JPH09148406A - Substrate carrying apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent leap out of a substrate from a carrying arm while the substrate is carried. SOLUTION: A carrying apparatus 3 comprises a C-shaped carrying arm 1 which supports a substrate W at about a peripheral end portion of the substrate and a carrying drive mechanism 2 which drives the carrying arm 1. In a status where the substrate W is supported by the carrying arm 1, the carrying drive mechanism 2 drives the carrying arm 1 to carry the substrate W, and at a predetermined delivery position, the substrate W is delivered between the carrying arm 1 and a predetermined substrate delivery object. In this case, the carrying arm 1 has a placement support member 4 which supports placement of the substrate W at about a peripheral end portion of the substrate from a position under the substrate, and a press-contact member 5, which is openably/closably constructed such that it can be in non-operating status where it is not in contact with the peripheral end of the substrate W, and in operating status where it press-contacts the peripheral end of the substrate W. Further, an opening/closing drive mechanism 6 which open/close-drives the press-contact member 5 is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus provided in, for example, a semiconductor manufacturing apparatus (substrate processing apparatus), and more particularly to a C type supporting a peripheral portion of a semiconductor wafer (substrate). It has a transfer arm and a transfer drive means for driving the transfer arm. The transfer arm is driven by the transfer drive means while the substrate is supported by the transfer arm to transfer the substrate, and at a predetermined transfer position. The present invention relates to a substrate transfer device that transfers a substrate between a transfer arm and a predetermined substrate transfer target.

[0002]

2. Description of the Related Art A conventional substrate transfer apparatus of this type includes a C-shaped transfer arm that supports the vicinity of the outer peripheral edge of a substrate. The transfer arm includes a mounting support member that mounts and supports the vicinity of the outer peripheral edge of the substrate from below, and a horizontal regulating member that regulates the horizontal movement of the substrate mounted and supported by the mounting support member. And are attached. The horizontal regulating member is arranged at a predetermined position so as to be arranged outside the outer peripheral edge of the substrate in a state where the substrate is mounted and supported by the mounting support member, and is fixed to the transfer arm. There is.

Further, the substrate transfer device is provided with a transfer drive mechanism for driving the transfer arm. By the transfer drive mechanism driving the transfer arm, the substrate is transferred and supported in a state in which the vicinity of the outer peripheral end is placed and supported by the mounting support member and the horizontal movement is restricted by the horizontal restricting member. At the same time, the substrate is transferred between the transfer arm and the transfer target such as the substrate processing unit at a predetermined transfer position.

This type of substrate transfer apparatus, for example, performs various substrate processes (resist coating, development, various baking processes, etc.) before and after the exposure process in the photolithography process on the substrate (semiconductor wafer). , A spin coater for resist coating, a spin developer for development, and a heat treatment unit for baking processing (a plurality of substrate heating treatment units and substrate cooling treatment units are vertically stacked, and also in a horizontal uniaxial direction). Substrate processing apparatus equipped with (equipped in parallel), etc., for transporting substrates in the substrate processing apparatus, and various substrates such as a spin coater, a spin developer, a substrate heating processing unit, and a substrate cooling processing unit. Substrate loading / unloading (delivery of substrates to / from each substrate processing unit) is performed.

In such a substrate processing apparatus, a substrate processing unit using a chemical such as a spin coater or a spin developer is arranged in parallel in a horizontal uniaxial direction in which a substrate heating processing unit and a substrate cooling processing unit are arranged in parallel, and heat treatment is performed. And the spin coater and the spin developer are arranged to face each other, and the substrate transport path of the substrate transport device is disposed between them.

Therefore, the transfer arm of the substrate transfer apparatus is moved in the horizontal uniaxial direction along the substrate transfer path, and the transfer position on the substrate transfer path and the transfer of the substrate within each substrate processing section are performed. It is configured to be moved in and out (horizontal movement) with respect to the position. In addition, for example, the substrate cooling processing is configured to be vertically movable so as to transfer the substrate between the substrate heating processing unit and the substrate cooling processing unit that are stacked in the vertical direction, and further, for example, the substrate cooling processing is arranged to face each other. In transporting the substrate between the unit and the spin coater, the substrate is also configured to be swiveled around a vertical axis in order to change the direction of the withdrawal movement by approximately 180 °. As described above, the substrate transfer apparatus of this type is configured so that the transfer arm can perform a plurality of operations, and the transfer drive mechanism that drives the transfer arm is, for example, a horizontal transfer unit that moves the transfer arm horizontally along the substrate transfer path. A horizontal movement drive mechanism that moves in one axis direction, a lifting drive mechanism that raises and lowers in the vertical direction, a swing drive mechanism that swings around a vertical axis, and a retracting drive that moves the transport arm in and out between a transport position and a delivery position. It is configured with a mechanism and the like. Each drive mechanism has a drive source such as a motor.

[0007]

However, the prior art having such a structure has the following problems. That is, recently, in order to improve the throughput of the entire substrate processing apparatus, there is a tendency to shorten the substrate transfer time by the substrate transfer apparatus. Therefore, the operating speed of the transfer arm during the transfer of the substrate (the speed of horizontal movement, vertical movement, turning, etc.) is increased, and two operations are simultaneously performed as much as possible.

However, when two operations are performed simultaneously and at high speed, for example, when the transfer arm is rapidly lowered and swung rapidly, the substrate jumps out of the transfer arm, and There has been a problem that the section rides on the horizontal regulating member and the transfer arm obliquely supports the substrate, or in some cases the substrate is dropped.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transfer device capable of preventing a substrate from jumping out from a transfer arm during substrate transfer.

[0010]

As a result of investigating the cause of the protrusion of the substrate from the transfer arm during the transfer of the substrate, the inventor has found out the following cause.

That is, since the horizontal regulating member of the conventional substrate transfer device is provided only for regulating the horizontal movement of the substrate placed and supported by the placing support member,
Substantially, the substrate is only placed and supported on the placing support member near the outer peripheral edge from below, and the force that the transfer arm supports the substrate is only the force directed vertically downward due to the gravity of the substrate. is there. Therefore, as in the case where the transfer arm is swung while being rapidly lowered, two operations are performed simultaneously and
When performed at high speed, it is estimated that the force of the transfer arm supporting the substrate cannot follow the movement of the transfer arm and the substrate jumps out of the transfer arm.

In addition, since an allowable error is recognized in the size (diameter) of the board according to the standard, the mounting position of the horizontal regulating member is set so that the board having a large size within the error permissible range fits inside the horizontal regulating member. Has been decided. Therefore, when a substrate having a small size within the allowable error range including the standard size substrate is supported by the transfer arm, a slight gap is formed between the outer peripheral edge of the substrate and the horizontal regulating member. Therefore, it is conceivable that such a gap makes it easier for the substrate to jump out of the transfer arm.

Further, mechanical vibrations from the substrate processing apparatus itself and devices arranged around the substrate processing apparatus, such as a carrier for carrying a carrier containing a plurality of substrates, are carried between the plurality of substrate processing apparatuses. Automatic carrier (Auto Guide
It is considered that vibrations from a vehicle (AG Vehicle: AGV) or the like are transmitted to the substrate being transferred, and it is considered that the influence of such vibrations further promotes the jumping out of the substrate from the transfer arm.

Therefore, in view of such a fact, the present inventor has made the following invention which can solve the above-mentioned inconvenience.

That is, of the inventions made by the present inventor,
According to a first aspect of the present invention, there is provided a C-type transfer arm that supports a semiconductor wafer (hereinafter, referred to as a “substrate”) near an outer peripheral end thereof, and a transfer driving unit that drives the transfer arm. While the substrate is supported by the arm, the transfer arm is driven by the transfer drive means to transfer the substrate, and the substrate is transferred between the transfer arm and a predetermined substrate transfer target at a predetermined transfer position. In the substrate transfer device, the mounting and supporting means for mounting and supporting the vicinity of the outer peripheral edge of the substrate from below, the non-operating state in which the outer peripheral edge of the substrate is not in contact, and the outer peripheral edge of the substrate are A pressure contact means configured to be openable and closable so as to be in a pressure contact operation state; and an opening and closing drive means attached to the transfer arm and driving the pressure contact means to open and close.

According to a second aspect of the present invention, in the substrate transfer apparatus according to the first aspect, the drive source of the opening / closing drive means is provided separately from the drive source of the transfer drive means.

According to a third aspect of the present invention, in the substrate transfer apparatus according to the first aspect, the transfer arm transfers the substrate and the transfer position and a predetermined position for transferring the substrate. Of the transport arm, the transport drive means includes a transport drive means for transporting the transport arm between the transfer position and the transport position, and the opening / closing drive. The means is constituted by a mechanical mechanism that engages with a member fixedly installed in the vicinity of the delivery position to open and close the pressure contact means in the process of moving the transport arm forward and backward by the forward and backward drive means. It is a thing.

[0018]

The operation of the present invention is as follows. That is,
According to the first aspect of the invention, the opening / closing driving means drives the opening / closing so that the pressure contact means is in the operating state during the transportation of the substrate and the pressure contact means is in the inactive state during the delivery of the substrate.
Therefore, during the transportation of the substrate, the vicinity of the outer peripheral edge of the substrate is placed and supported by the mounting support means from below, and the pressure contact means presses the outer peripheral edge of the substrate in pressure contact. Since the pressing force of the pressing means acts on the outer peripheral edge of the substrate, it is possible to prevent the substrate from jumping out from the transfer arm during the transfer of the substrate. Further, when the substrate is delivered, the pressure contact means is in a non-operating state, the pressure contact means is not in contact with the outer peripheral edge of the substrate, and the substrate is only placed and supported by the placement support means. The pressure contact means does not interfere with the operation of taking out the substrate from the transfer arm for the delivery of the substrate or receiving the substrate by the transfer arm.

According to the second aspect of the present invention, since the drive source of the opening / closing drive means for driving the opening / closing of the press contact means is provided separately from the drive source of the transfer drive means of the transfer arm, it is independent of the drive of the transfer arm. Thus, the pressure contact means can be opened and closed, and the pressure contact means can be opened and closed at an arbitrary (desired) timing without being restricted by the timing of driving the transfer arm.

Further, in the third aspect of the present invention, the transfer arm is moved back and forth between the transfer position and a predetermined transfer position for transferring the substrate, in order to transfer the substrate. , And a retreating drive means for performing reciprocating movement between the transfer position of the transfer arm and the transfer position. And
The opening / closing drive means for driving the opening / closing of the pressure contact means is a machine that engages with a member fixedly installed in the vicinity of the delivery position to open / close the pressure contact means in the process of the transfer arm moving in and out of the transfer arm. It is composed of a mechanism. That is, since the opening / closing drive means is configured by a mechanical mechanism that utilizes the movement of the transport arm to move in and out without providing a special drive source in the opening / closing drive means, the invention according to claim 2 is described. The configuration is simpler than in.

[0021]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the invention described in claim 1 will be described with reference to FIG. FIG. 1 (a) shows the claim 1.
1 is a plan view showing a schematic configuration of a substrate transfer apparatus according to an embodiment of the invention described in FIG. 1, and FIG. 1B is a longitudinal sectional view showing a configuration of a main part of FIG. FIG. 1 (b) is the same as FIG.
It is a longitudinal cross-sectional view of the main part of A1 portion of (a), other A
The main part of the A2 part is also configured in the same manner as in FIG.

As shown in FIG. 1, according to the first aspect of the present invention, a C-shaped transfer arm 1 for supporting a semiconductor wafer (substrate) W in the vicinity of an outer peripheral end thereof and a transfer drive for driving the transfer arm 1 are provided. And a mechanism (conveyance driving means) 2 and a conveyance arm 1
The transfer arm 1 is driven by the transfer drive mechanism 2 to transfer the substrate W while the substrate W is supported by the transfer arm 1, and the transfer arm 1 and the predetermined substrate transfer target (for example, transfer the substrate W at a predetermined transfer position). In the substrate transfer device 3 in which the substrate W is transferred to and from a substrate processing unit in the substrate processing apparatus including the device 3, a mounting support member for mounting and supporting the vicinity of the outer peripheral end of the substrate W from below. (Placement support means)
4, a non-operation state in which the substrate W is not in contact with the outer peripheral edge (a state shown by an imaginary line in the figure), and the outer peripheral edge of the substrate W is pressure-contacted (contacts the outer peripheral edge of the substrate W and A pressure contact member (pressure contact means) 5 configured to be openable and closable so as to be in a working state (inwardly pushing the outer peripheral edge of W) (a state shown by a solid line in the figure).
Are attached to the transfer arm 1 and are provided with an opening / closing drive mechanism (opening / closing drive means) 6 for opening / closing the pressing member 5.

The transfer arm 1 shown in the figure has a curved portion 1a having a shape along the outer peripheral edge of the substrate W, and a member supporting portion 1b formed at a plurality of locations (three locations in the figure) of the curved portion 1a. And a connecting portion 1c for connecting the transfer arm 1 and the arm support base 7
And a bridge portion 1 connecting the bending portion 1a and the connecting portion 1c.
d. The member support portion 1b is formed one step lower than the upper surface of the curved portion 1a, the press contact member 5 is attached to the upper surface thereof, and the mounting support member 4 is attached to the side surface thereof.

Further, this type of transfer arm 1 includes a connecting portion 1
With the arm support base 7 that supports the transfer arm 1 via c, for example, horizontal movement (movement in the X-axis direction in the drawing) or vertical movement (direction perpendicular to the paper surface of FIG. 1A, FIG. Movement of the substrate W in the Z-axis direction), a vertical axis (an axis perpendicular to the paper surface of FIG. 1A and an axis parallel to the Z axis of FIG. 1B), and the like so that the substrate W is transferred. 1A, the connecting arm 1c is slid in the Y-axis direction with respect to the arm supporting base 7 so that the carrying arm 1 is moved in and out of the arm supporting base 7. The carrier arm 1 is horizontally moved between a state in which the carrier arm 1 is retracted on the arm support base 7 (transport position) and a state in which the transport arm 1 is sent out from the arm support base 7 (delivery position), and the substrate W is transferred at the delivery position. Will be delivered.

Therefore, the transport drive mechanism 2 is provided with, for example, a horizontal movement drive mechanism 2a, a lift drive mechanism 2b, a swing drive mechanism 2c, and a retracting drive mechanism 2d in order to realize a plurality of operations of the transport arm 1. ing. These drive mechanisms 2a
2d are also provided in the conventional substrate transfer apparatus, and for example, the horizontal movement drive mechanism 2a and the elevation drive mechanism 2 are provided.
b, the advance / retreat drive mechanism 2d is configured by a well-known uniaxial drive mechanism including a motor (drive source), a screw shaft, a guide shaft, and the like, and the turning drive mechanism 2c controls the rotational force of the motor (drive source). It is realized by conducting. The drive mechanisms 2a to 2d are controlled by the transport drive controller 8.

The specific structure of the opening / closing drive mechanism 6 will be clarified in the embodiments of the invention described in claims 2 and 3 described later.

In FIG. 1, three pressure contact members 5 are provided, and when these pressure contact members 5 are in operation, the outer peripheral edge of the substrate W is pressure contacted from three locations.

According to the substrate transfer device 3 shown in FIG.
The opening / closing drive mechanism 6 drives the opening / closing so that the pressure contact member 5 is in the operating state during the transportation of the substrate W and the pressure contact member 5 is in the inactive state during the delivery of the substrate W. As a result, during the transportation of the substrate W, the vicinity of the outer peripheral edge of the substrate W is placed and supported on the mounting support member 4 from below, and the press contact member 5 presses the outer peripheral edge of the substrate W (from three points). Therefore, in addition to the force due to the gravity of the substrate W, the force with which the pressure contact member 5 is in pressure contact acts on the outer peripheral edge of the substrate W, so that the substrate W is prevented from jumping out from the transport arm 1 during transport of the substrate W. can do. Further, when the substrate W is delivered, the pressure contact member 5 is in a non-operating state, the pressure contact member 5 is not in contact with the outer peripheral edge of the substrate W, and the substrate W is placed and supported by the placement support member 4. The transfer arm 1 to transfer the substrate W from the transfer arm 1 to the substrate W.
The pressure contact member 5 does not interfere with the operation of taking out the wafer W or the transfer arm 1 receiving the substrate W.

Next, an embodiment of the invention described in claim 2 will be described with reference to FIG. 2A is a plan view showing a schematic configuration of a substrate transfer apparatus according to an embodiment of the present invention as set forth in claim 2, and FIG. 2B is an enlarged view in which a main part of FIG. 2A is enlarged. FIG. 2 (c) is a plan view, FIG. 2 (c) is a longitudinal sectional view showing the structure of the main part of FIG. 2 (a), and FIG. 2 (d) is a partially omitted rear view of the transfer arm as seen from the base end side. . In addition, FIG.
FIG. 2C is an enlarged view of the main part of the A1 portion of FIG.
FIG. 2 is a longitudinal sectional view, but other main parts of A2 and A3 parts are also shown in FIG.
The configuration is similar to that of (b) and FIG. 2 (c). In addition, parts that are assigned the same reference numerals as those in FIG. 1 and have no particular description have the same configuration as in FIG.

The invention according to claim 2 is characterized in that, in the substrate transfer device 3 according to claim 1, the drive source of the opening / closing drive mechanism 6 is provided separately from the drive source of the transfer drive mechanism 2. There is.

Specifically, it is realized by FIG. Each press-contact member 5 is composed of a "V" -shaped member,
The oscillating portion 5a on the base end side and the press contact portion 5b on the tip end side which presses the outer peripheral edge of the substrate W in the operating state. A base end of the swinging portion 5a is pivotally supported by a swinging fulcrum shaft 10 provided upright on the transfer arm 1, and the pressure contact member 5 is swingable. The torsion coil spring 1 is attached to the swing fulcrum shaft 10.
1 is fitted and the base end portion 11a of the torsion coil spring 11
Is fixed to the upper surface of the transfer arm 1 and the tip 1
1b is fixed to the lower surface of the pressure contact member 5 (oscillating portion 5a). As a result, each pressure contact member 5 is biased in the direction of the arrow indicated by the alternate long and short dash line in the figure to perform a closing operation from an inactive state to an active state, as will be described later, and to move the outer peripheral edge of the substrate W in the active state. Pressure contact.

At the base end of the swinging portion 5a of each pressure contact member 5,
One end side of the wire 12 is connected. Each wire 1
Reference numeral 2 denotes a tube 1 arranged along the curved portion 1a of the transfer arm 1 and a bridge portion 1e newly provided on the transfer arm 1.
3 (note that the tube 13 is not shown in FIG. 2A), and is guided to the base end of the transfer arm 1,
The other end of each wire 12 is connected to the tip of a rod 14a of an air cylinder 14 fixed to the base end surface of the transfer arm 1.

When the rod 14a of the air cylinder 14 is contracted, each wire 12 is pulled toward the base end side of the transfer arm 1, whereby each pressure contact member 5 is moved as shown by the chain double-dashed line in FIG. 2 (b). It is opened from the working state to the non-working state.
On the other hand, when the rod 14a of the air cylinder 14 is extended, the wires 12 are loosened as compared with the state in which the rod 14a of the air cylinder 14 is contracted, and the respective torsion coil springs 1
By the restoring force of 1, each pressure contact member 5 is closed from the non-acting state to the acting state as shown by the solid line in FIG.
That is, in this configuration, members indicated by reference numerals 10 to 14 and the like, the air supply pipe 15 and the air supply source 1 described later are provided.
6, the opening / closing drive control unit 17 and the like constitute the opening / closing drive mechanism 6, and the air cylinder 14 (more strictly speaking, the air cylinder 14
The torsion coil spring 11) serves as a drive source of the opening / closing drive mechanism 6, and is provided separately from the drive source (motor or the like) of the transport drive mechanism 2.

When the rods 14a of the air cylinder 14 are extended and each wire 12 is not loosened only by contacting each pressure contact member 5 with the outer peripheral edge of the substrate W, each pressure contact member 5 is released from the substrate W. Since the outer peripheral edge of the substrate W is not pressure-contacted, each pressure contact member 5 presses the outer peripheral edge of the substrate W in the operating state (contacts the outer peripheral edge and pushes the outer peripheral edge of the substrate W inward). Force to work)
A stroke of expansion and contraction of the rod 14a of the air cylinder 14 is set so that each wire 12 can still be slightly loosened in a state in which each pressure contact member 5 is in contact with the outer peripheral edge of the substrate W.

An air supply pipe 15 for supplying driving air to the air cylinder 14 is guided to the arm support base 7 and an air supply source 16 (this air supply source 16 may be provided in the arm support base 7). Connected to. In addition, when the transport arm 1 is moved in and out of the arm support base 7,
The air cylinder 14 is configured to allow the transfer arm 1 to move in and out.
The length of the air supply pipe 15 between the arm support base 7 and the arm support base 7 may be made sufficiently long. Further, when the transfer arm 1 is sent out from the arm support base 7, the air supply pipe 15 is pulled out from the arm support base 7, while when the transfer arm 1 is retracted, the excess air supply pipe 15 is removed.
It may be configured to be housed inside.

The drive control of the air supply source 16 (drive control of expansion / contraction of the rod 14a of the air cylinder 14) is controlled by the opening / closing drive control unit 17 by receiving a timing signal from the transport drive control unit 8, for example.

For example, at a predetermined delivery position, the transfer arm 1
When the substrate W receives the substrate W, for example, a timing signal indicating that the transfer arm 1 is located at a predetermined transfer position is received from the transfer drive control unit 8, and based on this signal, before the transfer arm 1 receives the substrate W. The rod 14a of the air cylinder 14 is contracted to open each pressure contact member 5 in a non-operating state so that each pressure contact member 5 does not interfere with the reception of the substrate W to the transfer arm 1. Then, when the substrate W is received (mounted and supported by the mounting support member 4), for example, a timing signal indicating the start of substrate transportation is received from the transport drive control unit 8 and the substrate W is transported based on this signal. At the same time, the rod 1 of the air cylinder 14
4a is extended to activate each pressure contact member 5, and the outer peripheral edge of the received substrate W is pressed against each pressure contact member 5. Then, the substrate W is transported while maintaining this state. If the transport drive control unit 8 outputs a timing signal indicating the start of substrate transport to the opening / closing drive control unit 17 at the timing of the original transport start, the actual transport of the substrate W may be started with a slight delay. Before the transfer of the substrate W, the outer peripheral edge of the received substrate W may be pressed against each pressing member 5.

Further, with the transfer arm 1 supporting the substrate W, the substrate W is transferred from the transfer arm 1 at a predetermined transfer position.
When the wafer W is taken out, for example, a timing signal indicating that the transfer arm 1 is positioned at a predetermined transfer position is received from the transfer drive control unit 8, and based on this signal, the rod of the air cylinder 14 is taken out before the substrate W is taken out. 14
The pressure contact member 5 is contracted to open each pressure contact member 5 in a non-acting state so that each pressure contact member 5 does not interfere with the removal of the substrate W from the transfer arm 1. Thereafter, as described above, the operation of the transfer arm 1 receiving the next substrate W at the predetermined transfer position is repeated.

Since the transport drive controller 8 drives the transport arm 1 by driving the drive source of the transport drive mechanism 2 (2a to 2d), it is possible that the transport arm 1 is located at a predetermined delivery position. The transport drive control unit 8 recognizes the timing of starting transport after receiving the substrate W.

Further, the opening / closing drive control for the pressure contact member 5 is not limited to being performed based on the timing signal from the transport drive control unit 8, and for example, it is detected that the transport arm 1 is located at a predetermined delivery position. With a sensor
It is also possible to carry out based on the detection signal from this sensor.

Next, the position of the transfer arm 1 in a state where the transfer arm 1 is retracted from the arm support base 7 and the transfer arm 1 is retracted above the arm support base 7, the transfer position is the transfer position. The opening / closing drive control for the pressure contact member 5 when the position of the transfer arm 1 in the state of being sent from the arm support base 7 is the delivery position will be described.

In this case, when the transfer arm 1 receives the substrate W at the predetermined transfer position, first, the exit / retract drive mechanism 2 is used.
By d, the transfer arm 1 is sent out from the arm support base 7 and moved from the transfer position to the delivery position. At this time, for example, a timing signal indicating the start of the delivery of the transport arm 1 is received from the transport drive control unit 8, and based on the signal, the rod 14a of the air cylinder 14 is sent simultaneously with the delivery of the transport arm 1 from the transport position to the delivery position. May be contracted to open each pressure contact member 5 in a non-acting state, or a timing signal indicating that the transport arm 1 has been sent out and the transport arm 1 is in the delivery position is driven. The rod 14a of the air cylinder 14 may be contracted as soon as the transport arm 1 is located at the delivery position, based on the signal received from the control unit 8. Further, for example, a sensor that detects that the transport arm 1 is located at a predetermined position between the transport position and the delivery position, which is located before the delivery position, is provided, and the air cylinder 14 of the air cylinder 14 is detected based on the detection signal from the sensor. Shrink the rod 14a,
When the transfer arm 1 is at the delivery position, or
The operation of opening each pressure contact member 5 to the non-acting state may be completed immediately before it is located at the delivery position.

Next, when the substrate W is received by the transfer arm 1 (mounted on and supported by the mounting support member 4), for example, a timing signal indicating the start of retreat from the transfer position of the transfer arm 1 to the transfer position. Received from the transport drive control unit 8,
Based on this signal, the rod 14a of the air cylinder 14 may be extended simultaneously with the retreat of the transfer arm 1 to close each pressure contact member 5 to the operating state, or the original timing of starting the retreat of the transfer arm 1. Transport control unit 8
Sends a timing signal indicating the start of the retreat of the transport arm 1 to the opening / closing drive control unit 17 to start the actual retreat of the transport arm 1 slightly later than that, and receives it before the start of the retreat of the transport arm 1. The outer peripheral edge of the substrate W is pressed against the pressing member 5
It may be pressed against. Further, a sensor or the like that detects that the substrate W is placed on the placement support member 4 is provided, and the substrate W is placed on the placement support member 4 based on the detection signal from this sensor (the substrate W The rod 14a of the air cylinder 14 may be extended immediately after it is received) or after some time has elapsed. In this case, it is better to control so that the outer peripheral edge of the received substrate W is pressed against the pressing member 5 after the substrate W is received and before the retreat of the transfer arm 1 is started. preferable.

While the outer peripheral edge of the received substrate W is kept pressed against the pressing member 5, the transfer arm 1 together with the arm support 7 moves, moves up and down, and turns after being positioned at the transfer position. The substrate W is transferred at a high speed and at the same time performs two operations as much as possible.

Further, the opening / closing drive control for the pressure contact member 5 when the transfer arm 1 is sent out from the transfer position to the transfer position and the substrate W supported by the transfer arm 1 is taken out at the transfer position is controlled by the transfer position described above. The opening / closing drive control for the pressure contact member 5 when the transfer arm 1 receives the substrate W may be performed in the same manner. In this case, after the transfer arm 1 is located at the delivery position, the substrate W is taken out. During this period, it is preferable to control the opening / closing drive so that the pressure contact member 5 is opened in the non-acting state.

It is also possible to replace the air cylinder 14 with a drive source for opening and closing each pressure contact member 5 and use a motor or the like. For example, each wire 1 on the rotation axis of the motor
If a bobbin that winds the end portion of 2 (the end portion on the base end side of the transfer arm 1) is connected, the wire 12 is wound around the bobbin by rotating the motor in the forward and reverse directions (each wire 1).
2 is pulled to the base end of the transfer arm 1) and each wire 12 is sent out from the bobbin 21 (each wire 12).
And the action of loosening).

According to the substrate transfer device 3 in which the drive source of the opening / closing drive mechanism 6 is provided separately from the drive source of the transfer drive mechanism 2 as shown in FIG. 2 and its modification, pressure contact is made independently of the drive of the transfer arm 1. The member 5 can be opened and closed, and the transport arm 1 can be configured as in the embodiment of the invention described in claim 3 described later.
Without being restrained (not dependent) by the drive timing of, for example, after the substrate W is received, the pressure contact member 5 is opened and closed at the same time as the operation of the transfer arm 1 or the pressure contact is performed before the operation of the transfer arm 1. The pressure contact member 5 can be opened and closed at an arbitrary (desired) timing, such as opening and closing the member 5.

Next, an embodiment of the invention described in claim 3 will be described with reference to FIG. FIG. 3A is a plan view showing a schematic configuration of a substrate transfer device according to an embodiment of the present invention as set forth in claim 3, and FIG. 3B shows that the transfer arm is located slightly before the delivery position. Partially omitted plan view showing
FIG. 3C is a partially omitted plan view showing a state in which the transfer arm is located at the delivery position. In addition, in the parts denoted by the same reference numerals as those in FIG. 1 and FIG.
It has the same configuration as in FIGS. 1 and 2.

According to the invention of claim 3, in the substrate transfer device 3 of claim 1, the transfer arm 1 is
For delivery of the substrate W, a delivery position (the position of the transport arm 1 in a state where the transport arm 1 is sent out from the arm support base 7) and a predetermined transport position for transporting the substrate W (the transport arm 1 is an arm support base). 7 and the position of the transfer arm 1 in the state of being retracted above 7).
Is provided with a moving-out / retracting drive mechanism 2d (moving-out / retracting drive means) for moving the transfer arm 1 between the transfer position and the transfer position, and the opening / closing drive mechanism 6 is driven by the moving-out / moving drive 2d. It is characterized by being configured by a mechanical mechanism that engages with a member fixedly installed near the delivery position to open and close the press contact member 5 in the process of the transfer arm 1 moving in and out.

Specifically, it is realized by FIG. That is, the swinging member 20 is swingably mounted on the swinging fulcrum shaft 21 near the base end of the transfer arm 1. The ends of the wires 12 on the base end side of the transfer arm 1 are connected to the swing member 20. An engaging pin 22 that engages with the swinging member 20 is provided upright on the arm support base 7 immediately before the transfer arm 1 is sent out from the arm support base 7 and positioned at the delivery position. Other configurations are similar to those of the substrate transfer device shown in FIG. In addition,
In the case of FIG. 3, the opening / closing drive mechanism 6 is configured by a mechanical mechanism including members indicated by reference numerals 10 to 13 and 20 to 22.

In the substrate transfer device 3 of FIG. 3, when the transfer arm 1 is sent out from the arm support base 7 for the transfer of the substrate W, the swinging member 20 is provided immediately before the transfer arm 1 is positioned at the transfer position. Is engaged with the engaging pin 22 and is swung toward the base end side of the transfer arm 1, whereby each wire 1
2 is pulled toward the base end side of the transfer arm 1, and each pressure contact member 5 is opened to the inoperative state. On the other hand, for example, when the transfer arm 1 located at the transfer position is retracted to move the substrate W received at the transfer position to the transfer position,
When the swinging member 20 is disengaged by the engagement pin 22 and each wire 12 is loosened when it is slightly retracted from the delivery position, the outer circumference of the substrate W received by each pressure contact member 5 by the restoring force of the torsion coil spring 11. Press the edges together.

In the substrate transfer device 3 shown in FIG. 3, the pressure contact member 5 is opened and closed depending on the withdrawal operation of the transfer arm 1. However, like the substrate transfer device of FIG. A drive source (such as the air cylinder 14) does not need to be additionally provided, and the structure of the device is simplified accordingly.

As shown in FIG. 4A, the wires 12 are bundled together at the base end side and connected to the rocking member 20, so that the rocking member 20 is engaged with the engaging pin 22. The lengths of the respective wires 12 pulled when they are combined and swung can be the same.

As shown in FIG. 4B, a stopper 23 for restricting the swinging member 20 from being swung more than necessary by the torsion coil spring 11 toward the tip of the transport arm 1 is provided. It may be provided in 1 (bridge portion 1e).

By the way, the substrate transfer device 3 shown in FIGS. 2 and 3 includes the pressure contact member 5 and the opening / closing drive mechanism 6 for driving the pressure contact member 5 to open and close. However, the conventional substrate transfer device is so large. It has a relatively compact structure without any change. If the substrate transfer device 3, in particular, the transfer arm 1 is increased in size, it delays the operation of the transfer arm 1 and hinders the transfer speed from increasing, and the loading / unloading ports of various substrate processing units in the embodiments described later. However, the substrate transfer device 3 shown in FIGS. 2 and 3 can avoid such an inconvenience.

Further, for example, in order to receive the substrate W already located at the delivery position and deliver another substrate W to the delivery position, and to perform the replacement work of the substrates W efficiently and in a short time, FIG. In some cases, a so-called double-arm type substrate transfer device 3 having two transfer arms 1 that can independently move in and out as shown in FIG. In the case of the substrate transfer device 3 having such a configuration, since the two transfer arms 1 are vertically stacked, it is not allowed to increase the size of the lower transfer arm 1. However, according to the configurations shown in FIG. 2 and FIG. 3, the pressure contact member 5 and the opening / closing drive mechanism that drives the pressure contact member 5 to open and close to both the transfer arms 1 of the double-arm type substrate transfer device 3 as described above. 6 can be provided without difficulty.

If the mounting support member 4 and the pressure contact member 5 are integrally formed, the structure can be further simplified.

Further, as shown in FIGS. 6 (a) and 6 (b),
If the eaves member 5c is provided on the pressure contact portion 5b of the pressure contact member 5,
Even if the substrate W tries to jump out of the transfer arm 1 against the pressing force of the pressing member 5, the eaves member 5c can prevent the substrate W from jumping out of the transfer arm 1.

Further, as shown in FIG. 6C, the substrate W
The side surface of the pressure contact member 5 (pressure contact portion 5b) that comes into contact with the outer peripheral edge of the substrate W is protruded from the transfer arm 1 against the pressure contact force of the pressure contact member 5 by providing an inclined V-shape. Can be prevented more preferably.

Further, as described above, the size (diameter) of the substrate W has a permissible error in the standard, and the horizontal regulating member of the conventional apparatus is a substrate having a large size within the error permissible range. Since the mounting position (fixing position) of the horizontal regulation member is determined in accordance with the above, as shown in FIG. 7A, a substrate W having a small size within the error permissible range including a standard size substrate is transported. When supported by the arm 1, a gap S is formed between the outer peripheral edge of the substrate W and the horizontal regulating member 100, and the substrate W moves in the horizontal direction within the gap S. Is acceptable. However, since the gap S is a comma number mm within the error allowable range of the substrate W, the horizontal movement itself of the substrate W within the range of the gap S has not been a serious problem in the past.

By the way, in the case of the present invention, for example, as shown in FIG.
As shown in (b), the position of the pressure contact member 5 in the non-contact state is the position of the conventional horizontal regulating member 100 (shown by a chain line).
If it is set to the outer side, there is no problem as long as the closing operation of the pressing member 5 to the operating state is completed before the transfer arm 1 is moved and the pressing member 5 presses the outer peripheral edge of the substrate W. However, for example, when the closing operation of the pressure contact member 5 to the operating state is started at the same time as the movement of the transfer arm 1, the pressure contact member 5 moves from the start of the movement of the transfer arm 1 to the outer peripheral edge of the substrate W. Although it takes a little time until the pressure contact is made, there is a concern that the horizontal movement of the substrate W is allowed in a larger range than in the conventional apparatus.

Therefore, as shown in FIG. 7C, the position of the pressure contact member 5 in the non-contact state is set to the conventional horizontal regulating member 100.
It is preferable to set the same position as the position (shown by the one-dot chain line). This position adjustment can be performed by adjusting the length by which each wire 12 is pulled when the pressing member 5 is opened. Therefore, in the case of the device of FIG.
4 may be adjusted by the expansion and contraction stroke of the rod 14a. In the apparatus of FIG. 3, for example, the distance d (see FIG. 3B) between the interference pin 22 and the swing fulcrum shaft 21 is adjusted. The swing angle of the swing member 20 may be adjusted by, for example, At this time, in order to reliably regulate the horizontal movement of the substrate W by the non-acting pressure contact member 5, FIGS. 7C and 7D are used.
As shown in FIG. 5, a horizontal regulating portion 5d may be formed on the pressure contact member 5.

Further, a horizontal regulating member 10 similar to the conventional device.
If 0 is provided as shown by the chain double-dashed line in FIG.
As shown in (b), the position of the pressure contact member 5 in the non-contact state may be set outside the position of the conventional horizontal regulating member 100 (shown by a chain line).

Next, the present invention relates to a substrate processing apparatus for subjecting a substrate (semiconductor wafer) to various substrate processes (resist coating, development, various baking processes, etc.) before and after the exposure process in the photolithography process. An example in which a substrate transfer device is attached will be described.

[0065]

FIG. 8 is a partially omitted perspective view showing the external appearance of a substrate processing apparatus equipped with a substrate transfer apparatus according to the present invention, and FIG. 9 is its substrate processing apparatus and interface unit (I / F unit). FIG. 10 is a vertical cross-sectional view showing the schematic configuration of the exposure unit (a part) and FIG.

The substrate processing apparatus 40 includes an indexer 50 for loading / unloading the substrate W into / from the apparatus 40, and a spin coater SC for resist coating (one unit is installed in the figure, but a plurality of units may be installed. ), A spin developer SD for development (two units are installed in the figure, but one or more units may be installed), a heat treatment unit 60 for bake processing, the substrate transfer device 3 according to the present invention, and the like. Is configured as a unit.

The indexer 50 accommodates a plurality of substrates W between a pre-process apparatus that performs a substrate process in the pre-process of the photolithography process and a next-process device that performs a substrate process in the next process of the photolithography process. A carrier mounting table 51 on which a plurality of carriers C (four in the drawing) for transporting are mounted, a carrier C mounted on the carrier mounting table 51, and the substrate W between the substrate transporting device 3 are arranged. A substrate loading / unloading robot 52 and the like for performing delivery are provided.
It should be noted that the carrier C is conveyed between the pre-process apparatus and the carrier placement table 51, and the carrier placement table 51
The carrier C is conveyed between the apparatus and the next process apparatus by an automatic carrier conveying apparatus (AGV) (not shown).

When the substrate transfer device 3 is attached to this device 40, the transfer arm 1 is configured to be able to move in and out of the arm support base 7, and will be described later at the delivery position sent from the arm support base 7. As described above, the transfer of the substrate W to the spin coater SC, the spin developer SD, the substrate heating processing unit 61, the substrate cooling processing unit 62, etc.
Carrying out) is performed, and the transfer arm 1 is moved to the arm support base 7
At the transfer position retracted above the transfer arm 1,
Horizontal movement (movement along the substrate transport path TR provided along the X-axis direction in the figure), elevation (movement in the Z-axis direction in the figure), vertical axis (parallel to the Z-axis in the figure) together with the arm support base 7. The substrate W is transported between the spin coater SC, the spin developer SD, the substrate heating processing unit 61, the substrate cooling processing unit 62, and so on. The transfer of the substrate W to / from the substrate loading / unloading robot 52 of the indexer 50 is also performed at the delivery position where the transport arm 1 is delivered from the arm support 7.

Substrate transfer device 3 attached to this device 40
May have any of the configurations shown in FIGS. 2 and 3 and modifications thereof, or other configurations that realize the configuration of FIG. Further, in the figure, a so-called single-arm type substrate transfer device 3 in which one transfer arm 1 is provided is shown, but the double-arm type substrate transfer device 3 (mounting support member 4 described with reference to FIG. 5 is shown. Or a pressure contact member 5, an opening / closing drive mechanism 6 and the like), and the double-arm type substrate transfer device 3 is preferable in order to improve the throughput of the substrate processing apparatus 40.

The spin coater SC holds the substrate W in a horizontal posture and is rotated by a motor 71 around a vertical axis, ie, a spin chuck 72, a resist solution supply mechanism 73, and a resist solution scattered around during the resist coating process. An anti-scattering cup 74 for preventing the above is provided. The spin chuck 72 and the anti-scattering cup 74 are configured to be capable of moving up and down relatively, and with respect to the spin chuck 72 when the substrate W is carried in and out of the spin coater SC by the carrier arm 1 of the substrate carrier 3. The anti-scattering cup 74 is relatively lowered downward so that the interference of the anti-scattering cup 74 is eliminated and the transfer of the substrate W between the transfer arm 1 of the substrate transfer device 3 and the spin chuck 72 is allowed. There is.
Further, the sides and the upper side of the spin coater SC are covered with a cover or the like, and the airflow adjusted to the temperature and the humidity suitable for the resist coating process is made to flow downward from above the spin coater SC. Has become. The cover on the substrate transfer device 3 side is provided with a loading / unloading port 75 through which the transfer arm 1 passes for loading / unloading the substrate W to / from the spin coater SC by the substrate transfer device 3. A shutter 76 that can be opened and closed is provided at the loading / unloading port 75, and the spin coater S for the substrate W by the substrate transfer device 3 is provided.
The loading / unloading port 75 is configured to be opened only when loading / unloading to / from C.

The substrate W is transferred from the substrate transfer device 3 to the spin coater SC, for example, as follows. First, the shutter 76 is opened, and the spin chuck 7
The shatterproof cup 74 is lowered relative to 2.
Next, the transfer arm 1 supporting the substrate W is sent out from the arm support base 7, passes through the loading / unloading port 75, and enters slightly above the spin chuck 1. Then, in a state where the pressure contact member 5 is opened in a non-acting state, the transfer arm 1 (arm support base 7) is lowered by a predetermined amount to place the substrate W on the spin chuck 1, and the transfer arm 1 is retracted. Are returned to the transport position. The shutter 76 is closed after the transfer arm 1 is retracted, and the anti-scattering cup 74 is attached to the spin chuck 72.
Is relatively raised, and the substrate W placed and supported by the spin chuck 72 is vacuum-adsorbed by the spin chuck 72.

Spin coater SC by substrate transfer device 3
The reception of the substrate W from the wafer is performed, for example, by an operation substantially opposite to the above-mentioned delivery. That is, first, the shutter 76
Is opened, the anti-scattering cup 74 is lowered relative to the spin chuck 72, and the empty transfer arm 1 moves slightly below the substrate W supported by the spin chuck 1. Then, the spin chuck 72 releases the adsorption of the substrate W, the transfer arm 1 (arm support base 7) is lifted by a predetermined amount in a state where the pressure contact member 5 is opened in a non-acting state, and the substrate W is placed on the transfer arm 1. It is placed on the placement support member 4 and received. After that, the press contact member 5 is closed in the operating state, the outer peripheral edge of the substrate W is pressed against the press contact member 5, and the transfer arm 1 is retracted to the transfer position. After the transfer arm 1 is retracted, the shutter 76 is closed and the anti-scattering cup 74 is raised relative to the spin chuck 72.

The spin developer SD is provided with a spin chuck 81, a developing solution supply mechanism 82, a scattering prevention cup 83 for preventing the scattering of the developing solution and the like, and its side and upper portions are covered with a cover to carry out a development process. Suitable for temperature,
The humidity air flow is configured to flow down. In addition, for loading / unloading the substrate W to / from the spin developer SD by the transport arm 1 of the substrate transport apparatus 3,
The spin chuck 81 and the scattering prevention cup 83 are configured to be able to move up and down relatively. Further, the cover on the substrate transfer device 3 side of the spin developer SD also has a loading / unloading port 8 for loading / unloading the substrate W to / from the spin developer SD.
4 is provided, and a shutter (not shown) that can be opened and closed is also provided at the carry-in / out port 84.

The transfer of the substrate W between the spin developer SD and the substrate transfer device 3 is performed by substantially the same operation as the transfer of the substrate W between the spin coater SC and the substrate transfer device 3 described above.

The spin coater SC and the spin developer SD are arranged side by side in the X-axis direction in the figure.

The heat treatment section 60 cools the substrate heating processing section 61 equipped with a hot plate HP for heating the substrate W to a predetermined temperature and the substrate W heated by the substrate heating processing section 61 to a predetermined temperature near room temperature. A plurality of substrate cooling processing units 62 each having a cool plate CP for cooling are stacked in the Z-axis direction in the drawing and arranged in parallel in the X-axis direction in the drawing. A loading / unloading port 6 for loading / unloading the substrate W into / from each of the substrate heating processing section 61 and the substrate cooling processing section 62.
Shutters 3 and 64, each of which can be opened and closed freely
5 and 66 are also provided, and the loading / unloading ports 63 and 64 are configured to be opened only when the substrate W is carried in / out of the substrate heating processing unit 61 and the substrate cooling processing unit 62 by the substrate transfer apparatus 3. Further, each of the substrate heating processing unit 61 and the substrate cooling processing unit 62 is provided with a plurality of elevating pins 67 that can move up and down through the hot plate HP and the cool plate CP.

Since the transfer of the substrate W between the substrate heating processing section 61 and the substrate transfer apparatus 3 is substantially the same as the transfer of the substrate W between the substrate cooling processing section 62 and the substrate transfer apparatus 3,
The transfer of the substrate W between the substrate heating processing unit 61 and the substrate transfer device 3 will be described as an example.

The transfer of the substrate W from the substrate transfer device 3 to the substrate heating processing section 61 is performed as follows, for example. First, the shutter 65 is opened, and the transfer arm 1 supporting the substrate W is sent out from the arm support 7 and passes through the carry-in / out port 63 to enter above the hot plate HP. Then, in the state where the pressure contact member 5 is opened in the non-acting state, the elevating pins 67 rise to lift the substrate W of the transfer arm 1 above the transfer arm 1 to receive the substrate W, and then the transfer arm 1 retracts. Then, the lifting pins 67 are lowered to move the substrate W to the hot plate HP.
Support it on. The shutter 65 is closed after the transfer arm 1 is retracted. The elevating pins 67 are lowered after the carrier arm 1 is retracted to a position where the substrate W supported by the elevating pins 67 does not interfere with the carrier arm 1.

The substrate heating processing section 61 by the substrate transfer device 3
The reception of the substrate W from the wafer is performed, for example, by an operation substantially opposite to the above-mentioned delivery. That is, first, the shutter 65
Is opened, the lifting pins 67 are raised, and the hot plate HP
The upper substrate W is lifted above the hot plate HP.
Next, the transfer arm 1 enters above the hop plate HP and slightly below the substrate W lifted by the lift pins 67. Then, the lifting pins 67 are lowered with the pressure contact member 5 opened in the non-acting state, and the substrate W is placed on the placing support member 4 and the substrate W is received by the transfer arm 1 in the middle of the lowering. . When the elevating pin 67 is lowered until the elevating pin 67 and the transfer arm 1 are no longer interfered with each other, the pressing member 5 is pressed.
Is closed in a working state, the outer peripheral edge of the substrate W is brought into pressure contact with the pressure contact member 5, and the transfer arm 1 is retracted to the transfer position. The shutter 65 is closed after the transfer arm 1 is retracted.

The spin coater SC and the spin developer SD and the heat treatment section 60 are opposed to each other with the substrate transfer path TR of the substrate transfer device 3 interposed therebetween.

An exposure unit RU is attached to the substrate processing apparatus 40 via an IF unit IFU.

The exposure unit RU is a unit for performing exposure processing in the photolithography process, and is used for exposure equipment such as a reduction projection exposure equipment (stepper) or for aligning the substrate W during exposure by the exposure equipment. Alignment mechanism,
A substrate transfer device for transferring the substrate W in the exposure unit RU (neither is shown) is unitized and configured.

The IF unit IFU is the substrate processing apparatus 40.
And the exposure unit RU for transferring the substrate W between the exposure unit RU and the pre-exposure substrate W received from the substrate transfer device 3 in the substrate processing apparatus 40 and transferred in the IF unit IFU. Substrate transfer robot which transfers the exposed substrate W received from the substrate transfer device in the exposure unit RU in the IF unit IFU to the substrate transfer device 3 in the substrate processing apparatus 40 (see FIG. (Not shown) etc.

In the substrate processing apparatus 40, when the substrate transfer apparatus 3 receives the substrate W from the substrate loading / unloading robot 52 of the indexer 50, the substrate W is subjected to various kinds of substrate processing before the exposure processing (for example, bake before resist coating, In order to perform substrate cooling before resist coating, resist coating, pre-baking, substrate cooling after pre-baking, etc., the substrate W is sequentially processed in the substrate heating processing unit 61, the substrate cooling processing unit 62, and the spin coater SC. When the substrate is transported and the substrate processing before exposure is completed, the substrate W is delivered to the exposure unit RU via the IF unit IFU. After the exposure process is completed, I
The exposed substrate W from the F unit IFU is the substrate transfer device 3
When the substrate W is exposed to light, the substrate W is subjected to various kinds of substrate processing after the exposure processing (for example, post-exposure baking, substrate cooling before development,
In order to perform post-baking, substrate cooling after post-baking, etc.), the substrate heating processing unit 6 is performed in accordance with the processing sequence.
1. The substrate W is sequentially transported to the substrate cooling processing unit 62 and the spin developer SD, and when the final substrate processing is completed, the substrate W is delivered to the substrate loading robot 52 of the indexer 50. Substrate transfer device 3 in this substrate processing apparatus 40
Substrate loading / unloading robot 52, spin coater S
Substrate W between C, spin developer SD, substrate heating processing unit 61, substrate cooling processing unit 62, and IF unit IFU.
In the transfer of, the horizontal movement along the substrate transfer path TR, ascending / descending, and turning are performed at high speed, and two operations are combined as much as possible, for example, turning while descending. During the transfer of the substrate, the pressure contact member 5
Presses the outer peripheral edge of the substrate W, so that the disadvantage that the substrate W jumps out of the transfer arm 1 is prevented.

The transfer arm 1 moves back and forth when the substrate W
Since the transfer arm 1 is moved back and forth, it is not combined with other operations. After the transfer arm 1 is retracted onto the arm support base 7 and positioned at the transfer position, horizontal movement along the substrate transfer path TR and , Ascending / descending / turning speed is as fast as possible, 2
The two operations are combined to carry the substrate W.

In the above embodiment, the case where the substrate transfer device 3 according to the present invention is attached to the substrate processing apparatus for performing the substrate processing before and after the exposure processing in the photolithography process on the substrate (semiconductor wafer). As described above, by attaching the substrate transfer device 3 according to the present invention to other devices (for example, the IF unit IFU and the exposure unit RU), while preventing the substrate W from jumping out from the transfer arm 1, It is possible to speed up the transfer of the substrate W in the apparatus (unit).

[0087]

As is apparent from the above description, according to the first aspect of the present invention, the outer peripheral edge of the substrate is pressure-contacted by the pressure-contacting means during the transportation of the substrate. It is possible to increase the force for supporting the substrate on the transfer arm during the transfer, and it is possible to prevent the disadvantage that the substrate jumps out from the transfer arm during the transfer of the substrate. Therefore, it is possible to realize high-speed substrate transfer and to realize a substrate transfer device that is not affected by vibration.

Further, since the pressure contact means is configured to open and close between the working state and the non-working state, it can be brought into the working state during the transportation of the substrate and the non-working state during the delivery of the substrate. While the substrate is being transferred, a pressing member is pressed against the outer peripheral edge of the substrate to prevent the substrate from jumping out from the transfer arm, while at the time of substrate transfer, the substrate is transferred from the transfer arm to the substrate for transfer. The pressing means does not interfere with the operation of taking out the substrate or the transfer arm receiving the substrate.

According to the second aspect of the present invention, since the drive source of the opening / closing drive means for driving the opening / closing of the press contact means is provided separately from the drive source of the transfer drive means of the transfer arm, it is independent of the drive of the transfer arm. Thus, the pressure contact means can be opened and closed, and the substrate transfer apparatus can be realized in which the pressure contact means can be opened and closed at an arbitrary (desired) timing without being restricted by the timing of driving the transfer arm.

According to the third aspect of the present invention, the opening / closing driving means is provided by a mechanical mechanism utilizing the moving movement of the transfer arm by the moving-out driving means without providing a special driving source in the opening / closing driving means. Since it is configured, it is possible to realize a substrate transfer device having a simpler configuration than the invention according to the second aspect.

[Brief description of the drawings]

FIG. 1 is a plan view showing a schematic configuration of a substrate transfer apparatus according to an embodiment of the invention described in claim 1 and a longitudinal sectional view showing a configuration of a main part thereof.

FIG. 2 is a plan view showing a schematic configuration of a substrate transfer device according to an embodiment of the present invention, an enlarged plan view showing an enlarged main part thereof, a longitudinal sectional view thereof, and a transfer arm at a base end side. It is a partially omitted rear view seen from above.

FIG. 3 is a plan view showing a schematic configuration of a substrate transfer apparatus according to an embodiment of the invention as set forth in claim 3, a partially omitted plan view showing a state in which a transfer arm is located slightly before a delivery position, It is a partially omitted plan view showing a state in which a transfer arm is located at a delivery position.

FIG. 4 is a plan view showing a main configuration of a modified example of the substrate transfer apparatus according to the embodiment of the present invention.

5A and 5B are a side view and a front view showing a configuration of a double-arm type substrate transfer device.

6A and 6B are a vertical cross-sectional view and a plan view showing the main configuration of a modified example of the substrate transfer apparatus according to the embodiment of the present invention.

FIG. 7 is a main part plan view for explaining a configuration for preferably performing horizontal regulation.

FIG. 8 is a partially omitted perspective view showing the external appearance of a substrate processing apparatus provided with a substrate transfer apparatus according to the present invention.

9 is a plan sectional view showing a schematic configuration of a substrate processing apparatus, an interface unit (I / F unit) and an exposure unit (a part) of FIG.

10 is a vertical cross-sectional view of the substrate processing apparatus of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Transfer arm 2 ... Transfer drive mechanism (transfer drive means) 2a ... Horizontal movement drive mechanism 2b ... Elevating drive mechanism 2c ... Swiveling drive mechanism 2d. Placement support member (placement support means) 5 ... Pressure contact member (pressure contact means) 6 ... Opening / closing drive mechanism (opening / closing drive means) 10, 21 ... Swing fulcrum shaft 11 ... Screw coil spring 12 ... Wire 13 ... Tube 14 ... Air cylinder 15 Air supply pipe 16 Air supply source 17 Open / close drive control unit 20 Swing member 22 Engagement pin 40 Substrate processing device SC Spin coater SD Spin developer 61 Substrate heat treatment unit 62 Substrate cooling treatment unit TR ... Substrate transport path W ... Substrate

Claims (3)

[Claims] 1. A semiconductor wafer (hereinafter referred to as “substrate”)
Has a C-shaped transfer arm for supporting the vicinity of the outer peripheral end and a transfer drive means for driving the transfer arm, and the transfer arm drives the transfer drive means while the substrate is supported by the transfer arm. In the substrate transfer device in which the substrate is transferred and the substrate is transferred between the transfer arm and a predetermined object to be transferred at a predetermined transfer position, the substrate is mounted from below in the vicinity of the outer peripheral end. Placement supporting means for placing and supporting, a non-operating state of non-contact with the outer peripheral edge of the substrate, and a pressure contact means configured to be openable and closable so as to have an operating state in which the outer peripheral edge of the substrate is in pressure contact, Is attached to the transfer arm, and is provided with opening / closing drive means for opening / closing driving the pressure contact means. 2. The substrate transfer apparatus according to claim 1, wherein the drive source of the opening / closing drive unit is provided separately from the drive source of the transfer drive unit. 3. The substrate transfer apparatus according to claim 1, wherein the transfer arm is moved back and forth between the transfer position and a predetermined transfer position for transferring the substrate in order to transfer the substrate. The transfer drive means includes a retreat drive means for performing reciprocating movement between the transfer position and the transfer position of the transfer arm, and the opening / closing drive means is moved by the transfer drive means. A substrate transfer apparatus comprising a mechanical mechanism that engages with a member fixedly installed in the vicinity of the transfer position to open and close the press contact means in the process of the arm moving in and out.