JPH09166612A - Magnetic sensor - Google Patents

Magnetic sensor

Info

Publication number
JPH09166612A
JPH09166612A JP34844995A JP34844995A JPH09166612A JP H09166612 A JPH09166612 A JP H09166612A JP 34844995 A JP34844995 A JP 34844995A JP 34844995 A JP34844995 A JP 34844995A JP H09166612 A JPH09166612 A JP H09166612A
Authority
JP
Japan
Prior art keywords
magnetic
magnet
lead frame
pole surface
sensing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP34844995A
Other languages
Japanese (ja)
Inventor
Akihiro Hanamura
昭宏 花村
Kiyoshi Takeuchi
潔 竹内
Akira Asaoka
昭 浅岡
Hiroyuki Kaneko
洋之 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP34844995A priority Critical patent/JPH09166612A/en
Publication of JPH09166612A publication Critical patent/JPH09166612A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Magnetic Variables (AREA)
  • Regulating Braking Force (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized inexpensive magnetic sensor having high sensitivity. SOLUTION: The upper pole surface 3a of a magnet 3 is stuck to the lower surface of a magnetism sensing element 2 and the lower pole surface 3b of the magnet 3 is stuck to the bottom wall 3a of a U-shaped lead frame 5 made of a high-permeability soft magnetic metallic material. The tops of the vertical walls 5b of the frame 5 are made higher than the upper pole surface 3a of the magnet 3. The element 2, magnet 3, and frame 5 are integrally wrapped with a sealing resin 7. The sensitivity of a magnetic sensor is improved, because the frame 5 works as a back yoke and intensifies the magnetic flux from the pole surface of the magnet 3 on the element 2 side. In addition, since the tops of the vertical walls 5b of the frame 5 are higher than the pole surface of the magnet 3 on the element 2 side, a magnetic circuit having a small magnetic reluctance is formed between the sensor and a magnetic body to be detected.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、自動車のＡＢＳ
（アンチロックブレーキシステム）の車輪回転センサ、
クランク角センサ、エンジン回転センサ等の非接触回転
センサとして使用される磁気センサに関する。TECHNICAL FIELD The present invention relates to an automotive ABS.
(Anti-lock brake system) wheel rotation sensor,
The present invention relates to a magnetic sensor used as a non-contact rotation sensor such as a crank angle sensor and an engine rotation sensor.

【０００２】[0002]

【従来の技術】この種の磁気センサとしては、例えば、
図７に示すようなものがある。すなわち、感磁素子１０
１を磁石１０２の上に直接接着し、さらに、磁石１０２
を非磁性材よりなるリードフレーム１０３に接着し、こ
れを封止樹脂１０４でパッケージングして一体構造とし
ていた。これにより、感磁素子１０１と磁石１０２との
距離が短いことにより、感磁素子１０１に作用する磁束
が大きくなり比較的に感度が良く、さらに、外部磁場の
影響が小さくなるためＳ／Ｎ比が向上するという特徴を
有している。2. Description of the Related Art As a magnetic sensor of this type, for example,
There is such as shown in FIG. That is, the magnetic sensing element 10
1 is directly bonded onto the magnet 102, and the magnet 102
Was bonded to a lead frame 103 made of a non-magnetic material, and this was packaged with a sealing resin 104 to form an integrated structure. Accordingly, since the distance between the magnetic sensitive element 101 and the magnet 102 is short, the magnetic flux acting on the magnetic sensitive element 101 becomes large and the sensitivity is relatively good, and the influence of the external magnetic field is small, so that the S / N ratio is small. Is improved.

【０００３】さらに、感磁素子と磁石とを別体として、
感磁素子のパッケージに磁石を取り付けた構造では、感
磁素子と磁石との間のパッケージ厚さのばらつきによ
り、センサ感度がばらつくという不具合が発生するのに
対し、図７のものでは、感磁素子１０１と磁石１０２と
の間にパッケージ材が介在しないため、感度がばらつく
という不具合は発生しない。そして、パッケージ外部に
磁石を取り付ける際には必要な磁石の位置調整作用も不
要である。Further, the magnetic sensitive element and the magnet are separately provided,
In the structure in which the magnet is attached to the package of the magnetic sensing element, the sensor sensitivity varies due to the variation in the package thickness between the magnetic sensing element and the magnet. Since the package material is not interposed between the element 101 and the magnet 102, the problem that sensitivity varies does not occur. Further, when the magnet is attached to the outside of the package, the necessary position adjusting action of the magnet is unnecessary.

【０００４】また、全体を樹脂でパッケージングしてい
るので、磁石を含んだ状態での形状を小型化でき、さら
に、磁石が外部に露出しないため、外部雰囲気などの影
響を受けにくく、また、形状も複雑にならないので、取
扱いも簡便であるという利点がある。Further, since the whole is packaged with resin, the shape including the magnet can be miniaturized. Further, since the magnet is not exposed to the outside, it is hardly affected by the external atmosphere and the like. Since the shape does not become complicated, there is an advantage that the handling is simple.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、このよ
うな従来の磁気センサにあっては、磁気回路的には、開
磁路であるため、磁気回路の長さが長く磁気抵抗が高
い。このため、例えばヨークを備える磁気センサに比べ
ると感度はまだ低く、高感度化に関して改善の余地があ
る。そこで、対策として外部にヨークを付加することが
考えられるが、組立工数が増加し、形状が大型化し、ヨ
ークとセンサとの位置調整が必要になるという問題が生
じ、このため最終的に価格が高くなってしまうという不
都合がある。したがって本発明は、従来のこのような問
題点に着目し、高感度で、しかも小型、安価な磁気セン
サを提供することを目的とする。However, in such a conventional magnetic sensor, since the magnetic circuit is an open magnetic circuit, the length of the magnetic circuit is long and the magnetic resistance is high. For this reason, the sensitivity is still lower than that of a magnetic sensor including a yoke, for example, and there is room for improvement in terms of higher sensitivity. Therefore, it is conceivable to add a yoke to the outside as a countermeasure, but there is a problem that the number of assembly steps increases, the shape becomes large, and the position adjustment between the yoke and the sensor becomes necessary. There is an inconvenience that it becomes high. Therefore, an object of the present invention is to provide a magnetic sensor which has high sensitivity, is small in size, and is inexpensive in view of such conventional problems.

【０００６】[0006]

【課題を解決するための手段】このため本発明は、感磁
素子と、高透磁率軟磁性金属材のリードフレームと、前
記感磁素子と前記リードフレームとの間に配置した磁石
と、前記感磁素子、磁石およびリードフレームを包み一
体構造とする封止樹脂とからなるものとした。For this reason, the present invention provides a magnetic sensing element, a lead frame made of a high magnetic permeability soft magnetic metal material, a magnet arranged between the magnetic sensing element and the lead frame, and The magnetic field sensitive element, the magnet, and the lead frame are wrapped to form an integral structure.

【０００７】上記リードフレームは底壁とその両端に縦
壁を有するコの字型形状に形成され、感磁素子と磁石は
前記縦壁に挟まれた空間で前記底壁に取り付けるのが好
ましい。また、リードフレームの縦壁の先端は、磁石の
感磁素子側の磁極面より上方に位置していることが好ま
しい。そして、感磁素子は、磁石の端部近傍に複数設け
ることができる。さらに、感磁素子と前記磁石との間に
非磁性材スペーサを配置することもできる。It is preferable that the lead frame is formed in a U shape having a bottom wall and vertical walls at both ends thereof, and the magnetic sensing element and the magnet are attached to the bottom wall in a space sandwiched by the vertical walls. Further, it is preferable that the tip of the vertical wall of the lead frame is located above the magnetic pole surface of the magnet on the magnetic sensitive element side. A plurality of magnetic sensitive elements can be provided near the end of the magnet. Further, a non-magnetic material spacer may be arranged between the magnetic sensing element and the magnet.

【０００８】[0008]

【作用】高透磁率軟磁性金属材のリードフレーム側の磁
極面の磁束は、リードフレームに集磁され、その中を導
かれる。このため、リードフレームはバックヨークとし
ての働きをする。これにより、感磁素子側の磁極面の磁
束が強められ、感度が向上する。The magnetic flux on the magnetic pole surface of the high permeability soft magnetic metal material on the lead frame side is collected by the lead frame and guided therein. Therefore, the lead frame acts as a back yoke. As a result, the magnetic flux on the magnetic pole surface on the magnetic sensitive element side is strengthened, and the sensitivity is improved.

【０００９】また、リードフレームをコの字型形状に形
成することにより、さらには、その縦壁の先端を磁石の
感磁素子側の磁極面より上方に位置させることにより、
検出対象の磁性体との間に磁気抵抗の小さい磁気回路が
形成される。また、感磁素子を磁石の端部近傍に複数設
けることにより、感磁素子ごとに作用する磁束の変化が
大きくなり、感磁素子の出力の差動比較により高い感度
で磁性体の有無、接近を検知することができる。さら
に、感磁素子と磁石との間に非磁性材スペーサを配置す
ることにより、その厚さによって磁束密度変化が大きい
位置に感磁素子が配置される。Further, by forming the lead frame in a U-shape, and further by arranging the tip of the vertical wall above the magnetic pole surface of the magnet on the magnetic sensitive element side,
A magnetic circuit having a small magnetic resistance is formed between the magnetic body to be detected. Also, by providing multiple magnetic sensitive elements near the end of the magnet, the change in the magnetic flux acting on each magnetic sensitive element increases, and the differential comparison of the magnetic sensitive element outputs makes it possible to detect the presence / absence of a magnetic substance with high sensitivity. Can be detected. Further, by disposing the non-magnetic material spacer between the magnetic sensing element and the magnet, the magnetic sensing element is disposed at a position where the magnetic flux density changes greatly depending on the thickness thereof.

【００１０】[0010]

【発明の実施の形態】図１は、本発明の第１の実施例の
構成を示す透視図、図２は、図１のＡ−Ａ断面を示す断
面図である。磁気センサ１はその主要構成部品として感
磁素子２と磁石３、およびリードフレーム５を有する。
感磁素子２としては、半導体ホール素子が用いられる。
感磁素子２は、磁石３の上側の磁極面３ａに接着剤で接
着されている。ここで、磁石３は、そのＮ極またはＳ極
の磁極面が上記接着面となっている。細線形状のリード
端子４が感磁素子２の面と高さが略等しい位置に配さ
れ、リード端子４の一端と、感磁素子２上のパッドがボ
ンディングワイヤ６で接続されている。1 is a perspective view showing the configuration of a first embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the AA cross section of FIG. The magnetic sensor 1 has a magnetic sensitive element 2, a magnet 3, and a lead frame 5 as its main components.
A semiconductor Hall element is used as the magnetic sensing element 2.
The magnetic sensing element 2 is adhered to the upper magnetic pole surface 3a of the magnet 3 with an adhesive. Here, the magnetic pole surface of the N pole or the S pole of the magnet 3 is the adhesive surface. A thin wire-shaped lead terminal 4 is arranged at a position where the height of the surface of the magnetic sensing element 2 is substantially equal to each other, and one end of the lead terminal 4 and a pad on the magnetic sensing element 2 are connected by a bonding wire 6.

【００１１】リードフレーム５は、高透磁率軟磁性金属
材、例えば４２Ｎｉ−Ｆｅ合金の平板をプレスによりコ
の字形状に形成したタブである。リードフレーム５は、
矩形形状の底壁５ａの両端に縦壁５ｂを有して、全体と
してコの字型形状をなしている。リードフレームの上記
底壁５ａ上に、磁石３の感磁素子２を接着した磁石面３
ａと反対側の磁極面３ｂが接着剤により接着され、感磁
素子２と磁石３とはリードフレーム５のコの字型形状の
内側凹部内に配置された状態となっている。リードフレ
ーム５の縦壁５ｂは、磁石３の厚さより高く形成され、
その先端は、磁石３の上面の磁極面３ａより上方に位置
している。さらに、感磁素子２と磁石３とリードフレー
ム５とは、エポキシレジン等の封止樹脂７により包括さ
れて一体構造のパッケージに構成されている。The lead frame 5 is a tab formed by pressing a flat plate of a high magnetic permeability soft magnetic metal material such as 42Ni--Fe alloy into a U-shape. The lead frame 5 is
Vertical walls 5b are provided at both ends of the rectangular bottom wall 5a to form a U-shape as a whole. On the bottom wall 5a of the lead frame, the magnet surface 3 in which the magnetic sensitive element 2 of the magnet 3 is bonded
The magnetic pole surface 3b on the side opposite to a is adhered with an adhesive, and the magnetic sensitive element 2 and the magnet 3 are arranged in the U-shaped inner concave portion of the lead frame 5. The vertical wall 5b of the lead frame 5 is formed higher than the thickness of the magnet 3,
The tip is located above the magnetic pole surface 3a on the upper surface of the magnet 3. Further, the magnetic sensing element 2, the magnet 3, and the lead frame 5 are enclosed by a sealing resin 7 such as epoxy resin to form a package having an integral structure.

【００１２】次に作用を図３および図４を参照して説明
する。ここで、図中の右半分は、リードフレーム５を設
けた本実施例における磁力線を示し、左半分は、リード
フレームの無い場合の磁力線を示している。図３に示す
ように、高透磁率軟磁性金属で形成したリードフレーム
５の設けられている右半分側にあっては、磁極面３ｂの
磁束は、リードフレーム５に集磁され、リードフレーム
５を形成する高透磁率軟磁性材の中を導かれリードフレ
ーム５の端から放出される。したがって、感磁素子２が
接着された磁極面３ａの磁束が、リードフレームのない
左半分側に比して、強められる。このように、本実施例
において、リードフレーム５はバックヨークとしての機
能を発揮している。Next, the operation will be described with reference to FIGS. 3 and 4. Here, the right half of the figure shows the magnetic force lines in the present embodiment provided with the lead frame 5, and the left half shows the magnetic force lines in the absence of the lead frame. As shown in FIG. 3, on the right half side where the lead frame 5 formed of a high magnetic permeability soft magnetic metal is provided, the magnetic flux of the magnetic pole surface 3b is collected by the lead frame 5 and the lead frame 5 is formed. Is guided through the high-permeability soft magnetic material forming the magnetic field and is emitted from the end of the lead frame 5. Therefore, the magnetic flux of the magnetic pole surface 3a to which the magnetic sensing element 2 is bonded is strengthened as compared with the left half side without the lead frame. In this way, in this embodiment, the lead frame 5 functions as a back yoke.

【００１３】図４には、リードフレーム５の縦壁間幅よ
りも大きい磁性体８を接近させたときの状態を示す。リ
ードフレーム５はコの字型形状をしているので、磁石３
の磁極面３ｂと磁性体８との間に、高透磁率軟磁性材の
リードフレーム５が存在して、小さな磁気回路を構成し
ている。また、リードフレーム５の縦壁５ｂの先端は磁
石３の磁極面３ａより上方に位置しているので、磁性体
８とリードフレーム５との距離はその分小さくなってい
る。そのため、上記の小さな磁気回路の磁気抵抗はさら
に小さくなっている。FIG. 4 shows a state in which the magnetic body 8 having a width larger than the width between the vertical walls of the lead frame 5 is approached. Since the lead frame 5 has a U-shape, the magnet 3
A lead frame 5 made of a high-permeability soft magnetic material exists between the magnetic pole surface 3b and the magnetic body 8 to form a small magnetic circuit. Further, since the tip of the vertical wall 5b of the lead frame 5 is located above the magnetic pole surface 3a of the magnet 3, the distance between the magnetic body 8 and the lead frame 5 is reduced accordingly. Therefore, the magnetic resistance of the small magnetic circuit is further reduced.

【００１４】本実施例は以上のように構成され、高透磁
率軟磁性材のリードフレーム５がバックヨークとしての
働きをするので、磁石３を含む小さな磁気回路をパッケ
ージ内に構成することができる。また、リードフレーム
５の縦壁５ｂの先端が磁極面３ａより上方に位置してい
るため、リードフレーム５が磁性体８により接近して感
度が向上する。このように、本実施例によれば、外部に
ヨーク等を付加することなく、高感度化することができ
るので、形状が大形化することがない。また、製造工程
も増加しない。このため、小型で安価に、かつ高感度化
した磁気センサが得られる。また、磁石を樹脂パッケー
ジ内に一体に封止しているので、感度のばらつきが小さ
く、信頼性も高く維持される。In this embodiment, the lead frame 5 made of a soft magnetic material having a high magnetic permeability functions as a back yoke, so that a small magnetic circuit including the magnet 3 can be formed in the package. . Further, since the tip end of the vertical wall 5b of the lead frame 5 is located above the magnetic pole surface 3a, the lead frame 5 approaches the magnetic body 8 and the sensitivity is improved. As described above, according to the present embodiment, the sensitivity can be increased without adding a yoke or the like to the outside, so that the shape does not become large. Moreover, the manufacturing process does not increase. Therefore, it is possible to obtain a magnetic sensor that is small in size, inexpensive, and highly sensitive. In addition, since the magnet is integrally sealed in the resin package, variations in sensitivity are small and high reliability is maintained.

【００１５】図５は、本発明の第２の実施例を示す。こ
の実施例は、磁石を小形化するとともに、複数の感磁素
子を用いて、磁気差動型の磁気センサとしたものであ
る。この磁気センサ１０においては、感磁素子１１と感
磁素子１２とが半導体基板１３の上面に所定距離だけ離
間させて設けられている。また、磁石１４が非磁性材１
５の中央部に埋め込まれて配設されており、半導体基板
１３は、接着剤により磁石１４の上側磁極面１４ａおよ
び非磁性材１５の上面に接着されている。磁石１４はそ
の大きさが、２つの感磁素子１１、１２の設置間隔と等
しく、感磁素子１１と感磁素子１２は、それぞれ磁石１
４の端部近傍に位置している。FIG. 5 shows a second embodiment of the present invention. In this embodiment, the magnet is miniaturized and a plurality of magnetic sensitive elements are used to form a magnetic differential type magnetic sensor. In the magnetic sensor 10, the magnetic sensitive element 11 and the magnetic sensitive element 12 are provided on the upper surface of the semiconductor substrate 13 with a predetermined distance therebetween. In addition, the magnet 14 is made of the non-magnetic material 1.
The semiconductor substrate 13 is bonded to the upper magnetic pole surface 14a of the magnet 14 and the upper surface of the non-magnetic material 15 by an adhesive. The size of the magnet 14 is equal to the installation interval of the two magnetic sensitive elements 11 and 12, and the magnetic sensitive element 11 and the magnetic sensitive element 12 are respectively provided in the magnet 1.
It is located near the end of No. 4.

【００１６】磁石１４の下側の磁極面１４ｂと非磁性材
１５の下面は、高透磁率軟磁性金属板をコの字形状に形
成したリードフレーム１６の底壁１６ａに接着剤により
接着されている。そして、リードフレーム１６の縦壁１
６ｂの先端は、磁石１４の半導体基板１３と接着された
磁極面１４ａより上方に位置している。感磁素子１１、
１２、磁石１４、非磁性材１５、およびリードフレーム
１６は封止樹脂１７で、包括されて一体のパッケージと
されている。The lower magnetic pole surface 14b of the magnet 14 and the lower surface of the non-magnetic material 15 are adhered to the bottom wall 16a of the lead frame 16 formed of a U-shaped high permeability soft magnetic metal plate by an adhesive. There is. And the vertical wall 1 of the lead frame 16
The tip of 6b is located above the magnetic pole surface 14a of the magnet 14 bonded to the semiconductor substrate 13. Magnetic sensitive element 11,
The magnet 12, the magnet 14, the non-magnetic material 15, and the lead frame 16 are encapsulated with a sealing resin 17 to form an integrated package.

【００１７】次に作用を説明する。図５には、上記磁気
センサ１０にリードフレーム１６の縦壁間幅の半分程度
の幅をもつ磁性体１８を近接させた場合の磁力線が示さ
れる。軟磁性のリードフレーム１６は、その半分を磁性
体１８で覆われると、磁性体１８に近い側に磁束が集磁
される。このとき、一方の感磁素子１２は閉磁気回路内
にあり、他方の感磁素子１１は開磁気回路内にあるた
め、磁束の強さが異なる。Next, the operation will be described. FIG. 5 shows magnetic force lines when a magnetic body 18 having a width of about half the vertical wall width of the lead frame 16 is brought close to the magnetic sensor 10. When half of the soft magnetic lead frame 16 is covered with the magnetic body 18, the magnetic flux is collected on the side close to the magnetic body 18. At this time, since one magnetic sensitive element 12 is in the closed magnetic circuit and the other magnetic sensitive element 11 is in the open magnetic circuit, the magnetic flux strengths are different.

【００１８】さらに、磁石１４の端部近傍では、磁性体
１８の移動に伴う磁束の強度変化が大きい。本実施例に
あっては、感磁素子１１、１２は磁石１４の端部近傍に
配置されているので感磁素子１１と感磁素子１２に作用
する磁束の変化は大きくなる。したがって、感磁素子１
１、１２の出力の差動比較により高い感度で磁性体の有
無、接近を検知することができる。以上のように本実施
例によれば、第１実施例と同様の効果が得られるととも
に、２つの感磁素子１１、１２を設けて差動構成をとる
ものとし、さらには、感磁素子１１、１２を磁石１４の
端部近傍に配置したので、外乱磁場の影響が排除され、
一層の高感度化が得られるFurther, in the vicinity of the end of the magnet 14, there is a large change in the intensity of the magnetic flux due to the movement of the magnetic body 18. In this embodiment, since the magnetic sensitive elements 11 and 12 are arranged near the ends of the magnet 14, the magnetic flux acting on the magnetic sensitive elements 11 and 12 changes greatly. Therefore, the magnetic sensing element 1
The differential comparison of the outputs of 1 and 12 makes it possible to detect the presence or absence of a magnetic substance and the approach thereof with high sensitivity. As described above, according to the present embodiment, the same effect as that of the first embodiment can be obtained, and two magnetic sensitive elements 11 and 12 are provided to form a differential structure. , 12 are arranged near the ends of the magnet 14, the influence of the disturbance magnetic field is eliminated,
Higher sensitivity can be obtained

【００１９】図６は、本発明の第３の実施例を示す。こ
の実施例の磁気センサ２０では、感磁素子２１と、磁石
２２の間に非磁性材スペーサ２３が配設されている。す
なわち、感磁素子２１の下面に非磁性材スペーサ２３が
接着剤により接着され、さらに非磁性材スペーサ２３の
下面に磁石２２の上側磁極面２２ａが接着剤により接着
されている。また、磁石２２の下側磁極面２２ｂは、高
透磁率軟磁性金属の平板をプレスによりコの字形状に形
成したリードフレーム２４の底壁２４ａに接着剤により
接着されている。そして、リードフレームの縦壁２４ｂ
の先端は、磁石２２の非磁性材スペーサ２３と接着され
た磁極面２２ａより上方に位置している。感磁素子２
１、非磁性材スペーサ２３、磁石２２、およびリードフ
レーム２４は封止樹脂２５で、包括されて一体のパッケ
ージとされている。FIG. 6 shows a third embodiment of the present invention. In the magnetic sensor 20 of this embodiment, a non-magnetic material spacer 23 is arranged between the magnetic sensing element 21 and the magnet 22. That is, the nonmagnetic spacer 23 is adhered to the lower surface of the magnetic sensing element 21 with an adhesive, and the upper magnetic pole surface 22a of the magnet 22 is adhered to the lower surface of the nonmagnetic spacer 23 with an adhesive. The lower magnetic pole surface 22b of the magnet 22 is adhered to the bottom wall 24a of the lead frame 24, which is formed by pressing a flat plate of high-permeability soft magnetic metal into a U shape by an adhesive. And the vertical wall 24b of the lead frame
Is positioned above the magnetic pole surface 22a bonded to the non-magnetic material spacer 23 of the magnet 22. Magnetic sensitive element 2
1, the non-magnetic material spacer 23, the magnet 22, and the lead frame 24 are encapsulated with the sealing resin 25 to form an integrated package.

【００２０】これにより、感磁素子２１は磁束密度変化
が大きい領域に位置する。すなわち、一般に磁石近傍で
磁性体が移動したとき、磁界は磁性体により変化する。
しかしながら、磁極表面の磁束密度は一定であり、磁束
密度変化の大きい場所は磁極面から離れたところにあ
る。したがって、非磁性材スペーサ２３を感磁素子２１
と、磁石２２の間に介装し、その厚さによって所定間隔
を与えると磁束密度変化が大きい位置に感磁素子２１を
配置することができる。本実施例ではしたがって、所定
厚さの非磁性材スペーサ２３を感磁素子２１と磁石２２
の間に介装して、感磁素子２１を磁束密度変化が大きい
位置に配置してある。As a result, the magnetic sensitive element 21 is located in a region where the change in magnetic flux density is large. That is, generally, when the magnetic body moves near the magnet, the magnetic field changes due to the magnetic body.
However, the magnetic flux density on the surface of the magnetic pole is constant, and the location where the magnetic flux density changes largely is located away from the magnetic pole surface. Therefore, the non-magnetic material spacer 23 is connected to the magnetic sensing element 21.
The magnetic sensitive element 21 can be arranged at a position where the change in magnetic flux density is large by interposing between the magnets 22 and providing a predetermined distance depending on the thickness. Therefore, in this embodiment, therefore, the non-magnetic material spacer 23 having a predetermined thickness is used for the magnetic sensitive element 21 and the magnet 22.
The magnetic sensitive element 21 is disposed between the magnetic field sensor and the magnetic field sensor at a position where the magnetic flux density change is large.

【００２１】本実施例は以上のように構成され、非磁性
材スペーサを用いて磁束密度変化が大きい位置に感磁素
子を配置してあるので、第１実施例と同様の効果が得ら
れるとともに、一層の高感度化を図ることができる。Since this embodiment is constructed as described above and the magnetic sensitive element is arranged at the position where the magnetic flux density change is large by using the non-magnetic material spacer, the same effect as the first embodiment can be obtained. It is possible to further increase the sensitivity.

【００２２】なお、上記の各実施例では、感磁素子とし
て半導体ホール素子を用いたものを示したが、その他、
半導体ホールＩＣ、磁気抵抗素子、磁気ダイオード、磁
気トランジスタ等各種磁電交換素子などを用いることが
できる。また、リードフレームを形成する高透磁率軟磁
性金属材としては、４２Ｎｉ−Ｆｅ合金の他、例えばＮ
ｉ−Ｆｅ合金、硅素鋼、軟磁性金属膜等も用いることが
できる。In each of the above embodiments, the semiconductor Hall element is used as the magnetic sensing element.
Various magnetoelectric exchange elements such as a semiconductor Hall IC, a magnetoresistive element, a magnetic diode, and a magnetic transistor can be used. Further, as the high permeability soft magnetic metal material forming the lead frame, in addition to 42Ni—Fe alloy, for example, N
An i-Fe alloy, silicon steel, a soft magnetic metal film, etc. can also be used.

【００２３】[0023]

【発明の効果】以上のとおり、本発明の磁気センサは、
感磁素子と、高透磁率軟磁性金属材のリードフレーム
と、感磁素子とリードフレームとの間に配置した磁石
と、これら感磁素子、磁石およびリードフレームを包み
一体構造とする封止樹脂とからなるので、感度のばらつ
きが少なく、信頼性が高いという効果に加え、リードフ
レームがバックヨークとしての働きをするので、これに
より、感磁素子側の磁極面の磁束が強められ、外部ヨー
ク等を付加することなく、高感度が得られるという効果
を有する。そして、小型で、製造工程を増加させること
なく、安価に製造できる。As described above, the magnetic sensor of the present invention is
Magnetic sensitive element, lead frame of high magnetic permeability soft magnetic metal material, magnet arranged between magnetic sensitive element and lead frame, and encapsulating resin that encloses these magnetic sensitive element, magnet and lead frame to form an integral structure In addition to the effect that there is little variation in sensitivity and high reliability, the lead frame acts as a back yoke, which strengthens the magnetic flux on the magnetic pole surface on the magnetic sensitive element side, and the external yoke. There is an effect that high sensitivity can be obtained without adding such as. Further, it is small in size and can be manufactured at low cost without increasing the manufacturing process.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施例の構成を示す透視図であ
る。FIG. 1 is a perspective view showing a configuration of a first exemplary embodiment of the present invention.

【図２】図１のＡ−Ａ断面と磁束状態を示す断面図であ
る。FIG. 2 is a cross-sectional view showing a cross section taken along the line AA of FIG. 1 and a magnetic flux state.

【図３】第１の実施例の磁束状態をリードフレームを有
しないものと対比して示す断面図である。FIG. 3 is a cross-sectional view showing a magnetic flux state of the first embodiment in comparison with one having no lead frame.

【図４】第１の実施例の磁性体が接近したときの磁束状
態をリードフレームを有しないものと対比して示す断面
図である。FIG. 4 is a cross-sectional view showing a state of magnetic flux when the magnetic body of the first embodiment approaches, in comparison with a magnetic body having no lead frame.

【図５】本発明の第２の実施例の構成と磁束状態を示す
断面図である。FIG. 5 is a sectional view showing the configuration and magnetic flux state of the second embodiment of the present invention.

【図６】本発明の第３の実施例の構成と磁束状態を示す
断面図である。FIG. 6 is a sectional view showing the configuration and magnetic flux state of the third embodiment of the present invention.

【図７】従来例を示す断面図である。FIG. 7 is a sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

１、１０、２０ 磁気センサ ２、１１、１２、２１ 感磁素子 ３、１４、２２ 磁石 ３ａ、３ｂ、１４ａ、１４ｂ、２２ａ、２２ｂ 磁極
面 ４ リード端子 ５、１６、２４ リードフレーム ５ａ、１６ａ、２４ａ 底壁 ５ｂ、１６ｂ、２４ｂ 縦壁 ６ ボンディングワイヤ ７、１７、２５ 封止樹脂 ８、１８ 磁性体 １３ 半導体基板 １５ 非磁性材 ２３ 非磁性材スペーサ1, 10, 20 Magnetic sensor 2, 11, 12, 21 Magnetosensitive element 3, 14, 22 Magnet 3a, 3b, 14a, 14b, 22a, 22b Magnetic pole surface 4 Lead terminal 5, 16, 24 Lead frame 5a, 16a, 24a Bottom wall 5b, 16b, 24b Vertical wall 6 Bonding wire 7, 17, 25 Sealing resin 8, 18 Magnetic material 13 Semiconductor substrate 15 Non-magnetic material 23 Non-magnetic material spacer

───────────────────────────────────────────────────── フロントページの続き (72)発明者 金子 洋之 神奈川県横浜市神奈川区宝町２番地 日産 自動車株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroyuki Kaneko 2 Takaracho, Kanagawa-ku, Yokohama, Kanagawa Nissan Motor Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 感磁素子と、高透磁率軟磁性金属材のリ
ードフレームと、前記感磁素子と前記リードフレームと
の間に配置した磁石と、前記感磁素子、磁石およびリー
ドフレームを包み一体構造とする封止樹脂とからなるこ
とを特徴とする磁気センサ。1. A magnetic sensing element, a lead frame made of a high magnetic permeability soft magnetic metal material, a magnet arranged between the magnetic sensing element and the lead frame, and the magnetic sensing element, the magnet and the lead frame. A magnetic sensor comprising a sealing resin having an integral structure. 【請求項２】 前記リードフレームは底壁とその両端に
縦壁を有するコの字型形状に形成され、前記感磁素子と
磁石は前記縦壁に挟まれた空間で前記底壁に取り付けら
れていることを特徴とする請求項１記載の磁気センサ。2. The lead frame is formed in a U-shape having a bottom wall and vertical walls at both ends thereof, and the magnetic sensing element and the magnet are attached to the bottom wall in a space sandwiched between the vertical walls. The magnetic sensor according to claim 1, wherein: 【請求項３】 前記リードフレームの縦壁の先端は、前
記磁石の感磁素子側の磁極面より上方に位置しているこ
とを特徴とする請求項２記載の磁気センサ。3. The magnetic sensor according to claim 2, wherein a tip of a vertical wall of the lead frame is located above a magnetic pole surface of the magnet on the magnetic sensitive element side. 【請求項４】 前記感磁素子は、前記磁石の端部近傍に
複数設けられていることを特徴とする請求項１記載の磁
気センサ。4. The magnetic sensor according to claim 1, wherein a plurality of the magnetic sensitive elements are provided near an end of the magnet. 【請求項５】 非磁性材スペーサが前記感磁素子と前記
磁石との間に配置されていることを特徴とする請求項
１、２、３または４記載の磁気センサ。5. The magnetic sensor according to claim 1, wherein a non-magnetic material spacer is arranged between the magnetic sensing element and the magnet.
JP34844995A 1995-12-18 1995-12-18 Magnetic sensor Withdrawn JPH09166612A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34844995A JPH09166612A (en) 1995-12-18 1995-12-18 Magnetic sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34844995A JPH09166612A (en) 1995-12-18 1995-12-18 Magnetic sensor

Publications (1)

Publication Number Publication Date
JPH09166612A true JPH09166612A (en) 1997-06-24

Family

ID=18397085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34844995A Withdrawn JPH09166612A (en) 1995-12-18 1995-12-18 Magnetic sensor

Country Status (1)

Country Link
JP (1) JPH09166612A (en)

Cited By (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001289676A (en) * 2000-04-07 2001-10-19 Toyo Keiki Co Ltd Flow rate meter
JP2005043328A (en) * 2003-07-25 2005-02-17 Mitsubishi Electric Corp Manufacturing method of magnetism detecting device and magnetism detecting device
JP2006003096A (en) * 2004-06-15 2006-01-05 Mitsubishi Electric Corp Magnetic detector
JP2006170999A (en) * 2004-12-15 2006-06-29 Robert Bosch Gmbh Magnetic sensor device
JP2008304470A (en) * 2008-07-10 2008-12-18 Asahi Kasei Electronics Co Ltd Magnetic sensor
US7476953B2 (en) 2005-02-04 2009-01-13 Allegro Microsystems, Inc. Integrated sensor having a magnetic flux concentrator
WO2011102050A1 (en) * 2010-02-17 2011-08-25 三菱電機株式会社 Magnetic position detection device
US8143169B2 (en) 2007-03-29 2012-03-27 Allegro Microsystems, Inc. Methods for multi-stage molding of integrated circuit package
CN103090891A (en) * 2011-11-04 2013-05-08 英飞凌科技股份有限公司 Magnetic Sensor Device And A Method For Fabricating The Same
US8461677B2 (en) 2008-12-05 2013-06-11 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
CN104157068A (en) * 2013-05-14 2014-11-19 北京嘉岳同乐极电子有限公司 Magnetic sensor
US8952471B2 (en) 2006-01-20 2015-02-10 Allegro Microsystems, Llc Arrangements for an integrated sensor
CN104819683A (en) * 2014-02-03 2015-08-05 爱信精机株式会社 Displacement sensor
US9121880B2 (en) 2011-11-04 2015-09-01 Infineon Technologies Ag Magnetic sensor device
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
JPWO2015190468A1 (en) * 2014-06-11 2017-04-20 三菱電機株式会社 Magnetic sensor device
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10333055B2 (en) 2012-01-16 2019-06-25 Allegro Microsystems, Llc Methods for magnetic sensor having non-conductive die paddle
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US10921391B2 (en) 2018-08-06 2021-02-16 Allegro Microsystems, Llc Magnetic field sensor with spacer
US10935612B2 (en) 2018-08-20 2021-03-02 Allegro Microsystems, Llc Current sensor having multiple sensitivity ranges
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11567108B2 (en) 2021-03-31 2023-01-31 Allegro Microsystems, Llc Multi-gain channels for multi-range sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
US11994541B2 (en) 2022-04-15 2024-05-28 Allegro Microsystems, Llc Current sensor assemblies for low currents

Cited By (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001289676A (en) * 2000-04-07 2001-10-19 Toyo Keiki Co Ltd Flow rate meter
JP2005043328A (en) * 2003-07-25 2005-02-17 Mitsubishi Electric Corp Manufacturing method of magnetism detecting device and magnetism detecting device
US7117585B2 (en) 2003-07-25 2006-10-10 Mitsubishi Denki Kabushiki Kaisha Magnetic detection apparatus with resin infiltration prevention
US7441322B2 (en) 2003-07-25 2008-10-28 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a magnetic detection apparatus
JP2006003096A (en) * 2004-06-15 2006-01-05 Mitsubishi Electric Corp Magnetic detector
JP2006170999A (en) * 2004-12-15 2006-06-29 Robert Bosch Gmbh Magnetic sensor device
US7476953B2 (en) 2005-02-04 2009-01-13 Allegro Microsystems, Inc. Integrated sensor having a magnetic flux concentrator
US9082957B2 (en) 2006-01-20 2015-07-14 Allegro Microsystems, Llc Arrangements for an integrated sensor
US10069063B2 (en) 2006-01-20 2018-09-04 Allegro Microsystems, Llc Integrated circuit having first and second magnetic field sensing elements
US8952471B2 (en) 2006-01-20 2015-02-10 Allegro Microsystems, Llc Arrangements for an integrated sensor
US9859489B2 (en) 2006-01-20 2018-01-02 Allegro Microsystems, Llc Integrated circuit having first and second magnetic field sensing elements
US8143169B2 (en) 2007-03-29 2012-03-27 Allegro Microsystems, Inc. Methods for multi-stage molding of integrated circuit package
JP2008304470A (en) * 2008-07-10 2008-12-18 Asahi Kasei Electronics Co Ltd Magnetic sensor
US8461677B2 (en) 2008-12-05 2013-06-11 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
US8486755B2 (en) 2008-12-05 2013-07-16 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
CN102741661A (en) * 2010-02-17 2012-10-17 三菱电机株式会社 Magnetic position detection device
US8791692B2 (en) 2010-02-17 2014-07-29 Mitsubishi Electric Corporation Magnetic position detecting device
JP5271448B2 (en) * 2010-02-17 2013-08-21 三菱電機株式会社 Magnetic position detector
WO2011102050A1 (en) * 2010-02-17 2011-08-25 三菱電機株式会社 Magnetic position detection device
CN103090891A (en) * 2011-11-04 2013-05-08 英飞凌科技股份有限公司 Magnetic Sensor Device And A Method For Fabricating The Same
US9121880B2 (en) 2011-11-04 2015-09-01 Infineon Technologies Ag Magnetic sensor device
US10333055B2 (en) 2012-01-16 2019-06-25 Allegro Microsystems, Llc Methods for magnetic sensor having non-conductive die paddle
US11961920B2 (en) 2012-03-20 2024-04-16 Allegro Microsystems, Llc Integrated circuit package with magnet having a channel
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10916665B2 (en) 2012-03-20 2021-02-09 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an integrated coil
US11444209B2 (en) 2012-03-20 2022-09-13 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an integrated coil enclosed with a semiconductor die by a mold material
US11677032B2 (en) 2012-03-20 2023-06-13 Allegro Microsystems, Llc Sensor integrated circuit with integrated coil and element in central region of mold material
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US11828819B2 (en) 2012-03-20 2023-11-28 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10230006B2 (en) 2012-03-20 2019-03-12 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an electromagnetic suppressor
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US11680996B2 (en) 2012-05-10 2023-06-20 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having integrated coil
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
CN104157068A (en) * 2013-05-14 2014-11-19 北京嘉岳同乐极电子有限公司 Magnetic sensor
US10254103B2 (en) 2013-07-19 2019-04-09 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US11313924B2 (en) 2013-07-19 2022-04-26 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US10670672B2 (en) 2013-07-19 2020-06-02 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
CN104819683A (en) * 2014-02-03 2015-08-05 爱信精机株式会社 Displacement sensor
JPWO2015190468A1 (en) * 2014-06-11 2017-04-20 三菱電機株式会社 Magnetic sensor device
US11307054B2 (en) 2014-10-31 2022-04-19 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
US10753768B2 (en) 2014-10-31 2020-08-25 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US10753769B2 (en) 2014-10-31 2020-08-25 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
US10837800B2 (en) 2016-06-08 2020-11-17 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10649042B2 (en) 2017-05-26 2020-05-12 Allegro Microsystems, Llc Packages for coil actuated position sensors
US11768256B2 (en) 2017-05-26 2023-09-26 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US11073573B2 (en) 2017-05-26 2021-07-27 Allegro Microsystems, Llc Packages for coil actuated position sensors
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US11320496B2 (en) 2017-05-26 2022-05-03 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US11313700B2 (en) 2018-03-01 2022-04-26 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US10921391B2 (en) 2018-08-06 2021-02-16 Allegro Microsystems, Llc Magnetic field sensor with spacer
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US11686599B2 (en) 2018-08-06 2023-06-27 Allegro Microsystems, Llc Magnetic field sensor
US10935612B2 (en) 2018-08-20 2021-03-02 Allegro Microsystems, Llc Current sensor having multiple sensitivity ranges
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11567108B2 (en) 2021-03-31 2023-01-31 Allegro Microsystems, Llc Multi-gain channels for multi-range sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
US11994541B2 (en) 2022-04-15 2024-05-28 Allegro Microsystems, Llc Current sensor assemblies for low currents

Similar Documents

Publication Publication Date Title
JPH09166612A (en) Magnetic sensor
US5637995A (en) Magnetic detection device having a magnet including a stepped portion for eliminating turbulence at the MR sensor
JPH11109009A (en) Package for field detector
US5883567A (en) Packaged integrated circuit with magnetic flux concentrator
US7385394B2 (en) Integrated magnetic sensor component
US5216405A (en) Package for the magnetic field sensitive device
US7476953B2 (en) Integrated sensor having a magnetic flux concentrator
EP2783229B1 (en) Magnetic field sensor device having non-conductive die paddle and production method
US6064198A (en) Gear tooth sensor with improved resolution and stability
EP1443332B1 (en) Current sensor
US20100188078A1 (en) Magnetic sensor with concentrator for increased sensing range
JPH0280913A (en) Position sensor
JP3603406B2 (en) Magnetic detection sensor and method of manufacturing the same
US20060261801A1 (en) Magnetoresistive sensor
US20200158791A1 (en) Sensor package with integrated magnetic shield structure
US4771240A (en) Magnetic field sensor with magnetic field-dependent resistor
US10991644B2 (en) Integrated circuit package having a low profile
EP0789250A2 (en) Thin film giant magnetoresistive cip transducer with flux guide yoke structure
CN112393748B (en) System with magnetic field shielding structure
US10607925B2 (en) Integrated circuit package having a raised lead edge
JPH06111251A (en) Magnetic sensor
JP2552683B2 (en) Current sensor
JP3233129B2 (en) Magnetic detector
JPH095016A (en) Magnetic sensor
JPH0721507B2 (en) Magnetic sensor

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20030304