JPH0832120A - Surface emission type display - Google Patents

Surface emission type display

Info

Publication number
JPH0832120A
JPH0832120A JP6166771A JP16677194A JPH0832120A JP H0832120 A JPH0832120 A JP H0832120A JP 6166771 A JP6166771 A JP 6166771A JP 16677194 A JP16677194 A JP 16677194A JP H0832120 A JPH0832120 A JP H0832120A
Authority
JP
Japan
Prior art keywords
resin
elements
wiring
section
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6166771A
Other languages
Japanese (ja)
Inventor
Eiji Osawa
英治 大澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP6166771A priority Critical patent/JPH0832120A/en
Publication of JPH0832120A publication Critical patent/JPH0832120A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Liquid Crystal (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Light Guides In General And Applications Therefor (AREA)

Abstract

PURPOSE:To provide a structure from which desired emission luminance can be obtained for a surface emission type display composed of light emitting diodes used as light sources, etc., for back light of liquid crystal display devices. CONSTITUTION:A plurality of light emitting diode elements 2 are fitted in a matrix-like state to one main surface of a substrate 1 on which necessary wiring is formed and which is composed of a glass epoxy resin, etc. The elements 2 are mounted on the wiring at prescribed positions and one electrodes of the elements 2 are electrically connected with the wiring. The other electrodes of the elements 2 are electrically connected in suitable states to the wiring through wires 2a, etc. A resin injecting section 4 is formed around the elements 2 by fitting a reflecting plate 3 composed of a white resin to the substrate 1 around the elements 2 so as to surround the elements 2 and a protective layer 5 is formed in the resin injecting section 4 by injecting a transparent or translucent resin, such as the epoxy, silicon, etc., containing a milky white diffusing agent into the resin injecting section and hardening the resin. In addition, a continuous groove section 6 is formed on the upper surface of the reflecting plate 3 so that the section 6 can surround the section 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば液晶表示装置の
バックライト用の光源等として用いる発光ダイオードに
よる面発光表示器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface emitting display using a light emitting diode used as a light source for a backlight of a liquid crystal display device, for example.

【0002】[0002]

【従来の技術】従来、この種の面発光表示器としては、
例えば図7及び図8に示すような構造が提案されてい
る。符号11はガラスエポキシ樹脂等からなる基板を示
し、当該基板の一主面上には、本図面には図示されな
い、必要な配線が厚膜配線技術等により形成されてい
る。符号12は、発光ダイオード素子を示し、当該発光
ダイオード素子は前記配線の所定の位置に搭載されて一
方の電極と前記配線とが電気的に接続される一方、当該
発光ダイオード素子の他方の電極と前記配線とは適宜ワ
イヤー12a等の手段により電気的に接続される。ま
た、符号13は、発光ダイオード素子12の周囲に、ポ
リマー、ポリカーボネイト等の白色樹脂より形成された
反射板を示し、更に符号15は、反射板13内側の樹脂
注入部14に、乳白色の拡散剤を含む透明または半透明
のエポキシまたはシリコン等の樹脂を注入、固化して形
成された保護層を示す。
2. Description of the Related Art Conventionally, as a surface emitting display of this type,
For example, a structure as shown in FIGS. 7 and 8 has been proposed. Reference numeral 11 denotes a substrate made of glass epoxy resin or the like, and necessary wirings, which are not shown in the drawing, are formed on one main surface of the substrate by a thick film wiring technique or the like. Reference numeral 12 denotes a light emitting diode element, which is mounted at a predetermined position of the wiring so that one electrode and the wiring are electrically connected to each other and the other electrode of the light emitting diode element. The wiring is appropriately electrically connected by means such as a wire 12a. Reference numeral 13 indicates a reflector around the light emitting diode element 12, which is made of a white resin such as polymer or polycarbonate, and reference numeral 15 indicates a milk-white diffusing agent in the resin injection portion 14 inside the reflector 13. A protective layer formed by injecting and solidifying a transparent or semi-transparent epoxy resin containing silicon or the like is shown.

【0003】このような面発光表示器においては、発光
ダイオード素子12が発光し、保護層15内で拡散され
た光が直接的に、または反射板13により反射されて間
接的に保護層15の上面に出ていくことになる。
In such a surface emitting display, the light emitting diode element 12 emits light, and the light diffused in the protective layer 15 is directly or indirectly reflected by the reflecting plate 13 in the protective layer 15. It will be on the top.

【0004】[0004]

【発明が解決しようとする課題】上記従来の発光ダイオ
ード素子による面発光表示器は、例えば次のような方法
で作成される。まず、基板11上に必要な配線を形成し
た後、発光ダイオード素子12を前記配線上の所定の位
置に搭載して一方の電極と前記配線とを接続する一方、
他方の電極と前記配線とを適宜ワイヤー12a等で接続
する。次に発光ダイオード素子12を取り囲むように、
ポリマー、ポリカーボネイト等の樹脂より反射板13を
形成し、最後に、反射板13内側の樹脂注入部14に、
乳白色の拡散剤を含むエポキシまたはシリコン等の樹脂
を注入、固化して保護層15を形成する。
The conventional surface emitting display using the above-described light emitting diode element is manufactured by the following method, for example. First, after forming necessary wiring on the substrate 11, the light emitting diode element 12 is mounted at a predetermined position on the wiring to connect one electrode to the wiring,
The other electrode is appropriately connected to the wiring by a wire 12a or the like. Next, so as to surround the light emitting diode element 12,
The reflector 13 is formed of a resin such as polymer or polycarbonate, and finally, in the resin injection portion 14 inside the reflector 13,
A resin such as epoxy or silicon containing a milky white diffusing agent is injected and solidified to form the protective layer 15.

【0005】この際、反射板13内側の樹脂注入部14
へのエポキシまたはシリコン等の樹脂注入は、従来から
作業者による手作業で行われているため、樹脂注入部1
4への樹脂注入量は、反射板13の上面13aと、注入
される樹脂の上面15aが略同一の高さになるよう、目
分量で調整されている。しかしながら、作業者が目分量
で注入する以上、樹脂の注入量にどうしてもバラツキが
生じ、その結果、製品間における発光輝度のバラツキが
生じるという問題が生じていた。例えば、図9(a)に
示すように樹脂注入量が多くなると発光輝度が高くな
り、図9(b)に示すように樹脂注入量が少なくなると
発光輝度が低くなる。また、樹脂注入量が多くなり過ぎ
ると反射板13の内側に樹脂が溢れ出てしまうという問
題もあった。 本発明は、これらの問題を解消できるよ
うにした面発光表示器の構造を提供することを技術的課
題とするものである。
At this time, the resin injection portion 14 inside the reflection plate 13
Since resin injection of epoxy or silicone into the resin has been conventionally performed manually by an operator, the resin injection part 1
The amount of resin injected into the resin 4 is adjusted by the amount of division such that the upper surface 13a of the reflection plate 13 and the upper surface 15a of the injected resin have substantially the same height. However, since the worker injects the resin in a proper amount, the resin injection amount inevitably varies, and as a result, the emission brightness varies among products. For example, as shown in FIG. 9A, the emission brightness becomes higher as the resin injection amount increases, and as the resin injection amount becomes smaller as shown in FIG. 9B, the emission brightness decreases. There is also a problem that the resin overflows to the inside of the reflection plate 13 when the resin injection amount becomes too large. It is a technical object of the present invention to provide a structure of a surface emitting display capable of solving these problems.

【0006】[0006]

【課題を解決するための手段】上記技術的課題を解決す
るため、本願発明では、次の技術的手段を講じている。
すなわち、本願の請求項1に記載した面発光表示器は、
配線が形成された基板上に搭載された発光ダイオード素
子と、前記発光ダイオード素子を取り囲むように形成さ
れた反射板と、前記反射板内側の樹脂注入部と、前記樹
脂注入部に樹脂を注入して形成された樹脂保護層とを備
える面発光表示器において、前記反射板の上面の少なく
とも一部に溝部を設けるようにしたことを特徴としてい
る。
In order to solve the above technical problems, the present invention takes the following technical measures.
That is, the surface emitting display according to claim 1 of the present application is
A light emitting diode element mounted on a substrate on which wiring is formed, a reflector formed so as to surround the light emitting diode element, a resin injection part inside the reflection plate, and a resin is injected into the resin injection part. In a surface emitting display including a resin protective layer formed as described above, a groove is provided on at least a part of the upper surface of the reflector.

【0007】また、本願の請求項2に記載した面発光表
示器は、請求項1記載の面発光表示器において、前記反
射板の上面に前記樹脂注入部を取り囲むように連続する
前記溝部を設けるようにしたことを特徴としている。更
に、本願の請求項3に記載した面発光表示器は、請求項
1または2記載の面発光表示器において、前記反射板の
上面の少なくとも一部に設けられた段差部に前記溝部を
設けるようにしたことを特徴としている。
Further, the surface emitting display according to claim 2 of the present application is the surface emitting display according to claim 1, wherein the continuous groove portion is provided on the upper surface of the reflector so as to surround the resin injection portion. It is characterized by doing so. Furthermore, in the surface emitting display according to claim 3 of the present application, in the surface emitting display according to claim 1 or 2, the groove is provided in a step provided on at least a part of the upper surface of the reflector. It is characterized by having done.

【0008】[0008]

【作用】以上のような構成にすることにより、請求項1
記載の発明によれば、前記樹脂保護層を形成するとき、
樹脂の過剰注入分を反射板の上面に設けた溝部がトラッ
プし、その結果、樹脂が溝部に流れ込んでいる間に注入
を止めれば、均一の厚みの保護層とし得る。
With the above-mentioned structure, the present invention can be realized.
According to the invention described, when forming the resin protective layer,
A groove provided on the upper surface of the reflector traps an excessive amount of injected resin, and as a result, if the injection is stopped while the resin is flowing into the groove, a protective layer having a uniform thickness can be obtained.

【0009】また、本願請求項2記載の発明によると、
樹脂の過剰注入分が樹脂注入部の全周囲に亘り形成され
た溝部に均一に流れ込んでいくので、反射板全周囲に亘
って、樹脂が反射板の外側に溢れ出ていくのを防止し得
る。更に、本願請求項3記載の発明によると、若干、溝
部に流れ込んだ樹脂量が多く、溝部においても樹脂が溢
れ出るような場合であっても、段差部における外壁部
が、溝部で溢れ出た樹脂が更に反射板の外側に溢れ出す
のを完全に遮断する。
According to the invention of claim 2 of the present application,
Excessive injection of resin uniformly flows into the groove formed over the entire circumference of the resin injection portion, so that the resin can be prevented from overflowing to the outside of the reflection plate over the entire circumference of the reflection plate. . Further, according to the invention of claim 3 of the present application, even when a large amount of resin has flowed into the groove and the resin overflows in the groove, the outer wall portion in the stepped portion overflows in the groove. It completely blocks the resin from overflowing to the outside of the reflector.

【0010】[0010]

【発明の効果】従って、本発明によれば、樹脂注入部に
注入される樹脂の量を一定に保つことができ、その結
果、発光輝度のバラツキの少ない面発光表示器を提供す
ることができるという効果を有する。
Therefore, according to the present invention, the amount of the resin injected into the resin injection portion can be kept constant, and as a result, it is possible to provide the surface emitting display with less variation in the emission brightness. Has the effect.

【0011】[0011]

【実施例】以下、本発明の実施例を図面を参照して説明
する。図1〜図3は本発明の実施例を示す。符号1はガ
ラスエポキシ樹脂等からなる基板を示し、基板1の一主
面上には複数の発光ダイオード素子2がマトリクス状に
取り付けられている。基板1の一主面上には本実施例に
は図示されていないが、発光ダイオード素子2を発光さ
せるのに必要な電源を導くための配線が厚膜配線技術等
により形成されており、発光ダイオード素子2は、前記
配線の所定の位置に搭載されて一方の電極と前記配線と
が電気的に接続される一方、当該発光ダイオード素子の
他方の電極と前記配線とが適宜ワイヤー2a等により電
気的に接続される。発光ダイオード素子2の周囲には、
ポリマー、ポリカーボネイト等からなる白色樹脂からな
る反射板3が発光ダイオード素子2を取り囲むように取
り付けられて樹脂注入部4が形成され、更に樹脂注入部
4に乳白色の拡散剤を含む透明または半透明のエポキ
シ、シリコン等の樹脂を注入、固化して保護層5が形成
される。また、反射板3の上面には、樹脂注入部4を取
り囲むように連続する溝部6が形成されている。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show an embodiment of the present invention. Reference numeral 1 denotes a substrate made of glass epoxy resin or the like, and a plurality of light emitting diode elements 2 are attached in a matrix on one main surface of the substrate 1. Although not shown in this embodiment, a wiring for guiding a power source required for causing the light emitting diode element 2 to emit light is formed on one main surface of the substrate 1 by a thick film wiring technique or the like, and The diode element 2 is mounted at a predetermined position of the wiring so that one electrode and the wiring are electrically connected, while the other electrode of the light emitting diode element and the wiring are electrically connected by a wire 2a or the like as appropriate. Connected. Around the light emitting diode element 2,
A reflector 3 made of a white resin made of polymer, polycarbonate or the like is attached so as to surround the light emitting diode element 2 to form a resin injection part 4, and the resin injection part 4 is made of a transparent or translucent material containing a milky white diffusing agent. Resin such as epoxy or silicon is injected and solidified to form the protective layer 5. Further, a continuous groove portion 6 is formed on the upper surface of the reflection plate 3 so as to surround the resin injection portion 4.

【0012】このような構成にすることにより、樹脂注
入部4に樹脂を注入する際に反射板3の高さを少し越え
る量の樹脂を注入すれば、図3に示すように、当該樹脂
の一部5bが溢れ出て溝部6に流れ込む。そして、溝部
6に樹脂が流れ込んでいる間に樹脂の注入を止めれば、
保護層5の表面5aと反射板3の表面3aの高さを略等
しくでき、均一厚さの保護層5を得ることができるので
ある。なお、反射板3の高さは所望の輝度が得られるよ
うに予め設定されている。
With such a structure, when injecting the resin into the resin injecting portion 4, if the amount of the resin slightly exceeding the height of the reflecting plate 3 is injected, as shown in FIG. Part 5b overflows and flows into the groove 6. Then, if the resin injection is stopped while the resin is flowing into the groove portion 6,
The heights of the surface 5a of the protective layer 5 and the surface 3a of the reflection plate 3 can be made substantially equal, and the protective layer 5 having a uniform thickness can be obtained. The height of the reflector 3 is set in advance so that a desired brightness can be obtained.

【0013】また、本実施例においては、反射板上面の
全周囲に亘り連続する溝部を形成した例を示したが、少
なくとも溢れ出た樹脂を吸収し得る程度の溝部を設ける
だけでも良い。更に、図4(a)または(b)に示すよ
うに、反射板上面に不連続の溝部61〜64(図4
(a)参照)または65〜68(図4(b)参照)を形
成しても良い。すなわち、図4(a)の場合、溢れ出た
樹脂5bを四隅の溝部61〜64に流入させ吸収するこ
とで、また、図4(b)の場合、溢れ出た樹脂5bを四
辺側の溝部65〜68に流入させ吸収することで、上記
実施例と同様に均一厚さの保護層5を得ることができ
る。
Further, in the present embodiment, the example in which the continuous groove portion is formed over the entire circumference of the upper surface of the reflection plate has been shown, but it is also possible to provide only a groove portion capable of absorbing at least overflowed resin. Further, as shown in FIG. 4A or 4B, the discontinuous groove portions 61 to 64 (see FIG.
(See (a)) or 65 to 68 (see FIG. 4B) may be formed. That is, in the case of FIG. 4A, the overflowed resin 5b is made to flow into and absorbed by the groove portions 61 to 64 at the four corners, and in the case of FIG. 4B, the overflowed resin 5b is absorbed into the groove portions on the four sides. By flowing into 65 to 68 and absorbing the same, the protective layer 5 having a uniform thickness can be obtained as in the above embodiment.

【0014】図5及び図6は本発明の別の実施例を示
す。上記本発明の図1の実施例同様、符号1は基板、符
号2は発光ダイオード素子、符号3は反射板、符号4は
樹脂注入部、符号5は保護層を示す。本実施例において
は、反射板3の一部に段差部3aが形成されており、更
に、段差部3aに溝部6が形成されている。このような
構成にすることにより、若干、溝部6に溝部6が吸収し
得る量を越えた過剰注入樹脂が流れ込んだとしても、溝
部6の過剰注入樹脂が表面張力で外壁部3bによって引
き寄せられるため、外壁部3bが防波堤の役割を果た
し、溝部6から溢れ出た樹脂が更に反射板3の外側に溢
れ出るのを完全に遮断することができるのである。
5 and 6 show another embodiment of the present invention. Similar to the embodiment of FIG. 1 of the present invention, reference numeral 1 is a substrate, reference numeral 2 is a light emitting diode element, reference numeral 3 is a reflector, reference numeral 4 is a resin injection portion, and reference numeral 5 is a protective layer. In this embodiment, the step portion 3a is formed on a part of the reflection plate 3, and the groove portion 6 is further formed on the step portion 3a. With such a configuration, even if the excess injected resin that slightly exceeds the amount that the groove 6 can absorb flows into the groove 6, the excess injected resin in the groove 6 is attracted by the outer wall portion 3b due to surface tension. The outer wall portion 3b serves as a breakwater, and it is possible to completely block the resin overflowing from the groove portion 6 from further overflowing to the outside of the reflection plate 3.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す平面図である。FIG. 1 is a plan view showing an embodiment of the present invention.

【図2】図1のIIーII断面図である。FIG. 2 is a sectional view taken along line II-II of FIG.

【図3】反射板上面に設けられた溝部に樹脂が流れ込ん
だ状態を示す、反射板部周辺の拡大断面図である。
FIG. 3 is an enlarged cross-sectional view of the periphery of the reflector plate, showing a state where resin has flowed into a groove provided on the upper surface of the reflector plate.

【図4】溝部の他の形成パターンを示す図である。FIG. 4 is a diagram showing another formation pattern of the groove portion.

【図5】本発明の別の実施例を示す平面図である。FIG. 5 is a plan view showing another embodiment of the present invention.

【図6】図5のVIーVI断面図である。6 is a sectional view taken along line VI-VI in FIG.

【図7】従来例の平面図である。FIG. 7 is a plan view of a conventional example.

【図8】図1のVIII-VIII断面図である。8 is a sectional view taken along line VIII-VIII of FIG.

【図9】樹脂注入部に多量の樹脂が注入された従来例の
断面図及び樹脂注入部に少量の樹脂が注入された従来例
の断面図。
FIG. 9 is a cross-sectional view of a conventional example in which a large amount of resin is injected into a resin injection part and a cross-sectional view of a conventional example in which a small amount of resin is injected into a resin injection part.

【符号の説明】[Explanation of symbols]

1 基板 2 発光ダイオード素子 3 反射板 4 樹脂注入部 5 保護層 6 溝部 1 Substrate 2 Light-Emitting Diode Element 3 Reflector 4 Resin Injection Section 5 Protective Layer 6 Groove

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 配線が形成された基板上に搭載された発
光ダイオード素子と、前記発光ダイオード素子を取り囲
むように形成された反射板と、前記反射板内側の樹脂注
入部と、前記樹脂注入部に樹脂を注入して形成された樹
脂保護層とを備える面発光表示器において、前記反射板
の上面の少なくとも一部に溝部を設けたことを特徴とす
る面発光表示器。
1. A light emitting diode element mounted on a substrate on which wiring is formed, a reflector formed so as to surround the light emitting diode element, a resin injection part inside the reflection plate, and the resin injection part. A surface emitting display comprising a resin protective layer formed by injecting a resin into the surface emitting display, wherein a groove is provided on at least a part of the upper surface of the reflector.
【請求項2】 請求項1記載の面発光表示器において、
前記反射板の上面に前記樹脂注入部を取り囲むように連
続する前記溝部を設けたことを特徴とする面発光表示
器。
2. The surface-emitting display according to claim 1, wherein
The surface emitting display, wherein the continuous groove portion is provided on the upper surface of the reflection plate so as to surround the resin injection portion.
【請求項3】 請求項1または2記載の面発光表示器に
おいて、前記反射板の上面の少なくとも一部に設けられ
た段差部に前記溝部を設けたことを特徴とする面発光表
示器。
3. The surface emitting display according to claim 1, wherein the groove is provided in a step provided on at least a part of an upper surface of the reflector.
JP6166771A 1994-07-19 1994-07-19 Surface emission type display Pending JPH0832120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6166771A JPH0832120A (en) 1994-07-19 1994-07-19 Surface emission type display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6166771A JPH0832120A (en) 1994-07-19 1994-07-19 Surface emission type display

Publications (1)

Publication Number Publication Date
JPH0832120A true JPH0832120A (en) 1996-02-02

Family

ID=15837393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6166771A Pending JPH0832120A (en) 1994-07-19 1994-07-19 Surface emission type display

Country Status (1)

Country Link
JP (1) JPH0832120A (en)

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