JPH09138717A - Heat radiating structure of compact electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively realize heat radiation from a cooled component without loosing the feature of a compact electronic equipment of excellent portability by providing a heat radiating part in thermal contact with the cooled component within an opening within a main body when a board is opened. SOLUTION: The opening/closing board 20 is provided on the rear side of the main body part 2 loading CPU 4 (cooled component) being a main heat generating body and simultaneously at the main body part 2 behind a display 3. A first heat adiating board 21 consisting of highly heat conductive metal such as aluminum material is arranged in contact with CPU 4 in the opening 5 of the main body part 2 when the board 20 is opened. The first heat radiating board 21 is connected to a second heat radiating board 23 by means of a hinge part 22. The second heat radiating board 23 consists of material similar to that of the first heat radiating board 21 and fitted to the back side of the board 20. Thereby the first and second heat radiating boards 21 and 23 are exposed to atmosphere.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure suitable for use in small electronic devices such as notebook personal computers.

[0002]

2. Description of the Related Art In recent years, miniaturization of computers has progressed, and in particular, compact and lightweight notebook personal computers have been rapidly spread. Further, in order to realize a high-performance computing function, a CPU (central processing unit) mounted on a notebook personal computer is also being improved in performance. The heat dissipation technology of the CPU has been attracting attention as an important issue because it tends to increase.

As a conventional CPU heat dissipation technique, an air-cooled fan is known in a computer of a normal size. However, it requires a relatively large space and is applied to a small notebook personal computer. It was difficult to do. Further, the heat radiation technology using the air-cooled fan is not preferable to be applied to a notebook personal computer which is often used in a quiet office or the like because noise from the fan is large.

Therefore, a relatively compact heat radiation system using a heat pipe has been noticed and put into practical use. The heat pipe encloses the working fluid in the pipe and uses the phase transformation and movement of the working fluid to cause heat transfer. In recent years, the diameter has been reduced, and those with a diameter of 3 mm or less have also been put into practical use. Has been done. Since this type of heat pipe can be bent to some extent, the CP stored in a limited mounting space can be obtained by appropriately determining the shape.
It can be a path for dissipating the heat of U.

[0005]

By the way, in order to dissipate heat from a cooled component such as a CPU mounted in a computer using a heat pipe to the outside, the cooled component and the heat pipe are thermally coupled. The heat pipe is connected to the heat sink and the heat pipe is thermally connected to the heat sink. At this time, the component to be cooled and the heat pipe may be brought into direct contact with each other, but the component to be cooled and the heat pipe are also thermally connected via a heat absorbing plate having excellent heat conductivity.

As described above, it is desirable that the heat radiation plate thermally connected to the heat pipe has a relatively large area in order to enhance the heat radiation efficiency. Therefore, a heat dissipation structure has been proposed in which a heat dissipation plate having excellent thermal conductivity is provided on the lower surface of the housing of the computer, or a part of the housing is provided with the function of the heat dissipation plate.

However, in a small electronic device such as a notebook type personal computer, it is difficult to provide a heat dissipation plate having a large area because of restrictions on the size and material of the housing. The present invention has been made in view of such problems of the conventional art, and an object of the present invention is to provide a heat dissipation structure for a small electronic device, which is preferable when applied to the small electronic device.

[0008]

In order to achieve the above object, a heat dissipation structure for a small electronic device according to a first aspect of the present invention is provided with a main body having a component to be cooled and an opening / closing on the upper surface of the main body. In a small electronic device including a panel portion that is capable of being installed, an openable and closable board is provided on an upper surface of the main body, and the cooled component is provided in an opening of the main body when the board is opened. Is characterized in that a heat dissipation portion thermally connected to is provided.

[0009] It is preferable that the board is openably and closably mounted on the upper surface of the main body located on the back side of the panel when the panel is opened with respect to the main body. A heat radiating portion that is thermally connected to the component to be cooled may also be mounted on the panel. Further, in the opening of the main body portion, a heat dissipation portion may be provided on the board itself in addition to the main body side.

A heat dissipation structure for a small electronic device according to a second aspect of the present invention is a small electronic device including a main body having a component to be cooled, and a panel provided on the upper surface of the main body so as to be openable and closable. In the device, a board that can be opened and closed is provided on the back side of the panel section opposite to the screen, and heat dissipation that is thermally connected to the cooled component is provided in the opening on the back side of the panel section when the board is opened. It is characterized in that a section is provided.

In the heat dissipation structure for a small electronic device according to the present invention, it is preferable that a heat pipe is interposed as at least a part of the thermal connection between the cooled component and the heat dissipation part. It is preferable that one end of the heat pipe is arranged at a hinge portion of the board. Further, the heat pipe may be arranged at the hinge portion of the panel portion.

The opening and closing of the board may be manual or automatic. In the case of automatic operation, the force of opening and closing the panel portion may be used to open and close in conjunction with the opening and closing of the panel portion. Also,
The temperature of the component to be cooled may be detected and the board may be automatically opened when the temperature is equal to or higher than a predetermined temperature. It should be noted that when the panel portion is not opened, it is not necessary to radiate heat from the component to be cooled in normal use, so the board may be kept closed. However, the opening and closing of the board does not necessarily have to be linked to the panel section. This is because there may be a state in which the panel unit is used with the panel closed.

In the heat dissipation structure for a small electronic device of the present invention, a board provided on the upper surface of the main body portion or the back surface of the panel portion so as to be openable and closable, and provided in the opening of the main body portion or the panel portion when the board is opened. It has a heat dissipation part. Therefore, by opening the board, the heat from the cooled component is dissipated into the atmosphere through the heat radiating portion. Such a board can be formed by utilizing a part of the main body portion or the panel portion and can be closed when it is not needed. Therefore, even a small electronic device has few space restrictions. Further, since the heat dissipation portion is exposed to the atmosphere by opening the board, it is not necessary to provide the heat dissipation portion on the outer surface of the main body or the panel from the beginning.

In particular, small electronic devices such as notebook type personal computers are often put in a shelf or a bag when not in use. In the present invention, the board can be freely opened and closed, and when not in use, the board is closed. Since it can be put into a state, its usability is also good. No heat dissipation is required when not in use. In a notebook personal computer, the panel section is opened in a normal use state. In that case, a dead space occurs on the back surface side of the panel portion. In the present invention, the board is opened in this originally dead space to radiate heat, so that the dead space can be effectively used.

As described above, the board according to the present invention can be provided on either the main body portion or the panel portion, but its position is determined by utilizing the dead space of a small electronic device. Further, in this case, it is more preferable that the board itself is also provided with a heat dissipation portion. This is because it is possible to dissipate heat not only from the heat radiating section provided in the opening of the main body section or the panel section when the board is opened but also from the heat radiating section provided on the board side.

In the present invention, the heat from the component to be cooled can be dissipated by directly contacting the component to be cooled and the heat radiating portion, but a heat pipe is further interposed between the component to be cooled and the heat radiating portion. It is also possible to transfer the heat from the cooled component to the heat radiating portion via the heat pipe. When such a heat pipe is used, one end of the heat pipe can be arranged at the hinge portion of the board. By doing so, the thermal connection between the heat dissipation part provided in the opening of the main body part or the panel part and the heat dissipation part provided on the board side is excellent.

In the present invention, a heat radiation fin may be added to the heat radiation portion, whereby the heat radiation performance can be further improved. In the present invention, the heat radiating portion on the upper surface of the main body also has a role of a wall that isolates the inside of the main body, in which the CPU as an example of the cooled component is housed, from the external environment, and prevents dust from entering the equipment. You can In addition, small electronic devices such as notebook personal computers are expected to receive external force during use. According to the present invention, the board and / or the heat radiating portion provided in the main body portion is the CPU
An object to be cooled such as can be effectively protected from an external force such as a drop.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a perspective view showing a laptop personal computer according to an embodiment of the present invention.
FIG. 1B is a perspective view showing a heat dissipation plate according to the embodiment,
1C is a cross-sectional view and FIG. 1D is a plan view.

The heat dissipation structure for a small electronic device according to this embodiment can be applied to a notebook personal computer 10 as shown in FIG. 1, for example. The notebook personal computer 10 includes a main body 2 having a keyboard 1 and a display (panel portion) 3 which is openable and closable with respect to the main body 2. When the display 3 is closed, it constitutes the lid of the main body 2, while when it is opened, the liquid crystal panel provided on the inner surface appears.
Various information is displayed here.

In the notebook personal computer 10 shown in FIG. 1, the CPU 4 (cooled component) which is the main heating element.
Is provided on the rear side of the main body 2. In the present embodiment, an openable / closable board 20 is provided on the main body 2 behind the main body 2 on which the CPU 4 is mounted and behind the display 3. As shown in FIG.
Inside the opening 5 of the main body 2 when the board 20 is opened, a metal having excellent thermal conductivity, for example, an aluminum material A1000 is used.
A first heat radiating plate 21 made of a series or A5000 series is arranged so as to contact the CPU 4. The first heat dissipation plate 21 is connected to the second heat dissipation plate 23 by the hinge portion 22.
It is connected to the. The second heat dissipation plate 23 is made of the same material as the first metal plate, and is attached to the back surface of the board 20 in the present embodiment. Thereby, when the board 20 is opened, the first heat dissipation plate 21 and the second heat dissipation plate 23
And will be exposed to the atmosphere. The board 20
It may itself be made of a metal plate having excellent heat dissipation.

In the present invention, the position of the hinge portion 22 of the board 20 is on the panel side (rear side) as shown in FIG. 2 even if it is on the side opposite to the panel (rear side) as shown in FIG. 1 (A). It may be either on the front side). Further, when the CPU 4 is not mounted immediately below the board 20, heat can be transferred to the heat radiating plates 21 and 23 through the heat absorbing plate 24 and the heat pipe 25 as shown in FIG. Further, regarding the notebook personal computer 10 having no space for installing the board 20 behind the main body 2 and the display 3, the board 20 is provided behind the keyboard 1 of the main body 2 and in front of the display 3. (Not shown).

Although it is preferable that the board 20 is opened and closed manually by the user in terms of mechanism and cost, for example, even if the board 20 is automatically opened and closed in conjunction with the opening and closing operation of the display 3. good. This is because the personal computer 10 is considered to generate the most heat from the cooled component 4 while the display 3 is open.

The heat from the CPU 4 is applied to the first heat radiating plate 2
It is more desirable to provide a heat pipe 25 as shown by a dotted line in FIG. 1D so that the heat pipe 25 can be efficiently transmitted to the whole 1. In addition, the first heat dissipation plate 21 to the second heat dissipation plate 23
It is more desirable to insert the heat pipe 25 into the hinge portion 22 in order to further enhance the heat conduction to the. Furthermore, when the thermal connection characteristics between the hinge portion 22 and the heat pipe 25 are not satisfied, it is preferable to apply grease or the like between the hinge portion 22 and the heat pipe 25.

Further, the thermal contact structure between the cooled component 4 and the first heat radiating plate 21 is not limited to the direct contact as shown in FIGS. 1 (C) and 4 (A), but also in FIG. 4 (B). As shown in, a heat transfer body 30 having an excellent heat transfer property may be interposed between the cooled component 4 and the first heat dissipation plate 21. FIG.
As shown in (C), a heat pipe or other heat transfer body 31 is provided between the component to be cooled 4 and the substrate 32, and the heat generation of the object to be cooled is released to the heat dissipation plate via the heat transfer body 31. You may radiate heat there. Further, as shown in FIG. 4 (D), the through holes 34 of the printed circuit board 32 are used to allow the heat generated by the cooled component 4 to escape to the back surface of the printed circuit board 32, from which the heat transfer member 35 such as a heat pipe is removed. The heat may be released to the heat sink via the heat sink. Alternatively, these thermal contact structures may be used in combination. When the heat pipe is a flat flat tube, it is particularly effective to directly contact the object to be cooled such as CPU.

In the notebook type personal computer 10 according to the present embodiment configured as described above, the first heat radiating plate which opens the board 20 and contacts the CPU 4 during long-time use or heavy arithmetic processing. Dissipate heat from 21. In this case, heat is also radiated from the second heat radiating plate 23 that is thermally connected to the first heat radiating plate 21, and a greater cooling effect can be obtained.

The heat dissipation structure for a small electronic device according to the present invention is not limited to the above-mentioned embodiment but can be modified in various ways. 5 (A) and 5 (B) are perspective views showing a laptop personal computer according to another embodiment of the present invention. In the embodiment shown in FIGS. 5A and 5B, the board 20 is provided on the back surface of the display 3 so as to be openable and closable, and the first heat dissipation plate is provided in the opening 5 on the display 3 side when the board 20 is opened. 21 is provided. In the present embodiment, the CPU 4 mounted on the main body 2
The heat from is transmitted to the first heat dissipation plate 21 provided on the back surface of the display 3 via the heat pipe 25, and is dissipated there. Even in this case, the board 20
It is desirable to provide the second heat dissipation plate 23 on the side. By providing the second heat dissipation plate 23 on the board 20 side, especially when the board 20 is opened, not only from the first heat dissipation plate 21 in the opening 5 on the display 3 side but also the second heat dissipation plate provided on the board 20. The heat radiation plate 23 can also radiate heat, and a greater cooling effect can be obtained.

In the heat dissipation structure for a small electronic device according to the present invention, it is possible to provide boards on both the main body and the display. This is because it is desirable to dissipate heat from both the main body and the display when a plurality of parts to be cooled are mounted, or when even one single part to be cooled generates a large amount of heat.

For example, FIG. 6 shows an embodiment in which a heat dissipation plate is provided on both the main body and the display. FIG. 6 (A),
As shown in (B), the object to be cooled 4 such as the CPU is directly connected to the first heat radiating plate 21 provided in the main body 2.
The first heat radiating plate 21 is thermally connected to the second heat radiating plate 23 provided on the inner surface of the board 20 via a heat pipe 42 attached to the hinge portion 22 a of the board 20. The first heat dissipation plate 21 is further connected via a heat pipe 40,
It is also thermally connected to a third heat dissipation plate 41 provided inside the back surface of the display 3. A part of the heat pipe 40 is a part of the opening / closing hinge part 22b of the display 3.

In this embodiment, the three heat dissipation plates 21,
Since the heat is radiated by 23 and 41, the heat radiation efficiency is further improved. 7 and 8 are perspective views showing a heat dissipation plate according to another embodiment of the present invention.

For example, as shown in FIG. 7, if a plurality of heat radiation fins 26 are formed on the second heat radiation plate 23 provided on the board 20 so as to be openable and closable, the heat radiation when the board 20 is opened. By erecting the fins 26, the heat radiation effect can be further enhanced. In particular, it is more desirable to form the heat radiation fin 26 on the first heat radiation plate 21 provided in the opening 5 of the main body 2 or the display 3. Since the heat from the component to be cooled 4 is directly transferred to the first heat radiating plate 21, it is more efficient as compared with the case where it is provided to the second heat radiating plate 23 because the thermal resistance is smaller.

Further, as shown in FIG.
It is also possible to form a plurality of doors 3 and open the board 20 so that the plurality of heat dissipation plates 23 open at intervals.

[0032]

As described above, the board according to the present invention can be formed by utilizing a part of the main body portion or the panel portion and can be closed when it is not necessary. Even if there is little space restriction, and because the heat dissipation part is exposed to the atmosphere by opening the board,
It is not necessary to provide the heat dissipation portion on the outer surface of the main body or the panel from the beginning. Therefore, it is possible to efficiently realize the heat radiation from the cooled component without impairing the characteristics of the small electronic device having excellent portability.

Further, according to the present invention, the heat dissipating portion on the upper surface of the main body also has a role of a wall for isolating the inside of the main body, in which the CPU as an example of the parts to be cooled is accommodated, from the external environment, and is installed in the device. It is possible to prevent dust from entering. In addition, a small electronic device such as a laptop personal computer is expected to receive external force during use. However, in the present invention, the board and / or the heat radiating unit provided in the main body is a CPU or the like. The object to be cooled can be effectively protected from an external force such as a drop.

[Brief description of the drawings]

FIG. 1A is a perspective view showing a notebook personal computer according to an embodiment of the present invention, FIG. 1B is a perspective view showing a heat dissipation plate according to the embodiment, and FIG.
(D) is a plan view.

FIG. 2 is a perspective view showing a heat dissipation structure according to another embodiment of the present invention.

FIG. 3 is a perspective view showing a heat dissipation structure according to another embodiment of the present invention.

4A to 4D are diagrams showing an example of thermal contact between a cooling component and a heat transfer body or a heat radiating portion.

5A and 5B are perspective views showing a notebook personal computer according to another embodiment of the present invention.

6A and 6B are a partial cross-sectional side view and a plan view of a main part of a notebook personal computer according to another embodiment of the present invention.

FIG. 7 is a perspective view showing a heat dissipation plate according to another embodiment of the present invention.

FIG. 8 is a perspective view showing a heat dissipation plate according to another embodiment of the present invention.

[Explanation of symbols]

2 ... Main body part 3 ... Display (panel part) 4 ... CPU (components to be cooled) 5 ... Opening 10 ... Notebook type personal computer (small electronic device) 20 ... Board 21 ... First heat sink (heat sink) 22 ... Hinge Part 23 ... Second heat dissipation plate (heat dissipation part) 25 ... Heat pipe 26 ... Heat dissipation fin

Claims (6)

[Claims] 1. A small electronic device comprising a main body having a component to be cooled, and a panel portion openably and closably provided on the upper surface of the main body, wherein an openable and closable board is provided on the upper surface of the main body. A heat dissipating part provided separately from the panel and provided in the opening of the main body part when the board is opened is provided with a heat dissipation part that is thermally connected to the cooled component. Heat dissipation structure. 2. The small electronic device according to claim 1, wherein the board is openably and closably mounted on an upper surface of the main body located on the back side of the panel when the panel is opened with respect to the main body. Heat dissipation structure. 3. A small electronic device comprising a main body having a part to be cooled, and a panel which is provided on the upper surface of the main body so as to be openable and closable. A heat sink for a small electronic device is provided, in which a heat-dissipating part that is thermally connected to the cooled component is provided in an opening on the back surface of the panel part when the board is opened. Construction. 4. The heat dissipation structure for a small electronic component according to claim 1, wherein the panel is also provided with a heat dissipation portion that is thermally connected to the component to be cooled. 5. The miniature according to claim 1, wherein a heat pipe is interposed as at least a part of a thermal connection between the cooled component and the heat radiating portion. Heat dissipation structure for electronic devices. 6. The heat dissipation structure for a small electronic device according to claim 1, wherein the component to be cooled is a semiconductor chip such as a CPU or an MPU, and the small electronic device is a notebook personal computer.