JPH08264691A - Ic package with cooling fin - Google Patents

Abstract

PURPOSE: To provide an IC package which does not lose heat dissipation performance, can be easily attached and detached, and can be formed in one piece with fixing parts with sufficient reliability by detachably connecting a cooling fin and the IC package with a pair of female and male snap members. CONSTITUTION: An IC package 1 and cooling fins (pin fins) 11 and 11' are detachably connected by a male snap 19 at the side of the IC package and a female snap 21 at the side of the pin fin. Namely, the pin fins 11 and 11' and the IC package 1 are detachably connected by a pair of male and female snap members 19 and 21 which are included opposingly between the bottom surface of the pin fins 11 and 11' and that of the IC package 1, thus easily placing the IC package 1 to the cooling fins 11 and 11' in snap structure by one touch and hence drastically improving productivity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package with a heat dissipation fin, and more particularly to an LSI package with a heat dissipation fin in which a heat dissipation fin is provided on an LSI package that generates a large amount of heat.

[0002]

2. Description of the Related Art LSI packages have a high degree of integration.
It is the most basic electronic device in which a C chip is hermetically sealed. As the degree of integration of ICs is improved, the heat generation amount is further increased in IC packages with higher degree of integration called, for example, LSI packages, and this heat causes the ICs to malfunction or lose the airtightness of the package. Serious trouble occurs. In order to prevent this, it is necessary to efficiently dissipate the heat generated in the IC chip to the outside of the package, and a package with a heat radiation fin is used for that purpose.

FIG. 13 shows an example in which a radiating fin 2 having a typical shape is attached to a ceramic pin grid array type IC package 1. The IC chip 3 is bonded onto the heat transfer substrate 4, and is housed in an airtight space S composed of frame-shaped ceramic plates 5 and 6 and a metal lid 7. The heat transfer substrate 4 and the ceramic plate 5 and the lid 7 and the ceramic plate 6 are joined together by brazing or the like, and the mating surfaces of the ceramic plates 5 and 6 are sealed with a glass layer. The large number of pins 8 inserted in the ceramic plate 6 and the IC chip 3 are electrically connected to each other through the wires 9 and the conduction circuit drawn on the surface 5 a of the ceramic plate 5.

The material of the heat transfer substrate 4 has a large thermal conductivity,
Moreover, a material having a small difference in linear expansion coefficient from the IC chip 3 is selected, and, for example, tungsten impregnated with copper is used. The heat dissipation fins 2 are attached to the lower surface of the heat transfer board 4, and the heat generated in the IC chip 3 is transferred to the heat dissipation fins 2 through the heat transfer board 4 and is dissipated in the air.

Cooling methods include forced air cooling in which air is blown onto the radiation fins 2 by a fan to promote heat dissipation, and natural air cooling in which no fan is used. The radiating fin 2 needs to secure a surface area for radiating heat in a limited space, and has a complicated shape as shown in FIG. The radiating fin 2 is preferably a metal integrally-molded product in order to smoothly conduct heat inside, and is manufactured by plastic working such as machining or extrusion.

Pure aluminum or aluminum alloy is generally used as the material of the radiation fin 2 because of its excellent thermal conductivity, light weight, and economical efficiency.

14 and 15 show typical examples of the radiation fin 2. FIG. 14 shows the channel fin 10, and FIG.
Is a plan view and (b) is a front view. Channel fin 10
Has a shape in which a large number of parallel heat radiation plates 10a are erected on a rectangular bottom plate portion 10b.

FIG. 15 shows the pin fin 11, which is shown in FIG.
(A) is a plan view and (B) is a front view. Pin fin 11
Is a rectangular base plate 11b with many needles (or bars).
The heat radiation pin 11a is in an upright shape.

Each bottom plate portion 10b shown in FIGS.
The plane size W ₁ × W ₂ of 11b is the same as or slightly smaller than the plane size of the IC package 1 shown in FIG. 13, and is attached to the IC package 1 using this bottom plate portion.

The method of attaching the heat radiation fins to the IC package will be described below by taking the case of the pin fins 11 of FIG. 15 as an example, but the same applies to the channel fins 10 of FIG. 14 and other heat radiation fins.

The method of attachment is roughly classified into two. The first attachment method is adhesion and the second attachment method is mechanical fixing. That is, the first method is a method of fixing the heat transfer substrate 4 and the pin fin bottom plate portion 11b with the adhesive layer 12 as shown in FIG. In this case, it is necessary to prevent the adhesive layer 12 from hindering heat conduction from the heat transfer substrate 4 to the pin fins 11, and an adhesive such as a silicon-based adhesive having excellent heat transfer property is used.

However, there are two problems with the bonding method. First, it is difficult to remove the pin fins 11 from the IC package 1 once they are bonded. For example, if the radiating pin 11a is deformed or damaged during handling after bonding, it is difficult to replace the pin fin 11, and the expensive IC package 1 may have to be discarded. The second problem is that when the weight of the pin fin 11 is large, the adhesive may be peeled off during use due to vibration of the electronic device incorporating the IC package 1. Therefore, the bonding method is limited to the case where the pin fin is lightweight, and is generally applied to the small pin fin 11 in which the side length (W ₁ , W ₂ ) of the bottom plate portion 11b is less than 40 mm. The second mounting method is a mechanical fixing method, and a typical mode thereof is shown in FIGS. 17 and 18.

That is, FIG. 17 shows a screw fixing method, FIG. 17 (a) is a partial sectional view, and FIG. 17 (b) is a front view seen from the pin fin 11 side. This is a method in which a male screw 13 fixed to the heat transfer board 4 by brazing or the like is passed through the hole 10c of the pin fin bottom plate portion 10b and tightened with a nut 14. The disadvantage of this method is that you need to make space for the nut 14 to be tightened, and at that location the heat dissipation pin
11a cannot be installed. That is, the heat dissipation performance of the pin fin 11 is reduced by that amount. Further, there is a drawback that the tightening work of the nut 14 is complicated and the productivity is hindered. Further, at the time of assembling the IC package 1 before attaching the pin fin 11, the protruding male screw 13
However, there is also a problem in that it interferes with transportation.

FIG. 18 shows a clip fixing method disclosed in, for example, Japanese Patent Laid-Open No. 2-298053, and FIG. 18A is a side view.
The same (b) is a front view seen from the side of the pin fin 11. Reverse T
This is a method of fixing the overhang portion 15a of the heat transfer board 15 having a V-shaped cross section and the bottom plate portion 11b of the pin fin 11 with the clip 16. The first drawback of this method is that it takes time to process the overhang portion 15a on the heat transfer board 15. Secondly, since it is necessary to provide a space for fixing the clip on the bottom plate portion 11b, the number of the heat radiation pins 11a must be reduced accordingly. That is, this method also impairs the heat dissipation performance of the pin fin 11.
Also, the work of attaching the clip 16 is complicated, and an automated device for this is also required to be complicated. When vibration is applied to the electronic device in which the IC package 1 is incorporated, the fastening force of the clip 16 is loosened, the adhesion between the heat transfer substrate 15 and the bottom plate portion 11b is lowered, and the heat transfer property may be deteriorated. Due to the above problems, the clip fixing method is not sufficient in terms of reliability.

[0015]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to easily attach / detach without impairing heat dissipation performance and to have sufficient reliability. An object of the present invention is to provide an IC package integrated with fixed parts, which is suitable for mass production and has a radiation fin.

[0016]

The inventor of the present invention pays attention to a snap stopper as a coupling means that can be easily attached and detached, and utilizes the elastic joining force of the snap stopper to transfer the IC package and the heat radiation fin. The inventors have completed the present invention, knowing that the productivity can be further improved by using a metal member for snap attachment, which can be thermally coupled. Therefore, the gist of the present invention is as follows.

(1) In an IC package with a heat radiation fin, the heat radiation fin and the IC package are detachably coupled by a pair of male and female snap members that are interposed between the bottom surface of the heat radiation fin and the bottom surface of the IC package. An IC package with heat dissipation fins.

(2) The IC package with a radiation fin according to (1) above, characterized in that a metal member having a plurality of male or female snap members attached at predetermined positions is joined to the bottom surface of the IC package.

(3) The metal member is a frame-shaped rectangular plate having a through hole in a central portion and a flat portion on the periphery of which a male or female snap member is attached.
(2) The IC package with the heat dissipation fin described above. (4) The IC package with a radiation fin according to (2), wherein the metal member is joined to the IC package by adhesion or brazing.

(5) The IC package with a radiation fin according to (2), wherein the male or female snap member is attached to the metal member by brazing or caulking. (6) The IC package with a radiation fin according to (1) above, wherein a metal member having a plurality of male or female snap members attached at predetermined positions is fixed to the radiation fin.

(7) The metal member is a rectangular plate having a pedestal portion for heat transfer in the central portion and a flat portion having a male or female snap member attached to the periphery thereof. An IC package with a radiation fin according to (6) above. (8) The IC package with a radiation fin according to (6), wherein the metal member is fixed to the radiation fin by adhesion or brazing.

(9) The IC package with a radiation fin according to (6), wherein the male or female snap member is attached to the metal member by brazing or caulking. (10) The IC package with a radiation fin according to (1) above, wherein a plurality of male or female snap members are fixed to the radiation fin by brazing or caulking.

That is, according to the present invention, the radiation fin and the I
A snap stopper is used to connect with the C package, and at that time, a good heat transfer relationship is established between the two. Therefore, in the present invention, a kind of spring elasticity which is found in the snap stopper is used. Is used, and if necessary, a heat transfer grease is used together. On the other hand, in terms of productivity, according to the preferred embodiment, a plurality of male and female snap members are attached to the metal member or the heat radiation fin in advance.

[0024]

The IC package with the heat dissipation fin according to the present invention is characterized in that the heat dissipation fin and the IC package are detachably connected by a snap mechanism, preferably in good heat transfer relationship. The details will be described below. Here, a pin fin will be described as an example of the radiation fin, but it goes without saying that the invention can be applied to other radiation fins.

FIG. 1 shows an I with pin fin according to the present invention.
An example of a C package is shown. First, in FIG.
The C package 1 and the pin fin 11 are detachably connected to each other by a male snap 19 on the IC package side and a female snap 21 on the pin fin side.
And a metal member joined to the bottom surface of the pin fin bottom plate portion 11b.
The central pedestal 40a of 40 is in surface contact, and in the illustrated example, the IC package and the pin fin are in a good heat transfer relationship via the metal member 40. The male snap 19 is attached to a frame-shaped metal member 18, which will be described later, and the female snap 21 is attached to the peripheral flat portion 40b of the metal member 40. A male snap 19 and a female snap are provided in a space of a height g (the sum of the height H ₁ of the heat transfer board 4 and the height H ₂ of the metal plate pedestal 40a) between the flat peripheral portion 40b of the metal member 40 and the ceramic plate 5. 21 are stored. In the case of an IC package without the heat transfer substrate 4, the heights H ₂ and g of the metal plate pedestal 40a may be the same.

FIG. 1B shows another embodiment in which the metal plate 40 in FIG. 1A is omitted, and in FIG.
Is attached to a frame-shaped metal member 18 described later, and the female snap 21 is attached to the bottom plate portion 11b of the pin fin 11 '. A pedestal 11'c is integrally provided at the center of the bottom plate portion 11'b of the pin fin 11 ', and a good heat transfer relationship is maintained between the heat transfer board 4 and the pedestal 11'c in surface contact with each other. are doing. In this case, male snaps 19 and female snaps 21 are housed in a space of height g between the flat peripheral portion of the bottom plate portion 11'b and the ceramic plate 5.

As described above, according to the present invention, the "heat transfer relationship" between the heat radiation fin 11 and the heat transfer board 4 of the IC package uses, for example, the metal member 40 having the pedestal 40a as shown in FIG. Or, as shown in Fig. 1 (b), attach the base 11'c to the bottom plate.
It is realized by using the radiation fin 11 provided in 11'b.

In addition, the heat transfer relationship between the two may be further ensured by interposing a heat transfer grease or the like at the contact interface. Next, male snap 19, female snap
21 will be described.

FIG. 2 shows an example of the male snap 19, and FIG.
(A) is a sectional view and (b) is a plan view. In the figure, the male snap 19 is a press-formed product of a metal sheet having a height h ₁ and comprising a dome-shaped head portion 19a having a diameter d _1, a body portion 19c having a smaller diameter and a flange portion 19b having a diameter D _1. is there.

FIG. 3 shows an example of the female snap 21, and FIG.
(A) is a plan view, (B) is a cross-sectional view, and (C) is a plan view of the ring-shaped spring 23 accommodated therein. Female snap 21
Is a head portion 21a (diameter d ₂ ) having a hole 21d slightly larger than the diameter d ₁ of the head portion 19a of the male snap shown in FIG. 2, a body portion 21c having a diameter slightly smaller than this, and a flange having a diameter D ₂ . It is a press-formed product of a thin metal plate having a height h ₂ formed of the portion 21b. A ring-shaped spring 23 made of a metal wire is housed inside the head portion 21a. The inner diameter d ₃ of the ring-shaped spring 23 is
The diameter is smaller than the diameter d ₁ of the male snap head 19a, and a cut 23a is provided as shown in FIG. 3C so that it can be elastically expanded.

Next, a method of attaching the male snap 19 and the female snap 21 will be described.

Here, as shown in FIGS. 1 (a) and 1 (b),
On the side of IC package 1, male snap 19, pin fin 11,
The case of attaching the female snap 21 to the 11 'side will be described, but there is no problem even if this is reversed. Further, since a plurality of snaps are used, male and female snaps may be mixed on one side. That is, it does not matter if the male snap 19 and the female snap 21 face each other.

First, a method of mounting the male snap 19 on the IC package 1 side will be described. 1 (a) and 1 (b), the metal member 18 having the male snap 19 attached to the ceramic plate 5 of the IC package 1 is bonded to the ceramic plate 5, and this embodiment will be described below as an example.

That is, FIG. 4 shows, as an example, a frame-shaped metal member 18 in which four male snaps 19 are joined at predetermined positions. FIG. 4 (a) is a side view and FIG. 4 (b) is a plan view. The outer dimensions W ₁ '× W ₂ ' are almost the same as the planar dimensions of the IC package 1, and a through hole 18a through which the heat transfer board 4 can pass is provided in the central portion. It goes without saying that the number of male snaps 19 can be arbitrarily selected as required.

There are two reasons for using the metal member 18. The first reason is that strong joining with the metal male snap 19 is possible and the joining area with the ceramic plate 5 can be made large. That is, a much larger joining force can be obtained than when the male snap 19 is directly joined to the ceramic plate 5, and a tensile force is applied to the IC package 1 and the pin fins 11 and 11 'to separate the male snap 19 and the female snap 21. There is less risk of the male snap 19 peeling off. The metal member 18 and the ceramic plate 5 can be joined firmly by bonding with an epoxy resin or brazing by subjecting the ceramic plate 5 to a metalizing process. The joining of the male snap 19 and the metal member 18 will be described later.

The second reason is that since the male snaps 19 can be fixed in place in advance, it is much more accurate and efficient than joining a plurality of male snaps 19 to the ceramics plate 5. It can be joined to.

Next, a method for attaching the female snap 21 to the pin fin side will be described. Also in this case, the female snap 21 is joined to the peripheral flat portion 40b of the metal member 40 in FIG. 1 (a), and this embodiment will be described below as an example.

That is, FIG. 5 shows a metal member 40 in which a female snap 21 is joined at a position corresponding to the male snap 19 of FIG. 4, FIG. 5 (a) is a plan view, and FIG. 5 (b) is a side view. is there. External dimensions W ₁ "× W ₂ " are the plane dimensions of the bottom plate portion 11b of the pin fin 11.
Almost the same as (W ₁ × W ₂ ), with a pedestal 40 of height H ₂ in the center
a is provided. The pedestal 40a serves as a heat transfer part from the IC package 1 and is for realizing the "heat transfer relationship" in the present invention, and the plane size thereof may be the same as the plane size of the heat transfer board 4. Of course, the above-mentioned "heat transfer relationship" may be realized by increasing the thickness of the heat transfer substrate 4 to the level of the pedestal 40a, in which case the pedestal 40a becomes unnecessary.

The metal member 40 and the pin fins 11 may be joined by bonding or brazing using a silicon adhesive having excellent heat conductivity. Further, in FIG. 1B, a female snap 21 is joined to a predetermined position of the pin fin bottom plate portion 11'b. 6 shows an embodiment of a pin fin 11 'having a female snap 21 at a position corresponding to the male snap 19 of FIG.
(A) is a plan view and (b) is a side view.

Here, the fitting of the male snap 19 and the female snap 21 will be described. FIG. 7 shows an example of FIG.
The fitting state of the male snap 19 and the female snap 21 in (a) is enlarged and a part thereof is shown. The ring-shaped spring 23 is pushed by the male snap head 19a and then slightly contracted, so that the male snap head 19a and the body portion 19b are located at an intermediate position between the male snap head 19a and the male snap head.
Holding nineteen. The coupling force between the male snap 19 and the female snap 21 is adjusted by the strength of the ring-shaped spring 23. In this state, the male snap 19 and the female snap 21 have no looseness in the vertical direction, the height of the male and female snaps in the combined state is h, the thickness of the metal member 18 is t ₁ , and the peripheral flat portion 40b of the metal member 40 is When the thickness of the t _2, the adhering the heat transfer substrate 17 and the pin fins pedestal 20c in FIG. 7, it is necessary relationship _{h + t 1 + t 2 =} g. Of course, a slight gap may occur between the heat transfer board 17 and the pin fin pedestal 11'c due to a manufacturing error, which may interfere with heat conduction.Therefore, apply heat transfer grease to the contact interface in advance. You can leave it.

Next, a method of joining the snap members will be described. The male snap 19 and the metal member 18 shown in FIG. 1 (a), the female snap 21 and the metal member 40 shown in FIG. 1 (b), and the male snap 19 shown in FIG. 1 (b).
As a method for joining the metal member 18, the female snap 21, and the pin fin 11, a brazing method or a mechanical joining method is preferable from the viewpoint of joining strength.

As the brazing method, aluminum brazing, silver brazing, copper brazing, soldering or the like may be selected according to the respective materials. The caulking method is a simple mechanical joining method.

FIG. 8 shows an example of the male snap 30 for caulking. FIG. 8 (a) is a sectional view and FIG. 8 (b) is a plan view. In the figure, the male snap 30 is a press-formed product of a metal thin plate composed of a dome-shaped head portion 30a, a body portion 30b having a smaller diameter and a bottom portion 30c, and the bottom portion 30c has a through hole 30d for caulking.
Is provided.

FIG. 9 shows a female snap 31 associated therewith.
9 (a) is a plan view and FIG. 9 (b) is a sectional view. In the figure, the female snap 31 is the diameter d of the male snap head 30a.
A press-molded product of a metal thin plate comprising a head portion 31a having a hole 31d slightly larger than ₁ and a body portion 31b and a bottom portion 31c each having a smaller diameter, and a through hole for caulking in the bottom portion 31c.
31e is provided. A ring-shaped spring 23 is housed inside the head portion 31a.

Next, an example of the caulking method will be described with reference to FIG. In FIG. 10 (a), the rivet 33 is inserted into the hole 18b at a predetermined position of the metal member 18 which is a frame-shaped metal plate, and the male snap 31 is inserted.
The rivet 33 is inserted through the bottom through hole 30d in FIG.
Note that, as shown in FIGS. 11 (a) and 11 (b), a metal member 18 'in which a protrusion 33' used as a rivet for crimping is integrated from the beginning may be used.

Next, the rivet 33 is struck by a caulking tool (not shown) from the head through hole 30e to crush the head of the rivet 33, and the male snap 30 is fixed to the frame-shaped metal plate 18. The same is for the metal member 40, the female snap 31 and the rivet 33.
Shows the state where is set, and caulking and fixing is performed in the same manner as in Fig. 10 (a). Even in this case, the metal member 40 and the rivet 33 which are integrated in advance may be used.

Even when the female snap 31 is caulked to the pin fin, the pin fin 11 "having the projection 33 'integrated therein as shown in FIGS. 12 (a) and 12 (b) may be used. A state in which a male snap 30 and a female snap 31 fixed by crimping are fitted to each other is shown, and is fixed by a ring-shaped spring 23 expanded by the male snap 30 in a state in which there is no looseness in the vertical direction.

An advantage of the above caulking fixing method is that the male snap 30 and the female snap 31 can be easily positioned. Of course, one of the opposed snap parts may be fixed by caulking and the other may be fixed by brazing.

[0049]

【Example】

(Example 1) In this example, the plane dimensions as shown in FIG.
On a flat surface of the ceramic plate 5 of the ceramic pin grid type IC package 1 having a plane dimension of 55 mm × 55 mm, which has a square conductive substrate 4 of 35 mm × 35 mm and a height H ₁ = 1.5 mm,
Outer diameter dimension W ₁ '× W ₂ ' = 54 mm × 54 mm shown in FIG. 4, thickness t ₁
= 1mm, 36mm × 36mm square through hole 18a in the center, and four brass frame (thickness 0.3mm) male snaps 19 are brazed to the four corners of the frame. The metal plate 18 was fixed by brazing. The dimensions of the male snap 19 were D ₁ = 8 mm, d ₁ = 4 mm, h ₁ = 4.7 mm, as shown in FIG.

Next, as shown in FIG. 5, the outer diameter dimension is 54 mm ×
54 mm, t ₂ = 1 mm, height H ₂ = 4.5 mm in the center, and a pedestal 40 a with a plane size of 35 mm × 35 mm in the center, four pure aluminum pieces at predetermined positions on the four corner plates of the aluminum alloy metal member 40. A female snap 21 made of plate (plate thickness 0.3 mm) was brazed. The size of the female snap 21 is D ₂ = 8 mm, d shown in FIG.
₂ = 6.5 mm, was h ₂ = 4.7 mm. Thereafter, the metal member 40 was brazed to the bottom plate portion 11b of the aluminum pin fin 11 having a plane dimension of 55 mm × 55 mm, in which a total of 169 radiating pins 11a having a diameter of 2 mm and a height of 20 mm were arranged at a pitch of 4 mm.

Next, after applying heat conductive grease to the surface of the pedestal 40a, the male snap 19 and the female snap 21 are fitted to each other to bring the heat conductive substrate 4 and the pedestal 40a into close contact with each other to form an IC package with pin fins. did. The total force required to separate the four male snaps 19 and female snaps 21 was about 2 kg, and the fastening force was sufficient.

When an IC was operated to generate heat of 20 W and a wind tunnel experiment was conducted, the thermal resistance value under conditions of a wind speed of 1.5 m / sec was 0.85 ° C./W, indicating good heat dissipation performance. On the other hand, when a similar heat dissipation performance evaluation was performed for the IC package 1 shown in FIG. 17 in which the pin fins 11 in which 151 heat dissipation pins 11a having a diameter of 2 mm and a height of 20 mm are arranged at a pitch of 4 mm are fixed with screws, the heat resistance is The value was 1.05 ° C./W, and the IC package with the pin fin of the present invention showed better heat dissipation performance.

(Embodiment 2) In this embodiment, the outer diameter dimension W shown in FIG.
₁ '× W ₂ ' = 54mm × 54mm, thickness t ₁ = 1mm, 36 in the center
A brass metal member 18 having a square through hole 18a of mm × 36 mm was prepared, and as shown in FIG. 10 (a), it was set in the through hole 18b having a diameter of 1 mm provided on the plate surface at the four corners thereof. Aluminum rivets 33 made of 4 aluminum alloy plates (plate thickness 0.3 mm)
After the bottom through hole 30d of the male snap 30 is inserted and caulked, as shown in FIG. 1 (b), a plane dimension 55 having a square conductive substrate 4 having a plane dimension of 35 mm × 35 mm and a height H ₁ = 1.5 mm.
A frame-shaped metal member 18 made of an aluminum alloy was brazed and fixed to the flat surface of the ceramic plate 5 of the ceramic pin grid type IC package 1 of mm × 55 mm. Male snap
The dimensions of 30 were d ₁ '= 4 mm and h ₁ ' = 4 mm as shown in FIG.

Next, as shown in FIG. 6, the diameter is 2 mm and the height is 20.
mm heat radiating fin 11'a is total 169 present arrangement at 4mm pitch, the planar dimensions 35 mm × 35 mm in the central portion, the planar dimensions 55 mm × 55 mm having a pedestal 11'c height H ₂ = 4.5 mm aluminum pin fin A through hole with a diameter of 1 mm is provided at the four corners of the bottom plate part 11'b of the 11 ', and an aluminum rivet set in this through hole
The bottom through holes 31e of four female snaps 31 made of an aluminum alloy plate (thickness: 0.3 mm) were inserted into and crimped. The dimensions of the female snap 31 are d ₂ '= 8 mm and h ₂ ' = 5 as shown in FIG.
It was mm.

Next, after applying heat transfer grease to the surface of the pedestal 11'c, the male snap 30 and the female snap 31 are fitted to each other to bring the heat transfer board 14 and the pedestal 11'c into close contact with each other, IC package with pin fins. The total force required to separate the four male snaps 30 and the female snaps 31 was about 2 kg, and the fastening force was sufficient. When the IC was operated to generate 20W of heat and a wind tunnel experiment was conducted,
The thermal resistance value at a wind speed of 1.5 m / sec is 0.85 ° C / W,
It showed good heat dissipation performance.

(Embodiment 3) In this embodiment, the same I as in Embodiment 1 is used.
On the flat surface of the ceramic plate 5 of the C package 1, the outer diameter dimension W ₁ '× W ₂ ' = 54 × 54 mm and the thickness t ₁ = 1 mm shown in FIG.
And, an aluminum alloy with a 36 × 36 mm square through hole 18a in the center and brazed four male snaps 19 made of pure aluminum (thickness 0.3 mm) on the four corners of the plate surface (blazing sheet). The edge-shaped metal plate 18 made of resin was adhered and fixed with an epoxy resin. The dimensions of the male snap 19 were the same as in Example 1.

Next, four female snaps 21 made of pure aluminum plate (thickness 0.3 mm) were brazed to predetermined positions on the four corner plate surfaces of the metal member 40 made of the same aluminum alloy as in Example 1. The size of the female snap 21 is the same as that of the first embodiment. After that, this metal member 40 is attached to the same pin fin 11 as in the first embodiment.
It was joined to the bottom plate portion 11b of the above with a silicone adhesive.

Next, the male snap 19 and the female snap 21
And the heat transfer substrate 4 and the pedestal 40a were brought into close contact with each other.
With respect to the fastening force and the heat resistance value, substantially the same test results as in Example 1 were obtained.

(Embodiment 4) In this embodiment, the outer diameter dimension W ₁ '× W ₂ ' = 54 × 54 mm and the thickness t ₁ = 1 mm shown in FIG.
Protrusions 33 'having a diameter of 1 mm and a height of 1.5 mm at the four corners of a pure aluminum edge-shaped metal plate 18' having a square through hole 18a 'of × 36 mm.
The same four male snaps 30 as in Example 2 were inserted and fixed by caulking, and this was adhesively fixed to the flat surface of the ceramic plate 5 of the same IC package 1 as in Example 2 with an epoxy resin.

Next, as shown in FIG. 12, a total of 169 radiating pins 11a "having a diameter of 2 mm and a height of 20 mm are arranged at a pitch of 4 mm, and a pedestal having a plane size of 35 × 35 mm and a height of H ₂ = 4.5 mm in the central portion. In the same manner as in the second embodiment, the projections 33 'having a diameter of 1 mm and a height of 1.5 mm are provided at the four corners of the plate surface of the bottom plate portion 11b "of the pin fin 11" having 11c ".
Inserted 31 female snaps and crimped.

Next, the male snap 30 and the female snap 31 are fitted together to bring the heat transfer board 4 and the pedestal 11c "into close contact with each other,
IC package with pin fins. With respect to the fastening force and the heat resistance value, substantially the same test results as in Example 1 were obtained.

[0062]

INDUSTRIAL APPLICABILITY The IC package with the heat radiation fin according to the present invention has a snap structure that allows the heat radiation fin to be attached to the IC package very easily with one touch. Therefore, the productivity is higher than that of the conventional nut fixing method or clip fixing method. Is remarkably excellent. In particular, the method of attaching the snap member to the frame-shaped metal plate in advance makes the assembly very easy.

Moreover, the snap does not cause any loosening of the fixing, which is more reliable than the conventional clip fixing method. Further, the radiation fin and the IC package can be separated from each other much more easily than the conventional method, and the radiation fin can be easily attached to the IC package.

In the trend of increasing integration of ICs in the future, it is certain that IC packages with heat dissipation fins will be used in large quantities, enabling mass production and easy attachment and detachment of heat dissipation fins. It is obvious that the IC package with the heat radiation fin of the present invention has great industrial value.

[Brief description of drawings]

1A and 1B are explanatory views of an IC package with a radiation fin according to the present invention, FIG. 1A is a schematic side view, and FIG. 1B is another schematic side view showing another embodiment.

FIG. 2 is an explanatory view of a male snap, FIG. 2 (a) is a side view, and FIG. 2 (b) is a plan view.

3 (a) is a plan view, FIG. 3 (b) is a side view, and FIG. 3 (c) is a plan view of a spring incorporated therein.

4 is an explanatory view of a frame-shaped metal member in which male snaps are joined by a method such as brazing, and FIG. 4 (a) is a side view and FIG.
(B) is a plan view.

5A and 5B are explanatory views of a metal member provided with a pedestal in which female snaps are joined by brazing or the like, FIG. 5A is a plan view, and FIG. 5B is a side view.

FIG. 6 is an explanatory view of a frame-shaped metal member in which female snaps are joined by a method such as brazing, and FIG.
(B) is a side view.

FIG. 7 is an explanatory diagram of a combined state of a male snap and a female snap.

8A and 8B are explanatory views of a male snap for caulking and fixing, wherein FIG. 8A is a sectional view and FIG. 8B is a plan view.

9A and 9B are explanatory views of a female snap for caulking fixation, FIG. 9A being a plan view and FIG. 9B being a sectional view.

FIG. 10 is an explanatory view of caulking fixation of male and female snaps,
10 (a) to 10 (c) are all sectional views.

11 (a) and 11 (b) are a plan view and a side view, respectively, of a metal member in which a caulking projection is integrally formed in advance.

12 (a) and 12 (b) are a plan view and a side view, respectively, of a pin fin integrally formed with a caulking projection in advance.

FIG. 13 is an explanatory diagram of a conventional IC package with heat dissipation fins.

14A and 14B are explanatory views of a heat radiation fin provided with channel fins, FIG. 14A is a plan view, and FIG. 14B is a side view.

15A and 15B are explanatory views of a heat dissipation fin provided with pin fins, FIG. 15A being a plan view and FIG. 15B being a side view.

FIG. 16 is an explanatory diagram of an IC package with a radiation fin that is adhesively fixed.

FIG. 17 is an explanatory diagram of an IC package with a radiation fin fixed to a nut, FIG. 17 (a) is a side view, and FIG. 17 (b) is a bottom view.

18A and 18B are explanatory views of an IC package with a radiation fin fixed to a clip. FIG. 18A is a side view and FIG. 18B is a bottom view.

[Explanation of symbols]

1: IC package 4: Heat transfer board 11: Pin fin 19: Male snap 21: Female snap 18: Metal member 25: Metal member 40: Metal member

Claims (10)

[Claims] 1. In an IC package with a heat radiation fin, the heat radiation fin and the IC package are detachably coupled by a pair of male and female snap members interposed between the bottom surface of the heat radiation fin and the bottom surface of the IC package. IC package with heat dissipation fins. 2. The heat radiating fin-equipped I according to claim 1, wherein a metal member having a plurality of male or female snap members attached at predetermined positions is joined to the bottom surface of the IC package.
C package. 3. The metal member has a through hole in a central portion,
3. A frame-shaped rectangular plate having a flat portion on the periphery of which a male or female snap member is attached.
IC package with heat dissipation fin as described. 4. The IC package with a radiation fin according to claim 2, wherein the metal member is bonded to the IC package by adhesion or brazing. 5. The IC package with a radiation fin according to claim 2, wherein the male or female snap member is attached to the metal member by brazing or caulking. 6. The IC package with a radiation fin according to claim 1, wherein a metal member having a plurality of male or female snap members attached at predetermined positions is fixed to the radiation fin. 7. The metal member is a rectangular plate having a pedestal portion for heat transfer in the central portion and a flat portion having a male or female snap member attached to the periphery thereof. Item 7. An IC package with heat dissipation fins. 8. The IC package with a radiation fin according to claim 6, wherein the metal member is fixed to the radiation fin by adhesion or brazing. 9. The IC package with a radiation fin according to claim 6, wherein the male or female snap member is attached to the metal member by brazing or caulking. 10. The IC package with a radiation fin according to claim 1, wherein a plurality of male or female snap members are fixed to the radiation fin by brazing or caulking.