JPH08136462A - Disc peripheral face inspection device - Google Patents

Abstract

PURPOSE: To provide the disc peripheral face inspection device which can make a non-destructive inspection with no semiconductor wafer cut off, concurrently requires neither skill nor much time, and furthermore can continuously photograph the peripheral face. CONSTITUTION: This invention concerned with the inspection device which is equipped with an image pick-up element 35 at the outside of a rotating seat 2, and enlarges and pick up the image of the peripheral face of a disc rested on the ratating seat 2, and the disc peripheral face inspection device is characterized in that it is provided with a forward and backward moving means 5 moving the image pick-up element 35 forward and backward and a traversing means 4 which traverses the element 35 with respect to the rotating seat 2, a revolving means 6 revolving the element 35 to the head and tail directions along the peripheral face of the disc rested on the ratating seat 2, and concurrently with focal point focusing means 40 through 46 focusing each focal point with the peripheral face of the disc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting the condition of a peripheral surface of a disk, and more particularly, to a peripheral surface after processing the peripheral surface in the process of manufacturing a semiconductor wafer (hereinafter also referred to as a wafer). The present invention relates to an apparatus for inspecting by enlarging an image on an image sensor.

[0002]

2. Description of the Related Art As is well known, a semiconductor wafer is sliced from a cylindrical ingot to be formed into a disk shape, and then the sharply cut outer periphery of the sliced disk is ground with a diamond grindstone to be chamfered. Manufactured. The chamfering process is performed in order to prevent the occurrence of pitching and cracks in the subsequent process, and its chamfering shape is often composed of a chamfering angle α portion and an R portion as shown in FIG. Also, an orientation flat portion and a notch portion are formed on the wafer.

The peripheral surface of the manufactured semiconductor wafer (existence of surface flaws, dimensions of chamfered portion, etc.) is checked by sampling inspection. In the conventional inspection of the peripheral surface of a semiconductor wafer, the outer peripheral portion of the wafer is cut into an appropriate size, the peripheral surface of the cut wafer is fixed in the imaging direction, and the surface is subjected to a normal microscope or projector. Being inspected by the method.

[0004]

The above-mentioned method for inspecting the peripheral surface of a semiconductor wafer has the following problems. That is, since the outer peripheral portion of the wafer is cut into an appropriate size and inspected by using a normal microscope or projector, the inspected wafer does not become a product. In addition to the time-consuming task of cutting the wafer, it takes more time to pinch and position the wafer for inspection with a microscope or a projector. Since the wafer cut into an appropriate size is inspected, the peripheral surface cannot be continuously imaged. Further, if there is a defect in the cut portion, it is cut and the defect is overlooked.

The present invention has been made to solve the above problems, and its purpose is to enable nondestructive inspection without cutting a semiconductor wafer and to be skilled in positioning for the inspection. (EN) Provided is a disc peripheral surface inspection device capable of continuously capturing an image of a peripheral surface without requiring labor and time.

[0006]

In order to achieve the above object, a disk peripheral surface inspection apparatus according to the present invention is provided with an image sensor outside a rotary seat, and the disk mounted on the rotary seat. Which magnifies and images the peripheral surface of the disk, including a forward / backward moving means for moving the image pickup element forward and backward with respect to the rotary seat and a lateral moving means for laterally moving the image pickup element, and a disk on which the image pickup element is mounted on the rotary seat. It is provided with a rotating means for rotating in the front-back direction along the peripheral edge surface and a focus adjusting means for adjusting the focus with the peripheral edge surface of the disk.

[0007]

In the present invention, the image sensor is provided outside the rotary seat,
Since the image pickup device is moved forward and backward with respect to the rotating seat by the advancing and retracting moving means, and is laterally moved by the lateral moving means, it is moved back and forth according to the outer diameter of the disk mounted on the rotating seat, and It can be moved back and forth and left and right according to the orientation flat and notch. Further, since the image pickup device is rotated by the rotating means in the front-back direction along the peripheral edge surface of the disk placed on the rotary seat, the direction of the image pickup element is adjusted in the direction perpendicular to the peripheral edge surface of the disk. In addition, since the focus adjusting means is provided, it is possible to adjust the focus on the peripheral surface of the disc in the rotated state. Therefore, the semiconductor wafer can be inspected non-destructively without cutting, and the positioning at the time of inspection can be performed relatively easily. Moreover, the peripheral surface can be continuously imaged by rotating the rotary seat on which the semiconductor wafer is mounted.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view of a disk peripheral surface inspection device according to the present invention, in which a is a top view, b is a view of A along arrow A, FIG. 2 is a sectional view taken along line BB of FIG. 1, and FIG. FIG. 3 is an enlarged explanatory view of a C portion of FIG. 2, a is a side view, and b is a top view showing the rotary seat and the base plate of a, but not shown.

In the figure, 1 is a base, 2 is a rotary seat, 3 is an image pickup unit, 4 is a lateral moving means, 5 is an advancing / retracting moving means, 6 is a rotating means, and the upper right side of the gantry frame 7 of the base 1. A base plate 8 is detachably attached to the base plate by bolts or the like.

The rotary seat 2 is constructed by laminating an upper plate 9 on an upper surface of a shaft seat 10. The shaft portion 11 of the shaft seat 10 is inserted into a through hole 12 of the base plate 8 and the lower part of the base plate 8 is inserted. It is rotatably attached to the bearing portion 13 attached to the above through two upper and lower bearings 14 and 15. A pulley 16 is attached to the lower end of the shaft 11. A rotating shaft 18 having a knob 17 at the upper end is attached to one corner of the base plate 8, and a pulley 19 is attached to the lower end of the rotating shaft 18. Then, the belt 20 is attached to the pulley 16 and the pulley 19, and the rotary seat 2 is rotated by rotating the knob 17. Further, a suction hole 21 is provided at the center of the shaft seat 10 and communicates with four suction holes 22 opened on the upper surface of the upper plate 9.

On the other hand, on the upper part of the shaft portion 11 of the shaft seat 10, a pulley 23 is inserted at the lower end, and a rotary shaft 25 having a rotary part 24 formed at the upper part between the shaft seat 10 and the base plate 8 is inserted. Guides 26 are provided on the base plate 8 at intervals of 120 degrees, and a donut-shaped guide plate 27 which is divided into three is provided between the guide 26 and the outer periphery of the rotating portion 24 of the rotating shaft 25. Further, a rotary shaft (not shown) having a knob 28 at the upper end is attached to one corner of the base plate 8, and a pulley 29 is attached to the lower end of the rotary shaft. Attach the belt 30 to the wafer to rotate the wafer 2
A centering device when placed on top is configured.
In this centering device, a slider 32 having a pin 31 is slidably provided in an inner groove of a guide 26, a thin plate 33 is passed through a slit portion of a guide plate 27 divided into three, and a rotating portion 24 is provided at one end. And the other end is fixed to the slider 32. Therefore, when the knob 28 is rotated, the rotating portion 24 of the rotating shaft 25 is rotated via the pulley 29 and the belt 30,
As a result, the slider 32 moves back and forth together with the thin plate 33, and the wafer mounted on the rotary seat 2 is centered. The pin 31 is detachably provided on the slider 32, and the upper part of the pin 31 on the side contacting the wafer and the lower part attached to the slider 32 are eccentrically formed to rotate the pin 31. It is configured to correct the misalignment of the pin positions.

The image pickup section 3 is a T-shaped optical tube 34, which has an image pickup device 35 at the rear end, an objective lens 36 at the front end, an illumination light source 37 at the lower end of the lower tube, and the lower tube of the optical tube 34. The peripheral edge of the wafer is imaged by illuminating the peripheral edge of the wafer from the light source 37 through the half mirror 38, and the peripheral edge of the wafer is enlarged and imaged by the objective lens 36. This is performed by imaging the element 35. In addition, this imaging unit 3
The optical tube 34 is attached and held by the support portion 39, and the rack 40 attached to the optical tube 34, a small gear 41 meshing with the rack 40, a rotary shaft 42 of the small gear 41, a pulley 43,
A drive system including a belt 45, a belt 45, and a knob 46 allows the focus to be adjusted by rotating the knob 46. On the other hand, the support portion 39 has a U-shaped support frame 47.
Bearings on the upper and lower support shafts 49 fixed to the left and right support plates 48 of the
It is supported so as to be slidable in the axial direction of the support shaft 49 with 50 interposed. The pulley 44 and the support shaft 51 of the knob 46 are concentrically and rotatably attached to one of the rotation centers of the support frame 47.

The lateral moving means 4 is a nut provided on the support portion 39.
52, a screw shaft 53 screwed to the nut 52 and rotatably provided on the left and right support plates 48, a pulley 54 fixed to the screw shaft 53, and a rotation center of the support frame 47. A pulley 56 mounted on a rotatable support shaft 55 mounted concentrically,
Knob 57 and belt 58 attached to the pulley 54 and pulley 56
And the screw shaft is rotated by turning the knob 57.
The support portion 39 is supported by the support shaft 49 by rotating the nut 53 in the nut 52.
Move sideways along.

The advancing / retreating means 5 includes a sliding shaft 60 having a rotary support portion 59 at its tip, and sliding bearings 61 mounted on the left and right of the upper surface of the base plate 8 to slidably support the sliding shaft 60. , Rotatably attached between a rack 62 attached to the lower part of the rotation support portion 59 in parallel with the sliding shaft 60 in the same direction and brackets (not shown) attached to the left and right lower surfaces of the base plate 8. A small gear 64 and a knob of the rotating shaft 63, which are mounted so as to mesh with the rack 62.
It consists of 65, and by rotating the knob 65, the small gear
By moving the sliding shaft 60 back and forth in the sliding bearing 61 via the rack 64 and the rack 62, the rotation support portion 59 is moved back and forth.

The turning means 6 includes a turning shaft 68, which is rotatably supported by a projecting plate 66 at a lower inner portion of the left and right turning supporting portions 59, and a knob 67 is attached to one end of the turning shaft 68. A worm shaft 69 whose upper and lower ends are rotatably supported, and a bevel gear 70 provided on the shaft end of the worm shaft 69 protruding from the rotation support portion 59.
And a bevel gear 71 attached to the rotating shaft 68 and meshing with the bevel gear 70, and integrally formed on the side surfaces of the open ends (rotating center portions) of the left and right support plates 48 formed in the U-shape of the support frame 47. The left and right support plates 48 are attached to the rotation support portion together with the open ends.
It is composed of a worm wheel 73 rotatably supported by a projecting portion 72 projecting bifurcated on 59, and by rotating a knob 67, via a bevel gear 70, a bevel gear 71 and a worm shaft 69. The worm wheel 73 is rotated, whereby the support frame 47 integrally attached to the worm wheel 73 is rotated in the vertical direction with the worm wheel 73 as the center of rotation.

The peripheral surface inspection of the semiconductor wafer by the disk peripheral surface inspection apparatus according to the present invention having the above-mentioned structure is carried out as follows. : Place the wafer on the rotating seat 2 and use the knob
28 is turned to align the wafer with the center of the rotary seat 2 using the three pins 31. : The suction hole 21 is connected to a vacuum source, and the wafer is adsorbed and fixed to the rotary seat 2 by the four suction holes 22 opened on the upper surface of the rotary seat 2, and the knob 17 is rotated to rotate the rotary seat 2 for inspection. The peripheral surface of the wafer is oriented in the imaging direction. : The knob 65 of the advancing / retreating moving means 5 is turned according to the outer diameter of the wafer to adjust the distance between the objective lens 36 of the image pickup section 3 and the wafer peripheral surface to the working distance (WD) of the objective lens 36. : Adjust the knob 67 of the rotating means 6 by turning it according to the cross-sectional shape of the peripheral surface so that the chamfer angle is perpendicular to the α portion and the R portion (see FIG. 4). In the case of the orientation flat portion or the notch portion, the knob 57 of the lateral movement means 4 is turned to laterally move the image pickup section 3 and the knob 65 of the forward / backward movement means 5 is turned to increase the working distance (WD) of the objective lens 36. adjust. : When the imaging preparation by these items is completed, the knob 46 is turned to adjust the focus on the image sensor 35 while watching the monitor (not shown), and the inspection is started. : When the above inspection is completed, at the next inspection point, among the knob 17 for rotating the rotary seat 2, the knob 57 of the lateral moving means 4, the knob 65 of the advancing / retreating moving means 5, and the knob 67 of the rotating means 6, Turn the required knob to move and inspect as above.

As described above, since the wafer inspection point can be moved to the image pickup section 3 continuously without touching the wafer only by turning the necessary knob, the wafer can be inspected without being contaminated with particles. In addition, the semiconductor wafer can be non-destructively inspected without cutting it as in the conventional case, and positioning at the time of inspection can be relatively easily performed.

[0018]

As described above, the disk peripheral surface inspection apparatus according to the present invention enables non-destructive inspection of a semiconductor wafer without cutting the semiconductor wafer, and the positioning during the inspection is comparatively easy. It can be easily performed, and as compared with the conventional method of cutting and inspecting a semiconductor wafer, the yield of products can be improved, the labor of cutting can be saved, labor saving and improvement of productivity are expected. Moreover, the peripheral surface can be continuously inspected by rotating the rotary seat on which the semiconductor wafer is mounted.

[Brief description of drawings]

FIG. 1 is an explanatory view of a disk peripheral surface inspection device according to the present invention,
a is a top view and b is a view of the arrow A in FIG.

FIG. 2 is a sectional view taken along line BB of FIG.

3 is an enlarged explanatory view of a C portion of FIG. 2, where a is a side view and b is a.
FIG. 3 is a top view showing the rotary seat and the base plate of FIG.

FIG. 4 is an enlarged sectional view of a peripheral portion of a semiconductor wafer.

[Explanation of symbols]

1: Base 2: Rotating seat
3: Imaging unit 4: Lateral moving means 5: Forward / backward moving means
6: Rotating means 7: Mounting frame 8: Base plate
9: Upper plate 10: Shaft seat 11: Shaft part 1
2: Through hole 13: Bearing part 14, 15: Bearing 1
6, 19: Pulley 17: Knob 18: Rotation axis 2
0: Belt 21: 22: Suction hole 23, 29: Pulley 2
4: Rotating part 25: Rotating shaft 26: Guide 2
7: Guide plate 28: Knob 30: Belt 3
1: Pin 32: Slider 33: Thin plate 3
4: T-shaped optical tube 35: Imaging device 36: Objective lens 3
7: Light source for illumination 38: Half mirror 39: Support part 4
0: Rack 41: Small gear 42: Rotating shaft 4
3, 44: Pulley 45: Belt 46: Knob 4
7: Support frame 48: Support plate 49: Support shaft 5
0: Bearing 51: Support shaft 52: Nut 5
3: Screw shaft 54, 56: Pulley 55: Support shaft 5
7: Knob 58: Belt 59: Rotation support 6
0: Sliding shaft 61: Sliding bearing 62: Rack 6
3: Rotation axis 64: Small gear 65: Knob 6
6: Projection plate 67: Knob 68: Rotating shaft 6
9: Worm shaft 70, 71: Bevel gear 72: Projection 7
3: Worm wheel

Claims (1)

[Claims] 1. An inspection apparatus, comprising an image pickup device outside a rotary seat, for enlarging and imaging a peripheral surface of a disk placed on the rotary seat, wherein the image pickup device moves forward and backward with respect to the rotary seat. The image pickup device further includes a moving unit and a lateral moving unit for lateral movement, and further includes a rotating unit that rotates the image pickup element in a front-back direction along a peripheral edge surface of the disk mounted on the rotary seat, and focuses on the peripheral edge surface of the disk. A disk peripheral surface inspection device comprising focus adjusting means for performing adjustment.