JPH0839976A - Card having coil enabling embossing - Google Patents

Abstract

PURPOSE:To permit the pressure deformation of a coil at the time of the carving of a projection part such as a character due to embossing and to prevent the cutting of the wire material in the coil by arranging a means permitting the pressure deformation of the coil built in the emboss region of a card caused by embossing. CONSTITUTION:A data card 2 is formed by bonding two plate members 4 by an adhesive 8. A semiconductor device 10 for processing data and a coil 12 for inputting and outputting data are built in the space between both plate members 4. The coil 12 is formed by winding a wire material 14 in a spiral form. An emboss region 16 is set to the card 2 and a projection part 18 such as a character is carved in the emboss region 16 by embossing. In this case, the coil 12 built in at the position of the projection part 18 is subjected to pressure deformation and, in order to prevent the cutting of the wire material 14, a pressure deformation permitting means is arranged. That is, a inclined part 20 is arranged to the coil 12 and inclined with respect to the shape of the projection part 18 in order to permit the pressure deformation caused by embossing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card having an embossable coil, and more particularly to a card having an embossed coil that does not cut the built-in coil even if the card is embossed. Regarding cards.

[0002]

2. Description of the Related Art Recently, an information card (IC card) having an information calculation function, an information storage function, an information input / output function of an individual or a group has been widely used. As such a card, there is one shown in FIGS.

The card 102 shown in FIGS. 8 and 9 is formed by adhering two flat plate members 104 and 106 with an adhesive 108. Between the two plate members 104 and 106, an information processing semiconductor device 110 having a circuit configuration for processing information and an information input / output coil 112 wound in a spiral for inputting / outputting information. , Etc. are built in.

The coil 112 is formed by spirally winding a wire 114. As a result, the card 102
It has a computing function for information such as individuals and groups, a memory function, and an information input / output function.

[0005]

By the way, the card 10
In No. 2, the protrusions 118 such as letters and numbers are stamped on the embossed region 116 by embossing. For example, the card 102 shown in FIG. 8 has two embossed areas 1 including a first embossed area 116-1 and a second embossed area 116-2.
16 are provided. Although not shown on the card,
Some have one embossed area.

However, in the card 102, when the protrusions 118 such as characters are stamped on the plate members 104 and 106 by embossing, the coil 112 built in at the position of the protrusions 118 in the embossed region 116 is pressed and deformed, There was the inconvenience of being disconnected. As a countermeasure, the embossed area 116
It is conceivable to avoid the above and incorporate the coil 112.

However, the inclusion of the coil 112 while avoiding the embossed region 116 has a problem that the coil 112 must be reduced in diameter because the region in which the coil 112 is incorporated is narrowed. Therefore, the coil 11
In order to secure the required length, 2 must be formed by superposing and winding in multiple spirals in the winding axis direction, and the thickness becomes large, and the thickness of the card 102 itself becomes large. was there.

[0008]

Therefore, in order to eliminate the above-mentioned inconvenience, the present invention provides a card having a semiconductor device for information processing and a coil for information input / output between two plate members. A deformation permitting means for permitting the press deformation due to the embossing of the coil built in the embossing area of the card is provided.

[0009]

According to the structure of the present invention, the card is provided with the deformation permitting means for permitting the press deformation due to the embossing of the coil incorporated in the embossing area, so that the protrusions such as characters are struck on the plate member by the embossing. It is possible to allow pressing deformation of the coil incorporated in the embossed region when carving, and prevent cutting.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a first embodiment of the present invention. In the figure, 2 is an information card (IC card). The card 2 is formed by adhering two flat plate members 4 and 6 with an adhesive 8.

Between the two plate members 4 and 6, there are a semiconductor device 10 for information processing, which has a circuit structure for processing information, and a spirally wound information input / output for inputting / outputting information. Parts such as the coil 12 are built in.

The coil 12 is formed by winding the wire rod 14 into a single substantially annular spiral shape with a thickness of the diameter d of the wire rod 14 without overlapping the wire rod 14 in the winding axis direction. As a result, the card 2 has a calculation function for information such as an individual or a group, a storage function, and an input / output function for information.

The card 2 is provided with an embossed area 16. In this embodiment, the first embossed region 16-1 and the second embossed region 1 are used as the embossed region 16.
6-2 is provided. The plate members 4 and 6 in the embossed region 16 are embossed with protrusions 18 such as characters.

In such a card 2, in order to prevent the coil 12 built in at the position of the protruding portion 18 of the embossed region 16 from being pressed and deformed and cut, the deformation permitting means for allowing the press deformation by the embossing. Is provided.

In the first embodiment, the coil 12 is provided with the inclined portion 20 as the deformation permitting means. Slope 2
0 is arranged so as to be inclined with respect to the shape of the protrusion 18 stamped by the embossing so as to allow the pressing deformation of the coil 12 due to the embossing.

That is, the inclined portion 20 is built in the embossed region 16 so as to be arranged so as to be inclined with respect to the shape of the character or the like forming the protruding portion 18.

As described above, the card 2 has the embossed area 1
As the deformation permitting means for permitting the pressing deformation of the coil 12 built in 6 by the embossing, the inclined portion 20 inclined with respect to the shape of the protrusion 18 stamped by the embossing.
By providing the embossed area, the embossed area 16 when the protrusions 18 such as characters are stamped on the plate members 4 and 6 by embossing
Since the inclined portion 20 of the coil 12 incorporated in the coil is allowed to be pressed and deformed, the wire 14 can be prevented from being cut.

Therefore, in this card 2, the coil 12 incorporated therein is not cut even when embossed.
In addition, this card 2 does not need to avoid the embossed area 16 and incorporate the coil 12, and it is possible to avoid the area in which the coil 12 is incorporated being narrowed. Therefore, in this card 2, it is not necessary to reduce the diameter of the coil 12, and
It is not necessary to superpose and form a plurality of spirals in the winding axis direction in order to secure the required length, and it is possible to avoid the disadvantage that the thickness of the card 2 itself becomes large due to the large thickness.

3 to 7 each show another embodiment of the present invention. In each of the following embodiments, the portions having the same functions as those of the first embodiment will be described with the same reference numerals. That is, in the figure, 2 is an information card (IC card), 4 and 6 are flat plate members, 8 is an adhesive, 10 is a semiconductor device, 12 is a coil, 14 is a wire rod, 1
6 is an embossed area, 16-1 is a first embossed area, 16
-2 is a 2nd embossing area | region, 18 is a protrusion part.

In the card 2 of the second embodiment shown in FIG. 3, the coil 12 contained in the embossed area 16 is pressed and deformed,
In order to prevent cutting, the coil 12 is provided with a stretched portion 22 as a deformation permitting means for permitting press deformation due to embossing.

The extending portion 22 is a flat plate member 4 with respect to the protruding direction of the protruding portion 18 stamped by the embossing so that the coil 12 can be pressed and deformed by the embossing.
-It is formed in a substantially S-shape that is continuously curved in a direction parallel to the surface of 6.

As described above, the card 2 has the embossed area 1
As the deformation permitting means for permitting the pressing deformation of the coil 12 built in 6 by the embossing, the plate member 4 having a flat plate shape with respect to the projecting direction of the protrusion 18 stamped by the embossing.
By providing the extending portion 22 formed in a substantially S shape that is continuously curved in the direction parallel to the surface of 6, the embossed region when the protrusions 18 such as letters are stamped on the plate members 4 and 6 by embossing The extension part 22 of the coil 12 contained in the coil 16 is allowed to be pressed and deformed, and the wire 14 can be prevented from being cut.

Therefore, in this card 2, the coil 12 incorporated therein is not cut even if embossed.
In addition, this card 2 does not need to avoid the embossed area 16 and incorporate the coil 12, and it is possible to avoid the area in which the coil 12 is incorporated being narrowed. Therefore, in this card 2, it is not necessary to reduce the diameter of the coil 12, and
It is not necessary to superpose and form a plurality of spirals in the winding axis direction in order to secure the required length, and it is possible to avoid the disadvantage that the thickness of the card 2 itself becomes large due to the large thickness.

FIG. 4 shows a modification of the second embodiment of the present invention. In the card 2 shown in FIG. 4, in order to prevent the coil 12 contained in the embossed region 16 from being pressed and deformed and cut, the extending portion 24 of the coil 12 is provided as a deformation permitting unit that allows the press-deformed by embossing. Is provided.

The extending portion 24 allows the coil 12 to be pressed and deformed by embossing, so that the plate member 4 having a flat plate shape with respect to the protruding direction of the protruding portion 18 stamped by embossing.
-It is formed in a substantially S-shape that is continuously curved in a direction orthogonal to the surface of 6.

As described above, the card 2 has the embossed area 1
As the deformation permitting means for permitting the pressing deformation of the coil 12 built in 6 by the embossing, the plate member 4 having a flat plate shape with respect to the projecting direction of the protrusion 18 stamped by the embossing.
By providing the extending portion 24 that is formed in a substantially S shape that is continuously curved in the direction perpendicular to the surface of 6, the embossed area when the protrusions 18 such as letters are stamped on the plate members 4 and 6 by embossing The extension part 24 of the coil 12 contained in the coil 16 is allowed to be pressed and deformed, and the wire 14 can be prevented from being cut.

Therefore, in this card 2, the coil 12 incorporated therein is not cut even when embossed.
In addition, this card 2 does not need to avoid the embossed area 16 and incorporate the coil 12, and it is possible to avoid the area in which the coil 12 is incorporated being narrowed. Therefore, in this card 2, it is not necessary to reduce the diameter of the coil 12, and
It is not necessary to superpose and form a plurality of spirals in the winding axis direction in order to secure the required length, and it is possible to avoid the disadvantage that the thickness of the card 2 itself becomes large due to the large thickness.

FIG. 5 shows a third embodiment of the present invention. The card 2 shown in FIG. 5 is non-bonded to the embossed area 16 as a deformation permitting means for allowing the pressure deformation due to embossing in order to prevent the coil 12 contained in the embossed area 16 from being pressed and deformed and cut. A section 26 is provided.

The non-adhesive portion 26 does not apply the adhesive 8 for adhering the two flat plate members 4 and 6 in the embossed region 16 in order to allow the press deformation due to the embossing of the coil 12. The non-bonded state and the embossed area 16
The coil 12 is provided so as to be movable in a direction parallel to the surfaces of the plate members 4 and 6.

As described above, the card 2 has the embossed area 1
As the deformation permitting means for permitting the press deformation due to the embossing of the coil 12 built in the coil 6, the coil 12 is not adhered to the embossed region 16 without applying the adhesive 8 and is parallel to the surfaces of the plate members 4 and 6. By providing the non-adhesive portion 26 to enable movement in the direction, when the protrusions 18 such as letters are stamped on the plate members 4 and 6 by embossing,
The coil 12 built in the embossed area 16 is formed by the plate member 4
6 is allowed to be pressed and deformed in the direction parallel to the surface, and the wire 14 can be prevented from being cut.

Therefore, in this card 2, the coil 12 incorporated therein is not cut even when embossed.
In addition, this card 2 does not need to avoid the embossed area 16 and incorporate the coil 12, and it is possible to avoid the area in which the coil 12 is incorporated being narrowed. Therefore, in this card 2, it is not necessary to reduce the diameter of the coil 12, and
It is not necessary to superpose and form a plurality of spirals in the winding axis direction in order to secure the required length, and it is possible to avoid the disadvantage that the thickness of the card 2 itself becomes large due to the large thickness.

FIG. 6 shows a fourth embodiment of the present invention. The card 2 shown in FIG. 6 has a gap around the coil 12 as a deformation permitting means for permitting the press deformation due to embossing in order to prevent the coil 12 contained in the embossed region 16 from being pressed and deformed and cut. A section 28 is provided.

In order to allow the pressing deformation of the coil 12 due to the embossing of the coil 12, the gap 28 is not applied without applying the adhesive 8 for adhering the two flat plate members 4 and 6 in the embossed region 16. It is provided in a bonded state so that the coil 12 in the embossed region 16 can move in a direction perpendicular to the surfaces of the plate members 4 and 6.

As described above, the card 2 has the embossed area 1
As the deformation permitting means for permitting the press deformation due to the embossing of the coil 12 built in the coil 6, the adhesive 8 is not applied to the embossed region 16 and the coil 12 is in a non-bonded state and is perpendicular to the surfaces of the plate members 4 and 6 of the coil 12. Since the gap 28 is provided around the coil 12 so as to be movable in the direction, the protrusions 18 such as letters are formed on the plate members 4 and 6 by embossing.
The coil 12 built in the embossed region 16 is allowed to be pressed and deformed in a direction perpendicular to the surfaces of the plate members 4 and 6 when the stamp is stamped, and the wire 14 can be prevented from being cut.

Therefore, in this card 2, the coil 12 incorporated therein is not cut even when embossed.
In addition, this card 2 does not need to avoid the embossed area 16 and incorporate the coil 12, and it is possible to avoid the area in which the coil 12 is incorporated being narrowed. Therefore, in this card 2, it is not necessary to reduce the diameter of the coil 12, and
It is not necessary to superpose and form a plurality of spirals in the winding axis direction in order to secure the required length, and it is possible to avoid the disadvantage that the thickness of the card 2 itself becomes large due to the large thickness.

In order to allow the press deformation due to the embossing of the coil 12, the card 2 is not applied without applying the adhesive 8 for adhering the two flat plate-shaped plate members 4 and 6 in the embossed region 16. As shown in FIG. 7, not only the gap 28 that allows the coil 12 in the embossed region 16 to move in a direction perpendicular to the surface of the plate members 4 and 6 but also the surface of the plate members 4 and 6 of the coil 12 as shown in FIG. The gap portion 30 may be provided so as to allow movement in a direction parallel to.

That is, the coils 12 in the embossed area can be moved in the directions perpendicular to and parallel to the surfaces of the plate members 4 and 6 by providing the gaps 28 and 30 in the periphery to make the array sparse. The range of pressing deformation can be expanded, and cutting can be prevented more reliably.

The present invention is not limited to the above-mentioned embodiments, and it is needless to say that various application modifications can be made.

For example, in the card 2, the extending portions 22 and 24 provided in the coil 12 of the embossed area 16 of the second embodiment are surrounded by the directions perpendicular to and parallel to the surfaces of the plate members 4 and 6 of the fourth embodiment. By providing the gap portions 28 and 30 that allow the coil 12 to move to the position, the pressing deformation due to the embossing of the coil 12 can be more favorably allowed, and the cutting of the coil 12 can be further reliably prevented.

In the card 2, as in the second embodiment, the coil 12 in the embossed area 16 is provided with the extending portions 22 and 24 and the non-adhesive portion 26 in the third embodiment is provided. By embedding the coil 12 by providing the gap portions 28 and 30 around the provided extending portions 22 and 24, which allow the planes of the plate members 4 and 6 of the fourth embodiment to move in the perpendicular direction and the parallel direction. The pressing deformation can be better tolerated and the cutting of the coil 12 can be prevented more reliably.

Of course, in the card 2, the inclined portion 20 is provided in the coil 12 of the embossed area 16 of the first embodiment, the non-bonded portion 26 of the third embodiment is provided in the embossed area 16, and Around the extension portions 22 and 24 provided in the coil 12, the gap portion 2 that allows movement of the surfaces of the plate members 4 and 6 of the fourth embodiment in the perpendicular direction and the parallel direction.
By providing 8.30, the press deformation due to the embossing of the coil 12 can be allowed more favorably, and the cutting of the coil 12 can be prevented more reliably.

That is, in the card 2 of the present invention, the inclined portion 20, the extending portions 22 and 24, the non-adhesive portion 26, and the gap portions 28 and 30 shown in the first to fourth embodiments can be combined. Thus, the cutting of the coil 12 can be prevented more reliably.

[0043]

As described above, according to the present invention, the card is provided with the deformation permitting means for permitting the press deformation due to the embossing of the coil incorporated in the embossing area, so that the embossing causes the plate member to have characters and the like. When the protrusion is stamped, the coil included in the embossed region can be pressed and deformed, and cutting can be prevented.

Therefore, in this card, the coil incorporated therein is not cut even when embossed, and
There is no need to reduce the coil diameter, and there is no need to form multiple spiral windings in the winding axis direction to secure the required length of the coil. It is possible to avoid the inconvenience that becomes large.

[Brief description of drawings]

FIG. 1 is a plan view of a card showing a first embodiment of the present invention.

2 is a side view of the card of FIG. 1. FIG.

FIG. 3 is a plan view of a card showing a second embodiment of the present invention.

FIG. 4 is an enlarged sectional view of a main part of a card showing a modified example of the second embodiment of the present invention.

FIG. 5 is an enlarged cross-sectional view of a main part of a card showing a third embodiment of the present invention.

FIG. 6 is an enlarged sectional view of a main part of a card showing a fourth embodiment of the present invention.

FIG. 7 is an enlarged plan view of an essential part of a coil showing a modification of the fourth embodiment of the present invention.

FIG. 8 is a plan view of a card showing a conventional example.

9 is a side view of the card of FIG. 8. FIG.

[Explanation of symbols]

 2 Cards 4/6 Plate Member 8 Adhesive 10 Semiconductor Device 12 Coil 14 Wire Rod 16 Embossing Area 18 Projection 20 Inclined Part 22 Extending Part 24 Extending Part 26 Non-Adhesive Part 28 Gap Part 30 Gap Part

Claims (5)

[Claims] 1. A card in which a semiconductor device for information processing and a coil for information input / output are built in between two plate members, and press deformation due to embossing of the coil built in the embossed area of this card is allowed. A card having a coil capable of embossing, which is provided with a deformation permitting means. 2. The deformation permitting means, wherein the coil is provided with an inclined portion that is inclined with respect to the shape of the protrusion stamped by the embossing so as to allow the pressing deformation due to the embossing of the coil. A card having an embossable coil according to claim 1. 3. The card having a coil capable of embossing according to claim 1, wherein the deformation permitting means is provided with an extension portion in the coil to allow the pressing deformation by the embossing of the coil. . 4. The embossable coil according to claim 1, wherein the deformation permitting means is provided with a non-adhesive portion in the embossed region so as to allow press deformation due to embossing of the coil. Card to have. 5. The embossable coil according to claim 1, wherein the deformation permitting means is provided with a gap portion around the coil to allow the press deformation due to the embossing of the coil. Card to have.