JPH0911119A - Pad for polishing glass plate, and method for polishing the same - Google Patents
Pad for polishing glass plate, and method for polishing the sameInfo
- Publication number
- JPH0911119A JPH0911119A JP10161296A JP10161296A JPH0911119A JP H0911119 A JPH0911119 A JP H0911119A JP 10161296 A JP10161296 A JP 10161296A JP 10161296 A JP10161296 A JP 10161296A JP H0911119 A JPH0911119 A JP H0911119A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- glass plate
- sheet
- width
- modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶ディスプレイ
用ガラス基板、フォトマスク用ガラス基板、磁気ディス
ク用ガラス基板等の表面を研磨するためのガラス板研磨
用パッドおよびそれを用いたガラス板の研磨方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass plate polishing pad for polishing the surface of a glass substrate for a liquid crystal display, a glass substrate for a photomask, a glass substrate for a magnetic disk and the like, and a glass plate polishing using the same. Regarding the method.
【０００２】[0002]
【従来の技術】液晶ディスプレイ等に使用されるガラス
板の火造り面は完全な平滑面ではなく、多少のうねり、
マイクロコルゲーションや凹凸、傷を有している。ま
た、ブロック状のガラス塊からスライス加工により切り
出されるガラス板も多くのうねりや凹凸、傷を有してい
る。そのため、これらのガラスは研磨により平滑な鏡面
に加工される場合が多い。2. Description of the Related Art The fire-polished surface of a glass plate used for a liquid crystal display or the like is not a completely smooth surface, but a slight swell,
It has micro corrugations, unevenness, and scratches. Further, a glass plate cut out from a block-shaped glass lump by slicing also has many undulations, irregularities, and scratches. Therefore, these glasses are often processed into a smooth mirror surface by polishing.
【０００３】しかし、これらの製品に占める研磨加工コ
ストの割合は大きい。その削減のために、フロート法ガ
ラス板成形法におけるマイクロコルゲーションの低減
策、うねり変形の少ないフュージョン法の開発、高い表
面品質が得られる精密プレス成形法等が提案され、開発
されてきたが、研磨工程を省略できるまでには至ってお
らず、依然として研磨コストの比率は高い。However, the ratio of the polishing cost to these products is large. In order to reduce this, measures to reduce microcorrugation in the float glass plate forming method, development of a fusion method with less undulation deformation, precision press forming method that achieves high surface quality, etc. have been proposed and developed. The number of steps has not been eliminated, and the ratio of polishing cost is still high.
【０００４】研磨コストが大きくなる一つの原因は、ガ
ラス板表面を、除去したい凹凸の高低差の何倍も研磨除
去しなくてはならないためである。例えば、振幅が０．
５μｍで周期が１０ｍｍである緩やかなうねりを０．１
μｍにまで減らすには、酸化セリウムを含浸した硬質発
泡ポリウレタンパッドと酸化セリウムを含む研磨液を用
いて研磨を行った場合、表面層を平均５μｍも研磨して
除去しなければならなかった。One of the reasons for increasing the polishing cost is that the glass plate surface has to be polished and removed by many times the height difference of the unevenness to be removed. For example, if the amplitude is 0.
A gentle undulation with a period of 5 mm and a period of 10 mm is 0.1
In order to reduce the thickness to μm, when polishing was performed using a hard foamed polyurethane pad impregnated with cerium oxide and a polishing liquid containing cerium oxide, the surface layer had to be polished and removed by an average of 5 μm.
【０００５】また鋳鉄定盤と＃１５００番のカーボラン
ダムを含む研磨液を用いた研磨では、平均２μｍの研磨
除去を行った後、カーボランダム粉によって形成された
マイクロクラックを除去するため、さらに酸化セリウム
による研磨が必要であり、酸化セリウムによる４μｍの
研磨も含め合計６μｍの研磨除去が必要であった。Further, in polishing using a cast iron surface plate and a polishing liquid containing # 1500 carborundum, an average of 2 μm was removed, and then microcracks formed by the carborundum powder were removed. Polishing with cerium was necessary, and polishing with a total of 6 μm was necessary including polishing with 4 μm with cerium oxide.
【０００６】このように、比較的に緩やかなうねりにつ
いて、効率的に、僅かの研磨量で除去するとともに、厚
み偏差、表面粗さを十分に小さくすることは難しかっ
た。As described above, it has been difficult to efficiently remove the relatively gentle undulations with a small amount of polishing and to sufficiently reduce the thickness deviation and the surface roughness.
【０００７】[0007]
【発明が解決しようとする課題】本発明の目的は、従来
技術が有していた前述の欠点の解消にある。すなわち、
少ない研磨量で周期３〜３０ｍｍ程度の表面のうねり、
凹凸を効率的に除去し、かつ十分に小さい厚み偏差およ
び表面粗さを得るためのガラス板研磨用パッドおよびガ
ラス板の研磨方法を提供することを目的とする。The object of the present invention is to eliminate the above-mentioned drawbacks of the prior art. That is,
Surface waviness with a period of about 3 to 30 mm with a small amount of polishing,
An object of the present invention is to provide a glass plate polishing pad and a glass plate polishing method for efficiently removing irregularities and obtaining a sufficiently small thickness deviation and surface roughness.
【０００８】[0008]
【課題を解決するための手段】本発明は前述の課題を解
決すべくなされたものであり、材料試験規格に基づいて
測定されたヤング率が１ＧＰａ以上で厚さが０．５〜１
０ｍｍの高分子シートからなり、表面の主要な領域に幅
０．１〜２．０ｍｍの溝が溝幅の２〜１０倍のピッチで
形成されていることを特徴とするガラス板用研磨パッド
を提供する。The present invention has been made to solve the above-mentioned problems, and has a Young's modulus of 1 GPa or more and a thickness of 0.5 to 1 measured according to the material test standard.
A polishing pad for a glass plate, comprising a 0 mm polymer sheet, and grooves having a width of 0.1 to 2.0 mm formed in a main region of the surface at a pitch of 2 to 10 times the groove width. provide.
【０００９】また、裏面を軟質シートを介して固定保持
したガラス板の表面を上記のガラス板用研磨パッドで研
磨するガラス板の研磨方法を提供する。Further, there is provided a glass plate polishing method in which the front surface of a glass plate whose back surface is fixed and held via a soft sheet is polished by the above-mentioned glass plate polishing pad.
【００１０】以下、図面に従って本発明のガラス板研磨
用パッドについて説明する。図１において、１は高分子
シート、２は溝、３は軟質シート、４はガラス板、５は
定盤、６は両面粘着テープ、７はガラス板を保持するた
めの枠である。The glass plate polishing pad of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a polymer sheet, 2 is a groove, 3 is a soft sheet, 4 is a glass plate, 5 is a surface plate, 6 is a double-sided adhesive tape, and 7 is a frame for holding the glass plate.
【００１１】本発明の構成要素である高分子シート１
は、材料試験規格に基づいて測定された値が１ＧＰａ以
上のヤング率を有する樹脂であり、ある程度の耐熱性と
耐アルカリ性のあるものが好ましい。例えば、ポリプロ
ピレン樹脂、硬質塩化ビニル樹脂、ポリカーボネート樹
脂、メタクリル樹脂、ポリアセタール樹脂などが使用で
きる。Polymer sheet 1 which is a constituent element of the present invention
Is a resin having a Young's modulus of 1 GPa or more measured according to the material test standard, and is preferably a resin having a certain degree of heat resistance and alkali resistance. For example, polypropylene resin, hard vinyl chloride resin, polycarbonate resin, methacrylic resin, polyacetal resin, etc. can be used.
【００１２】ヤング率が１ＧＰａ未満の高分子シートで
は、周期３〜３０ｍｍ程度のうねりに対して凹凸の形状
に応じて変形しやすく、かかるうねりの凸部に集中的な
加工力が働きにくいため、うねりを効果的に取り除くこ
とができない。なお、ここでいうヤング率は、ＪＩＳや
ＡＳＴＭなどの材料試験規格に基づいた値である。実際
に研磨が行われるような加圧下では、弾性率は変化する
場合がある。たとえば、ヤング率は１桁以上低い場合も
あり得る。A polymer sheet having a Young's modulus of less than 1 GPa is likely to be deformed according to the shape of the unevenness with respect to the waviness having a period of about 3 to 30 mm, and it is difficult for the concentrated processing force to act on the convex part of the waviness. The swell cannot be removed effectively. The Young's modulus mentioned here is a value based on a material test standard such as JIS or ASTM. The elastic modulus may change under pressure such that polishing is actually performed. For example, Young's modulus may be lower by an order of magnitude or more.
【００１３】高分子シート１の厚さは、０．５〜１０ｍ
ｍとされるが、さらには１〜５ｍｍとすることが、溝加
工を施す際に必要な剛性と、研磨定盤に貼付け、剥離す
る際に必要な柔軟性の点から望ましい。また、溝２の幅
を０．１〜２ｍｍとすることにより、研磨液の流れを良
くし、研磨速度を高いレベルに確保できる。さらに、溝
２のピッチを溝幅の２〜１０倍とすることにより、研磨
速度を高いレベルに確保できる。また、溝は直線でも曲
線でもよく、平行に形成しても、格子状や菱形状に形成
してもよい。The polymer sheet 1 has a thickness of 0.5 to 10 m.
However, it is preferable that the thickness is 1 to 5 mm from the viewpoint of the rigidity required when performing groove processing and the flexibility required when attaching and peeling to the polishing platen. Further, by setting the width of the groove 2 to 0.1 to 2 mm, the flow of the polishing liquid can be improved and the polishing rate can be secured at a high level. Furthermore, by setting the pitch of the grooves 2 to be 2 to 10 times the groove width, the polishing rate can be secured at a high level. The grooves may be straight or curved, may be formed in parallel, or may be formed in a lattice shape or a diamond shape.
【００１４】なお、溝２の深さは、研磨液の流れを良く
する点から０．１ｍｍ以上とすることが望ましい。The depth of the groove 2 is preferably 0.1 mm or more in order to improve the flow of the polishing liquid.
【００１５】一方、本発明の高分子シート１の代わり
に、鋳鉄やアルミニウムなどの金属定盤を用いた場合
は、溝の加工が困難になるうえ、溝の周縁にバリを生じ
やすく、傷の原因になる。この点で本発明の高分子シー
トは、金属定盤に比べて優位性が高い。On the other hand, when a metal surface plate such as cast iron or aluminum is used instead of the polymer sheet 1 of the present invention, it becomes difficult to process the groove, and burrs are apt to be generated at the peripheral edge of the groove, resulting in scratches. Cause. In this respect, the polymer sheet of the present invention is highly superior to the metal surface plate.
【００１６】高分子シートは、面内の厚さが不均一であ
ったり面内の平坦度が不十分な場合がある。したがっ
て、表面の凸部を遊離砥粒によるラップ研磨あるいは砥
石による研削などの機械的手段を用いて平坦化してもよ
い。The polymer sheet may have a non-uniform in-plane thickness or an insufficient in-plane flatness. Therefore, the convex portions on the surface may be flattened by using a mechanical means such as lapping with free abrasive grains or grinding with a grindstone.
【００１７】軟質シート３はガラス板４の裏面側を吸着
保持するためのものである。軟質シート３としては、軟
質ゴム、軟質の発泡ポリウレタン樹脂、または発泡ポリ
エチレン樹脂および発泡なしの軟質ポリエチレン樹脂等
が使用できる。軟質シートの厚さを０．５〜２ｍｍ、好
ましくは０．８〜１．５ｍｍとすることが、大きい周期
の凹凸の形状に応じて変形し、小さい周期の凹凸の形状
に応じて変形しないために望ましい。同様の理由によ
り、軟質層の硬さはＪＩＳ：Ｓ６０５０で規定される硬
さ試験（日本ゴム協会規格ＳＲＩＳ０１０１で規定され
る通称「Ｃ硬度」）で８０以下、好ましくは４０〜６０
とされるのがよい。The soft sheet 3 is for adsorbing and holding the back side of the glass plate 4. As the soft sheet 3, soft rubber, soft foamed polyurethane resin, foamed polyethylene resin, soft polyethylene resin without foaming, or the like can be used. Since the thickness of the soft sheet is set to 0.5 to 2 mm, preferably 0.8 to 1.5 mm, the soft sheet is deformed according to the shape of the irregularities having a large period and is not deformed according to the shape of the irregularities having a small period. Desirable for. For the same reason, the hardness of the soft layer is 80 or less, preferably 40 to 60, in the hardness test defined by JIS: S6050 (commonly known as “C hardness” defined by Japan Rubber Association standard SRIS0101).
It is good to be said.
【００１８】[0018]
【作用】ガラス板表面を平滑に加工する場合、問題とな
る表面の凹凸は、その凹凸の周期から３通りに分類でき
る。When the surface of the glass plate is processed to be smooth, the unevenness of the surface, which is a problem, can be classified into three types according to the cycle of the unevenness.
【００１９】第１に周期１ｍｍ以下のいわゆる表面粗さ
と呼ばれるもの、第２に周期３〜５０ｍｍ程度のうねり
と呼ばれるもの、第３に周期５０ｍｍ以上の反りや肉厚
偏差と呼ばれるものなどである。軟質ウレタンなどの研
磨パッドを用いる従来のポリッシュにおいては、表面粗
さを小さくでき、鋳鉄定盤などを用いる従来のラッピン
グにおいては、反りや肉厚偏差を改善させることができ
る。The first is so-called surface roughness having a period of 1 mm or less, the second is a undulation having a period of about 3 to 50 mm, and the third is a warp having a period of 50 mm or more or a thickness deviation. In the conventional polish using a polishing pad such as soft urethane, the surface roughness can be reduced, and in the conventional lapping using a cast iron surface plate or the like, the warpage and the wall thickness deviation can be improved.
【００２０】一方、本発明のガラス板研磨用パッドによ
る加工方法では、うねりを効果的に取り除くことができ
る。それは、周期５０ｍｍ以上の反りや肉厚偏差と呼ば
れる凹凸に対してはガラス板の裏面側を保持するために
設けられた軟質シートとガラス板自身が変形して凹凸を
吸収し、周期３〜３０ｍｍ程度のうねりに対しては本発
明のガラス板研磨用パッドが凹凸の形状に応じて変形せ
ずに、周期３〜３０ｍｍ程度のうねりの凸部に積極的に
加工力が働いて、ガラス板が加工されるためである。On the other hand, in the processing method using the glass plate polishing pad of the present invention, the waviness can be effectively removed. It is because the soft sheet provided to hold the back surface side of the glass plate and the glass plate itself are deformed to absorb the unevenness when the period is 50 mm or more and the unevenness called the thickness deviation is absorbed, and the period is 3 to 30 mm. The glass plate polishing pad of the present invention does not deform according to the shape of the unevenness with respect to the degree of undulation, and the processing force is positively exerted on the convex portions of the undulation with a period of about 3 to 30 mm, so that the glass plate is This is because it is processed.
【００２１】[0021]
【実施例】厚さ３ｍｍのポリカーボネート樹脂シート
（ヤング率２．５ＧＰａ）をオスカー式研磨機の下定盤
に両面粘着テープにて固定し、彫刻刀にて表面に放射状
に幅１ｍｍの溝を、溝と溝のピッチが３〜６ｍｍとなる
ように形成した。また、軟質ポリウレタンシートと枠を
設けた上定盤に、厚さ１．１ｍｍ、縦横の寸法３００ｍ
ｍのソーダライムシリカガラス板を取り付けて、平均粒
径２μｍの酸化セリウム研磨液を供給しながら面圧５０
ｇ／ｃｍ2 で研磨を行い、平均厚さ１μｍだけ研磨除去
した。加工前のガラス板表面には高低差０．４μｍ、周
期１０ｍｍ前後のうねりが存在していたが、この加工後
にはうねりの高低差は０．１μｍを下回る値となり、し
かも、良好な表面であった。また、厚み偏差の劣化は
０．３μｍ以内であった。[Example] A polycarbonate resin sheet (Young's modulus 2.5 GPa) having a thickness of 3 mm was fixed to a lower plate of an Oscar type polishing machine with a double-sided adhesive tape, and a groove having a width of 1 mm was radially formed on the surface with a chisel. And the groove pitch was 3 to 6 mm. In addition, the upper surface plate provided with a soft polyurethane sheet and a frame, thickness 1.1mm, vertical and horizontal dimensions 300m
m soda lime silica glass plate is attached, and the surface pressure is 50 while supplying a cerium oxide polishing liquid having an average particle diameter of 2 μm.
Polishing was performed at g / cm 2 , and the average thickness of 1 μm was removed by polishing. The surface of the glass plate before processing had undulations with a height difference of 0.4 μm and a period of about 10 mm. After this processing, the undulation height difference was less than 0.1 μm, and the surface was good. It was The deterioration of the thickness deviation was within 0.3 μm.
【００２２】なお、続いてガラス板を鏡面研磨するため
に他のオスカー式研磨機にてスエード調のポリウレタン
パッドを用いて平均厚さ１μｍだけ研磨したところ、
傷、マイクロクラックとも認められない極めて良好な表
面を得た。Then, when the glass plate was polished by another Oscar type polishing machine with a suede-like polyurethane pad to an average thickness of 1 μm in order to polish the glass plate,
An extremely good surface without any scratches or microcracks was obtained.
【００２３】比較例として、厚さ１．０ｍｍ、縦横の寸
法３０ｃｍの硬質発泡ポリウレタンシート（ヤング率：
０．１ＧＰａ以下）をオスカー式の研磨機の下定盤に両
面粘着テープにて固定し、上定盤に厚さ１．１ｍｍ、縦
横の寸法３００ｍｍのソーダライムシリカガラス板を取
り付けて、平均粒径２μｍの酸化セリウム研磨液を供給
しながら面圧５０ｇ／ｃｍ2 で研磨を行った。加工前の
ガラス板表面には実施例と同様に高低差０．４μｍ、周
期１０ｍｍ前後のうねりが存在していたが、加工後にう
ねりの高低差を０．１μｍを下回る値とするために、平
均厚さ２μｍの研磨除去が必要であった。なお、ガラス
板周辺の減りが激しく、ガラス板の厚み偏差の劣化が１
μｍとなり、実施例よりも大きくなった。As a comparative example, a rigid foamed polyurethane sheet (Young's modulus: 1.0 mm in thickness and 30 cm in length and width)
0.1 GPa or less) is fixed to the lower surface plate of the Oscar type polishing machine with double-sided adhesive tape, and a soda lime silica glass plate having a thickness of 1.1 mm and length and width of 300 mm is attached to the upper surface plate, and the average particle size is Polishing was performed at a surface pressure of 50 g / cm 2 while supplying a 2 μm cerium oxide polishing liquid. As in the example, there was a undulation with a height difference of 0.4 μm and a period of about 10 mm on the surface of the glass plate before processing, but the average height of the undulation after processing was less than 0.1 μm. A polishing removal of a thickness of 2 μm was necessary. It should be noted that the reduction around the glass plate is severe and the deterioration of the thickness deviation of the glass plate is 1
μm, which is larger than that of the example.
【００２４】[0024]
【発明の効果】以上詳述したように、本発明により少な
い研磨加工量で、うねりが少なく、かつ傷やマイクロク
ラックが浅く少ないガラス板表面が作り出せ、しかも加
工時間が大幅に短縮でき、品質向上、生産量増大とコス
ト削減が実現できた。また、研磨パッドに研磨砥粒が目
詰まりしないため研磨パッドのドレッシングが不要とな
り、稼働率が向上し、傷発生による歩留まりの低下も少
なくなった。As described in detail above, according to the present invention, it is possible to produce a glass plate surface with less waviness, less waviness, and less scratches and microcracks, and the processing time can be greatly shortened to improve the quality. , Increased production and reduced costs. In addition, since the polishing pad is not clogged with polishing abrasive grains, dressing of the polishing pad is not necessary, the operating rate is improved, and the yield loss due to scratches is reduced.
【図１】本発明の実施例の断面図。FIG. 1 is a sectional view of an embodiment of the present invention.
１：高分子シート ２：溝 ３：軟質シート ４：ガラス板 1: Polymer sheet 2: Groove 3: Soft sheet 4: Glass plate
Claims (2)
って、材料試験規格に基づいて測定されたヤング率が１
ＧＰａ以上で厚さが０．５〜１０ｍｍの高分子シートか
らなり、表面の主要な領域に幅０．１〜２．０ｍｍの溝
が溝幅の２〜１０倍のピッチで形成されていることを特
徴とするガラス板用研磨パッド。1. A polishing pad for polishing the surface of a glass plate, which has a Young's modulus of 1 measured according to the material test standard.
A polymer sheet having a thickness of at least GPa and a thickness of 0.5 to 10 mm, and grooves having a width of 0.1 to 2.0 mm formed in a main area of the surface at a pitch of 2 to 10 times the groove width. A polishing pad for glass plates characterized by.
ラス板の表面を、材料試験規格に基づいて測定されたヤ
ング率が１ＧＰａ以上で厚さが０．５〜１０ｍｍの高分
子シートからなり、表面の主要な領域に幅０．１〜２．
０ｍｍの溝が溝幅の２〜１０倍のピッチで形成されてい
るガラス板用研磨パッドを用いて研磨することを特徴と
するガラス板の研磨方法。2. A polymer sheet having a Young's modulus of 1 GPa or more and a thickness of 0.5 to 10 mm, which is measured on the basis of a material test standard, on a surface of a glass plate whose back surface is fixed and held via a soft sheet. , A width of 0.1-2.
A method for polishing a glass plate, which comprises polishing with a glass plate polishing pad having 0 mm grooves formed at a pitch of 2 to 10 times the groove width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10161296A JPH0911119A (en) | 1995-04-27 | 1996-04-23 | Pad for polishing glass plate, and method for polishing the same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-103948 | 1995-04-27 | ||
| JP10394895 | 1995-04-27 | ||
| JP10161296A JPH0911119A (en) | 1995-04-27 | 1996-04-23 | Pad for polishing glass plate, and method for polishing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0911119A true JPH0911119A (en) | 1997-01-14 |
Family
ID=26442470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10161296A Withdrawn JPH0911119A (en) | 1995-04-27 | 1996-04-23 | Pad for polishing glass plate, and method for polishing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0911119A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998006541A1 (en) * | 1996-08-08 | 1998-02-19 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| JPH1170463A (en) * | 1997-05-15 | 1999-03-16 | Applied Materials Inc | Polishing pad with grooved pattern for use in chemical and mechanical polishing device |
| WO2001017725A1 (en) * | 1999-09-02 | 2001-03-15 | Teijin-Metton Kabushiki Kaisha | Polishing pad |
| US6273806B1 (en) | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| EP1211023A1 (en) * | 1999-03-30 | 2002-06-05 | Nikon Corporation | Polishing body, polisher, polishing method, and method for producing semiconductor device |
-
1996
- 1996-04-23 JP JP10161296A patent/JPH0911119A/en not_active Withdrawn
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998006541A1 (en) * | 1996-08-08 | 1998-02-19 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| JPH1170463A (en) * | 1997-05-15 | 1999-03-16 | Applied Materials Inc | Polishing pad with grooved pattern for use in chemical and mechanical polishing device |
| US6273806B1 (en) | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| SG83679A1 (en) * | 1997-05-15 | 2001-10-16 | Applied Materials Inc | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US6645061B1 (en) | 1997-05-15 | 2003-11-11 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in chemical mechanical polishing |
| US6699115B2 (en) | 1997-05-15 | 2004-03-02 | Applied Materials Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US6824455B2 (en) | 1997-05-15 | 2004-11-30 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| EP1211023A1 (en) * | 1999-03-30 | 2002-06-05 | Nikon Corporation | Polishing body, polisher, polishing method, and method for producing semiconductor device |
| US6749714B1 (en) | 1999-03-30 | 2004-06-15 | Nikon Corporation | Polishing body, polisher, polishing method, and method for producing semiconductor device |
| EP1211023A4 (en) * | 1999-03-30 | 2005-11-30 | Nikon Corp | Polishing body, polisher, polishing method, and method for producing semiconductor device |
| WO2001017725A1 (en) * | 1999-09-02 | 2001-03-15 | Teijin-Metton Kabushiki Kaisha | Polishing pad |
| US6547644B1 (en) | 1999-09-02 | 2003-04-15 | Teijin-Metton Kabushiki Kaisha | Polishing pad |
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