JPH0825272B2 - Liquid jet recording head - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid jet recording head, and more particularly, to a discharge ejector which is a droplet discharge means for discharging a recording liquid as flying droplets, and an electric discharge element. The present invention relates to a liquid jet recording head, which has an external wiring portion provided for applying a signal, and in which the ejection element and the external wiring portion are electrically connected.

[Prior Art and Background Art] The liquid jet recording method, so-called ink jet recording method, has a negligible noise generation at the time of recording, high-speed recording is possible, and special recording such as fixing on plain paper is performed. Since it has advantages such as being able to record without requiring processing, it has recently been attracting attention.

Among them, for example, a liquid jet recording method described in Japanese Patent Laid-Open No. 54-51875 and German Patent Publication (DOLS) 2843064 discloses that a recording liquid is ejected by applying thermal energy to the recording liquid. It has different characteristics from other liquid jet recording methods in terms of obtaining driving force.

That is, in the recording method disclosed in the above publication, the liquid subjected to the action of thermal energy causes a state change accompanied by a sudden increase in volume, and the action force based on this state change causes an orifice at the tip of the recording head portion. The recording liquid is ejected to form flying droplets, and the droplets adhere to the recording member to perform recording.

In particular, the liquid jet recording method disclosed in the DOLS2843064 publication is not only very effectively applied to the so-called drop-on-demand recording method, but also the recording head part is a full line type high density multi-orifice recording. The feature is that the head can be easily embodied and a high-resolution, high-quality image can be obtained at high speed.

A liquid jet recording head (hereinafter abbreviated as a recording head) of an apparatus to which this recording method is applied has an orifice provided for ejecting a liquid and a thermal energy for ejecting a liquid droplet that is in communication with the orifice. The liquid ejecting section has a liquid flow path having a heat acting section that is a part that acts as a part of the configuration, and an electric / heat converting body as a means for generating thermal energy. An example of the conventional structure of such a recording head is shown in the plan view of FIG.

In FIG. 1, reference numeral 1 is a substrate of a recording head, and on the substrate 1, a number of heating resistors 2 which are the above-mentioned electric / thermal converters are provided corresponding to the number of recording dots. Further, a large number of lead electrodes 3 for guiding the drive signal from the drive circuit to the heating resistor 2 are formed. Further, a protective layer 4 is provided on the substrate 1 so as to cover a part of the heating resistor 2 and the lead electrode 3 as shown by a dotted line in the figure. The protective layer 4 protects the heating resistor 2 and the lead electrode 3 from the recording liquid ink, and an orifice plate (not shown) having an ink droplet ejection port is provided on the protective layer 4. Reference numeral 5 denotes a flexible cable for guiding the drive signal from the drive circuit to the recording head. Although not shown in detail, wire bonding, soldering, heat They are connected by a method such as pressure bonding and fixed on the substrate 1.

However, in such a conventional recording head structure,
The lead electrode 3 is extended in order to connect to the flexible cable 5 in the area indicated by reference numeral 6 on the substrate 1, and there are many lead-out portions of the lead electrode 3, which causes the following drawbacks.

(1) The area of the substrate 1 is increased.

(2) The required amount of the relatively expensive material for the substrate 1 such as Si is large and the cost is high.

(3) Increasing the size of the substrate 1 makes it difficult to perform steps such as etching, sputtering, and vapor deposition for forming the heating resistor 2 and the lead electrode 3 and hinders mass production.

(4) Since a short circuit, a bridge or the like occurs at the lead electrode 3 portion on the originally unnecessary area 6 with the same probability as at other portions, the product yield is deteriorated accordingly.

In addition, the recording heads described above are, for example, 8 at 2.5 lines / mm for calculator printers and 16 at 4 lines / mm for facsimile printers. It is manufactured by changing the pattern of the electrode, so the mask is different for each device, and the above-mentioned etching, sputtering, vapor deposition, etc. processes become complicated, resulting in frequent work mistakes and the like, resulting in poor product yield. There was a drawback to do.

In view of such drawbacks, the perspective view of FIG.
A printhead having a structure as shown in FIG. 3, which is a sectional view taken along the line XY in the drawing, has been proposed. In this case, a discharge element having a liquid discharge portion of the printhead and this are connected to the drive circuit described above. The external wiring portion includes the first substrate 7 and this substrate 7
Are separately provided on the second substrate 8 having an opening portion for fitting.

That is, as shown in both figures, a plurality of heating resistors 10 similar to those described above and lead electrodes 11, 11 connected to both ends of the same are provided on the first substrate 7, and further on these. An orifice plate 12 having a plurality of ejection openings 12a for ejecting ink droplets D corresponding to each heating resistor 10 is provided, and the above-mentioned ejection element is formed from the substrate 7 and these members.
13 are made up.

Further, on the second substrate 8, a number of external wirings 14 forming the above-mentioned external wiring portion are provided corresponding to the above-mentioned lead electrodes 11.

In particular, as shown in detail in FIG. 3, the lead electrode 11 and the external wiring 14 are connected by wire bonding via the wire 9.
The bonding portions at both ends of are sealed with a sealant 15 in order to improve the reliability of the connection.

However, in the above structure, since the discharge element 13 and the external wiring portion are connected by wire bonding, there are the following drawbacks.

(1) Since the sealant 15 swells more than the ejection surface of the orifice plate 12, it is impossible to reduce the distance between the ejection surface and the recording paper to improve the recording quality.

(2) When the above distance is reduced, the sealant 15 rubs the recording surface of the recording paper to lower the printing quality, and the sealant 15 is worn to reduce the connection reliability.

(3) The sealant 15 may adhere to the orifice plate 12, and the stress may deform the orifice plate 12.

(4) Since the pitch between the connecting parts cannot be narrower than about 140 μm at present, the discharge element 13 has four colors integrated (24 ×
It is difficult to deal with the case of multiple dots such as 4 dots) and high density dots.

(5) There are many design restrictions such as the area of the bonding pad and the pattern arrangement around the pad, damage to the pad, stress on the wire 9, and the like.

(6) Since it takes about 0.3 to 1 second to bond at one location, the connection work takes time in the case of a multi-dot discharge element, etc., resulting in poor production efficiency and high cost.

(7) Product yield is poor.

The above drawbacks apply not only to the liquid jet recording heads described above, but also to all liquid jet recording heads of the type described at the beginning.

[Objective] The present invention has been made in view of the above-mentioned drawbacks of the related art and the background art, and can achieve miniaturization and reduction of production cost.
Moreover, it is an object of the present invention to provide a liquid jet recording head which is excellent in reliability and can perform recording with high quality.

[Summary of the Invention] In order to achieve the above object, in a liquid jet recording head according to the present invention, a plurality of energy generators that generate energy used for ejecting a liquid, and the plurality of energy generators are electrically connected to each other. A plurality of electrodes that are electrically connected to each other, and the plurality of electrodes extend to both ends of the substrate, and the plurality of energy generators of the substrate are arranged. A discharge element having a discharge surface in which a plurality of discharge ports for discharging a liquid in a direction facing the upper surface are provided corresponding to the plurality of energy generators, and an electric signal is applied to each of the plurality of energy generators. An external wiring member in which a plurality of wirings for arranging are arranged, and the plurality of electrodes and the plurality of wirings in the direction along the ejection surface are electrically connected at both ends of the substrate. And a flat connection member for electrically connecting the discharge surface and the discharge surface and the upper surface of the connection member have substantially the same height in the direction in which the liquid is discharged from the plurality of discharge ports.

[Embodiment] Hereinafter, details of an embodiment of the present invention will be described with reference to the drawings starting from FIG. In addition, in each figure, FIG.
The same or corresponding parts as those in the figure are designated by the same reference numerals.

[First Embodiment] FIGS. 4 (a), (b) to FIG. 6 explain a first embodiment of the present invention.

In this embodiment, as shown in FIG. 4 (a), the discharge element 13 is composed of the first substrate 7 arranged in the opening of the second substrate 8 and each member provided on the upper surface thereof. The lead electrode 11 and the external wiring 14 provided on the second substrate 8 are connected via the film carrier 18 shown in FIG. 4 (b) as shown in FIGS. 5 and 6. Adopted structure. Note that FIG. 6 is a sectional view taken along the line XY in FIG.

 The details of each part will be described below.

The first substrate 7 is made of glass, ceramics, silicon or the like.

On the upper surface of the substrate 7, as shown in FIG. 6, layered heating resistors 10 are provided in the number corresponding to the number of dots of the recording head.

As a material for forming the layer of the heating resistor 10, almost any material can be adopted as long as it can generate desired heat when energized.

Specific examples of such a material include tantalum nitride, nichrome, silver-palladium alloy, silicon semiconductor,
Alternatively, hafnium, lanthanum, zirconium, titanium, tantalum, tungsten, molybdenum, borides of metals such as niobium, chromium, vanadium, etc. are preferable.

Among these materials constituting the heat-generating resistor 10, metal borides can be particularly mentioned as excellent ones. Among them, hafnium boride has the most excellent characteristics, and then zirconium boride, Lanthanum boride, tantalum boride,
The order is vanadium boride and niobium boride.

The heating resistor 10 is formed on the substrate 7 by using a method such as electron beam evaporation or sputtering using the above-mentioned materials.

Further, on the upper surface of the substrate 7, layered lead electrodes 11 connected to both ends of each heating resistor 10 are formed. This lead electrode 11 is a material that can form a dense and pinhole-free inorganic insulating layer on its surface, for example, Al, Ta, Ti, Mg, Hf, Z.
It is formed on the substrate 7 by a method such as vapor deposition using r, V, W, Mo, Nb, Si or the like or an alloy thereof.

Further, each lead electrode 11 is formed such that the end portion on the side opposite to the heat generating resistor 10 extends to the vicinity of both end portions of the substrate 7, and a joint for connecting with the film carrier 18 is formed on this end portion. A metal (bump) 19 is provided. The bonding metal 19 is formed on the outer end of the lead electrode 11 by using gold, copper, solder (Pb-Sn), Al or the like by a method such as plating or vapor deposition.

Further, an orifice plate 12 having a long U-shaped cross section is provided on each heating resistor 10 and a portion of each lead electrode 11 excluding the outer end portion. An ejection port 12a for ejecting the ink droplet D is formed at each of the positions facing the heating resistor 10.

The orifice plate 12 is a metal plate (metal plate formed by electroforming) formed by plating with a noble metal such as nickel, copper, chromium, or cobalt, or a compound thereof such as a phosphide, a photosensitive film, a photosensitive glass, or the like. And is fixed on the substrate 7 by a method such as bonding with an epoxy-based or silicon-based adhesive.

It should be noted that each heating resistor 10 and each lead electrode 11 are covered by the orifice plate 12 on the substrate 7 including the portion excluding the outer end portion of each lead electrode 11 and each heating resistor 10 and the lead electrode 11 are covered.
A protective layer (not shown) that protects 11 is formed as necessary.

Materials for forming this protective layer include inorganic oxides such as SiO ₂ , inorganic nitrides such as Si ₃ N, titanium oxide, vanadium oxide, niobium oxide, molybdenum oxide, tantalum oxide, tungsten oxide, chromium oxide, zirconium oxide. , Transition metal oxides such as hafnium oxide, lanthanum oxide, yttrium oxide, and manganese oxide, and metal oxides such as aluminum oxide, calcium oxide, strontium oxide, barium oxide, and silicon oxide, and their composites, silicon nitride, aluminum nitride , Boron nitride, tantalum nitride and other high resistance nitrides, and composites of these oxides and nitrides, as well as semiconductors such as amorphous silicon and amorphous selenium, even if they have low resistance in bulk, sputtering method, CVD
Examples of the thin film material that can increase the resistance in the manufacturing process such as a vapor deposition method, a vapor deposition method, a gas phase reaction method, and a liquid coating method.

Further, a second protective layer is formed on the protective layer as needed. As the forming material, Al, Ta, Ti, Zr, Hf, V, Nb,
Oxides of metals such as Mg, Si, Mo, W, Y, La and their alloys,
Carbides, nitrides, borides, etc. are used.

A discharge element 13 is constituted by the above-mentioned parts and the substrate 7.

On the other hand, the second substrate 8 is formed of a sintered body such as ceramic or alumina.

A large number of external wirings 14 are formed on the substrate 8 so as to face the lead electrodes of the ejection element 13 described above. The external wiring 14 is, for example, silver-palladium, silver-palladium-platinum, gold-platinum, gold-palladium, gold, silver,
It is formed from a thick film printing material for conductors such as silver-platinum.

Further, as the board 8 and the external wiring 14, a printed wiring board in which these are integrated may be used. In this case, a paper phenol plate, a glass epoxy plate, a paper epoxy plate, a glass polyimide plate, a glass BT resin plate or the like is used as the printed circuit board material, and copper is mainly used as the wiring material.

Further, a bonding metal 19 similar to that described above is formed on the end portion of each external wiring 14 on the side facing each lead electrode 11 by using the same material and method as described above.

On the other hand, the film carrier 18 is one in which a predetermined number of lead wires 20 are supported in parallel with each other at a predetermined interval by a film 21 which is a support member formed in a flat rectangular thin plate shape from a material having insulating properties and flexibility. The lead wires 20 penetrate the film 21, and both ends thereof are provided so as to project from the side end surface of the film 21 by a predetermined dimension. The lead wire 20 is made of copper, copper alloy, Fe-Ni alloy, or the like, and at least the tip portion connected to the lead electrode 11 and the external wiring 14 is gold, tin, copper, solder, aluminum, or the like. It is covered with a thin film formed by plating or vapor deposition.

The type of the joining metal 19 described above is selected according to the type of metal and the connecting method of the connecting portion of the lead wire 20.

In the above configuration, the discharge element 13 and the external wiring 14
As shown in FIGS. 5 and 6, the film carrier 18 is arranged between the first and second substrates 7 and 8, and one of the projecting ends of each lead wire 20 of the film carrier 18 is connected. Is bonded to each lead electrode 11 on the first substrate 7 via the bonding metal 19, and the other is connected to each external wiring 14 on the second substrate 8.
Is bonded to the substrate via the bonding metal 19. As the above-mentioned bonding method, thermocompression bonding,
Methods such as eutectic, reflow, and ultrasonic wave can be used.

As described above, according to this embodiment, since the discharge element 13 and the external wiring 14 are connected via the film carrier 18, the following advantages can be obtained.

(1) The connection portion (film carrier 18) between the discharge element 13 and the external wiring 14 is flat, and the orifice plate
Since the amount of protrusion of 12 from the ejection surface is small, the distance between the orifice plate 12 and the recording paper can be reduced to improve the printing quality.

(2) Even if the distance is reduced, the connection portion does not hit the recording paper, so that the connection reliability is improved.

(3) The pitch between the connection portions can be made narrower than the conventional 140 μm, and it is possible to cope with the multi-dot and high-density dot of the ejection element 13.

(4) Since the connection can be collectively performed in a short time, the production efficiency is improved.

Not limited to the film carrier 18 described above, if the above-mentioned connection is made by a lead wire supported by a flat support member,
The same effect as above can be obtained.

[Second Embodiment] FIGS. 7 to 8 illustrate a second embodiment of the present invention, and FIG. 8 is a sectional view taken along line XY of the perspective view of FIG.

As shown in both figures, in the case of this embodiment, the ejection element 13 on the first substrate 7 has the same structure as that of the first embodiment, but a large number of lead frames 22 are provided on the second substrate 8. The discharge element 13 and the external wiring portion are connected via the lead frame 22.

The lead frame 22 is formed as a slender flat metal electrode from a metal such as Fe-Ni alloy or copper alloy by a method such as etching or punching, and is connected to an external wiring (not shown) on the second substrate 8. Alternatively, it is formed integrally therewith, that is, as an extension of the external wiring portion.

The lead frame 22 is the lead electrode 11 of the discharge element 13.
Corresponding to the lead electrodes 11, the tip ends of which project from the side edges of the second substrate 8 facing the respective lead electrodes 11 by a predetermined dimension, and the lower end of the leading end contacts the upper face of the joining metal 19 of the lead electrodes 11. Is configured.

Further, a coating film of gold, copper, tin, solder, aluminum or the like is formed on at least the surface of the above-mentioned tip end portion of the lead frame 22 by plating or vapor deposition.

As shown in both figures, the connection between the discharge element 13 and the external wiring portion is made by connecting the leading end portion of each lead frame 22 and each lead electrode.
It is carried out by joining the tip end of 11 with the joining metal 19 by a method such as thermocompression bonding, eutectic, reflow, and ultrasonic wave.

The type of the joining metal is selected from gold, copper, solder, aluminum, etc. and the forming method is selected depending on the type of the metal of the joining portion of the lead frame 22 and the joining method.

Further, the material of the substrate 8 may be any as long as it can fix the lead frame 22, and a sintered body such as ceramic or alumina, a resin or the like is used.

According to the configuration of the present embodiment as described above, the discharge element
Since the connection portion (lead frame 22) between 13 and the external wiring portion is flat and the connection can be made at once, the same effect as in the case of the first embodiment can be obtained.

Not only the lead frame 22 described above but also the above-mentioned connection by the flat electrode can obtain the same effect as that of the first embodiment.

[Third Embodiment] FIGS. 9 to 11 explain a third embodiment of the present invention.

In this embodiment, the anisotropic conductive film 23 shown in FIG. 9 is used, and as shown in FIGS. 10 and 11, the discharge element 13 on the first substrate 7 and the outside on the second substrate 8 are used. Connection between wirings 14 is made. The ejection element 13 and the external wiring 14 are constructed in substantially the same manner as in the first embodiment described above, but the above-mentioned joining metal is connected to the lead electrode 11 and the external wiring 14 of the ejection element 13.
The difference is that 19 is not provided.

As shown in FIG. 9, the anisotropic conductive film 23 has an adhesive layer 25 formed on one surface of a film material 24 formed on a flat rectangular thin plate from synthetic rubber such as silicone rubber.
And a copper electric body 26 made of a metal foil such as nickel or copper are alternately provided in stripes.

In addition, particularly necessary conditions of this anisotropic conductive film 23,
Since a current of about 400 mA flows between the ejection element 13 and the external wiring 14 when the recording head is driven, the current capacity is sufficiently larger than this. As such an anisotropic conductive film, for example, a JSRMF connector manufactured by Japan Synthetic Rubber Co., Ltd. is known, and its current capacity is 1A.

As shown in FIGS. 10 and 11, the anisotropic conductive film 23 as described above is placed on the substrate 7 and the end of the lead electrode 11 on the substrate 8 with the surface on which the conductor 26 is provided facing down. External wiring 14
Placed on the end of the bridge, 180-220 ℃
The lead electrodes 11 and the external wirings 14 are connected to each other through the joined conductors 26 by heating the substrates 7 and 8 at a moderate temperature and adhering them to the substrates 7 and 8.

According to the configuration of the present embodiment described above, the connection portion (anisotropic conductive film 23) between the ejection element 13 and the external wiring 14 is flat, as in the first and second embodiments described above, and the connection is performed collectively. Since it can be performed, the same effect as described above can be obtained.

The above-mentioned anisotropic conductive film 23 has an adhesive strength of 300 g / c.
Since it is about m, which is much larger than the conventional wire bonding of about 10 g / cm, the reliability of connection is significantly improved.

Further, since the anisotropic conductive film 23 has anisotropic conductivity in the direction orthogonal to the direction parallel to the stripes of each conductor 26, the alignment of the film before bonding is performed in the stripe direction and the lead. If the electrodes 11 and the external wiring 14 are made parallel to each other in the axial direction, it is not necessary to strictly perform the stripe direction and the direction orthogonal to the same direction, which is extremely simple.

Further, since the bonding metal 19 is not provided on the lead electrode 11 and the external wiring 14, the number of steps is reduced as compared with the case of the first embodiment.

Not only the anisotropic conductive film 23 described above but also a flat conductive member having anisotropic conductivity is used for the above connection to obtain the above effects.

[Fourth Embodiment] FIG. 12 illustrates a fourth embodiment of the present invention.

In the case of this embodiment, the recording head is configured as a multi-head in which the ejection elements 13 similar to those in the above-described first embodiment are arranged in a line on the plurality of first substrates 7.

Further, on the second substrate 8, the external wirings 14 similar to those of the first embodiment are provided corresponding to the lead electrodes 1 of all the ejection elements 13.

The discharge element 13 and the external wiring 14 are also connected via the film carrier 18 which is almost the same as the above.

In this case, the film carrier 18 is formed in an elongated shape corresponding to all the discharge elements 13, and the lead wire 20 corresponding to each lead electrode 11 of all the discharge elements 13 is provided, and the film carrier 18 is used in the same manner as described above. The lead electrodes 11 of all the discharge elements 13 are connected to the external wirings 14.

As described above, the present invention can be applied to the case of a multi-head, and the same effect as described above can be obtained. In this case, in particular, a large effect can be obtained in terms of reduction of man-hours and improvement of production efficiency by making connection in a batch.

The connecting parts between the discharge element 13 and the external wiring 14 are not limited to those in the above-mentioned respective embodiments, but may be any one as long as the connecting part is flat, and the same effect as described above can be obtained.

[Effect] As is apparent from the above description, according to the liquid jet recording head of the present invention, a plurality of electrodes and external wiring members respectively connected to a plurality of energy generators used for ejecting liquid of the ejection element. The plurality of wirings are connected by a flat connection member in the direction along the discharge surface of the discharge element, and the height of the upper surface of the connection member is substantially the same as the discharge surface. The amount of protrusion from the ejection surface of the connecting portion by the connecting member between the electrode and the wiring in the portion is small. As a result, even if the distance between the sheets is reduced, assuming that the recording paper faces the ejection element in a flat state, the connecting portion between the electrode and the wiring does not hit the recording surface of the recording paper and rub the recording surface, It is possible to perform high-quality recording and improve the reliability of the connection of the ejection elements.

In addition, since the plurality of electrodes connected to each of the plurality of energy generators of the discharge element extend to both ends of the substrate, the electrodes between the electrodes are provided as compared with the case where the electrodes are provided to extend to one end of the substrate. You can double the pitch,
The electrode and the wiring can be connected easily and surely. On the contrary, the number of electrodes is 2 without changing the pitch between the electrodes.
It is possible to double the number, and it is possible to obtain an excellent effect that it is possible to cope with a large number of dots and high density dots of the ejection element.

[Brief description of drawings]

FIG. 1 is a plan view of a conventional liquid jet recording head, FIG. 2 is a perspective view of a recording head according to the background art, FIG. 3 is a sectional view taken along line XY of FIG. 2, and FIG. , (B) to FIG. 6 are for explaining the first embodiment of the present invention. FIG. 4 (a) is a perspective view of a recording head before connection, FIG. 4 (b) is a perspective view of a film carrier, FIG. 5 is a perspective view of the recording head after connection, FIG. 6 is a sectional view taken along line XY of FIG. 5, FIG. 7 is a perspective view of the recording head according to the second embodiment, and FIG. FIG. 9 is a perspective view of an anisotropic conductive film according to the third embodiment, FIG. 10 is a perspective view of a recording head according to the same embodiment, and FIG. 11 is a view of FIG. FIG. 12 is a sectional view taken along line XY, and FIG. 12 is a perspective view of a recording head according to the fourth embodiment. 7,8 ...... Substrate, 10 ...... Heating resistor 11 ...... Lead electrode, 12 ...... Orifice plate 13 ...... Discharge element 14 ...... External wiring, 18 ...... Film carrier 19 ...... Joining metal, 20 ...... Lead Wire 22 ... Lead frame 23 ... Anisotropic conductive film 26 ... Conductor

Claims (8)

[Claims] 1. A substrate having an upper surface on which a plurality of energy generators that generate energy used to eject a liquid and a plurality of electrodes that are electrically connected to the plurality of energy generators are arranged. The plurality of electrodes extend to both ends of the substrate, and the plurality of ejection ports for ejecting liquid in a direction opposite to the upper surface of the substrate on which the plurality of energy generators are arranged have a plurality of ejection ports. A discharge element having a discharge surface provided corresponding to each of the energy generators, an external wiring member having a plurality of wirings for applying electric signals to the plurality of energy generators, respectively, A flat connecting member for electrically connecting the plurality of electrodes and the plurality of wirings in the direction along the surface at each of both end portions of the substrate; Luo liquid jet recording head, characterized in that the liquid having an upper surface and has substantially the same height of the connecting member and the discharge surface in a direction of ejecting. 2. The liquid jet recording head according to claim 1, wherein the connecting member is a film carrier including a supporting member and a lead wire supported by the supporting member. 3. The liquid jet recording head according to claim 1, wherein the connecting member is a metal lead frame. 4. The liquid jet recording head according to claim 1, wherein the connecting member is an anisotropic conductive member. 5. The liquid jet recording head according to claim 2, wherein the support member has flexibility. 6. The liquid jet recording head according to claim 1, wherein the energy generator is a heating element that generates thermal energy as the energy. 7. The liquid ejecting apparatus according to claim 1, wherein the external wiring member is provided with an opening, and the ejection element is arranged in the opening. Recording head. 8. The liquid jet recording head according to claim 1, wherein a plurality of the ejection elements are arranged in parallel.