JPH0831303B2 - Chip type fuse - Google Patents

Chip type fuse

Info

Publication number
JPH0831303B2
JPH0831303B2 JP61287081A JP28708186A JPH0831303B2 JP H0831303 B2 JPH0831303 B2 JP H0831303B2 JP 61287081 A JP61287081 A JP 61287081A JP 28708186 A JP28708186 A JP 28708186A JP H0831303 B2 JPH0831303 B2 JP H0831303B2
Authority
JP
Japan
Prior art keywords
chip
insulating base
type fuse
electrodes
conductive portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61287081A
Other languages
Japanese (ja)
Other versions
JPS63141233A (en
Inventor
覚 下川
英明 八段
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP61287081A priority Critical patent/JPH0831303B2/en
Priority to DE8787117577T priority patent/DE3785835T2/en
Priority to EP87117577A priority patent/EP0270954B1/en
Priority to ES198787117577T priority patent/ES2046194T3/en
Priority to AT87117577T priority patent/ATE89435T1/en
Publication of JPS63141233A publication Critical patent/JPS63141233A/en
Publication of JPH0831303B2 publication Critical patent/JPH0831303B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits

Landscapes

  • Fuses (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)

Abstract

A chip-type fuse (1) which includes an insulating member (2), a pair of electrode members (4a, 4b) disposed on the insulating member, a conducting member (3) for electrically connecting the pair of electrode members to each other, and a protecting member (5) disposed on the insulating member for protecting the conducting member. The conducting member is deposited or printed on the insulating member. The insulating member is made rectangular so that it can be easily automatically mounted on a printed circuit board.

Description

【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、低価格で印刷回路基板への自動実装に適
したチップ型ヒューズに関する。TECHNICAL FIELD The present invention relates to a chip-type fuse which is suitable for automatic mounting on a printed circuit board at a low cost.

（ロ）従来の技術 一般に、電子回路部品等においては、過電流が流れな
いようにヒューズを設け、破損等を防止するようにして
いる。このヒューズにおいて、近年、プリント基板等に
直接実装するために、チップ型のものが開発されてい
る。(B) Conventional Technology Generally, in electronic circuit parts and the like, a fuse is provided so as to prevent an overcurrent from flowing, and damage or the like is prevented. In recent years, a chip type fuse has been developed for direct mounting on the printed circuit board or the like.

従来のチップ型ヒューズとしては、絶縁基台両端に電
極を形成し、これら電極間を電気的に接続する金属薄膜
よりなる導電部を、絶縁基台下面に設けられる凹部内に
形成したものが知られている（実公昭61−11881号公
報）。As a conventional chip-type fuse, there is known one in which electrodes are formed at both ends of an insulating base and a conductive portion made of a metal thin film for electrically connecting these electrodes is formed in a recess provided on the lower surface of the insulating base. (Japanese Utility Model Publication No. 61-11881).

また、絶縁基台上に１対の電極を形成し、これら電極
間に金（Au）線をワイヤボンディングし、絶縁基台表面
に樹脂を盛り、この金線を封止してなるものも知られて
いる（実開昭58−113247号公報）。Also known is one in which a pair of electrodes are formed on an insulating base, gold (Au) wires are wire-bonded between these electrodes, resin is deposited on the surface of the insulating base, and the gold wires are sealed. (Japanese Utility Model Publication No. 58-113247).

（ハ）発明が解決しようとする問題点 上記従来のチップ型ヒューズは、絶縁基台下面に凹部
を形成したり、電極間を金線でワイヤボンディングする
加工が必要であり、製造コストが上昇する不都合があっ
た。また、角型チップ抵抗器に比べて複雑な形状を有し
ており、自動実装に適していないという不都合があっ
た。(C) Problems to be Solved by the Invention The conventional chip-type fuse described above requires a process for forming a recess on the lower surface of the insulating base and wire bonding between the electrodes with a gold wire, which increases the manufacturing cost. There was an inconvenience. Further, it has a complicated shape as compared with the rectangular chip resistor, and thus it is not suitable for automatic mounting.

また、角型チップ型ヒューズを大きな絶縁基板に格子
状のスリットを形成しておき、上面電極及びヒューズ部
を形成した後、各チップヒューズにブレイクをする場
合、側面電極はブレイク後に形成せねばならず、製造過
程が複雑になるという問題があった。In addition, when the square chip type fuse is formed with the grid-like slits on the large insulating substrate and the upper surface electrode and the fuse portion are formed and then each chip fuse is broken, the side surface electrode must be formed after the break. However, there is a problem that the manufacturing process becomes complicated.

この発明は、上記不都合に鑑みなされたもので、製造
が簡単で、製造コストが低く、かつ自動実装に適したチ
ップ型ヒューズを提供することを目的としている。The present invention has been made in view of the above inconveniences, and an object of the present invention is to provide a chip-type fuse that is easy to manufacture, has a low manufacturing cost, and is suitable for automatic mounting.

（ニ）問題点を解決するための手段及び作用 上記問題点を解決するための手段として、この発明の
チップ型ヒューズは、直方体形状の絶縁基台と、この絶
縁基台長手方向両端部にそれぞれ形成される金属薄膜か
らなる１対の電極と、前記絶縁基台上面に形成され、前
記電極を電気的に接続する金属薄膜からなる導電部と、
前記絶縁基台上面に設けられ、前記導電部を被覆する保
護外装膜より構成されるものにおいて、 前記絶縁基台の１対の電極を形成した両端部の側部
に、上面の各電極より下方に向けて、サイドスルーホー
ルを形成している。(D) Means and Actions for Solving Problems As a means for solving the above problems, the chip-type fuse of the present invention includes a rectangular parallelepiped insulating base and both ends of the insulating base in the longitudinal direction. A pair of electrodes formed of a metal thin film, and a conductive portion formed on the upper surface of the insulating base and formed of a metal thin film for electrically connecting the electrodes,
In a structure which is provided on the upper surface of the insulating base and is formed of a protective outer coating that covers the conductive portion, the insulating base has a pair of electrodes formed on both sides thereof, and is below the electrodes on the upper surface. A side through hole is formed toward.

従って、絶縁基台の加工が容易であり、また、導電部
の形成もめっき又は印刷により容易に行うことができ、
また電極も上面部とともに、サイドスルーホールにより
側部も同時に形成できるので、製造過程が簡単となり、
製造コストを低減することができる。一方、その形状を
直方体とし、チップ抵抗器と同じ大きさにできるため、
自動実装が容易となる。Therefore, the insulating base can be easily processed, and the conductive portion can be easily formed by plating or printing.
In addition, the electrodes can be formed at the same time with the upper surface and the side through holes, which simplifies the manufacturing process.
The manufacturing cost can be reduced. On the other hand, since its shape is a rectangular parallelepiped and can be made the same size as the chip resistor,
Automatic mounting becomes easy.

（ホ）実施例 この発明の一実施例を、第１図及び第２図に基づいて
以下に説明する。(E) Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

第１図は、この発明の実施例に係るチップ型ヒューズ
11の平面図、第２図は、同チップ型ヒューズの第１図中
II−II線における断面図である。12は、セラミック基板
（絶縁基台）である。このセラミック基板12は、角形チ
ップ抵抗器等と同一の直方体形状とされ、その横方向長
さl1、縦方向長さl2は、それぞれ3.2mm及び1.6mmとされ
る。FIG. 1 is a chip-type fuse according to an embodiment of the present invention.
11 is a plan view and FIG. 2 of the same chip type fuse in FIG.
It is a sectional view taken along the line II-II. 12 is a ceramic substrate (insulation base). The ceramic substrate 12 has the same rectangular parallelepiped shape as a rectangular chip resistor or the like, and its horizontal length l 1 and vertical length l 2 are 3.2 mm and 1.6 mm, respectively.

セラミック基板12の上面12aには、導電部13が形成さ
れる。この導電部13は、上面12aに形成される金属薄膜
であり、めっき又は印刷により形成される。この金属薄
膜には、銀（Ag）−パラジウム（Pd）合金、銀−白金
（Pt）合金、銀、銅、金等が使用できる。導電部13の形
状は、方形波状に屈曲する帯状である。さらに、この導
電部13には、信頼性を向上させるため、トリミング部13
b、…、13bが設けられている。このトリミング部13b
は、例えばレーザによりトリミングされるが、その際、
導電部13の抵抗を測定し、適切な抵抗値が得られるよう
にトリミング量を調整する。導電部13の両端部13a、13a
がセラミック基板２の端部12b、12bにそれぞれ達してい
る。A conductive portion 13 is formed on the upper surface 12a of the ceramic substrate 12. The conductive portion 13 is a metal thin film formed on the upper surface 12a and is formed by plating or printing. For this metal thin film, a silver (Ag) -palladium (Pd) alloy, a silver-platinum (Pt) alloy, silver, copper, gold or the like can be used. The shape of the conductive portion 13 is a band shape that is bent in a square wave shape. Further, the conductive portion 13 has a trimming portion 13 in order to improve reliability.
b, ..., 13b are provided. This trimming part 13b
Is trimmed by laser, for example,
The resistance of the conductive portion 13 is measured, and the trimming amount is adjusted so that an appropriate resistance value can be obtained. Both ends 13a, 13a of the conductive portion 13
Reach the ends 12b, 12b of the ceramic substrate 2, respectively.

セラミック基板両端部12b、12bには、金属薄膜よりな
る電極14、14が形成される。この電極14は、めっき等、
周知の手段により形成され、前記導電部端部13aに接続
される。また、方向両端部12b、12bには、上面の電極1
4、14より上下に延伸するサイドスルーホール12c、12c
が設けられている。Electrodes 14, 14 made of a metal thin film are formed on both ends 12b, 12b of the ceramic substrate. This electrode 14 is plated,
It is formed by a known means and is connected to the end 13a of the conductive portion. In addition, the electrodes 1 on the upper surface are provided on both ends 12b, 12b in the direction.
Side through holes 12c, 12c extending vertically from 4 and 14
Is provided.

セラミック基板上面12aには、シリコン樹脂膜（保護
外装膜）15が形成される。このシリコン樹脂膜15は、導
電膜13を完全に被覆する。もっとも、第１図では便宜
上、シリコン樹脂膜15を大部分、切欠いた図を示してい
る。A silicon resin film (protective exterior film) 15 is formed on the upper surface 12a of the ceramic substrate. The silicon resin film 15 completely covers the conductive film 13. However, in FIG. 1, for the sake of convenience, most of the silicon resin film 15 is cut away.

このチップ型ヒューズ11は、チップ抵抗器と同じ形状
であり、その梱包状態をテーピング仕様とすれば、容易
に自動実装を行うことができ、印刷回路基板への実装コ
ストが低減できる。The chip fuse 11 has the same shape as the chip resistor, and if the packaging state is taping specification, it can be easily automatically mounted and the mounting cost on the printed circuit board can be reduced.

チップ型ヒューズ11に過電流が流れた場合には、導電
部13の適所が溶断し、回路が遮断される。この時、導電
部13をシリコン樹脂膜15で被覆しているため、溶断部で
発生する金属蒸気が外部へ飛散する危険がない。また、
シリコン樹脂には消弧作用が認められ、溶断部で発生す
る金属蒸気によるアークの連続が防止され、電子部品の
保護が完全に行える。また、導電部13は、セラミック基
板上面12aに直接形成されており、放熱効果が大きく、
小型にもかかわらず大電流容量とすることができる。When an overcurrent flows through the chip-type fuse 11, the conductive parts 13 are blown off at appropriate places and the circuit is cut off. At this time, since the conductive portion 13 is covered with the silicon resin film 15, there is no danger that the metal vapor generated at the fusing portion will scatter to the outside. Also,
The arc extinguishing effect is recognized in the silicone resin, the continuation of the arc due to the metal vapor generated in the fusing part is prevented, and the electronic parts can be completely protected. Further, the conductive portion 13 is directly formed on the upper surface 12a of the ceramic substrate, and has a large heat dissipation effect,
Despite its small size, it can have a large current capacity.

また、このチップ型ヒューズ11においては、過電流が
流れた際に、導電部13のトリミング部13b、…、13bの何
れかにおいて、優先的に溶断が生じる。このため、過電
流を確実に遮断でき、チップ型ヒューズ11の信頼性が向
上される。また、このチップ型ヒューズ11は、導電部と
して金線を用いる従来のチップ型ヒューズに比べ、断線
のおそれがなく、取扱いが容易であるとともに、発熱に
よる導電部の熱応力に対しても強いものとすることがで
きる。Further, in the chip-type fuse 11, any of the trimming portions 13b, ..., 13b of the conductive portion 13 is preferentially blown when an overcurrent flows. Therefore, the overcurrent can be surely cut off, and the reliability of the chip-type fuse 11 is improved. Further, this chip-type fuse 11 is easier to handle than a conventional chip-type fuse that uses a gold wire as a conductive part, is easy to handle, and is strong against thermal stress of the conductive part due to heat generation. Can be

なお、上記実施例においては、導電部の形状として方
形波状に屈曲する帯状のものを示しているが、これに限
定されるものではなく、適宜変更可能である。In addition, in the above-mentioned embodiment, the shape of the conductive portion is a band shape bent in a square wave shape, but the shape is not limited to this and can be appropriately changed.

（ヘ）発明の効果 以上説明したように、この発明のチップ型ヒューズ
は、両端部の側部にスルーホールを形成するので、上面
部と側部の電極を同時に形成でき、製造が容易で、その
コストが低減できる利点を有すると共に、チップ抵抗器
と同じ直方体形状であり、自動実装が容易に行える利点
を有している。(F) Effects of the Invention As described above, in the chip-type fuse of the present invention, since the through holes are formed in the side portions of both end portions, the electrodes on the upper surface portion and the side portions can be simultaneously formed, and the manufacturing is easy, In addition to having the advantage of reducing the cost, it has the same rectangular parallelepiped shape as the chip resistor and has the advantage of facilitating automatic mounting.

また、実施例に示すように、保護外装膜をシリコン樹
脂とすれば、シリコン樹脂の消弧剤としての作用によ
り、導電部溶断時に発生する、金属蒸気によるアークの
連続が防止され、電子部品を確実に保護できる利点をも
有している。Further, as shown in the examples, if the protective outer coating is made of silicon resin, the action of the silicon resin as an arc extinguishing agent prevents the continuation of the arc due to the metal vapor, which occurs when the conductive portion is melted, and the electronic parts are It also has the advantage that it can be reliably protected.

【図面の簡単な説明】[Brief description of drawings]

第１図は、この発明の実施例に係るチップ型ヒューズの
平面図、第２図は、同チップ型ヒューズの第１図中II−
II線における断面図である。 12:セラミック基板、 12c・12c:サイドスルーホール、 13:導電部、 14・14:電極、 15:シリコン樹脂膜。FIG. 1 is a plan view of a chip-type fuse according to an embodiment of the present invention, and FIG. 2 is a II-of the same chip-type fuse in FIG.
It is sectional drawing in the II line. 12: Ceramic substrate, 12c / 12c: Side through hole, 13: Conductive part, 14/14: Electrode, 15: Silicon resin film.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】直方体形状の絶縁基台と、この絶縁基台長
手方向両端部の上面にそれぞれ形成される金属薄膜から
なる１対の電極と、前記絶縁基台上面に形成され、前記
電極を電気的に接続する金属薄膜からなる導電部と、前
記絶縁基台上面に設けられ、前記導電部を被覆する保護
外装膜とよりなるチップ型ヒューズにおいて、 前記絶縁基台の１対の電極を形成した両端部の側部に、
上面の各電極より下方に向けて、サイドスルーホールを
形成したことを特徴とするチップ型ヒューズ。1. An insulating base having a rectangular parallelepiped shape, a pair of electrodes made of metal thin films respectively formed on the upper surfaces of both ends of the insulating base in the longitudinal direction, and an electrode formed on the upper surface of the insulating base. In a chip-type fuse including a conductive part made of a metal thin film electrically connected to the insulating base, and a protective exterior film provided on the upper surface of the insulating base to cover the conductive part, a pair of electrodes of the insulating base is formed. On the side of both ends,
A chip-type fuse characterized in that side through holes are formed downward from each electrode on the upper surface.
JP61287081A 1986-12-01 1986-12-01 Chip type fuse Expired - Lifetime JPH0831303B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP61287081A JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type fuse
DE8787117577T DE3785835T2 (en) 1986-12-01 1987-11-27 CHIP FUSE.
EP87117577A EP0270954B1 (en) 1986-12-01 1987-11-27 Chip-type fuse
ES198787117577T ES2046194T3 (en) 1986-12-01 1987-11-27 CHIP TYPE FUSE.
AT87117577T ATE89435T1 (en) 1986-12-01 1987-11-27 CHIP SECURITY.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61287081A JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type fuse

Publications (2)

Publication Number Publication Date
JPS63141233A JPS63141233A (en) 1988-06-13
JPH0831303B2 true JPH0831303B2 (en) 1996-03-27

Family

ID=17712806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61287081A Expired - Lifetime JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type fuse

Country Status (5)

Country Link
EP (1) EP0270954B1 (en)
JP (1) JPH0831303B2 (en)
AT (1) ATE89435T1 (en)
DE (1) DE3785835T2 (en)
ES (1) ES2046194T3 (en)

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DE3785835D1 (en) 1993-06-17
ATE89435T1 (en) 1993-05-15
JPS63141233A (en) 1988-06-13
EP0270954A1 (en) 1988-06-15
ES2046194T3 (en) 1994-02-01
EP0270954B1 (en) 1993-05-12
DE3785835T2 (en) 1993-08-19

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