JPH0888470A - Ceramic multilayer substrate for mounting electronic parts and its manufacturing method - Google Patents

Abstract

PURPOSE: To provide a ceramic multilayer substrate for mounting electronic parts for easily mounting the electronic parts even if the terminal electrode for connecting electronic parts is formed with a narrow pitch and its manufacturing method. CONSTITUTION: A plurality of ceramic green sheets 11 where a conductor pattern 1c and a through hole 1b are formed are laminated and at the same time a through hole is formed on the surface of the lamination body corresponding to a terminal electrode 2a formed on the bottom surface of a semiconductor integrated circuit 2 for mounting, a resin sheet 4 which can be burnt down due to heat where an electrode 10 is formed by filling a material for conductive connection into the through hole, and these are contact-bonded. After that, they are baked at 150 deg.C and the resin sheet 4 is burnt down, thus obtaining a ceramic multilayer substrate 1 where a bump electrode 1a with a specific height is formed in one piece on the surface. The bump electrode 1a is used as a bump and the bump electrode 1a is connected to a terminal electrode 2a conductively, thus extremely simplifying the process for mounting electronic parts to the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic multilayer substrate for mounting electronic components such as semiconductor integrated circuits on the surface by face down bonding and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, face-down bonding has been known as a method for connecting an electronic component such as a semiconductor integrated circuit and a ceramic multilayer substrate for mounting the electronic component. The face-down bonding is a method in which a bump is provided on a pad (connection terminal electrode) formed on the bottom surface of an electronic component or an electrode on a mounting substrate, and the pad of the electronic component and the electrode on the substrate are bonded via the bump. Is used to electrically connect the electronic component to the wiring on the substrate.

As a method of forming bumps, there are used a method of forming on the electrodes of the mounting substrate by plating, a method of attaching a metal ball, and a so-called stud bump method of forming bumps by a wire bonder.

Further, as a method of joining the bumps and the electrodes, a method of applying a conductive resin and curing the resin, a method of filling an anisotropic conductive resin and curing the electronic component under pressure, and a cream on the substrate electrode. There is a method of supplying solder by solder printing or solder dipping, and then performing reflow.

[0005]

However, in the bump forming method, the soldering of the plated metal balls requires the formation of several metal layers on the aluminum (Al) pad of the electronic component by plating vapor deposition or the like. Therefore, the process becomes complicated. Further, although the stud bump formation by the wire bonder is simple in process, there is a problem that it is difficult to reduce the pad pitch because the bump diameter is about 80 μm.

In view of the above problems, an object of the present invention is to provide a ceramic multilayer substrate for electronic component mounting which can be easily mounted even if the pitch of the connection terminal electrodes of the electronic component is formed narrow, and a method for manufacturing the same. is there.

[0007]

In order to achieve the above-mentioned object, the present invention provides a ceramic multilayer substrate for mounting electronic components, such as a semiconductor integrated circuit, on a surface of the ceramic multilayer substrate according to claim 1, wherein There is proposed a ceramic multilayer substrate for mounting electronic parts, which has electrodes formed on the surface corresponding to the connection terminal electrodes, and the electrodes are integrally formed with convex portions having a predetermined height.

According to a second aspect of the present invention, in a ceramic multi-layer substrate for mounting electronic components, such as a semiconductor integrated circuit, on which electronic components are mounted, a predetermined surface integrally formed corresponding to the connecting terminal electrodes of the electronic components. We propose a ceramic multilayer substrate for mounting electronic parts, which has a protruding electrode having a height, and the protruding electrode is connected to a conductor pattern formed in an inner layer portion by a through hole.

According to a third aspect of the present invention, there is provided a method of manufacturing a ceramic multilayer substrate for mounting electronic components, such as a semiconductor integrated circuit, on the surface of which a predetermined conductor pattern or conductor pattern and through holes are formed. A plurality of ceramic green sheets are laminated, and through holes are formed on the surface of the laminated body of the ceramic green sheets corresponding to the connection terminal electrodes formed on the bottom surface of the electronic component, and the conductive holes are formed in the through holes. Laminating a heat-burnable sheet filled with a connecting material, after pressure bonding the ceramic green sheet and the heat-burnable sheet, fired at a predetermined temperature,
A method for manufacturing a ceramic multilayer substrate for electronic component mounting is proposed, in which a ceramic multilayer substrate having electrodes having integrally formed projections of a predetermined height on the surface is obtained by burning out the heat-burnable sheet.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a ceramic multilayer substrate for mounting electronic components, such as a semiconductor integrated circuit, on the surface of which a plurality of ceramics having predetermined conductor patterns and through holes are formed. Along with stacking the green sheets, through holes are formed on the surface of the laminated body of the ceramic green sheets corresponding to the connecting terminal electrodes formed on the bottom surface of the electronic component, and the conductive connecting material is formed in the through holes. Laminated heat-burnable sheets filled with
The ceramic green sheet and the heat-burnout sheet are pressure-bonded and then fired at a predetermined temperature to burn off the heat-burnable sheet to obtain a ceramic multilayer substrate having protruding electrodes of a predetermined height on the surface Electronic component mounting A method of manufacturing a ceramic multilayer substrate is proposed.

[0011]

According to the first aspect of the present invention, since the electrode formed on the surface corresponding to the connecting terminal electrode of the electronic component is integrally formed with the convex portion having a predetermined height, the convex portion is formed. The electrode is conductively connected to the connection terminal electrode of the electronic component by using the portion as a bump.

According to the second aspect of the present invention, since the protruding electrode having a predetermined height is integrally formed on the substrate surface corresponding to the connecting terminal electrode of the electronic component, the protruding electrode is used as a bump. The protruding electrode and the connecting terminal electrode of the electronic component are conductively connected.

According to a third aspect of the present invention, a plurality of ceramic green sheets on which a predetermined conductor pattern or conductor pattern and through holes are formed are laminated, and a mounting object is mounted on the surface of the laminated body of the ceramic green sheets. Through holes are formed corresponding to the connecting terminal electrodes formed on the bottom surface of the electronic component, and a heat-burnable sheet filled with a conductive connecting material is stacked in the through holes. Further, the ceramic green sheet and the heat-disintegratable sheet are pressure-bonded and then fired at a predetermined temperature. As a result, the heat-burnable sheet is burned off, and a ceramic multilayer substrate having an electrode integrally formed with a convex portion having a predetermined height on the surface is obtained. When mounting the electronic component on the ceramic multilayer substrate, the convex portion integrally formed with the electrode is used as a bump, and the electrode and the connection terminal electrode of the electronic component are conductively connected.

According to a fourth aspect of the present invention, a plurality of ceramic green sheets each having a predetermined conductor pattern and through holes are laminated, and an electronic object to be mounted is mounted on the surface of the laminated body of the ceramic green sheets. Through holes are formed corresponding to the connecting terminal electrodes formed on the bottom surface of the component, and a heat-burnable sheet filled with a conductive connecting material is laminated in the through holes. Further, the ceramic green sheet and the heat-disintegratable sheet are pressure-bonded and then fired at a predetermined temperature. As a result, the heat-burnable sheet is burned off, and a ceramic multilayer substrate having a projection electrode of a predetermined height integrally formed on the surface is obtained. When mounting the electronic component on the ceramic multilayer substrate, the protruding electrode is used as a bump, and the protruding electrode and the connection terminal electrode of the electronic component are conductively connected.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external view showing a ceramic multilayer substrate of a first embodiment of the present invention, and FIG. 2 is a side sectional view thereof. In the figure, 1 is a ceramic multi-layer substrate, on the surface of which,
A plurality of protruding electrodes 1a are integrally formed at positions corresponding to terminal electrodes (not shown) for connection formed on the bottom surface of a semiconductor integrated circuit (IC) 2 to be mounted. Further, these protruding electrodes 1a are connected to the conductor pattern 1c formed on the inner layer portion of the ceramic multilayer substrate 1 through through holes 1b.

The method of manufacturing the above-mentioned ceramic multilayer substrate 1 is as follows. First, as shown in FIG. 3, a resin sheet 4 having a thickness of 30 μm formed by kneading an ethylcellulose solvent on a base film 3 having a poor light absorption rate to form a sheet.
Then, the films 5 having a good light absorption rate are sequentially stacked. This is irradiated with laser light 6 to form a hole 7 having a diameter of 50 μm that penetrates the film 5 and the resin sheet 4.

Next, Ag-Pd electrode paste 8 is applied on top of this.
Then, the hole 7 is filled with the Ag—Pd electrode paste 8 with the squeegee 9 to form the electrode 10.

Thereafter, as shown in FIG. 4, the resin sheet 4 from which the upper and lower films 3 and 5 are peeled off and the ceramic green sheet 11 having the through holes 1b and the internal conductor patterns 1c formed thereon are laminated and then pressure-bonded. To form a laminate.

Then, by firing this laminated body, the insulating ceramics of the ceramic green sheet 11 and the paste of the through holes 1b, the conductor patterns 1c, and the electrodes 10 are sintered, and the resin sheet 4 is burned off. The ceramic multilayer substrate 1 integrally formed with the protruding electrodes 1a is completed.

When the semiconductor integrated circuit 2 is mounted on the ceramic multilayer substrate 1, a thermosetting conductive adhesive is pin-transferred to the protruding electrodes 1a of the ceramic multilayer substrate 1 so that the protruding electrodes 1a and the semiconductor integrated circuit 2 are connected to each other. After aligning with the terminal electrode 2a, the semiconductor integrated circuit 2 is formed on the ceramic multilayer substrate 1.
Is mounted and baked at a temperature of 150 ° C., so that the terminal electrode 2a of the semiconductor integrated circuit 2 and the protruding electrode 1a are conductively connected.

The resin sheet 4 on the surface when the ceramic multilayer substrate 1 is formed is the ceramic green sheet 11
Any material can be used, as long as it is in close contact with, and burns off during firing, and may be, for example, PET film or paper. The electrode 10 may be formed on the resin sheet 4 by using a method such as plating or vapor deposition.

Next, a second embodiment of the present invention will be described.
FIG. 5 is an external view showing a ceramic multilayer substrate of the second embodiment, and FIG. 6 is a side sectional view thereof. In the figure, reference numeral 20 denotes a ceramic multilayer substrate (hereinafter referred to as a substrate), which includes insulator layers 20a and 20b, a magnetic layer 20c, and a dielectric layer 20.
It is configured by laminating d.

The coil pattern 2 is provided inside the magnetic layer 20c.
1, a capacitor counter electrode 22 is formed inside the dielectric layer 20d, and a resistor 24 conductively connected to a surface electrode 23 is mounted on the back surface of the substrate 20. Further, on the surface of the substrate 20, there are provided an Au protruding electrode 26a integrally formed on the through hole 25 connected to the capacitor counter electrode 22 and the like and an Au protruding electrode 26b (convex portion) integrally formed on the surface electrode 27. It is provided. Further, an external electrode 28 that is conductively connected to the surface electrodes 23, 27 and the like is formed on the side surface of the substrate 20.

The method for manufacturing the above-mentioned ceramic multilayer substrate 20 is as follows. First, as shown in FIG.
As in the first embodiment, a base film having a poor light absorption rate was kneaded with an ethyl cellulose solvent to form a sheet having a thickness of 3
A 0 μm resin sheet and a film having a good light absorption rate are sequentially stacked. This is irradiated with a laser beam to form a hole 7 having a diameter of 50 μm that penetrates the film and the resin sheet having a good light absorption rate. Next, the Au electrode 31 is plated inside the hole.
a is formed.

After that, the resin sheet 31 from which the upper and lower films are peeled off, the through hole 25, and the internal conductor pattern 20.
e, the surface electrodes 23 and 27, the capacitor counter electrode 22, and the like, an insulating ceramic green sheet 32 in which a conductive paste is formed, a through hole 25, and a coil pattern 21.
A ferrite ceramic green sheet 33 having a conductive paste and the like, a through hole 25, a dielectric ceramic green sheet 34 having a capacitor counter electrode 22 and the like formed of a conductive paste are laminated and then pressure-bonded to form a laminated body.

Next, by firing this laminated body, the ceramics of the respective ceramic green sheets 32, 33 and 34, the through holes 25, and the internal conductor patterns 20.
The resin paste 31 is burned off as the electrode pastes such as e, the coil pattern 21 and the capacitor counter electrode 22 are sintered, so that the ceramic multilayer substrate 20 having the Au protruding electrodes 26a and 26b integrally formed on the surface is completed.

When mounting the semiconductor integrated circuit 2 on the ceramic multilayer substrate 20 as shown in FIG. 8, the Au protruding electrodes 26a and 26b of the ceramic multilayer substrate 20 and the terminal electrodes 2a of the semiconductor integrated circuit 2 are aligned with each other. After that, the semiconductor integrated circuit 2 is mounted on the ceramic multilayer substrate 20, and the Au protruding electrodes 26a and 26b are heated while applying pressure. Also, in some cases, ultrasonic waves are applied. As a result, the terminal electrode 2a of the semiconductor integrated circuit 2 and the Au protruding electrode 2 are
6a and 26b are conductively connected.

The resin sheet 31 on the surface when the ceramic multi-layer substrate 20 is manufactured may be one that adheres to the insulating ceramic green sheet 32 and burns off during firing, and may be, for example, PET film or paper. good. The Au electrode 31a may be formed on the resin sheet 31 by using a method such as vapor deposition.

[0029]

As described above, according to the first aspect of the present invention, the convex portion integrally formed with the electrode on the surface of the substrate is used as the bump, and the electrode and the connecting terminal electrode for the electronic component are conductively connected. Therefore, the step of mounting the electronic component on the substrate is greatly simplified, and the pitch of the connecting terminal electrodes of the electronic component can be formed narrow.

According to the second aspect of the present invention, the bump electrode integrally formed on the surface of the substrate is used as a bump, and the bump electrode and the connection terminal electrode of the electronic component are conductively connected. The mounting process of is greatly simplified. Further, since the projecting electrodes are connected to the conductor pattern of the inner layer portion by the through holes, the intervals between the projecting electrodes can be narrowed, and thus the pitch of the connection terminal electrodes of the electronic component can be narrowed. It is possible to increase the density of electronic parts.

According to the third aspect of the present invention, since the heat-burnable sheet is burnt out during firing, it is possible to easily form a ceramic multilayer substrate having an electrode on the surface of which convex portions having a predetermined height are integrally formed. Therefore, the manufacturing process can be simplified and the manufacturing cost can be kept low.

Further, according to the present invention, since the heat-burnable sheet is burned off during firing, it is possible to easily form a ceramic multilayer substrate having protruding electrodes of a predetermined height on the surface. It can be simplified and the manufacturing cost can be kept low.

[Brief description of drawings]

FIG. 1 is an external view showing a ceramic multilayer substrate according to a first embodiment of the present invention.

FIG. 2 is a side sectional view showing the ceramic multilayer substrate of the first embodiment.

FIG. 3 is a diagram illustrating a procedure for manufacturing a resin sheet according to the first embodiment.

FIG. 4 is a view for explaining the manufacturing procedure of the ceramic multilayer substrate of the first embodiment.

FIG. 5 is an external view showing a ceramic multilayer substrate according to a second embodiment of the present invention.

FIG. 6 is a side sectional view showing a ceramic multilayer substrate according to a second embodiment.

FIG. 7 is a diagram illustrating a manufacturing procedure of the ceramic multilayer substrate according to the second embodiment.

FIG. 8 is a diagram showing a component mounting state in the second embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Ceramic multilayer substrate, 1a ... Projection electrode, 1b ... Through hole, 1c ... Conductor pattern, 2 ... Semiconductor integrated circuit,
2a ... Terminal electrode, 3 ... Base film, 4 ... Resin sheet, 5 ... Film, 6 ... Laser light, 7 ... Hole, 8 ... Electrode paste, 9 ... Squeegee, 10 ... Electrode, 11 ... Ceramic green sheet, 12 ... Conductivity Adhesive, 20 ... Ceramic multilayer substrate, 20a, 20b ... Insulator layer, 20c ... Magnetic layer, 20d ... Dielectric layer, 20e ... Internal conductor pattern,
21 ... Coil pattern, 22 ... Capacitor counter electrode, 2
3 ... Surface electrode, 24 ... Resistor, 25 ... Through hole, 2
6a, 26b ... Au bump electrode, 27 ... Surface electrode, 28 ...
External electrode.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 23/13 23/12 H05K 1/18 J 8718-4E

Claims (4)

[Claims] 1. A ceramic multi-layer substrate for mounting electronic components, such as a semiconductor integrated circuit, on a surface of which an electrode for connecting electronic components formed on the surface corresponding to a connecting terminal electrode of the electronic component is provided. A ceramic multilayer substrate for electronic component mounting, wherein the electrode is integrally formed with a protrusion having a predetermined height. 2. A ceramic multilayer substrate for mounting an electronic component, such as a semiconductor integrated circuit, on a surface of which a protrusion having a predetermined height is integrally formed on the surface corresponding to a connecting terminal electrode of the electronic component. A ceramic multilayer substrate for mounting electronic parts, comprising an electrode, and the protruding electrode is connected to a conductor pattern formed in an inner layer portion by a through hole. 3. A method for manufacturing a ceramic multilayer substrate for mounting electronic components, which mounts electronic components such as semiconductor integrated circuits on a surface thereof, comprising a plurality of ceramic green sheets having predetermined conductor patterns or conductor patterns and through holes. And through-holes are formed on the surface of the laminated body of the ceramic green sheets corresponding to the connection terminal electrodes formed on the bottom surface of the electronic component, and the through-holes are filled with the conductive connection material. The heat-burnable sheet is laminated, the ceramic green sheet and the heat-burnable sheet are pressure-bonded, and then fired at a predetermined temperature, and the heat-burnable sheet is burned to form a convex surface having a predetermined height. A method of manufacturing a ceramic multilayer substrate for mounting electronic components, comprising: obtaining a ceramic multilayer substrate having electrodes integrally formed with a portion. 4. A method of manufacturing a ceramic multilayer substrate for mounting electronic parts, such as mounting an electronic part such as a semiconductor integrated circuit on a surface, comprising laminating a plurality of ceramic green sheets having predetermined conductor patterns and through holes. At the same time, a through hole is formed on the surface of the laminated body of the ceramic green sheets corresponding to the connecting terminal electrode formed on the bottom surface of the electronic component, and the through hole is filled with a conductive connecting material. By stacking burn-off sheets, press-bonding the ceramic green sheet and the heat-burn out sheet, and then firing at a predetermined temperature to burn out the heat-burnable sheet, thereby providing a protruding electrode with a predetermined height on the surface. A method for manufacturing a ceramic multilayer substrate for mounting electronic components, which comprises obtaining a ceramic multilayer substrate.