JPH09107178A - Soldering jig, soldering jig unit and soldering method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering method which can solder only a necessary part while preventing flaw and deformation of a solder applied body. SOLUTION: In a first process, flux F1 is applied to a lead frame 1 which is a plate-like solder applied body and a first jig 21 which consists of a resin plate material 22 as a bendable thin plate is arranged in a rear side which is a soldering surface of the lead frame 1. An opening part 27 which exposes only a necessary part in the lead frame 1 is formed in the jig 21. In only a second process, molten solder SL1 is supplied to an exposed part through the opening part 27. In a third process, the lead frame 1 is cooled. In a fourth process, the jig 21 is separated from the lead frame 1.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a soldering method,
It also relates to a jig and a jig unit used at that time.

[0002]

2. Description of the Related Art Conventionally, as one method of soldering, for example, flow soldering has been known in which molten solder is supplied to a joint portion of a solder adherend and the portion is soldered at the same time. There is. Further, such a soldering method is generally used in a mounting process of electronic components on a printed wiring board, a manufacturing process of a semiconductor package, and the like. When performing flow soldering, a rigid plate-shaped soldering jig is arranged on the soldering surface of a substrate or the like that is a solder adherend. The jig is provided with a solder supply port having a rectangular shape or the like that exposes the entire region including the joint portion. The soldering surface of the substrate is then dipped together with the jig into the molten solder surface in the solder bath. As a result, the molten solder adheres to the entire joint, and the solder joint is achieved.

By the way, depending on the type of the solder adherend, there are cases where a portion to which the solder is to be attached and a portion to which the solder is not attached are mixed in the area on the soldering surface exposed from the supply port. Here, when it is desired not to attach solder, for example, a case where a solid pattern is already plated with gold or the like is referred to. Therefore, in the flow soldering to the solder adherend having such a special structure, some measure is required to prevent the solder from adhering to a specific portion. As a countermeasure, the following methods have been conventionally used.

The first method is to prevent the contact of the solder with molten solder by attaching a protective tape in advance to a portion of the area exposed from the jig supply port where solder is not desired to be attached. Is the way.

The second method is a so-called dispensing method which does not use a jig. In this method, a soldering robot having a dispenser is used, and the dispenser individually supplies solder only to predetermined portions.

[0006]

However, these conventional soldering methods have the following problems. In the first method, since the protection tape is attached and peeled off manually, the work is complicated and the production efficiency is poor. Furthermore, since the flux is applied to the solder adherend before the flow soldering, the solder adherend and the jig are attached to each other by the adhesive force. Therefore, when the jig and the solder adherend have a large contact area, if the jig is forcibly peeled off, the solder adherend may be damaged or deformed due to the stress applied at that time. Therefore, a great deal of caution is required when performing the separation work, which is one of the causes of deterioration of production efficiency.

In the second method, although it was an automatic work by a robot, it was necessary to individually dispense one by one, so that the production efficiency was still poor. In addition, there is a problem that an expensive device is required to carry out this method.

The present invention has been made to solve the above problems, and a first object thereof is to efficiently solder only a necessary portion while preventing scratches and deformation of a solder adherend. It is to provide a soldering method capable of A second object of the present invention is to provide a soldering jig and a soldering jig unit that can reliably and easily carry out the above soldering.

[0009]

In order to solve the above-mentioned problems, the invention according to claim 1 is such that, when performing soldering to a plate-shaped solder adherend, at least the solder adherend is soldered. A soldering jig arranged on the surface side, wherein the soldering jig is made of a flexible thin plate, and the flexible thin plate has an opening for exposing only a necessary portion of the solder adherend. The soldering jig provided is the gist.

According to a second aspect of the present invention, there is provided a first jig according to the first aspect and a flexible thin plate which is arranged on a surface side of the solder adherend which faces a soldering surface. The gist is a soldering jig unit including a second jig and a third jig that fixes and holds the solder adherends to each other while sandwiching the solder adherend by the jigs.

According to a third aspect of the present invention, flux is applied to a plate-shaped solder adherend and a flexible thin plate having an opening for exposing only a necessary portion of the solder adherend is used. A first step of arranging a tool on at least the soldering surface side of the solder adherend, and a second step of supplying molten solder to the exposed portion through the opening.
And a third step of cooling the solder adherend to solidify or weaken the flux, and a fourth step of separating the solder adherend from the jig. Is the gist.

The "action" of the above invention will be described below. According to the invention of claim 1, since the jig is a flexible thin plate, deformation of the jig itself due to repeated contact with the molten solder can be easily performed with an extremely weak force (adhesive force of flux, etc.). Can be corrected. Moreover, since the jig side can be bent, the jig and the solder adherend can be separated without applying a large stress to the solder adherend. Further, the jig is bent toward the solder adherend side due to the pressure and heat of the molten solder received during the soldering process. Therefore, the jig and the solder adherend are surely brought into close contact with each other, and the molten solder is prevented from entering the interface between them. Further, since this jig is thin, the aspect ratio does not become so high even if the opening is fine. Therefore, the problem that the molten solder does not sufficiently enter the opening does not occur, and it is difficult to form an unsoldered portion.

The invention described in claim 2 has the following actions in addition to the above actions. That is, the first
Since soldering is performed in a state where the second jig and the solder adherend are fixed and held on the third jig, even if the first jig is a flexible thin plate, soldering is performed. It is possible to surely prevent the displacement of these three sheets during attachment. Therefore, only the necessary portion can be soldered. In addition, the jig unit as described above facilitates transportation as compared with the case where the first and second jigs are simply arranged. further,
In the case of this jig unit consisting of three pieces, since it can be disassembled into individual jigs, cleaning and the like can be relatively easily performed after use. In addition, such a jig unit makes it relatively easy to mechanize and automate processes from assembly to separation / disassembly.

It is preferable that the first and second jigs constituting the jig unit are made of a resin thin plate having solder heat resistance. If something like this,
Even when the jig comes into contact with the molten solder, deformation of the jig itself is avoided. Further, it is preferable that the first and second jigs have substantially the same material and the same thickness. With such a structure, the solder adherend is less likely to warp.

According to the third aspect of the present invention, the jig adheres to the solder adherend due to the adhesive force of the flux, and only the necessary portion of the solder adherend is exposed from the opening. At this time, first, when the flux is applied to the solder adherend in the first step and then the jig is arranged at least on the soldering surface side of the solder adherend, this effect is further enhanced. When the molten solder is supplied in the second step,
The jig is bent by the pressure and heat of the molten solder and is brought into close contact with the solder adherend, and only the exposed necessary portion is touched and soldered to the molten solder. Since the other parts are protected by the jig, the adhesion of the molten solder is avoided. Since the flux is solidified or weakened by cooling in the third step, the solder adherend and the jig are easily and surely separated in the fourth step. In particular, since the jig is a flexible thin plate, it is possible to easily bend the jig, and by utilizing this bending, separation can be performed more easily and surely. Therefore,
It is possible to improve the production efficiency as compared with the conventional case where the jig peeling work requires carefulness.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to FIGS.

First, a lead frame 1 for manufacturing a QFP (Quad flat package) which is a solder adherend in this embodiment will be described with reference to FIGS. 1, 6 and 7. The lead frame 1 refers to a long thin plate metal member formed of Kovar, 42 alloy, or the like. In this embodiment, the lead frame 1 of length × width × thickness = 216 mm × 55 mm × 0.2 mm is used.

As shown in FIG. 1, the lead frame 1
Is composed of rails 3, outer leads 4, inner leads 5, sprocket holes 6, and the like. In the case of the present embodiment, one lead frame 1 to four QFPs
Is obtained. Therefore, the lead frame 1 is composed of four small units separated after transfer molding. The printed wiring boards 2 are temporarily fixed one by one to the central portion of each small unit via an adhesive. The printed wiring board 2 is a so-called double-sided board and has a large number of through holes 7 in the outer peripheral portion. The formation position of each through hole 7 corresponds to the position of the tip of each inner lead 5 extending from the four sides toward the center in each small unit. A substantially square through window 8 is formed in the center of the printed wiring board 2. Surface of printed wiring board 2 (that is, surface in contact with lead frame 1)
A large number of wiring patterns 9 made of copper are formed on the side. One ends of these wiring patterns 9 are connected to the through holes 7, and the other ends thereof extend toward the through window portion 8 at the center. Each wiring pattern 9 is entirely covered with a solder resist 10 except for both ends. Both ends of the wiring pattern 9 exposed from the solder resist 10 are plated with gold (not shown).
The outer end of each wiring pattern 9 is the outer pad 11
And the inner end is used as the inner pad 12. On the inner pad 12, Al electrodes of an IC chip or an LSI chip (not shown) are mounted face down via bumps.

A solid ground pattern 13 is formed on the back surface of the printed wiring board 2 to be the soldering surface so as to surround the through window portion 8. The ground pattern 13 is made of copper, and the outer pad 1 is provided on the upper surface thereof.
As in the case of 1 and inner pad 12, thin gold plating 14 is applied.

In the present embodiment, the inner lead 5, the through hole 7 and the outer pad 11 are soldered. Therefore, in the flow soldering, it is necessary to selectively supply the molten solder SL1 only to these portions. However, only one opening of the through hole 7 exists on the back surface side which is the soldering surface. Therefore, the molten solder SL1 passes through the through hole 7 and is supplied to the surface side which is the opposite side surface. On the other hand, the ground pattern 1 existing on the back surface
No. 3 is a portion where the adhesion of the molten solder SL1 should be avoided.

Next, the structure of the soldering jig unit U1 for soldering the lead frame 1 will be described. As shown in FIGS. 1 and 2,
This unit U1 includes a first jig 21 and a second jig 3
It is composed of three types of jigs 21 to 41, namely, a first jig 41 and a third jig 41.

FIG. 1 shows a state in which the first jig 21 arranged on the back surface side of the lead frame 1 is viewed from the front surface side. The jig 21 is made of a resin plate material 22 having a solder heat resistance as a flexible thin plate. The plate member 22 has a substantially rectangular shape and has an outer dimension slightly larger than the lead frame 1 (length × width = 248 mm × 85 mm in this embodiment). In this embodiment, a plate material 22 made of BT resin (bismaleimide-triazine resin), more specifically, a BT resin-impregnated glass cloth plate material 22 is used. Therefore, this plate 22
Inside, the glass fibers run vertically and horizontally. here,
The reason why the plate material 22 made of BT resin is selected is as follows. That is, i) it has suitable solder heat resistance, ii) it is easy to process because it is a resin, and iii) it is a material for forming a printed wiring board in the first place, so it has good thermal compatibility with the printed wiring board 2 ( It has a similar coefficient of thermal expansion and is less likely to warp)
Because. The selection of the plate material 22 made of BT resin is particularly preferable when the printed wiring board 2 is made of BT resin.

When a resin plate material 22 such as BT resin is selected, the thickness thereof is 0.1 mm to 0.8 mm, and particularly, the thickness is 0.1 mm to 0.8 mm.
It is preferably 4 mm to 0.6 mm. If the plate material 22 is too thin, the strength of the jig 21 itself becomes low, and the jig 21 is likely to be deformed or broken. In addition, fine processing such as forming a step may be difficult. Conversely, plate material 2
If 2 is too thick, the above problem does not occur, but the suitable flexibility is lost, so that the lead frame 1
The work for separating the jig 21 from the jig may be difficult. Moreover, there is a possibility that an unplated portion will be formed. In consideration of such circumstances, the thickness of the plate member 22 is set to 0.6 mm in this embodiment.

As shown in FIG. 1, the first jig 21 has four accommodating recesses 23 for accommodating the substantially square printed wiring board 2. These accommodation recesses 23 are provided at equal intervals along the longitudinal direction in the central portion of the jig 21. As shown in FIG. 4, the outer dimensions of the housing recess 23 are substantially equal to the outer dimensions of the printed wiring board 2 to be housed. On the inner wall surface near the opening of the accommodating recess 23, a step portion 24 is formed over the entire circumference thereof. As a result of the printed wiring board 2 being fitted in the housing recess 23, the first jig 21 and the lead frame 1 are aligned to some extent. In addition, the fitting state prevents the lead frame 1 from being displaced during soldering.

At the center of the bottom surface of the accommodating recess 23, there is formed a square-shaped protective piece 25 which is slightly smaller than the accommodating recess 23. The thickness of the protective piece 25 is about half that of the plate member 22 (about 0.3 mm in this embodiment). The protection piece 25 is located on the diagonal line of the accommodation recess 23.
It is supported by a book support piece 26. It should be noted that these support pieces 26 are also thinly formed like the protection piece 25. A region between the four sides of the protection piece 25 and the inner wall surface of the housing recess 23 is penetrated by a counterboring process. Therefore, the substantially square-shaped area is the jig 21.
Is the opening 27. The area of the lead frame 1 in which the through hole 7 is formed is exposed from the opening 27, as shown in FIG. Further, the ground pattern 13 with the gold plating 14 is hidden under the protective piece 25.

As shown in FIGS. 1 and 6, the first jig 21, the second jig 31, and the lead frame 1 are located at positions on the outer peripheral side of the four accommodation recesses 23. Six alignment holes 28 for alignment are provided through.
These positioning holes 28 are circumscribed on the four sides of the lead frame 1 when the first jig 21 is used. In addition, a positioning pin (not shown) is inserted into each of the positioning holes 28. Further, three gripping claw locking portions 29 are formed on each of the two long sides of the first jig 21. In these gripping claw engaging portions 29, the gripping claws 48 have the jig 2
This is for the convenience of gripping 1.

In FIG. 1, the second jig 31 is arranged on the surface (the surface facing the soldering surface) of the lead frame 1.
The state when viewed from the back side is shown. Like the first jig 21, this jig 31 is also made of a resin plate material 32 having solder heat resistance as a flexible thin plate.
The shape, size, thickness and forming material of the plate member 32 are almost the same as those of the plate member 22. The reason why the plate material 32 made of BT resin is selected is basically the same as the reason for selecting the plate material 22.

As shown in FIG. 1, the second jig 31 is provided with four substantially square gas vents 33. These degassing portions 33 are provided at equal intervals along the longitudinal direction in the central portion of the second jig 31.
As shown in FIG. 3, the outer dimensions of the gas vent 33 are
It is almost equal to the external dimensions of the printed wiring board 2.
A gas vent hole 34 penetrating the front and back of the jig 31 is provided at the center of the gas vent portion 33. This is because the presence of such a gas vent hole 34 suppresses an increase in pressure inside the accommodation recess 23, so that the molten solder SL1 easily passes through the through hole 7 and reaches the opposite side. The vaporized flux escapes to the outside through the gas vent hole 34. In the gas vent hole 34, a gas introduction groove 35 for guiding gas to the gas vent hole 34 is formed. A plurality of isosceles triangular protrusions 36 for pressing the lead frame 1 are provided between the gas introduction grooves 35.

Positioning holes 3 for positioning the first jig 21, the second jig 31, and the lead frame 1 at positions on the outer peripheral side of the four gas vents 33.
Six 7 are transparently installed. These alignment holes 37
Corresponds to the position where each positioning hole 28 of the first jig 21 is formed, and circumscribes exactly four sides of the lead frame 1 when the second jig 31 is used. A positioning pin (not shown) is inserted into each positioning hole 37.

A plurality of oval rod insertion holes 38 are formed at one end of the second jig 31. A plurality of separation rods (not shown) are inserted into each rod insertion hole 38. As a result, a gap is formed between the lead frame 1 and the first jig 21, and the two 1 and 21 are easily separated.

FIG. 2 shows a perspective view of the third jig 41 as seen from the back side thereof. This jig 41
The jig cassette is, so to speak, a jig cassette that holds and holds the lead frame 1 by the first jig 21 and the second jig 31 while sandwiching the lead frame 1 therebetween. Third jig 41
Is a plate material 42 made of a rigid BT resin having no flexibility.
(Length x width x thickness = 260 mm x 95 mm x 5 mm). This is because if the jig 41 is rigid, it is possible to reliably prevent the positional deviation of the three sheets housed therein, and to easily carry it.

In the center of the jig 41, four rectangular windows 43 are provided. The gas that has escaped from the gas vent hole 34 escapes to the outside through these windows 43. On the back surface of the jig 41, on both sides of these window portions 43, a pair of roller sliding grooves 4 extending in the longitudinal direction are provided.
4 are formed. In these roller sliding grooves 44,
When assembling and disassembling the three jigs 21 to 41, the rollers of the assembling / disassembling machine are guided.

On the back side of the jig 41, two guide members 45 having a substantially L-shaped cross section are fixed by screws 46 and nuts. Then, these guide members 45
A guide groove 47 extending along the longitudinal direction is formed. The jigs 21 and 31 and the lead frame 1 are
It is guided by both guide grooves 47 during insertion and removal. Moreover, inclined surfaces for facilitating the insertion of the jigs 21, 31, etc. are formed at both end portions on the back surface side of the plate member 42.

Next, a soldering method using the jig unit U1 including the three jigs 21 to 41 will be described in order with reference to FIGS. In the first step (flux applying step / jig assembling step), flux F1 is first applied to the entire lead frame 1 with the printed wiring board 2 temporarily fixed. After that, the first shown in FIG.
The lead frame 1 is overlaid on the jig 21 with the soldering surface side facing down (see FIG. 8 (b)). Then
As shown in FIG. 8C, a second jig 31 is further stacked on it. At this time, each positioning hole 2
Alignment is performed using 8,37. Both jigs 21,
31 and the lead frame 1 adhere to each other due to the adhesive force of the flux F1. Next, as shown in FIG. 8D, the jigs 21 and 31 and the lead frame 1 are placed in a third position.
By inserting from the insertion opening of the jig 41 of
The sheet is held by the third jig 41. The above assembling operation is automatically and continuously performed by an automatic jig assembling machine (not shown).

In the second step (molten solder supply step),
By passing the assembled jig unit U1 through the flow solder bath, the molten solder SL1 is supplied to the exposed portion through the opening 27 of the first jig 21 (see FIG. 9 (a)). As a result, as shown in FIG. 7, the molten solder SL1 is selectively supplied to the inner lead 5, the through hole 7, and the outer pad 11, and they are soldered to each other. In this step, the jig unit U1 is carried by a carrying device (not shown).

In the third step (solder adherent cooling step), the lead frame 1 is forcibly cooled to room temperature within a short time by applying cool air to the jig unit U1 pulled up from the flow solder bath. Then, the molten solder SL1 attached to the lead frame 1 cools and solidifies. At this time, the flux F1 also solidifies and loses its tackiness, so that the flux F1 becomes brittle. Of course, natural cooling may be performed at this time. However, the forced cooling is preferable from the viewpoint of improving productivity because the processing time is shorter. Further, if the quenching is performed by the forced cooling, cracks are induced in the flux F1, so that the separation work in the subsequent process becomes much easier.

In the fourth step (jig disassembly / separation step),
First, the jigs 21 and 31 and the lead frame 1 are pulled out from the third jig 41 (see FIG. 9B). Next, first, only the first jig 21 is separated from the two jigs 21 and 31 and the lead frame 1 in the pulled-out state. At this time,
A separation plate 49 as shown in FIG. 9C is inserted between the lead frame 1 and the jig 21. Flux F
Since 1 has been solidified and weakened by going through the cooling process, the separating plate 49 coming into
1 is easily separated. At this time, the lead frame 1 is still attached to the back surface of the second jig 31. Next, the second jig 31 is held by the holding claws 48, and the vibrator 50 applies vibration to the upper surface of the second jig 31. Then, the vibration at this time causes the cracks in the flux F1 to expand, and eventually the lead frame 1 peels off from the jig 31 as shown in FIG. 9 (d). The above disassembling / disassembling work is automatically and continuously performed by a jig disassembling / peeling machine (not shown) including the grip claw 48, the separating plate 49 and the vibrator 50.

In the fifth step (cleaning step), the lead frame 1 is immersed in the cleaning solution to completely remove the flux F1 adhering to the surface thereof. In addition, the same cleaning is performed for each of the jigs 21, 31, 41.
The disassembled and cleaned jigs 21, 31, 41 are reused. Further, the lead frame 1 becomes a desired QFP after the chip mounting step, the resin molding step, and the T / F step.

Now, the characteristic working effects of the above-described soldering method, jigs 21, 31, 41 and jig unit U1 of this embodiment will be described below. (A) According to the soldering method of the present embodiment, after the flux F1 is applied to the lead frame 1, the jigs 21 and 31 are arranged on the front and back surfaces of the lead frame 1. Therefore, due to the adhesive force of the flux F1, both jigs 2
1, 31 are in close contact with the lead frame 1, and only the through hole 7 formation region of the lead frame 1 is exposed from the opening 27. Therefore, if the molten solder SL1 is supplied, only the necessary portion can be soldered, and the adhesion of the molten solder SL1 to the other portion (ground pattern 13 or the like) can be avoided. Also, as a result of the flux F1 solidifying or weakening due to cooling,
Cracks are easily generated in the flux F1. Therefore,
The jigs 21 and 31 do not have to be forcibly peeled from the lead frame 1, and a large stress is not applied to the lead frame 1 at that time. Therefore, the lead frame 1 and the jig 21 can be easily and reliably separated. Therefore, the production efficiency in soldering is improved as compared with the conventional case in which the jig peeling operation requires considerable caution. Further, as a result of the stress applied to the lead frame 1 being reduced, it is possible to reliably prevent the lead frame 1 from being damaged or deformed.

(B) In the soldering method of this embodiment,
After cooling, the jig 31 is separated from the lead frame 1 by applying vibration to the second jig 31. Moreover, the vibration is not directly applied to the lead frame 1, but indirectly to the jig 31. With this method, almost no stress is applied to the lead frame 1, which is extremely convenient for preventing the occurrence of scratches and deformation.

(C) According to the first jig 21 of this embodiment, since the jig 21 is a flexible thin plate, deformation of the jig 21 due to repeated contact with the molten solder SL1 is extremely weak. It can be easily corrected by force (adhesive strength of flux F1). Moreover, by bending the jig 21 side instead of the lead frame 1 side, the both 1 and 21 can be separated. Therefore, the separation work can be performed without applying a large stress to the lead frame 1. When the soldering process is performed, the first jig 21
(Particularly the protective piece 25) is the pressure of the molten solder SL1
The lead frame 1 side is bent by heat. Therefore, the jig 21 and the lead frame 1 are surely brought into close contact with each other,
The molten solder SL1 is prevented from entering the interface between the two 1, 21. Therefore, adhesion of the molten solder SL1 to the ground pattern 13 and other portions not requiring plating can be reliably prevented.

(D) Since the first jig 21 of this embodiment is thin, even if the opening 27 is fine, its aspect ratio does not become so high. Therefore, the problem that the molten solder SL1 does not sufficiently enter the opening 27 does not occur, and there is an advantage that it is difficult to form an unsoldered portion.

(E) Jigs 21, 31, 41 of this embodiment
Is made of a BT resin thin plate having solder heat resistance. For this reason, the jigs 21, 31, 41 are melted by the molten solder S.
There is an advantage that even when they come into contact with L1, they do not lead to deformation or destruction of themselves. Especially leadframe 1
Since both jigs 21 and 31 for sandwiching the lead frame 1 have almost the same material and the same thickness, there is an advantage that the lead frame 1 is less likely to warp.

(F) First jig 21 and second jig 31
With regard to (1), basically, it is possible to fabricate by making a counterboring process on one plate member 22, 32. Therefore, the production is extremely simple, and it is excellent from the viewpoint of cost reduction.

(G) In this embodiment, the three jigs 21,
A jig unit U1 consisting of 31, 41 is used, and soldering is performed in a state where the other jigs 21, 31 and the lead frame 1 are fixed and held by the third jig 41 constituting the jig unit U1. Therefore, it is possible to reliably prevent the positional deviation of the jigs 21 and 31 and the lead frame 1, and it is possible to easily carry out the transportation and the like. In addition, since the three jigs 21 to 41 forming the jig unit U1 can be individually disassembled, cleaning after use is relatively easy. Further, by using such a jig unit U1, the steps from jig assembly to jig disassembly / separation can be relatively easily mechanized and automated. This is advantageous for improving production efficiency.

The present invention can be modified, for example, as follows. (1) Plate materials 22, 3 constituting the jigs 21, 31, 41
2, 42 is not limited to only BT resin,
For example, it may be made of a general resin for printed wiring boards such as epoxy, polyimide, BCB resin and the like. Of course,
It is also possible to use a resin other than the resin for the printed wiring board.

(2) The vibration applied to the jig 31 in the fifth step may be applied in the sixth step. That is, the cleaning of the lead frame 1 and the jig 31 may be performed while separating the lead frame 1 and the jig 31 in the cleaning liquid by ultrasonic vibration or the like.

[0048]

As described above in detail, according to the inventions of claims 1 to 3, it is possible to efficiently solder only the necessary portions while preventing the solder adherend from being scratched or deformed. It is possible to provide a possible soldering jig, a soldering jig unit, and a soldering method.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first jig, a second jig, and a lead frame according to an embodiment.

FIG. 2 is a perspective view of a third jig of the same.

FIG. 3 is a partially cutaway perspective view showing a degassing portion of a second jig.

FIG. 4 is a partially cutaway perspective view showing an accommodating recess of the first jig.

FIG. 5A is a side view showing a third jig in a jig non-holding state, and FIG. 5B is a side view showing the third jig in a jig holding state.

FIG. 6 is a partially cutaway bottom view showing a third jig in a jig holding state.

FIG. 7 is a partially cutaway cross-sectional view showing first and second jigs with a lead frame sandwiched therebetween.

8A to 8D are schematic perspective views for explaining the procedure of the soldering method of the present embodiment.

9A to 9D are schematic perspective views for explaining the procedure of the soldering method of the present embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Lead frame for manufacturing QFP as a solder adherend, 21 ... First jig as a soldering jig, 2
2, 32 ... Resin plate material as flexible thin plate, 27 ... Opening portion, 31 ... Second jig as soldering jig, 41
... third jig as soldering jig, U1 ... soldering jig unit, F1 ... flux.

Claims (3)

[Claims] 1. A soldering jig arranged at least on the soldering surface side of the solder adherend when performing soldering to a plate-like solder adherend, wherein the soldering jig is A soldering jig comprising a flexible thin plate, the flexible thin plate having an opening for exposing only a necessary portion of the solder adherend. 2. A first jig according to claim 1, a second jig which is made of a flexible thin plate and is arranged on a surface side of the solder adherend facing the soldering surface, A soldering jig unit comprising a third jig for fixing and holding the solder adherend to each other while sandwiching the solder adherend between them. 3. A jig comprising a flexible thin plate having a plate-shaped solder adherend coated with flux and having an opening for exposing only a necessary portion of the solder adherend,
A first step of arranging at least the soldering surface side of the solder adherend, a second step of supplying molten solder to the exposed portion through the opening, and cooling the solder adherend. A soldering method comprising a third step of solidifying or weakening the flux, and a fourth step of separating the solder adherend from the jig.