一層高めることができる。
It is preferable that the hot air is blown over the entire period of the insulating coating removing work, but it is also effective if it is blown during a part of the working period. Further, if the blowing of the hot air is started before the scanning irradiation step of the pulsed laser beam LBQP and the covered wire winding portion 26 (28) is preheated,
The warm air effect can be further enhanced.

【0350】以上説明したように、本実施例による絶縁
被膜除去方法によれば、被覆線巻き付け部26(28)
に対して一方向からレーザ光LBQP,LBCWを照射すれ
ばよく、処理時間は短く、人手による作業は不要であ
り、自動化を容易に実現することができる。
As described above, according to the insulating film removing method of this embodiment, the covered wire winding portion 26 (28)
On the other hand, the laser beams LBQP and LBCW may be emitted from one direction, the processing time is short, no manual work is required, and automation can be easily realized.

【0360】次に、本発明の一実施例による絶縁被膜除
去装置について説明する。
Next, an insulating film removing apparatus according to an embodiment of the present invention will be described.

【0370】図4に、この実施例による絶縁被膜除去装
置の外観を示す。この絶縁被膜除去装置は、制御ユニッ
ト40とレーザ発振ユニット42とスキャニングユニッ
ト44と熱風供給ユニット61とから構成される。
FIG. 4 shows the appearance of the insulating film removing apparatus according to this embodiment. This insulating film removing device includes a control unit 40, a laser oscillation unit 42, a scanning unit 44, and a hot air supply unit 61.

【0380】制御ユニット40において、上部室46に
は制御用ディスプレイ48が取り付けられ、中間室(前
扉50の奥)には制御基板が内蔵され、下部室(前扉5
2の奥)にはレーザ電源回路やレーザ冷却装置等が内蔵
されている。レーザ発振ユニット42内には、後述する
ようなQスイッチ方式のパルスレーザ光LBQPと連続発
振レーザ光LBCWとを切り換えて選択的に出力できるY
AGレーザ発振器が設けられている。スキャニングユニ
ット44内には、後述するような光学スキャニング機構
およびスキャニング駆動部が設けられている。熱風供給
ユニット61はスキャニングユニット44の側方に配置
され、ノズル63の熱風吐出口を加工位置に向けてい
る。
In the control unit 40, a control display 48 is attached to the upper chamber 46, a control board is built in the intermediate chamber (back of the front door 50), and a lower chamber (front door 5).
A laser power supply circuit, a laser cooling device, and the like are built in (inside of 2). In the laser oscillating unit 42, a Q-switch type pulsed laser light LBQP and a continuous wave laser light LBCW, which will be described later, can be selectively output by switching.
An AG laser oscillator is provided. Inside the scanning unit 44, an optical scanning mechanism and a scanning driving unit, which will be described later, are provided. The hot air supply unit 61 is arranged beside the scanning unit 44, and the hot air discharge port of the nozzle 63 is directed to the processing position.

【0390】スキャニングユニット44の下には作業台
54が配置されている。ワーク(ソレノイド・コイル)
10は、図示しない搬送装置により搬送されてきて、ス
キャニングユニット44のほぼ真下の作業台54上の所
定位置で位置合わせされる。
A workbench 54 is arranged below the scanning unit 44. Work (solenoid coil)
The sheet 10 is conveyed by a conveying device (not shown) and is aligned at a predetermined position on the work table 54 just below the scanning unit 44.

【0400】図5に、本絶縁被膜除去装置の内部の要部
の構成を示す。この絶縁被膜除去装置において、YAG
ロッド60、励起ランプ62、光共振器ミラー64,6
6、Qスイッチ68は、YAGレーザ発振器を構成して
いる。電源回路72、制御部74、設定部76、Qスイ
ッチ駆動回路78およびインタフェース回路79は、制
御ユニット40内に設けられ、YAGレーザ電源/制御
部を構成している。
FIG. 5 shows the internal structure of the present insulating film removing apparatus. In this insulation film removing device,
Rod 60, excitation lamp 62, optical resonator mirrors 64, 6
6. The Q switch 68 constitutes a YAG laser oscillator. The power supply circuit 72, the control unit 74, the setting unit 76, the Q switch drive circuit 78, and the interface circuit 79 are provided in the control unit 40 and constitute a YAG laser power supply / control unit.

【0410】熱風供給ユニット61は、ブロア67,ヒ
ータ65およびノズル63を有し、ブロア67で空気流
を生成し、ヒータ65で該空気流を加熱し、高温の空気
流をノズル63より熱風として 被加工物10の被処理
部(26,28)に吹き付けるようになっている。制御
部74は、ブロア67、ヒータ65を制御して、熱風の
風量と風温を制御する。
The hot air supply unit 61 has a blower 67, a heater 65 and a nozzle 63. The blower 67 generates an air flow, the heater 65 heats the air flow, and the high temperature air flow is turned into hot air from the nozzle 63. It is adapted to be sprayed onto the processed parts (26, 28) of the workpiece 10. The controller 74 controls the blower 67 and the heater 65 to control the volume and temperature of hot air.

【0420】本絶縁被膜除去装置において、YAGレー
ザ光を発振出力するときは、制御部74の制御の下で電
源回路72が電流を励起ランプ62に供給し、励起ラン
プ62が連続発光する。YAGロッド60は、励起ラン
プ62からの連続光を励起エネルギとして受け取ってロ
ッド端面より軸方向に連続的にレーザ光を出す。
In the present insulating film removing apparatus, when the YAG laser beam is oscillated and output, the power supply circuit 72 supplies a current to the excitation lamp 62 under the control of the control section 74, and the excitation lamp 62 continuously emits light. The YAG rod 60 receives continuous light from the excitation lamp 62 as excitation energy and continuously emits laser light in the axial direction from the rod end surface.

【0430】制御部74は、マイクロコンピュータから
なり、所定のソフトウェアにしたがって動作して、装置
内の各部を制御する。Qスイッチ68には、たとえば超
音波によるブラック回析を利用する音響光学Qスイッチ
を用いてよい。
The control section 74 is composed of a microcomputer, operates according to predetermined software, and controls each section in the apparatus. As the Q switch 68, for example, an acousto-optic Q switch utilizing black diffraction by ultrasonic waves may be used.

【0440】制御部74の制御の下で、Qスイッチ駆動
回路78より一定周波数を有するパルス状の変調信号で
変調された高周波電気信号ESがQスイッチ68に供給
されることにより、図7に示すように、変調周波数に等
しい繰返し周波数(周期TS)で尖頭出力PM の高いQ
スイッチパルスレーザ光LBQPが光共振器の出力ミラー
66より出力される。なお、Qスイッチパルスレーザ光
LBQPの繰返し周波数(周期TS )は、設定部76によ
り所望の値に設定することができる。
Under the control of the control section 74, the Q switch drive circuit 78 supplies the high frequency electric signal ES modulated by the pulse-shaped modulation signal having a constant frequency to the Q switch 68, and as shown in FIG. , The peak output PM has a high Q at a repetition frequency (period TS) equal to the modulation frequency.
The switch pulse laser light LBQP is output from the output mirror 66 of the optical resonator. The repetition frequency (cycle TS) of the Q switch pulse laser light LBQP can be set to a desired value by the setting unit 76.

【0450】制御部74の制御の下で、Qスイッチ駆動
回路78の動作を止め、高周波電気信号ESを停止する
と、Qスイッチ駆動回路78はオフ状態となり、図8に
示すようなレーザ出力Pm の連続波レーザ光LBCWが光
共振器の出力ミラー66より出力される。連続波レーザ
光LBCWのレーザ出力Pm は設定部76により所望の値
に設定することができる。
Under the control of the control section 74, when the operation of the Q switch drive circuit 78 is stopped and the high frequency electric signal ES is stopped, the Q switch drive circuit 78 is turned off, and the laser output Pm of the laser output Pm as shown in FIG. The continuous wave laser light LBCW is output from the output mirror 66 of the optical resonator. The laser output Pm of the continuous wave laser beam LBCW can be set to a desired value by the setting unit 76.

【0460】図6に、スキャニングユニット44内の光
学スキャニング機構およびスキャニング駆動部の構成例
を示す。光学的スキャニング機構は、互いに直交した回
転軸を有するX軸回転ミラー90およびY軸回転ミラー
92から構成されている。スキャニング駆動部は、X軸
回転ミラー90およびY軸回転ミラー92の回転軸にそ
れぞれ連結されたX軸ガルバノメータ・スキャナ94お
よびY軸ガルバノメータ・スキャナ96から構成されて
いる。
FIG. 6 shows a structural example of the optical scanning mechanism and the scanning drive section in the scanning unit 44. The optical scanning mechanism is composed of an X-axis rotary mirror 90 and a Y-axis rotary mirror 92 having mutually orthogonal rotary axes. The scanning drive unit includes an X-axis galvanometer scanner 94 and a Y-axis galvanometer scanner 96, which are connected to the rotation axes of the X-axis rotary mirror 90 and the Y-axis rotary mirror 92, respectively.

【0470】レーザ発振ユニット42からの平行光のレ
ーザ光LB(LBQP,LBCW)は、先ずX軸回転ミラー
90に入射して、そこで全反射してからY軸回転ミラー
92に入射し、このミラー92で全反射してのちfθレ
ンズ100を通って被加工物(ソレノイド・コイル1
0)の加工点(被膜線巻き付け部26,28のスキャン
照射領域30)に集光照射する。スキャン照射領域30
上のレーザスポットの位置は、X方向においてはX軸回
転ミラー90の振れ角によって決まり、Y方向において
はY軸回転ミラー92の振れ角によって決まる。
The parallel laser light LB (LBQP, LBCW) from the laser oscillating unit 42 first enters the X-axis rotating mirror 90, undergoes total reflection there, and then enters the Y-axis rotating mirror 92, and this mirror. After being totally reflected at 92, it is passed through the fθ lens 100 to be processed (solenoid coil 1
The processing point (0) (scan irradiation area 30 of the coated wire winding portions 26 and 28) is focused and irradiated. Scan irradiation area 30
The position of the upper laser spot is determined by the deflection angle of the X-axis rotating mirror 90 in the X direction and by the deflection angle of the Y-axis rotating mirror 92 in the Y direction.

【0480】X軸回転ミラー90は、X軸ガルバノメー
タ・スキャナ94によって矢印A,A’方向に回転振動
する。一方、Y軸回転ミラー92は、Y軸ガルバノメー
タ・スキャナ96によって矢印B,B’方向に回転振動
する。両スキャナ94,96には、制御ユニット40内
の制御部74よりインタフェース回路79および電気ケ
ーブル106,108を介してX方向およびY方向スキ
ャニング制御信号がそれぞれ供給される。
The X-axis rotary mirror 90 is rotationally oscillated by the X-axis galvanometer scanner 94 in the directions of arrows A and A '. On the other hand, the Y-axis rotating mirror 92 is rotationally vibrated in the directions of arrows B and B ′ by the Y-axis galvanometer scanner 96. Both scanners 94 and 96 are supplied with X-direction and Y-direction scanning control signals from a control unit 74 in the control unit 40 via an interface circuit 79 and electric cables 106 and 108, respectively.

【0490】したがって、レーザ発振ユニット42より
レーザ光LBがスキャニングユニット44内に所定のタ
イミングで入ってくる度毎に、それと同期して両スキャ
ナ94,96がX方向およびY方向スキャニング制御信
号に応じてX軸およびY軸回転ミラー90,92をそれ
ぞれ所定の角度で振ることにより、レーザ光LBのビー
ムスポットが被加工物10のレーザ光照射領域30内で
スキャンされる。
Therefore, each time the laser beam LB enters from the laser oscillation unit 42 into the scanning unit 44 at a predetermined timing, both scanners 94 and 96 respond to the X-direction and Y-direction scanning control signals in synchronization with it. By swinging the X-axis and Y-axis rotating mirrors 90 and 92 at predetermined angles, the beam spot of the laser beam LB is scanned within the laser beam irradiation region 30 of the workpiece 10.

【0500】上記した実施例の絶縁被膜除去装置を使用
すると、1台のレーザ装置でQスイッチ方式のパルスレ
ーザ光LBQPと連続発振レーザ光LBCWとを切り換えて
発生できるため、装置全体のサイズ、コスト、スペース
等で大きな利点があり、被覆線の絶縁被膜除去処理をQ
スイッチの操作のみで連続操業できるという利点もあ
る。もっとも、本発明による被覆線の絶縁被膜除去方法
は、パルスレーザ装置と連続波レーザ装置の2台を使用
しても実施できることはもちろんである。
When the insulating film removing apparatus of the above-mentioned embodiment is used, since it is possible to generate by switching between the Q-switch type pulse laser light LBQP and the continuous wave laser light LBCW with one laser device, the size and cost of the entire device can be reduced. , Has a great advantage in space, etc.
There is also an advantage that it can be operated continuously only by operating the switch. However, it goes without saying that the method for removing an insulating coating of a coated wire according to the present invention can be implemented by using two units, a pulse laser device and a continuous wave laser device.

【0510】上記実施例における被加工物(ソレノイド
・コイル)10および被覆線巻き付け部26,28の構
成は一例にすぎず、本発明は種々の形状の被加工物、種
々の型の被覆線および種々の形態の被覆線巻き付け部に
適用可能である。
The constructions of the work piece (solenoid coil) 10 and the covered wire winding portions 26, 28 in the above embodiments are merely examples, and the present invention is applicable to various shaped work pieces, various types of covered wire and It is applicable to various forms of covered wire winding parts.

【0520】[0520]

【発明の効果】以上説明したように、本発明による被覆
線の絶縁被膜除去方法または装置によれば、レーザ光の
スキャン照射により被覆線の巻き付け部から絶縁被膜を
効率良く除去することが可能であり、自動化と生産性お
よび加工品質の向上をはかることができる。
As described above, according to the method or apparatus for removing an insulating coating film of a coated wire according to the present invention, it is possible to efficiently remove the insulating coating film from the winding portion of the coated wire by the scanning irradiation of the laser beam. Yes, automation can be achieved and productivity and processing quality can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例による被膜線の絶縁被覆除去
方法を説明するための略平面図である。
FIG. 1 is a schematic plan view for explaining a method of removing an insulating coating of a coated wire according to an embodiment of the present invention.

【図2】実施例におけるパルスレーザ光照射工程を説明
するための一部断面側面図である。
FIG. 2 is a partial cross-sectional side view for explaining a pulsed laser light irradiation step in the example.

【図3】実施例における連続波レーザ光照射工程を説明
するための一部断面側面図である。
FIG. 3 is a partial cross-sectional side view for explaining a continuous wave laser light irradiation step in an example.

【図4】実施例における絶縁被覆除去装置の外観を示す
斜視図である。
FIG. 4 is a perspective view showing an external appearance of an insulating coating removing device according to an embodiment.

【図5】実施例における絶縁被覆除去装置の要部の構成
を示すブロック図である。
FIG. 5 is a block diagram showing a configuration of a main part of an insulating coating removing device in an example.

【図6】実施例の絶縁被覆除去装置のスキャニングユニ
ットの内部の構成を示す斜視図である。
FIG. 6 is a perspective view showing an internal configuration of a scanning unit of the insulating coating removing apparatus of the embodiment.

【図7】実施例の絶縁被膜除去装置で得られるQスイッ
チパルスレーザ光のレーザ出力波形を示す図である。
FIG. 7 is a diagram showing a laser output waveform of Q-switch pulse laser light obtained by the insulating film removing apparatus of the example.

【図8】実施例の絶縁被膜除去装置で得られる連続波レ
ーザ光のレーザ出力波形を示す図である。
FIG. 8 is a diagram showing a laser output waveform of continuous wave laser light obtained by the insulating film removing apparatus of the embodiment.

【図9】実施例における絶縁被覆除去処理を受ける被加
工物(ソレノイド・コイル)を示す図である。
FIG. 9 is a diagram showing a workpiece (solenoid coil) to be subjected to the insulating coating removal process in the example.

【符号の説明】[Explanation of symbols]

10 被加工物(ソレノイド・コイル) 14 被膜線 14a 導体 14b 絶縁被膜 22 端子 26,28 被膜線巻き付け部 30 レーザ光照射領域 44 スキャニングユニット 60 YAGロッド 61 熱風供給ユニット 63 ノズル 64,66 光共振器ミラー 68 Qスイッチ 74 制御部 78 Qスイッチ駆動回路 90 X軸回転ミラー 92 Y軸回転ミラー 94 X軸ガルバノメータ・スキャナ 96 Y軸ガルバノメータ・スキャナ 10 Workpiece (solenoid coil) 14 Coated wire 14a Conductor 14b Insulated film 22 Terminals 26, 28 Coated wire winding part 30 Laser light irradiation area 44 Scanning unit 60 YAG rod 61 Hot air supply unit 63 Nozzle 64, 66 Optical resonator mirror 68 Q switch 74 Control unit 78 Q switch drive circuit 90 X-axis rotary mirror 92 Y-axis rotary mirror 94 X-axis galvanometer scanner 96 Y-axis galvanometer scanner

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 導体を絶縁材で被覆してなる被覆線の巻
き付け部から前記絶縁材を少なくとも部分的に除去する
被覆線の絶縁被膜除去方法において、 前記被覆線の巻き付け部の絶縁被膜を除去すべき領域の
少なくとも一部にパルスレーザ光をX−Y方向に走査さ
せて照射するパルスレーザ光照射工程と、 前記パルスレーザ照射工程の終了後に、前記絶縁被膜を
除去すべき領域の少なくとも一部に連続波レーザ光をX
−Y方向に走査させて照射する連続波レーザ光照射工程
とを含むことを特徴とする被覆線の絶縁被膜除去方法。
1. A method for removing an insulating coating of a coated wire, which comprises at least partially removing the insulating material from a wound portion of a coated wire formed by coating a conductor with an insulating material, wherein the insulating coating of the wound portion of the coated wire is removed. A pulsed laser light irradiation step of irradiating at least a part of the area to be scanned with the pulsed laser light in the XY direction, and at least a part of the area where the insulating coating is to be removed after the completion of the pulsed laser irradiation step. Continuous wave laser light to X
A continuous wave laser light irradiation step of scanning and irradiating in the Y direction.
【請求項2】 前記パルスレーザ光がQスイッチを用い
て発振出力されるQスイッチパルスレーザ光であること
を特徴とする請求項1に記載の被覆線の絶縁被膜除去方
法。
2. The method for removing an insulating film from a covered wire according to claim 1, wherein the pulsed laser light is a Q-switched pulsed laser light oscillated and output by using a Q switch.
【請求項3】 前記被膜線の絶縁被膜除去処理期間の少
なくとも一部の期間を含む所定の期間中に前記被覆線の
絶縁被膜を除去すべき領域の少なくとも一部に所定温度
の熱風を吹き付ける熱風吹付け工程を含むことを特徴と
する請求項1または2に記載の被覆線の絶縁被膜除去方
法。
3. Heat for blowing hot air of a predetermined temperature onto at least a part of a region of the coated wire where the insulating coating is to be removed during a predetermined period including at least a part of an insulating film removal treatment period of the coated wire. The method for removing an insulating coating of a covered wire according to claim 1 or 2, comprising a wind blowing step.
【請求項4】 導体を絶縁材で被覆してなる被覆線の巻
き付け部から前記絶縁材を少なくとも部分的に除去する
被覆線の絶縁被膜除去装置において、 Qスイッチによるパルス発振出力のパルスレーザ光と連
続波のレーザ光とを切り換えて選択的に出力するレーザ
発振手段と、 前記レーザ発振手段からのレーザ光を入射させて、その
レーザ光を前記被覆線巻き付け部側に向けて反射し、か
つ前記被覆線の絶縁被膜を除去すべき領域の少なくとも
一部に対して第1の方向に走査させる第1の走査ミラー
手段と、 前記第1の走査ミラー手段からのレーザ光を入射させ
て、そのレーザ光を前記被覆線の絶縁被膜を除去すべき
領域の少なくとも一部に向けて反射し、かつ前記被覆線
の絶縁被膜を除去すべき領域の少なくとも一部に対して
前記第1の方向とは直交する第2の方向に走査させる第
2の走査ミラー手段とを含むことを特徴とする被覆線の
絶縁被膜除去装置。
4. An insulating film removing apparatus for a coated wire, which at least partially removes the insulating material from a wound portion of the coated wire, which is obtained by coating a conductor with an insulating material. Laser oscillating means for selectively outputting continuous wave laser light and selectively outputting laser light from the laser oscillating means, reflecting the laser light toward the covered wire winding portion side, and First scanning mirror means for scanning in a first direction at least a part of a region of the coated wire where the insulating coating is to be removed; and laser light from the first scanning mirror means is made incident on the laser beam. Light is reflected toward at least a part of a region of the coated wire where the insulating coating is to be removed, and the first direction is at least part of the region of the coated wire where the insulating coating is to be removed. And a second scanning mirror means for scanning in a second direction orthogonal to the above.
【請求項5】 前記被覆線の絶縁被膜を除去すべき領域
の少なくとも一部に所定温度の熱風を吹き付ける熱風供
給手段をさらに有することを特徴とする請求項4に記載
の被覆線の絶縁被膜除去装置。
5. The insulation coating removal of the coated wire according to claim 4, further comprising hot air supply means for blowing hot air of a predetermined temperature to at least a part of a region where the insulation coating of the coated wire is to be removed. apparatus.
JP7350530A 1995-12-22 1995-12-22 Method and device for removing insulating film of covered wire Pending JPH09174263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7350530A JPH09174263A (en) 1995-12-22 1995-12-22 Method and device for removing insulating film of covered wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7350530A JPH09174263A (en) 1995-12-22 1995-12-22 Method and device for removing insulating film of covered wire

Publications (1)

Publication Number Publication Date
JPH09174263A true JPH09174263A (en) 1997-07-08

Family

ID=18411128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7350530A Pending JPH09174263A (en) 1995-12-22 1995-12-22 Method and device for removing insulating film of covered wire

Country Status (1)

Country Link
JP (1) JPH09174263A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6515218B1 (en) 1999-11-22 2003-02-04 Canon Kabushiki Kaisha Photovoltaic element, process for the production thereof, method for removing a cover portion of a covered wire, and method for joining a covered wire and a conductor
JP2007266648A (en) * 1999-11-22 2007-10-11 Canon Inc Method of manufacturing photovoltaic element, removing coating of coated wire, and bonding coated wire and conductor
JP2008109753A (en) * 2006-10-24 2008-05-08 Tdk Corp Coating exfoliation method
JP2010005652A (en) * 2008-06-26 2010-01-14 Tdk Corp Method for peeling coating of insulating lead wire
JP2016187831A (en) * 2015-03-30 2016-11-04 ブラザー工業株式会社 Laser machining data preparation device
JP2020016530A (en) * 2018-07-25 2020-01-30 株式会社東洋ユニオン Laser decontamination device, laser decontamination system and laser decontamination method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6515218B1 (en) 1999-11-22 2003-02-04 Canon Kabushiki Kaisha Photovoltaic element, process for the production thereof, method for removing a cover portion of a covered wire, and method for joining a covered wire and a conductor
JP2007266648A (en) * 1999-11-22 2007-10-11 Canon Inc Method of manufacturing photovoltaic element, removing coating of coated wire, and bonding coated wire and conductor
JP2008109753A (en) * 2006-10-24 2008-05-08 Tdk Corp Coating exfoliation method
JP2010005652A (en) * 2008-06-26 2010-01-14 Tdk Corp Method for peeling coating of insulating lead wire
JP2016187831A (en) * 2015-03-30 2016-11-04 ブラザー工業株式会社 Laser machining data preparation device
JP2020016530A (en) * 2018-07-25 2020-01-30 株式会社東洋ユニオン Laser decontamination device, laser decontamination system and laser decontamination method

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