JPH08274048A - Manufacture of chip member - Google Patents

Abstract

PURPOSE: To provide a method of manufacturing chip members, which prevents clogging on a dicing blade and can reduce dicing dusts. CONSTITUTION: Chip members are manufactured by a method, wherein a plurality of elements 2 are formed on the surface of a prescribed substrate 1 and after an ultraviolet curing tape 10 is stuck to the rear of this substrate 1, the substrate 1 is subjected to full-cut dicing along scribing lines 3 between the elements 2, and the chip members are obtained by the method, wherein before the full-cut dicing is performed, a prescribed amount of ultraviolet rays are applied to at least parts 10a, which correspond to the positions of the scribing lines 3, of the tape 10 to cure the tape 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip member in which an ultraviolet irradiation curing type tape is attached to a predetermined substrate on which a plurality of elements are formed and then full cut dicing is performed.

[0002]

2. Description of the Related Art Conventionally, after forming a plurality of elements on a substrate such as a silicon wafer, borosilicate glass, or quartz glass,
In the manufacturing method of the chip member to perform full-cut dicing from the scribe line between each element using a dicing blade, the substrate after element formation is pasted with an ultraviolet irradiation curable tape, and after being held by a holder ring, by a dicing blade. Full cutting is performed by cutting the position of the scribe line to about one-third of the ultraviolet irradiation curing type tape.

[0003]

However, the back surface of the substrate to which the ultraviolet radiation curable tape is attached has high flatness,
Moreover, in order to obtain an adhesive force that exceeds the cutting resistance during dicing, it is necessary to attach the tape to the substrate via a relatively soft UV irradiation curable adhesive. Therefore, when the substrate is fully cut with the dicing blade, the UV-irradiation-curable tape is cut by a soft UV-irradiation-curable adhesive and adheres to the diamond abrasive grain surface of the dicing blade to cause crushing, resulting in chipping of the substrate. This causes chipping and shortens the life of the dicing blade.

Further, tape cutting chips or chippings to which a soft ultraviolet ray irradiation-curable adhesive adheres adheres to the surface and the side surface of the chip member, causing a dust defect in a later process. In addition, a CCD that requires optical characteristics
Even in the light receiving element using a silicon substrate such as an area / linear sensor, at the time of full-cut dicing, tape cutting chips with soft UV irradiation curing adhesive and chipping from the silicon substrate are provided on the light receiving surface and the light receiving surface. If it is caught in the concave portion of the formed lens (for example, on-chip microlens), it may cause a defect defect in strong incident light.

[0005]

The present invention is a method of manufacturing a chip member, which has been made to solve such problems. That is, the present invention provides a chip member in which a plurality of elements are formed on a predetermined substrate, an ultraviolet irradiation curing type tape is attached to the substrate, and then the substrate is subjected to full-cut dicing along scribe lines between the elements. This is a manufacturing method, and before performing full-cut dicing, at least a portion corresponding to the position of the scribe line of the ultraviolet irradiation curable tape is irradiated with a predetermined amount of ultraviolet light to be cured.

When the substrate has a light-transmitting property, before the full-cut dicing, the UV-irradiation-curable tape is placed on the opposite side of the substrate on which the UV-irradiation-curable tape is attached via a scribe line. Before the full-cut dicing is performed even if the substrate is not translucent by irradiating a fixed amount of ultraviolet rays to cure, and the position of the scribe line of the ultraviolet irradiation-curing tape through a predetermined mask. It is also a method of manufacturing a chip member in which a corresponding portion is irradiated with a predetermined amount of ultraviolet rays and cured.

[0007]

In the present invention, the ultraviolet irradiation curable tape is attached to the substrate after forming a plurality of elements, and before performing full-cut dicing, at least a portion of the ultraviolet irradiation curable tape corresponding to the position of the scribe line. Since it is cured by irradiating a predetermined amount of ultraviolet light, the dicing blade is in the state of cutting the cured portion according to the ultraviolet irradiation amount of the ultraviolet irradiation curable tape corresponding to the position of the scribe line during full cut dicing .

When the substrate has a light-transmitting property, the element is shielded by irradiating it with ultraviolet rays from the opposite side of the substrate on which the ultraviolet ray curing type tape is attached, that is, the side on which the element is formed. A predetermined amount of ultraviolet rays are transmitted through the substrate by using the scribe line as a slit, and a portion corresponding to the position of the scribe line of the ultraviolet irradiation curing type tape can be cured according to the ultraviolet irradiation amount. Even when the substrate does not have a light-transmitting property, the dicing is performed by irradiating a portion corresponding to the position of the scribe line of the ultraviolet irradiation curing type tape with a predetermined amount of ultraviolet rays through a predetermined mask. It becomes possible to cure the cut portion of the ultraviolet irradiation curable tape by the blade according to the amount of ultraviolet irradiation.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the method for manufacturing a chip member of the present invention will be described below with reference to the drawings. FIG. 1 is a first embodiment (a) of the method for manufacturing a chip member of the present invention.
It is a schematic cross section explaining it in order of (d). In addition, in the first embodiment, a case where a light-transmissive substrate 1 mainly made of quartz glass is used will be described as an example.

First, as shown in FIG. 1 (a), a plurality of elements 2 such as TFTs are formed on the surface of a substrate 1 made of quartz glass, and then an ultraviolet irradiation curing tape 10 is formed on the back surface of the substrate 1. A process of fixing with the attachment holder ring 11 is performed. The substrate 1 has, for example, a thickness of 0.
A quartz glass wafer with a diameter of 8 mm and a diameter of 8 inches is used. Further, the ultraviolet irradiation curing type tape 10 to be attached to the substrate 1 has a thickness of 90 μm (for example, the acrylic pressure-sensitive adhesive layer 1
0 μm + polyolefin base material of about 80 μm) is used. A scribe line 3 used when dicing is performed in a later step is provided between the plurality of elements 2.

Next, as shown in FIG. 1B, a predetermined amount of ultraviolet rays is irradiated from the side of the substrate 1 on which the element 2 is formed. The ultraviolet ray uses the element 2 formed on the substrate 1 as a light shielding film,
The scribe line 3 is used as a slit to pass through the light-transmissive substrate 1 and hit the portion 10a corresponding to the position of the scribe line 3 of the ultraviolet irradiation curing tape 10. Further, the ultraviolet rays are also in a state of hitting the portion 10b of the ultraviolet radiation curable tape 10 which is the outer region of the substrate 1. As a result, the portions 10a, 10b exposed to ultraviolet rays
The ultraviolet irradiation-curable tape 10 is cured according to the amount of ultraviolet irradiation. That is, at least the portion 10a of the ultraviolet radiation curable tape 10 corresponding to the position of the scribe line 3
Will cure depending on the amount of UV irradiation.

In some cases, the portion of the element 2 does not form a perfect light-shielding film, but by adjusting the amount of ultraviolet rays to be radiated, even if the ultraviolet ray penetrates the portion of the element 2 and hits the ultraviolet irradiation curing type tape 10. It is possible to maintain an appropriate adhesive force between the substrate 1 and the ultraviolet irradiation curing type tape 10.
For example, the amount of ultraviolet rays applied to the ultraviolet irradiation-curable tape 10 through the scribe line 3 is used as a reference, and this amount makes the ultraviolet irradiation-curable tape 10 have a predetermined hardness and a predetermined adhesive force with the substrate 1. Keep the amount that can be maintained.

Since the amount of ultraviolet light that passes through the element 2 is always smaller than the amount of ultraviolet light that is emitted through the scribe line 3, the substrate 1 in the element 2 portion is set by setting such an amount of ultraviolet light irradiation. Adhesive strength with can be sufficiently secured. By setting such an irradiation amount, even if the substrate 1 is subjected to full-cut dicing in a later step, the chip member formed by cutting is subjected to the ultraviolet irradiation curable tape 10.
It does not cause so-called chip fly that peels off from the chip.

Further, the amount of ultraviolet rays applied to the ultraviolet ray irradiation-curable tape 10 through the scribe line 3 should be adjusted to an amount capable of holding the substrate 1 with a predetermined adhesive force by the ultraviolet ray irradiation-curable tape 10 after the irradiation. Thus, during the subsequent dicing process, peeling does not occur at the interface between the UV irradiation curable tape 10 and the adjacent dicing portion, and it is possible to prevent cutting water from penetrating there from and reducing the adhesive force with the substrate 1. become.

Next, as shown in FIG. 1C, a scribe line 3 between a plurality of elements 2 formed on the substrate 1 is subjected to full-cut dicing with a dicing blade 4. At this time, the dicing blade 4 moves the ultraviolet irradiation curable tape 1 corresponding to the position of the scribe line 3.
It is in a state of cutting to about one-third of the thickness of 0 (about 25 to 30 μm).

However, this ultraviolet radiation curable tape 1
Since the portion 10a corresponding to the position of the scribe line 3 of 0 is hardened according to the irradiation amount of the ultraviolet rays in the process shown in FIG. 1B, the dicing blade 4 cuts this hardened portion. Therefore, the soft UV irradiation curable adhesive does not adhere to the diamond abrasive grain surface of the dicing blade 4, and the soft UV irradiation curable adhesive does not adhere to the tape cutting waste. Further, the soft UV irradiation curable adhesive does not adhere to the chipping of the substrate 1 either, and these do not adhere to the surface or the side surface of the chip member 20 (see FIG. 1 (d)) after cutting and the cutting water. To be easily washed away.

Next, as shown in FIG. 1D, the substrate 1
A process of irradiating the entire surface of the ultraviolet radiation curable tape 10 attached to the substrate with ultraviolet rays to completely cure it is performed. As a result, the adhesive force between the substrate 1 and the ultraviolet irradiation curable tape 10 is sufficiently reduced, and the chip member 20 divided for each element 2 can be easily peeled from the ultraviolet irradiation curable tape 10. Become. By such a manufacturing method,
It is possible to manufacture a good chip member 20 in which tape cutting dust and chipping are not attached to the surface and side surfaces.

Next, a method of manufacturing the chip member in the second embodiment of the present invention will be described. FIG. 2 is a schematic cross-sectional view for explaining the method of manufacturing the chip member in the second embodiment in the order of (a) to (d). In the second embodiment, the case of using the substrate 1 which is mainly made of silicon or the like and has no translucency will be described as an example.

First, as shown in FIG. 2A, a CCD area sensor or CC is formed on the surface of a substrate 1 made of silicon or the like.
After forming a plurality of predetermined elements 2 such as D linear sensor,
An ultraviolet irradiation curing type tape 10 is attached to the back surface of the substrate 1 and fixed by a holder ring 11.
The ultraviolet radiation curable tape 10 attached to the substrate 1 has a thickness of 90 μm (for example, the acrylic pressure-sensitive adhesive layer 1).
0 μm + polyolefin base material of about 80 μm) is used.

Next, as shown in FIG. 2B, the substrate 1
A mask 5 having slits 5a corresponding to the scribe lines 3 provided between the respective elements 2 is arranged on the side of the ultraviolet irradiation curing type tape 10 and ultraviolet rays are cured by irradiation with ultraviolet rays through the mask 5. Irradiate 10.

FIG. 3 is a schematic plan view for explaining the mask. The mask 5 shown in FIG. 3A is an example of a glass mask, and is composed of a light-transmitting glass plate 51 on which a light-shielding film 52 made of a metal such as chromium is formed. The light shielding film 52 corresponds to the position of the element 2 shown in FIG. 2B, and the slit 5 a between the light shielding films 52 corresponds to the position of the scribe line 3. Therefore, the width d of the slit 5a is, for example, 0.1 to 0.2 m according to the width of the scribe line 3.
Keep about m.

The mask 5 shown in FIG. 3 (b) is an example of a metal mask. For example, a light-shielding film 52 and slits 5a are formed by etching a stainless steel plate having a thickness of 0.2 mm.
And make up. The light shielding film 52 corresponds to the position of the element 2 shown in FIG. 2B, and the slit 5 a corresponds to the position of the scribe line 3. In the case of a metal mask, the support portion 53 for keeping the distance between the light shielding films 52 is required.

When the mask 5 and the substrate 1 are aligned with each other, the orientation flat (not shown) of the substrate 1 can be used for accurate alignment. Then, as shown in FIG. 2B, by irradiating the ultraviolet ray irradiation-curable tape 10 with ultraviolet rays through the mask 5, the scribe line 3 is provided from the slit 5 a.
Position 1 of the UV irradiation curable tape 10 corresponding to the position
0a is irradiated with ultraviolet rays, and the area is cured.

That is, since the substrate 1 made of silicon or the like does not have a light-transmitting property, it is necessary to irradiate the ultraviolet ray irradiation-curable tape 10 corresponding to the position of the scribe line 3 with ultraviolet rays through the substrate 1. Therefore, the ultraviolet irradiation curing type tape 10 is directly irradiated with ultraviolet rays through such a mask 5.

Further, as the amount of ultraviolet rays applied to the ultraviolet irradiation curing type tape 10 through the mask 5, the substrate 1 is adhered to a predetermined adhesive force by the ultraviolet irradiation curing type tape 10 after irradiation, as in the first embodiment. By adjusting to an amount that can be held by, peeling of the ultraviolet irradiation-curable tape 10 adjacent to the dicing portion does not occur during the subsequent dicing process,
It becomes possible to prevent the cutting water from soaking in from here to reduce the adhesive force with the substrate 1.

Next, as shown in FIG. 2C, the substrate 1
A process of performing full-cut dicing on the scribe line 3 formed between the plurality of elements 2 formed by the dicing blade 4 is performed. When performing the full-cut dicing, the dicing blade 4 is in a state of being cut to about one third (about 25 to 30 μm) of the thickness of the ultraviolet irradiation curing type tape 10 corresponding to the position of the scribe line 3.

At this time, since the portion of the ultraviolet irradiation curing type tape 10 corresponding to the position of the scribe line 3 is cured according to the amount of ultraviolet rays in the process shown in FIG. 2B, it is the same as in the first embodiment. The dicing blade 4 cuts this hardened part. Therefore, the soft UV irradiation curable adhesive does not adhere to the diamond abrasive grain surface of the dicing blade 4, and the soft UV irradiation curable adhesive does not adhere to the tape cutting waste. Furthermore, the soft UV irradiation curable adhesive does not adhere to the chipping of the substrate 1, and the cutting water does not adhere to the surface or the side surface of the chip member 20 (see FIG. 2D) after cutting. To be easily washed away.

Next, as shown in FIG. 2D, the substrate 1
A process of irradiating the entire surface of the ultraviolet radiation curable tape 10 attached to the substrate with ultraviolet rays to completely cure it is performed. As a result, the adhesive force between the substrate 1 and the ultraviolet irradiation curable tape 10 is sufficiently reduced, and the chip member 20 divided for each element 2 can be easily peeled from the ultraviolet irradiation curable tape 10. Become. By such a manufacturing method,
It is possible to manufacture a good chip member 20 in which tape cutting dust and chipping are not attached to the surface and side surfaces.

In the first and second embodiments,
An example of irradiating and curing a predetermined amount of ultraviolet rays at the position 10a corresponding to the position of the scribe line 3 of the ultraviolet irradiation-curable tape 10 has been described, but in the present invention, the ultraviolet irradiation-curable tape 10 is cured with respect to the irradiation amount of ultraviolet rays. The degree and the adhesive strength change may be used to irradiate the entire surface of the ultraviolet irradiation curable tape 10 with a predetermined amount of ultraviolet rays before performing the full-cut dicing.

That is, even if the entire surface of the ultraviolet ray irradiation-curable tape 10 is irradiated with ultraviolet rays, it is possible to obtain both a hardness that does not cause the dicing blade 4 to be crushed and a predetermined adhesive force for holding the substrate 1. By irradiating as much ultraviolet light as possible, the same effect can be obtained even if the entire surface of the ultraviolet irradiation curable tape 10 is irradiated with ultraviolet light. Further, in order to adjust the irradiation amount of ultraviolet rays, the light amount of the ultraviolet light source itself may be adjusted, the irradiation time of ultraviolet rays may be adjusted, or the irradiation amount of ultraviolet rays may be adjusted by inserting a filter.

[0031]

As described above, the method of manufacturing the chip member of the present invention has the following effects. That is, in the present invention, before performing the fuku cut dicing, a predetermined amount of ultraviolet rays is irradiated to cure at least a portion corresponding to the position of the scribe line of the ultraviolet irradiation curable tape attached to the substrate, so that a full cut is performed. It is possible to prevent the soft UV irradiation curable adhesive from adhering to the dicing blade during dicing, and to suppress the occurrence of blinding. This makes it possible to extend the life of the dicing blade.

Further, the soft ultraviolet irradiation curable adhesive does not adhere to the tape cutting chips and the chipping of the substrate, and the adhesion of dust to the surface and the side surface of the chip member is reduced,
It is possible to improve product yield and quality.

[Brief description of drawings]

FIG. 1 is a schematic sectional view illustrating a first embodiment of the present invention in the order of (a) to (d).

FIG. 2 is a schematic sectional view illustrating a second embodiment of the present invention in the order of (a) to (d).

FIG. 3 is a schematic plan view illustrating an example of a mask, (a) is a glass mask, and (b) is an example of a metal mask.

[Explanation of symbols]

 1 Substrate 2 Element 3 Scribe Line 4 Dicing Blade 5 Mask 10 UV Irradiation Curing Tape 11 Holder Ring 20 Chip Member

Claims (6)

[Claims] 1. A chip member in which a plurality of elements are formed on a predetermined substrate, an ultraviolet irradiation curable tape is attached to the substrate, and then the substrate is subjected to full-cut dicing along scribe lines between the elements. A manufacturing method, wherein before performing the full-cut dicing, at least a portion corresponding to the position of the scribe line of the ultraviolet irradiation curable tape is irradiated with a predetermined amount of ultraviolet rays to be cured, which is a chip member. Manufacturing method. 2. When the substrate has a light-transmitting property, before performing the full-cut dicing, the ultraviolet irradiation is performed from the opposite side of the substrate to which the ultraviolet irradiation-curable tape is attached via the scribe line. The method for manufacturing a chip member according to claim 1, wherein the curable tape is irradiated with a predetermined amount of ultraviolet rays to be cured. 3. Before performing the full-cut dicing,
2. The method of manufacturing a chip member according to claim 1, wherein a portion of the ultraviolet irradiation-curable tape corresponding to the position of the scribe line is irradiated with a predetermined amount of ultraviolet light through a predetermined mask to be cured. 4. The method for manufacturing a chip member according to claim 1, wherein the irradiation amount of the ultraviolet rays is an amount capable of holding the substrate with a predetermined adhesive force by the ultraviolet irradiation curable tape after irradiation. . 5. The method for manufacturing a chip member according to claim 2, wherein the irradiation amount of the ultraviolet rays is an amount capable of holding the substrate with a predetermined adhesive force by the ultraviolet irradiation curable tape after irradiation. . 6. The method for manufacturing a chip member according to claim 3, wherein the irradiation amount of the ultraviolet rays is an amount capable of holding the substrate with a predetermined adhesive force by the ultraviolet irradiation curable tape after irradiation. .