JPH08122806A - Liquid crystal display device - Google Patents

Abstract

PURPOSE: To increase wiring density, and make bending possible too for miniaturizing a liquid crystal display device by composing a wiring substrate for a peripheral driving circuit with a multilayer flexible substrate. CONSTITUTION: A liquid crystal display device is composed of a chip-on-glass type liquid crystal display element PNL having a driving IC loaded on a substrate being one of two sheets of piled up transparent insulated substrates SUB 1, 2, and a multilayer flexible substrate FML which is arranged in an outer peripheral part on the side of at least one side of the element PNL and electrically connected to the input terminal pattern of the driving IC, and has more than three layers of conductive layer parts. In this case, the part FML of more than three layers of conductive layers, for instance that of four layers of conductive layers L1-L4 is provided in parallel to the side of the liquid crystal panel PNL, and since peripheral circuit wiring and electronic parts are loaded in this part, even if the number of data lines increases, the device can correspond to the above increase by increasing the number of layers as the external form of the substrate is maintained. A connection between conductors can be electrically carried out through a through hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device in which a liquid crystal is sealed between two transparent insulating substrates which are stacked together.
The present invention relates to a liquid crystal display device having a backlight including a light guide plate disposed below the light guide plate and a fluorescent tube disposed near the side surface thereof, and an information processing device incorporating the liquid crystal display device as a display unit.

[0002]

2. Description of the Related Art An active matrix type liquid crystal display device is provided with a switching element corresponding to each of a plurality of pixel electrodes arranged in a matrix. Since the liquid crystal in each pixel is always driven logically, the active matrix method has a better contrast than the simple matrix method which adopts the time-division driving method, and is a technology indispensable especially for color. .

In a conventional active matrix type liquid crystal display device, a drive IC (driver IC) for driving the liquid crystal display unit (liquid crystal display panel) in which a thin film transistor (TFT) is formed and a liquid crystal is sealed is provided as a tape carrier. As a tape carrier package (TCP) mounted on the board, it is connected to the scanning line side in the vertical direction and the signal line side in the horizontal direction by an anisotropic conductive film (anisotropic connector), and further, liquid crystal display data and liquid crystal necessary for the drive IC. A peripheral circuit for generating a timing signal for transmission to each driving IC is wired on a printed circuit board, arranged around a tape carrier package (TCP), and soldered to the tape carrier package (TCP) to form a liquid crystal display device. Was.

An active matrix type liquid crystal display device using thin film transistors is disclosed in, for example, Japanese Patent Application Laid-Open No. 63-309921, "1.
2.5-inch active matrix color liquid crystal display ", Nikkei Electronics, pages 193-210,
Known for publication on December 15, 1986 by Nikkei McGraw-Hill, Inc.

[0005]

In the conventional liquid crystal display device, a printed circuit board is used as a peripheral circuit board, and signals and powers input to the driver IC are displayed on the liquid crystal display from the printed circuit board via a cable or TCP. Connected to the element. Therefore, in the conventional liquid crystal display device, when the number of pixels in the liquid crystal display device increases, the number of connections between the liquid crystal display element and the TCP increases, and there is a problem that the probability of electrical connection failure increases. Further, when the number of display colors increases, the number of data lines of display data also increases and the outermost shape tends to increase, and the outer size of an information processing device such as a personal computer or a word processor incorporating the liquid crystal display device becomes large. There was a problem.

Further, in the conventional liquid crystal display device, a drive IC is driven through a display data control circuit and horizontal and vertical drive peripheral circuits based on a control signal, a clock and display data transmitted from a main body computer. Supply the necessary signals and power to. Therefore, when the number of display colors and the number of pixels of the liquid crystal display device increase, the frequency of the required signal increases, the electrical mutual interference of signals between wirings increases, and the EMI increases.
(Electro Magnetic Interference)
There is a tendency that the generation potential of unnecessary radiated radio waves that causes the above-mentioned noise increases, and there is a problem that the environmental use conditions of the information processing device such as a personal computer or a word processor in which the liquid crystal display device is incorporated cannot be satisfied.

Further, in the conventional liquid crystal display device, a printed circuit board is used for a display data control circuit board, a power supply circuit board, and a peripheral drive circuit board for horizontal and vertical scanning. The electrical connection is connected to the liquid crystal display element via a joiner such as a flat cable. Therefore, when the number of display colors of the liquid crystal display device increases, the number of wiring lines required in a limited area also increases, and it becomes necessary to perform the connection at a narrow pitch with high reliability and efficiency.

A first object of the present invention is to ensure accurate connection reliability even if the number of pixels and the number of display colors increase, and the number of wiring lines connected to liquid crystal display elements and the number of data lines of display data also increase. On the other hand, it is to reduce the size of the peripheral drive circuit to miniaturize the liquid crystal display device and the information processing device.

A second object of the present invention is that even if the number of display colors and the number of pixels increase and the frequency of control signals, clocks and display data and the number of wirings increase, the EMI level is low and the environment resistance is excellent. Another object of the present invention is to provide an information processing device having a liquid crystal display device.

A third object of the present invention is to reduce the number of parts of a liquid crystal display device and realize highly reliable inter-board connection.

[0011]

In order to solve the above first problem, a liquid crystal display device of the present invention is a chip in which a driving IC is mounted on one of two transparent insulating substrates which are stacked. An on-glass type liquid crystal display element and an outer peripheral portion of the liquid crystal display element on at least one side, which is electrically connected to an input terminal pattern of the drive IC,
It is characterized in that it is configured with a multilayer flexible substrate having three or more conductor layer portions.

Alternatively, a chip-on-glass type liquid crystal display element in which a driving IC is mounted on one of two transparent insulating substrates that are stacked together, and one of the four sides of the liquid crystal display element is long. A portion of the conductor layer of three or more layers, which is disposed on the outer periphery of the side and one short side on the two sides, and is electrically connected to the input terminal pattern of the drive IC on the two sides. It is characterized in that it is configured with the multi-layer flexible substrate.

Alternatively, a chip-on-glass type liquid crystal display device in which a driving IC is mounted on one of two transparent insulating substrates that are stacked together, and two of the four sides of the liquid crystal display device that face each other. Are arranged on the outer periphery of the long side and one short side, and are electrically connected to the input terminal pattern of the drive IC on each of the two long sides and one short side. And a multilayer flexible substrate having three or more conductor layers.

Furthermore, the pattern portion of the multilayer flexible substrate electrically connected to the input terminal pattern of the drive IC on the transparent insulating substrate is composed of two or less conductor layers or plated conductor layers. IC with a conductive conductive film
It is characterized in that it is electrically connected to the input terminal pattern.

Further, the liquid crystal display device is characterized in that it is arranged on the outer peripheral portion on one side and the wirings for the display control circuit and the power supply circuit are constituted by a multilayer printed board.

Further, the multi-layered flexible substrate has a structure in which it can be bent, and the bent portion is composed of a multi-layered flexible substrate composed of two or less conductor layers.

Further, in the portion of the multilayer flexible substrate having three or more conductor layers, the electronic component is mounted only on one side.

Further, the electronic component mounted on only one side is located in the opening of the shield case in a portion of the multilayer flexible substrate having three or more conductor layers.

Further, in a portion of the bent multilayer flexible substrate having three or more conductor layers, an electronic component is mounted only on the surface side of the portion, and the electronic component is located in the opening of the shield case. The back side is characterized by being bonded to the back side of the transparent insulating substrate on which the drive IC of the liquid crystal display element is mounted.

In order to secure the connection reliability with the liquid crystal display panel, conductors of two layers or less of the multilayer flexible substrate electrically connected to the input wiring pattern to the driving IC formed on the transparent insulating substrate. The layer portion is characterized by having a convex shape separated for each drive IC.

Furthermore, a portion of the multilayer flexible substrate electrically connected to the input wiring pattern to the drive IC formed on the transparent insulating substrate, which is composed of two or less conductor layers,
It is characterized in that it is composed of a convex-shaped portion separated for each drive IC, and that a mark that can be aligned with the wiring on the transparent insulating substrate is formed in the convex-shaped portion.

In order to solve the second problem, the liquid crystal display device of the present invention has a pad pattern portion for mounting components, a through hole for electrical connection, a solid shape of a DC power source such as a ground or 5 volts, or It is characterized by comprising a multilayer flexible substrate having a surface conductor layer formed of a mesh pattern portion.

Alternatively, a multilayer flexible substrate having a surface conductor layer formed from a pad pattern portion for mounting components, a through hole for electrical connection, and a solid or mesh pattern portion of a DC power source such as a ground or 5 volts A first substrate, and a display data control circuit having a hole for electrical connection, a front surface conductor layer formed of a ground solid or mesh pattern portion, and a back surface conductor layer on which an electronic component is mounted on one side. And a power supply circuit multilayer wiring substrate as a second substrate, and the solid or mesh pattern portion of the ground of the first substrate and the second substrate,
It is characterized in that it is electrically connected to the ground pad of the same metal shield case.

In order to solve the above-mentioned third problem, the structure is such that the wirings of a plurality of multilayer flexible substrates which are peripheral driving circuits are electrically connected to each other through a metal wiring pattern on a transparent insulating substrate. Is characterized by.

Alternatively, the multilayer flexible substrate of the peripheral drive circuit and the multilayer wiring substrate for the display control circuit and the power supply circuit are electrically connected by using an anisotropic conductive film.

[0026]

Since the wiring board of the peripheral drive circuit is composed of the multilayer flexible board, the wiring density can be increased and the bending is possible, which is advantageous for downsizing. Moreover, a wiring layer such as a ground pattern or a DC power source can be formed on the surface layer, which is advantageous as a measure against EMI. Further, since the multilayer flexible substrate is used instead of the TCP and the joiner between the peripheral circuit substrates is unnecessary, the number of parts of the liquid crystal display device can be reduced.

Further, according to the present invention, the number of pixels is increased and the terminal pitch is reduced, so that the terminal of the video signal line of the liquid crystal display panel cannot be drawn out on one side, and even if it is drawn out from both sides, the image connected to the terminal is By disposing the multilayer flexible circuit board for driving the signal lines on two sides of the display panel, usually on the two sides of the long sides, and bending it, it is possible to sufficiently reduce the area of the frame portion around the display portion. Therefore, when it is mounted on an information processing device such as a personal computer or a word processor as a liquid crystal display device having high definition and a high pixel number such as XGA (extended graphics array), the liquid crystal display device and an information processing device incorporating the same. Can be made smaller and lighter, and the side on which the circuit board for driving the video signal line is arranged is evenly arranged on the upper side and the lower side of the screen, so that the vertical position of the screen can be made appropriate.

Further, in the liquid crystal display device of the present invention, by disposing the elongated fluorescent tube in the space below the multilayer flexible substrate mounted on the outer peripheral portion of the liquid crystal display element, the fluorescent light can be efficiently used in the space. Can store tubes. Therefore, the external dimensions of the device can be reduced, and the device can be reduced in size and weight.

[0029]

The invention, further objects of the invention and further features of the invention will be apparent from the following description with reference to the drawings.

<< Overall Configuration of Liquid Crystal Display Module >> FIG.
FIG. 6 is an exploded perspective view of the liquid crystal display module MDL.

SHD is a shield case made of a metal plate (also called a metal frame), WD is a display window, and SPC1.
4 are insulating spacers, FPCs 1 to 3 are bent multilayer flexible circuit boards (FPC 1 is a gate side circuit board, FPC 2 and FPC 3 are drain side circuit boards), P
CB is an interface circuit board, ASB is an assembled liquid crystal display element with a drive circuit board, PNL is a liquid crystal display element with a drive IC mounted on one of two transparent insulating substrates that are stacked, and GC1 and GC2 are rubbers. Cushion, PRS is a prism sheet, SPS is a diffusion sheet,
GLB is a light guide plate, RFS is a reflection sheet, MCA is a lower case (molded case) integrally formed, L
P is a fluorescent tube, LPC is a lamp cable, LCT is a connector for an inverter, and GB is a rubber bush that supports the fluorescent tube LP, and each member is stacked in a vertical arrangement as shown in the figure to display a liquid crystal display module. The MDL is assembled.

FIG. 2 is a perspective view of the assembled liquid crystal display module MDL as seen from the front side of the liquid crystal display element.

The module MDL includes a lower case MCA,
The shield case SHD has two types of storage / holding members.

The HLDs are four mounting holes provided for mounting the module MDL as a display unit on an information processing device such as a personal computer or a word processor. The shield case SH is located at a position matching the mounting holes MH1 to MH4 of the lower case MCA.
Mounting holes SH1 to SH4 of D are formed (see FIGS. 4 and 19).
, And fix and mount it on the information processing device by inserting screws, etc. into the mounting holes of both. The module MDL is provided with a volume VR for brightness adjustment, a backlight inverter is arranged in the MI portion, and a connection connector LC is provided.
Power is supplied to the backlight BL via T and the lamp cable LPC. Signals and necessary power from the main computer (host) are supplied to the controller and power supply of the liquid crystal display module MDL via the interface connector CT located on the back surface of the module.

FIG. 3 shows a TFT which is the embodiment shown in FIG.
FIG. 3 is a block diagram showing a TFT liquid crystal display element of a liquid crystal display module and a circuit arranged on an outer peripheral portion thereof. Although not shown, in the present invention, the drain drivers IC1 to ICM
The gate drivers IC1 to ICN are a chip-on-glass made of a drain side lead line DTM and a gate side lead line GTM formed on one transparent insulating substrate of a liquid crystal display element and an anisotropic conductive film or an ultraviolet curable resin. It is mounted (COG mounting). In this example, it is applied to a liquid crystal display device having effective dots of 1024 × 3 × 768 which are XGA specifications. Therefore, on the transparent insulating substrate of the liquid crystal display element, eight 192 output drain driver ICs are provided on each of the opposing long sides (M = 16) and eight 100 output gate driver ICs are provided on the short side. (N = 8) and C
Implements OG. The drain driver section 103 is arranged on the upper and lower sides of the liquid crystal display element, the gate driver section 104 is arranged on the side surface section, and the controller section 101 and the power supply section 102 are arranged on the other side surface section. The controller unit 101, the power supply unit 102, the drain driver unit 103, and the gate driver unit 104 are mutually connected by electrical connecting means JN1 to JN4.

The specific construction of each component will be described below with reference to FIGS.
Each member will be described in detail with reference to FIG.

<< Metal Shield Case SHD >> FIG.
It is a figure which shows the upper surface of the shield case SHD, a front side surface, a rear side surface, a right side surface, and a left side surface, and the perspective view when it sees from the diagonal upper direction of the shield case SHD is shown in FIG.

Shield case (metal frame) SHD
Is manufactured by punching and bending a single metal plate by a pressing technique. WD is a display panel PN
An opening that exposes L to the visual field is shown, and is hereinafter referred to as a display window.

NL is a fixing claw (10 in total) for the shield case SHD and the lower case MCA, and HK is a fixing hook (6 in total) for the shield case SHD.
It is integrated with HD. The fixing claws NL shown in FIGS. 1 and 4 are, before being bent, housed in the shield case SHD with the liquid crystal display element ASB with the drive circuit sandwiching the spacer SPC, and then bent inward to the lower side. Square fixing recess NR provided in case MCA
(See each side view of FIG. 19). The fixing hooks HK are fitted to the fixing protrusions HP (see the side view of FIG. 19) provided on the lower case MCA, respectively. Thereby, the shield case SHD for holding and storing the liquid crystal display element ASB with the drive circuit, the light guide plate GLB, the fluorescent tube LP
The lower case MCA for holding and storing the like is firmly fixed. Further, thin and elongated rectangular rubber cushions GC1 and GC2 (also referred to as rubber spacers; see FIG. 1) are provided around the four edges that do not affect the display on the lower surface of the display panel PNL. Further, since the fixing claw NL and the fixing hook HK can be easily removed (only by extending the bending of the fixing claw NL and removing the fixing hook HK), 2
Since the members can be easily disassembled and assembled, the repair is easy and the fluorescent tube LP of the backlight BL can be easily replaced. Further, in the present embodiment, as shown in FIG. 4, one side is fixed mainly by the fixing hook HK, and the other facing side is fixed by the fixing claw N.
Since it is fixed by L, it is possible to disassemble by removing some fixing claws NL without removing all fixing claws NL. Therefore, it is easy to repair and replace the backlight.

The CSP is a common through hole provided in the same plane position as the holes SSP of the insulating spacers SPC1 to SPC4 (see FIG. 5) in common. The CSP is insulated from the shield case SHD on the pin which is fixed and erected during manufacturing. The spacers SPC1 to SPC4 are sequentially inserted into the common through holes to be mounted, so that the relative positions of the two can be set accurately. Insulating spacers SPC1 to 4 are adhesive materials ADH on both sides of the insulator INS.
(Refer to Figure 5) is applied, and the shield case SHD
Also, the liquid crystal display element ASB with the drive circuit can be fixed with a certain distance between the insulating spacers. Further, when the module MDL is mounted on an applied product such as a personal computer, the common through hole CSP can be used as a positioning reference.

FGF is a total of 10 frame ground claws integrally formed with the metal shield case SHD.
The shield case SHD is formed by an elongated U-shaped opening formed in the upper surface of the shield case SHD, in other words, an elongated protrusion extending into a square opening. The elongated projections are respectively bent at the roots in the direction toward the inside of the device, and are connected to the ground wirings of the multilayer flexible circuit boards FPC1 to FPC1 to 3 and the interface board PCB via the cut portions SGF of the insulating spacers SPC1 to SPC1. The structure is such that it is connected to the ground pad FGP (see FIG. 6) by soldering. Since two claws FGN are provided on the side surface of the shield case SHD, the work of bending the claws FGN into the inside of the device and soldering them to the frame ground pad FGP is a circuit board assembly integrated with the liquid crystal display panel PNL. After storing ASB in the shield case SHD and fixing it with the spacer, the shield case SH
The work can be performed with the inner surface (lower surface) of D facing upward, and the workability is good. Further, when the claw FGN is bent, the claw FGN does not contact the circuit board assembly ASB, so that the bending workability is good. Further, in the soldering work, since the soldering iron can be applied from the inner surface side of the opened shield case SHD, the workability of soldering is good. Therefore, the connection reliability between the claws FGF and FGN and the frame ground pad FGP can be improved.

The square opening SHL opened on the surface of the shield case SHD is a liquid crystal display element ASB with a drive circuit.
Is a portion for accommodating capacitors CHD and CHG which are electronic circuit components mounted on the multilayer flexible substrates FPC1 to FPC1 to DPC3, and there are 10 capacitors on the drain substrate side and 10 capacitors on the gate substrate side. Also has a notch SPL (see FIG. 5) at a position common in plan view. By this means, the thickness of the module MDL can be further reduced.

The round opening CVL formed on the surface of the shield case SHD is provided for controlling the brightness adjusting volume VR, and the insulating spacer SPC4 also has a common through hole SVL (see FIG. 5).

<< Insulating Spacer >> FIG. 5 shows the insulating spacer S.
It is a figure which shows the upper surface of PC, and the perspective view when it sees from the diagonal upper direction of the insulating spacer SPC is shown in FIG. Furthermore, S
The sectional view in the AA cutting line in opening SPL of PC1 and the sectional view in the BB cutting line of SPC4 are shown.

As described above, the insulating spacer SPC is
Liquid crystal display device AS with shield case SHD and drive circuit
Not only ensuring insulation from B, but also shielding case SH
Liquid crystal display device AS with driving circuit and position accuracy
Fix B to the shield case SHD.

<< Multilayer Flexible Boards FPC1 to 3 >> FIG. 6 is a bottom view showing a state in which the multilayer flexible boards FPC1 to FPC1 to 3 and the multilayer printed board PCB are mounted on the outer peripheral portion of the display panel PNL. In this example, the multilayer flexible substrates FPC1 to 3 are bent in the subsequent steps.

The upper eight in FIG. 6 are drive IC chips on the side of the vertical scanning circuit, and the left and right eight are drive IC chips on the side of the video signal drive circuit, and an anisotropic conductive film, an ultraviolet curing agent or the like is used. And chip-on-glass (COG) on transparent insulating substrate
It is implemented. In the conventional method, a tape carrier package (TCP) in which a driving IC chip is mounted by a tape automated bonding method (TAB) is connected to a display panel PNL using an anisotropic conductive film.
In COG mounting, since the direct drive IC is used, the above-mentioned TAB step is not required and the step is shortened, and the tape carrier is not required, so that there is an effect of cost reduction. Furthermore, CO
The G mounting is suitable as a mounting technology for the high-definition / high-density display panel PNL. That is, in this example, a TFT liquid crystal display module of 1024 × 3 × 768 dots and a 10-inch screen size was designed as an XGA panel. Therefore, the size of each dot of red (R), green (G), and blue (B) is 207 μm (gate line pitch) × 69 μm (drain line pitch), and one pixel is red (R). ), Green (G), and blue (B) are combined to form a 207 μm square. Therefore, if the drain line lead-out DTM is 1024 × 3 on one side, the lead-out line pitch is 6
It becomes 9 μm or less, which is less than the connection pitch limit of the currently available TCP packaging. In COG mounting, although depending on the material such as the anisotropic conductive film used, the pitch of the bumps BUMP (see FIG. 13) of the driving IC chip is about 70 μm and the crossing area with the underlying wiring is about 50 μm square. It can be said to be the minimum value currently available. Therefore, in this example, the drain driver ICs are arranged in a line on the two long sides facing each other of the liquid crystal panel, the drain lines are alternately drawn out on the two long sides, and the pitch of the drain line lead-out DTM is set to 69. × 2 μm Therefore, the bump BUMP (see FIG. 13) of the driving IC chip can be designed to have a pitch of about 100 μm and the area of intersection with the underlying wiring to be about 70 μm square, and the connection with the underlying wiring can be achieved with higher reliability. Since the gate line pitch is 207 μm, which is sufficiently large, the gate line lead-out GTM is led out on the short side on one side. However, when the resolution becomes higher, the gate line lead-out is pulled out on the two shorter sides facing each other like the drain line. It is also possible to draw the line GTM alternately.

In the system in which the drain lines or the gate lines are alternately drawn out, as described above, the connection between the lead lines DTM or GTM and the output side BUMP of the driving IC becomes easy, but the peripheral circuit board is opposed to the liquid crystal panel PNL. Therefore, there is a problem in that it is necessary to dispose them on the outer peripheral portion of the two long sides, and therefore the outer dimension becomes larger than in the case of one-sided drawing. In particular, as the number of display colors increases, the number of data lines of display data increases, and the outermost shape of the information processing device increases. Therefore, the present invention solves the conventional problems by using a multilayer flexible substrate. When the screen size of the XGA panel is 14 inches or more, the pitch of the drain line lead-out DTM is as large as about 100 μm or more, and the drain driver IC can be arranged on one long side by COG mounting on one side. Also in this case, the multilayer flexible substrate of the present invention can be used.

FIG. 7A is a cross-sectional view of the multilayer flexible substrate used in this example.

Three or more conductor layers, for example, four in this example.
By providing the part FML of the conductor layers L1 to 4 of the layers in parallel with the side of the liquid crystal panel PNL and mounting the peripheral circuit wiring and electronic parts in this part, the outer shape of the substrate is maintained even if the number of data lines increases. You can deal with this by increasing the number of layers. The connections between the conductor layers are electrically connected through the through holes VIA (see FIG. 14). The conductor layers L1 to L4 are formed of copper CU wiring, but only the conductor layer L3 is formed by plating the copper CU with gold AU. Therefore, the output terminal TM and the drive I
The connection resistance with the input terminal wiring Td (see FIG. 13) to C can be reduced. An intermediate layer made of a polyimide film BFI material is interposed as an insulating layer between the conductor layers to form an adhesive BI.
Each conductor layer is fixed by N. The conductor layer is the output terminal TM
Other than the above, it is covered with an insulating layer, but in the multilayer wiring portion FML, a solder resist SRS was applied to the uppermost and lowermost layers in order to ensure insulation.

The advantage of the multilayer flexible substrate is that the conductor layer L3 including the connection terminal portion TM required for COG mounting is used.
Can be configured integrally with other conductor layers, and the number of parts can be reduced.

Further, by forming the portion FML of the conductor layer of three layers or more, since it becomes a hard portion with little deformation, the positioning hole FHL can be arranged in this portion. Further, even when the multilayer flexible substrate is bent, the bending can be performed with high reliability and accuracy without causing deformation in this portion.
Further, as will be described later, the solid or mesh-shaped conductor pattern ERH can be arranged on the surface layer L1, and the remaining two or more conductor layers can be used for wiring the component mounting and peripheral wiring conductor patterns.

Further, the protruding portion FSL does not have to be a conductor layer of a single layer L3, and as shown in FIG. 7 (b) as another embodiment of the present invention, the protruding portion FSL has two conductor layers L2,
It can also be configured with L3. In this configuration, when the pitch of the input terminal wiring Td to the drive IC becomes narrow, the patterns of the terminal wiring Td and the connection terminal portion TM are formed in a staggered pattern in a plurality of rows of wiring groups, and the anisotropic conductive film is formed. And the like are electrically connected to each other, and the connection terminal portion T on the conductor layer L3 is
When the wiring group of one column is connected to the conductor layer L2 of the other layer through the through hole VIA when M is drawn, or when a part of the peripheral wiring is arranged on the conductor layer L2 in the protruding portion FSL, The configuration of the two conductor layers L2 and L3 is effective.

As described above, by forming the protruding portion FSL with two or less conductor layers, good heat conduction can be achieved and pressure can be uniformly applied during thermocompression bonding with a heat tool, and the connection terminal portion TM and the terminal The electrical reliability of the wiring Td can be improved. Also, when bending a multilayer flexible board,
Accurate bending can be performed without applying bending stress to the connection terminal portion TM. In addition, since the protruding portion FSL is semitransparent, the pattern of the conductor layer can be observed from the upper surface side of the multilayer flexible substrate, so that there is an advantage that the pattern inspection such as the connection state can be performed from the upper surface side.

FIG. 8 is a top view (a) and a bottom view (b) of a multi-layer flexible substrate FPC1 for driving a gate driver and an enlarged view of a main part of a conductor pattern of A, B and C portions on the multi-layer flexible substrate. (C), FIG. 9 shows a multilayer flexible substrate FPC2 for driving a drain driver.
Top view (a) and bottom view (b), and an enlarged view (c) of a main part of a conductor pattern of portions A, B and C on the multilayer flexible substrate, and FIG. 10 is a multilayer flexible substrate for driving a drain driver. The top view (a) of FPC3 and a bottom view (b) and the principal part enlarged view (c) of the conductor pattern of A, B, and C part on a multilayer flexible substrate are shown.

The alignment mark on the flexible substrate will be described.

Flexible substrate FP shown in FIGS.
In C1 to C3, the length of the connection terminal portion TM is usually designed to be about 2 mm in order to secure the connection reliability. But,
Flexible substrates FPC1 to 3 have long sides of 170 to 240
Since the length is as long as mm, the positional deviation between the input terminal wiring Td and the connection terminal portion TM may occur due to the positional deviation including a slight rotation in the major axis direction, resulting in a poor connection. The liquid crystal panel PNL and the flexible substrates FPC1 to FPC1 to 3 are aligned by inserting the opening holes FHL formed at both ends of each substrate into the fixing pins and then aligning the input terminal wiring Td and the connecting terminal portion TM at several places. You can However, in this example, the alignment mark is provided in order to further improve the alignment accuracy.

As shown in FIGS. 37 and 38, the gate driver driving IC has a total of 20 inputs V1R to V1L.
There is a book, and the numbers 2 to 21 of the connection terminal portion TM shown in FIG. 8 are electrically connected. The pitch PG of the terminal TM is about 600
μm. The alignment mark ALMG is located in the vicinity of the 20 terminals TM to each driving IC, and the alignment accuracy with the input terminal wiring Td pattern is improved and the inspection after connection is performed. In this example, in order to improve the connection reliability, dummy lines NC (terminal numbers 1 and 22) are provided adjacent to the 20 input terminals TM, and the square-shaped alignment mark ALMG is the dummy. The pattern is connected to the line NC, and the square filled pattern ALG (see FIG. 24) on the opposing transparent substrate SUB1 is aligned so that it fits within the square shape. Further, in this example, the drain driver substrate FP is provided on both end sides of the FPC 1.
Since the joint patterns JN3 and JN4 for connecting to C2 and FPC3 are provided, the alignment mark ALMG is pattern-connected to the number 1 in the outermost wiring pattern JN4 or the number 1 in the pattern JN3.

As shown in FIGS. 39 to 43, the terminals AVDD to AVD are used as inputs of the drain driver driving IC.
There are 47 lines in total between D, and they are electrically connected to the numbers 3 to 49 of the connection terminal portion TM shown in FIGS. 9 and 10. The pitch PD of the terminals TM is about 370 μm. In this example, the alignment mark ALMD has dummy lines NC (terminal numbers 2 and 50) for improving connection reliability arranged adjacent to the 47 input terminals TM. Further, on the outside thereof, there is a counter electrode of the liquid crystal capacitance Clc, and in order to supply a voltage to the common transparent pixel electrode COM (see FIG. 22) inside the transparent insulating substrate SUB2, the terminals (numbered in FIG. 9 and FIG. 1 and 51) are arranged. Thus, the common voltage is supplied from the conductive beads or paste to the common transparent pixel electrode COM on the transparent insulating substrate SUB2 side through the wiring Td pattern on the transparent insulating substrate SUB1.

The alignment mark ALMD is provided by pattern-connecting to terminals (numbers 1 and 51) electrically connected to the electrode COM, and is aligned with a square filled pattern ALD (see FIG. 4) on the transparent substrate SUB1. Further, in this example, the FPC2 and FPC3 shown in FIGS.
Joint patterns JN3 and JN4 for connecting to the gate driver substrate FPC1 are provided at the upper end of the. Further, the lower end portions of the FPC2 and FPC3 are provided with joint wiring patterns JN1 and JN2 for connection on the multilayer printed circuit board for the power supply circuit and the controller circuit, and further the alignment mark A
Pattern-connect the LMC to the outermost wiring.

Next, the shape of the conductor layer portion FSL of two layers or less will be described.

In this example, the protruding length of the portion FSL formed of a single-layer or two-layer conductor wiring is the bent portion BNT (see FIG. 7).
(Refer to FIG. 4), it is set to about 4.5 mm. However, in the structure without bending, the portion FSL can be further shortened.

The protruding shape of the portion FSL is a convex shape separated for each drive IC. Therefore, it is possible to prevent a phenomenon in which the flexible substrate thermally expands in the major axis direction during thermocompression bonding with a heat tool, the pitches PG and PD of the terminals TM change, and peeling or connection failure from the connection terminals Td occurs.
That is, by forming a convex shape that is separated for each drive IC, the pitch PG and PD shifts of the terminals TM can be set to the amount of thermal expansion corresponding to the cycle length of each drive IC at the maximum. In this example, the flexible substrate has a convex shape that is divided into eight sections in the major axis direction, and this thermal expansion amount can be reduced to about 1/8, and the stress on the terminal TM can be relaxed. Also contributes to the liquid crystal module MDL against heat
The reliability of can be improved.

As described above, the alignment mark AL
By providing MG and ALMD and making the projecting shape of the partial FSL to be a convex shape separated for each drive IC, even if the number of connecting wires and the number of display data increases, the accuracy is high and the connection reliability is ensured. The peripheral drive circuit can be reduced.

Next, the conductor layer portion FML having three or more layers will be described.

Chip capacitors CHG and CHD are mounted on the conductor layer portions FML of the FPCs 1 to 3. That is, in the gate-side substrate FPC1, as shown in FIGS. 37 and 38, the ground potential Vss (0 volt) and the power supply Vdg.
Between (10V) or power supply Vsg (5V)
A total of 10 pieces of C41 to C50 are soldered between this and the power supply Vdg. Further, the drain side substrate FPC2 and FPC
3 shows the ground potential V as shown in FIGS.
C21 between ss and the power supply Vdd (5 volts) or between the ground potential Vss and the power supply Vdd (2.5 volts).
~ C30 in total on the FPC2 board, C31 ~ C
A total of 10 of 40 are soldered on the FPC3 substrate.
These capacitors CHG and CHD are for reducing noise superimposed on the power supply line. In order to improve the accuracy of soldering, the chip capacitors can be automatically mounted on the board by using the small holes FAL provided in the boards FPC1 to FPC3.

In this example, these chip capacitors are soldered only on the surface conductor layer L1 on one side so that they are all located on the shield case SHD side after bending, and further, in a plane with the opening SHL of the shield case SHD. Designed to be in common position. Therefore, the capacitors for smoothing the power supply noise can be mounted on the substrates FPC1 to 3 while keeping the thickness of the liquid crystal module MDL constant.

Next, a method of reducing high frequency noise generated from the information processing apparatus will be described.

The metal shield case SHD side is the front side of the liquid crystal module MDL and the front side of the information processing equipment. Therefore, the generation of EMI (electro magnetic interference) noise from this side is not used for external equipment. It causes a big problem in the environment.

Therefore, in this example, the surface layer L1 of the conductor layer portion FML is covered with the solid or mesh pattern ERH of the DC power source as much as possible. FIG. 14 (a)
FIG. 9 is a plan view showing a pattern configuration of an FML portion in portion D of FIG. 8. The mesh MESH has a surface conductor layer L1.
The mesh-shaped pattern ERH covers almost the entire surface except for the through-hole VIA and the capacitor parts CHD and CHG.

Further, the pattern ERH is the solder resist S.
The pattern FGP exposed from RS is applied to the gate side substrate FPC
1 in the shield case SHD and 4 in the drain side substrates FPC2 and FPC3 respectively.
EMI noise is reduced by soldering to the ground. That is, when the circuit board is divided into a plurality as in this example, if at least one of the drive circuit boards is connected to the frame ground in terms of direct current,
Although no electrical problems occur, if there are few places in the high frequency region, there is no need to cause EMI due to reflection of electrical signals or fluctuation of the ground wiring potential due to differences in the characteristic impedance of each drive circuit board. The generation potential of various radiated radio waves becomes high. In particular, an active matrix type module MDL using thin film transistors
Then, since a high-speed clock is used, it is difficult to take measures against EMI. In order to prevent this, the ground wiring (AC ground potential) is connected to a common frame having a sufficiently low impedance (that is, the shield case SHD) at at least one location for each of the plurality of divided circuit boards. As a result, the ground wiring in the high frequency region is reinforced, so that in comparison with the case where only one place is connected to the shield case SHD as a whole, there is a significant improvement in the electric field intensity of radiation in the case of 10 places of this embodiment. It was

<< Interface Circuit Board PCB >> FIG. 11A is a bottom view of the interface circuit board PCB having the functions of the controller section and the power supply section, and FIG. 11 is a side view and a front side view of the mounted hybrid integrated circuit HI.
A top view of the interface circuit board PCB is shown in FIG. 11 (c).

In this example, the substrate PCB is a multilayer printed circuit board having eight layers made of a glass epoxy material. A multilayer flexible printed circuit board can also be used, but since a bent structure was not adopted in this portion, a multilayer printed circuit board having a relatively low price was used.

All the electronic components are mounted on the lower surface side of the substrate PCB which is the rear surface side as viewed from the information processing apparatus. For the display control device, two integrated circuit elements TCON are arranged on the left and right sides of the substrate. The interface connector CT is located almost in the center of the board and further has a plurality of resistors and capacitors mounted thereon. As described above, the rotating portion of the brightness adjusting volume VR can be externally adjusted through the hole CVL of the shield case SHD that is located at the same plane position as the hole PVL of the substrate PCB.

The reason why the two integrated circuit elements TCON are used is to reduce the outer size of the PCB board, to disperse the power consumption, and to arrange the drain drivers arranged in a line on the two long sides of the liquid crystal panel PNL. This is to efficiently supply signals to the IC. << Display control integrated circuit device TCON
Subdivision >> of the TCON division method will be described in more detail.

Further, in this example, since the substrate PCB is arranged on the outer peripheral portion of the liquid crystal panel PNL on the side of the sealing port EPX (see FIG. 6), the concave portion PCN is arranged in the vicinity of the center of the substrate PCB to seal the substrate. It is possible to prevent the substrate PCB from coming into contact with the protruding portion of the entrance EPX. Therefore, the substrate PCB can be brought closer to the liquid crystal panel PNL by about 1 mm as compared with the conventional case, which is advantageous for making the outer shape of the module MDL compact. Similarly, the sealing port EPX is the liquid crystal panel PNL.
Even if it is not in the center of the center and is located at the corner or near the corner, avoid the protruding part of the filling port EPX.
The recess PCN can be arranged.

In the hybrid integrated circuit HI, a part of the circuit is hybrid-integrated, and a plurality of integrated circuits and electronic parts for forming power supply are mounted on the upper and lower surfaces of a small circuit board. One is mounted on the interface circuit board PCB. As shown in the figure,
The leads of the hybrid integrated circuit HI are formed long, and a plurality of electronic components EP including TCON and the like are also mounted on the circuit board PCB between the circuit board PCB and the hybrid integrated circuit HI. It should be noted that four holes CAL are provided in the substrate PCB for the automation of component mounting.

Further, in this example, the anisotropic conductive film ACF1 is used for the electrical connection between the drain driver substrates FPC2 and FPC3 and the interface circuit substrate PCB.

FIG. 12A shows a multilayer flexible substrate F.
PC2 is an anisotropic conductive film AC on the multilayer printed circuit board PCB.
It is a perspective view which shows the state electrically connected by F1.

An anisotropic conductive film ACF is attached on the connection points JN1 and JN2 of the substrate PCB to form the substrates FPC2 and F2.
The hole FHL of the PC3 is temporarily fixed to the positioning pin of the jig, and the opening hole CJH and the hole FJH of the FPC3 are aligned to perform rough alignment. In order to improve the alignment accuracy, a square filled pattern ALC is arranged on the substrate PCB side.
While adjusting the position of this pattern ALC so that it fits in the square-shaped alignment pattern ALMC on the FPC2 and FPC3 side, the flexible board is provisionally thermocompression bonded by a heat tool. After confirming that there is no misalignment, main thermocompression bonding,
The boards FPC2 and FPC3 are fixed to the board PCB.

The reason why the anisotropic conductive film ACF is used is that the width of the connection parts JN1 and JN2 is narrowed to about 15 mm due to the limitation on the outer shape of the substrate PCB, which is about 20 mm. It is necessary to wire about 44 lines or power supply lines (see I / F4 and I / F5 in FIGS. 39 and 42), and the wiring pitch is reduced to about 340 μm.
Therefore, it has been difficult to achieve reliable electrical connection by conventional soldering. Therefore, with this means, even if the number of pixels and the number of display colors increase and the pitch between the wirings becomes narrow, the electrical connection with the interface substrate can be made with high reliability.

The upper surface of the substrate PCB is the surface side as viewed from the information processing device, and the direction in which the EMI noise is most radiated is the highest potential. Therefore, in this example, as shown in FIG.
As shown in (c), a multi-layered surface conductor layer is almost entirely covered with a ground solid or mesh pattern ERH. FIG. 14B is an enlarged front view of the pattern ERH. Under the solder resist SRS, a copper conductor mesh pattern ERH is formed over the entire surface except the through hole VIA portion. This pattern ERH is a pattern FGP and a shield case SH on the lower surface of the substrate PCB.
EMI by soldering with FGN ground of D
Noise radiation can be reduced.

As described above, the flexible substrate FPC
In Nos. 1 to 3 as well, the surface conductor layer of the substrate is covered with the pattern ERH, and the outer peripheral portions of the four sides of the liquid crystal panel PNL are all fixed at the DC potential, effectively reducing the EMI noise radiation from the inside of the substrate. be able to.

<< Liquid Crystal Display Element ASB with Driving Circuit Board >>
FIG. 16 is a top view of the liquid crystal display element ASB with a drive circuit board.

Flexible substrates FPC1 to FPC3 are bent and adhered to the surface of the transparent insulating substrate SUB1 opposite to the surface on which the pattern is formed. Only a small effective pixel area AR (about 1
mm) There is a polarizing plate POL1 on the outside, and from there, about 1
The ends of the FMLs of the substrates FPC2 and FPC3 are located 2 mm apart. FPC1 to 3 from the end of the transparent insulating substrate SUB1
The distance to the tip of the bent part of the projection is only about 1 mm
And small and compact mounting is possible. Therefore,
In this example, the distance from the effective pixel area AR to the tip of the protrusion of the bent portion of the substrates FPC1 to FPC3 is about 10 on the drain side.
mm, about 12 mm on the gate side.

Next, a method of bending and mounting a flexible substrate will be described.

FIG. 12B is a perspective view showing a method of bending and mounting a multilayer flexible substrate. Drain driver board FPC2, FPC3 and gate driver board FPC
The connection of 1 uses a flexible substrate as a joiner, and can be folded and mounted at this portion if necessary. However, in this example, in order to reduce the number of parts and to perform the bending mounting easily, the electrical connection pattern JN3 between the substrates is formed on the transparent insulating substrate SUB1.
And JN4.

First, as a rough alignment between the flexible substrates FPC1 to FPC3 and the liquid crystal panel PNL, the liquid crystal panel PNL is fixed to a jig at a predetermined position, and the fixing pin of the jig has a hole F.
HL is inserted to temporarily fix the boards FPC1 to 3. An anisotropic conductive film ACF2 is attached on the liquid crystal panel PNL, and while more accurately aligning with the alignment mark described above, temporary thermocompression bonding with a heat tool is performed, and after confirming that there is no misalignment, Main thermocompression bonding, flexible substrate FP
C1-3 are fixed on the liquid crystal panel PNL.

Next, the conductor layer portion FM of the flexible substrate
A double-sided tape is attached to the surface of L which is not mounted at all, and is bent at the conductor layer portion BNT using a jig.

FIG. 15 shows the double-sided tape BAT1 to BAT3 used.
Indicates. The width is 3 mm and the length is 160 to 240 mm, which is an elongated shape, but it is sufficient if adhesiveness can be secured, and a short shape may be attached at several places. The double-sided tapes BAT1 to BAT3 may be attached in advance on the transparent insulating substrate SUB1 side.

As described above, the transparent flexible substrate SUB is formed by accurately bending the multilayer flexible substrate using the jig.
Can be bonded to the surface of 1.

<< Electrical Connection Patterns JN3 and JN4 >>
By arranging the electrical connection patterns JN3 and JN4, it is possible to reduce the number of parts and easily perform bending mounting.

The electrical connection patterns JN3 and JN4 are
It is formed at the same time when the pixel pattern of the liquid crystal panel PNL is formed. In this example, the pattern JN3 is composed of four wires (see FIG. 37), and Vdg (10 volts), Vsg (5 volts), C from the periphery of the frame of the substrate SUB1 toward the inside.
L3 (clock for gate scanning), Vss (ground)
Then, the wiring was made so that the voltage gradually decreased.
CL3 (see FIG. 31) is a low-frequency clock pulse having a cycle of about 20 μsec (about 500 kHz) in one horizontal period and changing its level between 5 and 10 volts. The pattern JN4 is also composed of four wires (see FIG. 38), and Vee (−17 volt) and V from the periphery of the frame toward the inside.
Wiring was performed so that the absolute voltage values gradually decreased such as eg (gate-off voltage), FLM (frame start instruction signal), and Vss (ground). Veg (see Figure 26)
Is in a period of 2 horizontal periods (about 250 kHz), -17 to-
It is a low frequency clock pulse whose level changes between 11 volts. The FLM (see FIG. 31) has a frequency of 60 Hz and is 5
It is a low-frequency pulse whose level changes between -10 volts. Therefore, these AC signals are not a problem as EMI noise because they have a low frequency. Further, a total of eight power supplies and signal lines intersect in the multilayer wiring in the gate driver substrate FPC1 and are supplied to the input terminals of the gate drive IC. Therefore, the average DC voltage of each wiring on the substrate SUB1 can be arranged so as to change approximately monotonically from the periphery of the frame toward the inside without being restricted by the order of the input terminals of the gate drive IC. It is possible to prevent migration between wiring patterns and reduce electromagnetic interference between wirings in a high humidity environment. Regarding the wiring width, the Vss power supply line is thick in consideration of the flowing current capacity.
In addition, although the wiring interval is set to be substantially equal in this example, it can be widened when the voltage difference between the wirings is large.

With the above configuration, a total of eight signals necessary for driving the gate driver are J signals of the drain driver substrate FPC2.
N3 part 1 to 4 terminals (see FIG. 9) and board FPC3 JN
Through the parts 1 to 4 terminals (see FIG. 10), the gate driver substrate FPC1 has JN3 and JN4 terminals 1 to 4 (see FIG. 8).
(See).

<< Rubber Cushion GC >> FIG. 17 is a view showing a top view of the rubber cushions GC1 and GC2, and FIG. 1 is a perspective view seen from diagonally above. Figure 20 (a)
Shows a cross-sectional view taken along the line AA of the liquid crystal module MDL shown in FIG. 2.

As shown in FIG. 20, the rubber cushion GC1 is interposed between the flexible substrate FPC on the periphery of the frame of the substrate SUB1 of the display panel PNL and the lower case MCA. As a result, pressure is applied and fixed to the conductor layer portion FSL of two layers or less, and the connection reliability with the wiring pattern of the substrate SUB1 is improved. Further, the drive IC is prevented from coming into contact with the lower case MCA and causing mechanical damage.

The rubber cushion GC2 is a display panel PN.
It is interposed between the L substrate SUB2 and the reflection sheet LS on the light guide plate GLB. By using the elasticity of the rubber cushion GC2 to push the shield case SHD toward the inside of the device, the fixing hook HK is caught by the fixing protrusion HP, and the fixing claw NL is bent and inserted into the fixing recess NR. Then, each fixing member functions as a stopper, the shield case SHD and the lower case MCA are fixed, and the entire module is integrally and firmly held, and other fixing members are unnecessary. Therefore, the assembly is easy and the manufacturing cost can be reduced. Further, the mechanical strength is high, the vibration and shock resistance is high, and the reliability of the device can be improved.
The rubber cushions GC1 and GC2 are provided with an adhesive material on one side, so that the flexible substrates FPC and SU
It is affixed to a predetermined place on B2.

<< Backlight BL >> FIG. 18 shows a fluorescent tube LP
Sidelight type backlight BL before incorporating
Reflection sheet LS, diffusion sheet SRS, prism sheet P
It is a top view of the assembly of RS, the light guide plate GLB, and the reflection sheet RFS, and sectional drawing in the AA cutting line.

The side-light type backlight BL for illuminating the display panel PNL from the back is one cold cathode fluorescent tube L.
P, fluorescent tube LP lamp cable LPC, fluorescent tube LP and lamp cable LPC holding rubber bush G
B, the light guide plate GLB, a diffusion sheet SPS arranged in contact with the entire upper surface of the light guide plate GLB, a reflection sheet RFS arranged on the entire lower surface of the light guide plate GLB, and a prism sheet arranged in contact with the entire upper surface of the diffusion sheet SPS. It is composed of PRS.

In the reflection sheet LS, after the fluorescent tube LP is arranged on the reflection sheet LP, it is rolled and bent 180 degrees, and its end is adhered to the adhesive material BAT.

In the module MDL, the elongated fluorescent tube LP is arranged in the space below the drain side flexible substrate FPC2 and the drain side drive IC mounted on one of the long sides of the liquid crystal display panel PNL (see FIG. 20). There is. As a result, the outer dimensions of the module MDL can be reduced, so that the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced.

<< Diffusion Sheet SPS >> Diffusion Sheet SPS
Is placed on the light guide plate GLB, diffuses the light emitted from the upper surface of the light guide plate GLB, and uniformly illuminates the liquid crystal display panel PNL.

<< Prism Sheet PRS >> The prism sheet PRS is placed on the diffusion sheet SPS, the lower surface is a smooth surface, and the upper surface is a prism surface. The prism surface is composed of, for example, a plurality of grooves having V-shaped cross-sections, which are linearly arranged in parallel with each other. Prism sheet PRS
Can collect the light diffused from the diffusion sheet SPS over a wide angle range in the normal direction of the prism sheet PRS, thereby improving the brightness of the backlight BL. Therefore, it is possible to reduce the power consumption of the backlight BL, and as a result, it is possible to reduce the size and weight of the module MDL and reduce the manufacturing cost.

<< Reflective Sheet RFS >> Reflective Sheet RFS
Is disposed under the light guide plate GLB and reflects light emitted from the lower surface of the light guide plate GLB toward the liquid crystal display panel PNL.

<< Lower Case MCA >> FIG. 19 is a top view, an upper side view, a lower side view, a right side view and a left side view of the lower case MCA.

Lower case M formed by molding
CA is the fluorescent tube LP and the lamp cable LP shown in FIG.
C, a holding member for the light guide plate GLB or the like, that is, a backlight storage case, which is made by integrally molding a synthetic resin in one mold. Since the lower case MCA is firmly united with the metal shield case SHD by the action of each fixing member and the elastic body, the vibration shock resistance and the heat shock resistance of the module MDL can be improved, and the reliability can be improved.

On the bottom surface of the lower case MCA, a large opening MO occupying more than half the area of the surface is formed in the central portion excluding the peripheral frame-shaped portion. As a result, after the module MDL is assembled, the liquid crystal display panel PNL and
Rubber cushion GC2 between the light guide plates GLB (see FIG. 20)
Due to the repulsive force applied to the bottom surface of the lower case MCA in the vertical direction from the upper surface to the lower surface, the bottom surface of the lower case MCA can be prevented from bulging and the maximum thickness can be suppressed. Therefore, in order to suppress the bulge, it is not necessary to increase the thickness of the lower case, and it is possible to reduce the thickness of the lower case.
Can be made thinner and lighter.

MCL is an interface circuit board PC
The heat-generating component B, in this embodiment, a notch provided in the lower case MCA at a position corresponding to a mounting portion of a power supply circuit (DC-DC converter) formed as a hybrid IC (for connecting the connector CT shown in FIG. 11). Including notches). As described above, by providing the notch without covering the heat generating portion on the circuit board PCB with the lower case MCA, it is possible to improve the heat dissipation of the heat generating portion of the interface circuit board PCB. That is, at present, in order to improve the performance and improve the usability of a liquid crystal display device using a thin film transistor TFT, it is required to have multiple gradations and a single power source. A circuit for achieving this consumes a large amount of power, and if the circuit means is to be compactly mounted, high density mounting is required and heat generation becomes a problem. Therefore, the lower case MCA
By providing a notch MCL corresponding to the heat generating part,
It is possible to improve the high-density packaging of the circuit and the compactness. In addition to this, the display control integrated circuit element TCO
N is considered to be a heat-generating component, and the lower case MCA above this may be cut out.

MH1 to MH4 are four mounting holes for mounting the module MDL to an application device such as a personal computer. Even the metal shield case SHD has a lower case M.
Mounting holes SH1 to SH4 corresponding to the mounting holes MH1 to 4 of the CA are formed, and are fixed and mounted on the applied product by using screws or the like.

The rubber bush GB holding the fluorescent tube LP and the lamp cable LPC is fitted into the housing portion MG formed so that the rubber bush GB fits tightly, and the fluorescent tube LP is housed in the lower case MCA without contact. It is stored in the section ML.

MB is a holding portion of the light guide plate GLB, and PJ is a positioning portion. ML is a housing for the fluorescent tube LP, M
G is a housing for the rubber bush GB, and MVX is a fluorescent tube LP.
It is a groove portion for accommodating the overlapping portion of the surrounding reflection sheet LS and the light guide plate GLB. MC1 is the lamp cable L
PC1 is a storage part, and MC2 is a storage part for the lamp cable LPC2.

<< Lower case MC of lamp cable LPC
Storing in A >> In this example, the wiring of the lamp cable LPC is devised so as to be mounted compactly and not to have an adverse effect on EMI noise.

FIG. 20B is a sectional view taken along the line BB of the liquid crystal module MDL shown in FIG.

That is, of the two lamp cables LPC, the cable LPC2 on the ground voltage side is the fluorescent tube LP.
The lower case M so as to follow the outer shape of the three sides other than the storage part of
It is stored in a storage portion MC2 formed of a groove formed in CA. The high-voltage side cable LPC1 is shortly wired so as to be close to the portion connected to the inverter IV, and is stored in the storage portion MC1 formed of a groove formed. Therefore, since only the ground voltage wiring has a long path, the adverse effect on EMI noise does not change as compared with the conventional case. Therefore, as compared with the conventional case where two lamp cables LPC1 and 2 are taken out from one side, as shown in FIG. 20 (a), there is no lamp cable LPC2 on the fluorescent tube LP side, and a wiring area is provided. It can be reduced by 1.5 to 2 mm. In this example, FIG.
As shown in (b), the lamp cable LPC2 is arranged inside the transparent insulating substrate SUB1 so as to be located just below the drive IC, and has a compact design. When the drain driver is pulled out on both sides, this wiring method is particularly suitable for making the liquid crystal module compact.

An inverter IV is connected to the tip ends of the lamp cables LPC1 and LPC2. Inverter IV
Are stored in the inverter storage portion MI. in this way,
When the module MDL is incorporated in an applied product such as a personal computer, the lamp cable LPC does not pass through the outer side surface of the module, and the inverter IV does not protrude outside the module MD, and the fluorescent tube LP of the backlight BL, the lamp cable LPC, Rubber bush GB, inverter I
The V can be accommodated and mounted compactly, the module MDL can be made smaller and lighter, and the manufacturing cost can be reduced.

The place where the fluorescent tube LP is installed is the light guide plate G.
You may install on the short side of LB.

<< Division of Display Control Integrated Circuit Element TCON >>
Hereinafter, a method of dividing the display control integrated circuit TCON will be described based on an embodiment of the liquid crystal display device of the present invention.

First, an outline of the TFT liquid crystal display module of this embodiment will be described.

FIG. 21 is a block diagram showing a TFT liquid crystal display panel and circuits arranged on the outer periphery thereof. TFT
The drain driver unit 103 is disposed on the upper side of the liquid crystal display panel (TFT-LCD), and 1024 × 3 × 76.
XGA specification liquid crystal display panel (T
The gate driver unit 10 is provided on the side surface of the FT-LCD.
4, a controller unit 101 and a power supply unit 102 are arranged.

As described above, the drain driver section 103 and the gate driver section 104 were formed by bending and mounting a multilayer flexible substrate, and could be designed sufficiently compact.

Controller section 101 and power supply section 102
Are mounted on the multilayer printed circuit board PCB. The interface board PCB on which the controller unit 101 and the power supply unit 102 are mounted is arranged on the outer periphery of the short side on the sealing port side of the liquid crystal panel PNL so as to face the gate driver unit 104, but the width of the information device is restricted. Yes, PCB as much as possible
The width of B also needed to be reduced.

FIG. 22 is a diagram showing an equivalent circuit of the TFT liquid crystal display panel (TFT P-LCD) shown in FIG.

As shown in FIG. 22, the thin film transistor T
The FT is arranged in an intersection region between two adjacent drain signal lines D and two adjacent gate signal lines G.

Drain electrode of thin film transistor TFT,
The gate electrodes are connected to the drain signal line D and the gate signal line G, respectively.

Since the source electrode of the thin film transistor TFT is connected to the pixel electrode and the liquid crystal layer is provided between the pixel electrode and the common electrode, the liquid crystal capacitance CLC is equivalently connected to the source electrode of the thin film transistor TFT. To be done.

The thin film transistor TFT becomes conductive when a positive bias voltage is applied to its gate electrode and becomes non-conductive when a negative bias voltage is applied to its gate electrode.

Further, the storage capacitor Ca is provided between the source electrode of the thin film transistor TFT and the gate signal line of the previous line.
dd is connected.

It should be understood that the source electrode and the drain electrode are originally determined by the bias polarity between them, and since the polarity is reversed during operation in the circuit of this liquid crystal display device, it is understood that the source electrode and drain electrode are switched during operation. . However, in the following description, for convenience, one is fixed as the source electrode and the other is fixed as the drain electrode.

In the equivalent circuit of one pixel of the TFT liquid crystal display panel (TFT-LCD) shown in FIG. 22, stray capacitances Cgd and Cgs exist between the drain and gate of the thin film transistor TFT and between the gate and source. To do.

Therefore, as shown in FIG. 23, a series circuit of the holding capacitance Cadd and the gate-source floating capacitance Cgs is connected between the gate signal lines.

As is well known, the storage capacitor Cadd functions to reduce the influence of the gate potential change on the pixel electrode potential when the thin film transistor (TFT) switches. Further, the storage capacitor Cadd also has a function of prolonging the discharge time, and accumulates the image information after the thin film transistor TFT is turned off for a long time.

In this example, the storage capacitance C of the first line of the gate
In order to prevent the other end of add from being opened, the dummy gate signal line (G1) is provided outside the gate signal line (G1).
0) is provided, and the storage capacitance Cadd of the first line of the gate is provided.
Is connected to the dummy gate signal line (G0).

In addition, the gate signal line (G76
Since there is no gate signal line outside 8), the final gate signal line (G768) and the other gate signal lines (G1)
-G767), the capacitance value of the capacitor connected to the gate signal line is different. Therefore, the TFT of this example
In the liquid crystal display module, a dummy gate signal line (G769) is provided outside the final gate signal line (G768) so that the capacitors connected to the gate signal line have substantially the same capacitance value.

In this example, starting from the gate signal line G0,
One gate pulse is sequentially applied to the normal gate signal lines (G1 to G768) in one horizontal period. Also,
A gate-off pulse is applied to the dummy gate signal lines (G-1, G769) provided on both sides of the gate signal lines (G0 to G768).

FIG. 24 is a plan view showing the structure around the gate, drain wiring and wiring lead-out portion of the liquid crystal display panel of this example.

As described above, in this example, the double-sided drawing is adopted in order to increase the drain pitch. That is,
Odd-numbered wirings such as drain lines D1 and D3 are drawn to the upper side, and even-numbered wirings such as D2 and D4 are drawn to the lower side. Each of the 192 wiring groups of drain lines is electrically connected to the output of one drive IC.

Dummy gate signal lines (G-1, G0, G7
69) also has the effect of preventing static electricity from entering during the manufacturing process.

Dummy gate signal line (G-1, G769)
The gate-off voltage to the multi-layer flexible substrate FPC1
Supply directly through the pattern. Gate signal line (G0
To G768), each 100 wiring group is electrically connected to the output of one gate drive IC. Therefore, in the final gate drive IC 8, the output terminals X1 to X69
(See FIG. 37) Only gate signal lines (G700 to 768)
The remaining 31 output terminals are open.

FIG. 25 shows each driver (drain driver, gate driver,
2 is a block diagram showing a schematic configuration of a common driver) and a signal flow. FIG.

In FIG. 25, the display control device 201 and the buffer circuit 210 are the controller unit 101 shown in FIG.
The drain driver 211 is provided in the drain driver unit 103 shown in FIG.
Reference numeral 06 is provided in the gate driver unit 104 shown in FIG.

The drain driver 211 is composed of a data latch unit for display data and an output voltage generating circuit.

The gradation reference voltage generator 208, multiplexer 209, common voltage generator 202, common driver 203, level shift circuit 207, gate-on voltage generator 204, gate-off voltage generator 205 and DC.
The DC converter 212 is provided in the power supply unit 102 shown in FIG.

FIG. 26 shows the common voltage applied to the common electrode, the drain voltage applied to the drain, the level of the gate voltage applied to the gate electrode, and the waveform thereof. The drain waveform shows the drain waveform when black is displayed.

FIG. 27 is a diagram showing the flow of display data and clock signals for the gate driver 206 and drain driver 211 in the TFT liquid crystal display module of this example. 32 is a timing chart showing display data input from the main body computer to the display control device 201 and signals output from the display control device 201 to the drain and gate drivers.

The display control device 201 receives the control signals (clock, display timing signal, synchronizing signal) from the main body computer, and uses the clock D1 (CL1) and the shift clock D2 as control signals to the drain driver 211.
(CL2) and display data are generated, and at the same time, a frame start instruction signal FLM, a clock G (CL3), and display data are generated as control signals to the gate driver 206.

Further, the carry output of the previous stage of the drain driver 211 is the same as that of the drain driver 211 of the next stage.
Is input to the carry input of.

FIG. 28 is a block diagram showing the relationship between input display data and pixels.

When the number of display control devices is one, two pixels are input to the display control device and display data is distributed and output for the upper drain driver and the lower drain driver in the display control. In this example, the input display data from the main body computer is input to the interface I / F1 in parallel for two pixels, and is divided into data for one pixel by the wiring in the substrate PCB. Input to each input terminal.

35 and 36 show input / output wirings of the display control device and its peripheral portion.

From the main computer, from I / F1,
Up to 7 bits can be input to the upper display control integrated circuit element TCON (defined as the master side). That is, the display data of the red dot data RA0-6 of the first pixel, the blue dot data BA0-6 of the first pixel, and the green dot data GB0-6 of the second pixel are input. The display control integrated circuit element TCON converts these data,
6-bit display data of R00-05, B00-05, G10-15 are output respectively. The reason for using 6-bit display data is that, at present, it is difficult to obtain a drain driver for 7-bit display and the price for 6-bit display is relatively inexpensive.

RA0, B which are the lowest input display data
A0 and GA0 are RF of the display control integrated circuit element TCON
Connected to RC, BFRC, and GFRC and used as input for frame rate control (abbreviated as FRC). The FRC method is a method of controlling display data for each designated frame, controlling an effective value applied to a liquid crystal cell Clc, and performing multicolor display. With a simple matrix liquid crystal, existing technology is applied to a TFT liquid crystal. An example of this was Hiroyuki Mano,
Tsutomu Furuhashi, And Toshio Tanaka
Al. , "Multi-color display control method for TFT-LCD", SID 91 digest, p. 547, 1991 (Hiroyuki Mano, Tsutomu Furuhashi, and Toshio Tan
aka et al., "Multicolor Display Control Method for
TFT-LCD ", SID 91 DIGEST, 547 (1991)).

Therefore, by designating the least significant bit, FRC drive can be set or reset, and a maximum of about 128 gradations can be displayed for each color.

Further, the lower side display control device (defined as the slave side) has the green dot data GA0 to GA6 of the first pixel.
Input the display data of the red dot data RB0-6 of the second pixel and the blue dot data BB0-6 of the second pixel to B
10 to 15, G01 to 05, and R10 to 15 are output.
GB0, RB0, BB0 which are the lowest input display data
Connects to GFRC, RFRC and BFRC.

As described above, in the TFT liquid crystal display module of the present example, the display data transmitted from the main computer is based on the premise that 64 gradation display or about 128 gradation display by the FRC method is performed for each color. A 7-bit or 6-bit input is provided for each color, and the drain driver is capable of 6-bit processing for each color. Since this display control device has a configuration in which the number of input pixels and the number of output pixels are the same, the cycle of the input clock (DCLK) and the cycle of the output (CL2) are the same.
If it is not necessary to process the input data, the received data is output as it is to the drain driver.

FIG. 29 shows two display control integrated circuit elements T.
It is a block diagram which shows schematic structure of CON.

Each display control device 201 comprises a circuit configuration section 226 for 1 bit, a cycle processing section 230, and a control signal generation section 222.

The circuit configuration unit 221 per bit is D
Type flip-flop 226, logic processing circuit 227,
D-type flip-flop 228 is connected in cascade,
The display data is received from the main body computer, and the display data is output to the drain driver 211 based on the clock signal from the control signal generation unit 222. In this example, since each pixel has a 6-bit configuration and the display data for one pixel is processed in parallel, a total of eighteen circuit units 221 for three dots are configured.

Logical processing circuit 227 of data processing unit 221
Is inserted to invert the display data. That is, as shown in FIG. 26, for example, in order to change the drain waveform of the black level every one horizontal period (1H), the logic processing circuit 227 performs logical inversion bit by bit and inputs it to the drain driver.

As is apparent from FIG. 32, the shift clock D2 (CL2) of the drain driver has the same frequency as the clock signal (DCLK) and display data input from the main computer, and the clock from the main computer is the same. By the clock signal of the same frequency as the signal,
The display data fetched by the D-type flip-flop 226 is output from the D-type flip-flop 228 to the data bus by the clock signal, and the simple one-column display data transmitted from the main body computer is output to the data bus. .

Since the display control device 201 generates the control signal for driving the driver by the control signal from the main body computer, the phase of the output clock does not shift between the two display control devices, but Initial value (undefined value)
Or in the signal generated by the reset release state,
Synchronization and polarity may not match between these two. If not synchronized, the XGA panel of this example has a problem that black and white are inverted between the upper drain driver and the lower drain driver.

In this example, in order to solve the above problem, the cycle processing portion 230 is arranged in the display control device 201.

FIG. 30 shows a circuit configuration of a main part of the cycle processing section 230.

A synchronization signal is sent from the master side to the slave side, and the slave side uses this signal to perform internal processing. In the embodiment, the data inversion / non-inversion instruction of the drain driver corresponds to the synchronization processing between the two.

The master mode and the slave mode are selected from the mode setting terminal.

When the display control device 201 is on the master side, the master mode terminal becomes the Hi level and the slave mode terminal becomes the Low level, and the data polarity signal becomes the signal actually used in the circuit, and the logic processing circuit. Two
27 clock inputs. Furthermore, the data polarity signal is
It is input from the output buffer to the display control device 201 on the slave side through the output pad PAD and acts as a synchronization signal.

When the display control device 201 is on the slave side, the master mode terminal becomes Low level, the slave mode terminal becomes Hi level, and the output buffer no longer operates. In this state, the data polarity signal that has passed through the output pad PAD from the output buffer on the master side is applied as an input to the PAD of the display control device 201 on the slave side. This data polarity signal from the master side becomes a signal that is actually used in the circuit as it is, and becomes the clock input of the logic processing circuit 227 of the display control device 201 on the slave side. Therefore, the phase of the output clock does not shift between the two display control devices.

35 and 36 show connection diagrams and terminal names around the display control integrated circuit element TCON.

Output pad P from master side output buffer
The data polarity signal that has passed through AD is transmitted from the terminal DDT to the terminal DDT of the slave side input pad PAD.

If the display data need not be inverted, the logic processing circuit 227 is not necessary.

That is, for example, since the drain waveform of the black level shown in FIG. 26 is changed every horizontal period (1H), it changes every horizontal period (1H) in the gray scale reference voltage generating section of FIG. A power supply inverting circuit and a ladder resistance circuit directly connected to a transistor are combined to generate two kinds of gradation reference voltages corresponding to each gradation level, and the multiplexer 209 synchronizes two kinds of gradation reference voltages every horizontal period (1H). The gray scale reference voltage of is selected and input to the same gray scale reference voltage supply line of the drain driver. This method requires a power supply inverting circuit means and a synchronizing means with the multiplexer 209, which makes the circuit design generally difficult as compared with the logic inverting method. However, according to this method, the logic processing circuit 227 is not required in the two display control devices TCON, and the D flip-flops 226 and 228 can be one, which is further advantageous in reducing the area.

FIG. 33 is a plan view showing the outer shape of the display control integrated circuit element TCON for three types of configurations.

FIG. 33A shows the external size when the XGA liquid crystal panel PNL of this example is controlled by one display control integrated circuit element TCON. Even with only the display data terminal,
[7 bits (input) + 6 bits (output)] x 3 (RGB
Dot) x 2 pixels (for upper / lower drain driver) = 78
The minimum number of terminals is required. In addition to this, the control signals output to the drain and gate drivers are doubled, for a total of 14
It turned out to be 4 terminals. Pitch between terminals 0.5 mm
Then, the outer shape is about 22 mm square.

FIG. 33B shows the outer size when data is controlled by the two display control integrated circuit elements TCON on the master side and the slave side. FIG. 11 shows this configuration.
The display control integrated circuit element TCON is actually manufactured and the substrate P is
It is mounted on the CB. As a display data terminal,
[7 bits (input) + 6 bits (output)] x 3 (RGB
Dot) = 39 terminals and halved. In addition to this, the signals output to the drain and gate drivers are also halved, for a total of 8
It becomes 0 terminal. When the pitch between terminals is 0.5 mm, the outer shape is about 13.6 mm (length) × 12 mm (width). The reason why it is not completely halved is that mode settings, synchronization signals from the main body computer, display timing signals, etc. cannot be halved. However, since this configuration has a mode setting terminal, not only the XGA panel but also the VGA panel (6
40 × 3 × 480 dots and SVGA panel (800 ×
(3 x 600 dots) can also be supported.

FIG. 33C shows the external size when the display control integrated circuit element TCON is used for control, which is further dedicated to the XGA panel and where the mode setting terminal is omitted. As a result, the total number of terminals is reduced to 64, and the outer shape can be reduced to 12 mm square.

<< Information Device Mounted with Liquid Crystal Display Module MDL >> FIG. 34 is a perspective view of a notebook personal computer or a word processor mounted with the liquid crystal display module MDL.

By adopting the COG mounting on the liquid crystal panel PNL of the driving IC according to the embodiment of the present invention and the bending mounting on the multilayer flexible substrate as the peripheral circuit for the drain and gate drivers in the outer peripheral portion, it is possible to significantly increase the size compared with the conventional one. The external size can be reduced. Therefore, since the drain driver peripheral circuits can be symmetrically arranged above and below the display section above the hinge of the information device, the center of the display section and the center of the liquid crystal panel PNL can be easily aligned with each other.

First, in the figure, signals from the information equipment are connected to the two display control integrated circuit elements TCON from the connector CT located substantially in the center of the left interface board PCB.
The display data converted here is divided into upper and lower parts and flows to the drain driver peripheral circuit. As described above, by using the plurality of display control integrated circuit elements TCON, the restriction on the outer shape of the width of the information device can be eliminated, and the small and low power consumption information device can be provided.

FIGS. 35 and 36 show the controller unit 101 shown in FIG. 22, FIGS. 37 and 38 show the gate driver unit 104 shown in FIG. 22, and FIGS. 39 to 43 show the drain driver unit 103 shown in FIG. 44 and 45 show circuits of each driver shown in FIG.

Although the present invention has been specifically described based on the embodiments, it is needless to say that the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention.

[0180]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) In a liquid crystal display device, a chip-on-glass type liquid crystal panel in which a drive IC is mounted on a transparent insulating substrate, and the drive IC substrate is bent at three or more layers and is located on the outer periphery thereof. Since it is a possible multilayer flexible substrate, even if the number of pixels and the number of display colors increase and the number of wiring increases, the peripheral drive circuit of the liquid crystal display device can be downsized and the outer size of the information processing device can be reduced. It is possible.

(2) Since the surface conductor layer of the multilayer flexible substrate is covered almost entirely with a solid or mesh pattern portion of a DC power source such as ground or 5 V, the number of pixels and the number of display colors are increased. However, it is possible to provide an information processing device having a liquid crystal display device having a low EMI level and excellent environmental resistance even if the frequency of a required signal increases.

(3) By combining the chip-on-glass type liquid crystal panel and the bendable multi-layer flexible substrate, the conventional tape carrier package (TCP) is not required and the connection between the peripheral drive circuits is transparently insulated. Since the wiring on the board can be used, the number of parts can be reduced.

(4) By using an anisotropic conductive film for the connection between the peripheral drive circuits and aligning with the alignment mark on the multilayer flexible substrate, the number of pixels and the number of display colors are increased and the number of wirings is increased. However, the connection between the boards can be made with high reliability.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a liquid crystal display module of a liquid crystal display device to which the present invention is applied.

FIG. 2 is a perspective view of the liquid crystal display module shown in FIG. 1 seen from the front surface side after completion of assembly.

FIG. 3 is a block diagram showing a liquid crystal display panel of a liquid crystal display module that is an embodiment of the liquid crystal display device of the present invention and circuits arranged in the periphery thereof.

FIG. 4 is a top view, a front side view, a rear side view, a right side view, and a left side view of a shield case SHD.

FIG. 5 is a top view of a spacer SPC, a cross-sectional view taken along the line AA, and a cross-sectional view taken along the line BB.

FIG. 6 is a bottom view showing a state in which a multilayer flexible board and a multilayer printed board are mounted on the outer peripheral portion of the liquid crystal display panel of the present embodiment.

FIG. 7A is a cross-sectional view of a foldable multilayer flexible substrate used in this example. (B) is another embodiment of the present invention, and is a cross-sectional view of a multilayer flexible substrate in which the protruding portion FSL is composed of two conductor layers.

8A and 8B are a top view and a bottom view of a multilayer flexible substrate for driving a gate driver used in this example, and an enlarged view of a main part of a conductor pattern.

9A and 9B are a top view and a bottom view of a multilayer flexible substrate for driving a drain driver on one side used in this example, and an enlarged view of a main part of a conductor pattern.

FIG. 10 is a top view and a bottom view of a multilayer flexible substrate for driving the drain driver on the other side used in this embodiment, and an enlarged view of a main part of a conductor pattern.

FIG. 11 is a top view and a bottom view of an interface circuit board having functions of a controller section and a power supply section used in this embodiment, and a lateral side view and a front side view of a hybrid integrated circuit mounted on the board.

FIG. 12A is a perspective view showing a state in which the multilayer flexible substrate used in this example and the multilayer printed circuit board are electrically connected by an anisotropic conductive film. FIG. 6B is a perspective view showing a method of bending and mounting the foldable multilayer flexible substrate used in this embodiment.

13 is a cross-sectional view taken along the line AA of the perspective view shown in FIG.

FIG. 14 is a top view showing a pattern of a surface conductor layer in a portion of three or more layers of a multilayer flexible substrate used in this example, showing a state in which a mesh-shaped pattern fixed to a DC voltage is almost entirely covered.

FIG. 15 is a top view of the adhesive tape.

FIG. 16 is a top view of the liquid crystal display element with the drive circuit board after bending the multilayer flexible board.

FIG. 17 is a top view of a rubber cushion GC.

18A and 18B are a top view and a cross-sectional view taken along the line AA of the backlight including the light guide body, the prism sheet, the diffusion sheet, and the reflection sheet before the fluorescent tube is assembled.

FIG. 19 is a top view, a front side view, a rear side view, a right side view, and a left side view of a lower case MCA.

20 (a) is a cross-sectional view taken along the line AA of the assembly completed diagram of the liquid crystal display module shown in FIG. 2, showing a shield case, a bent part of a multilayer flexible substrate, chip parts mounted therein, and a rubber cushion. ,Backlight,
The relative positional relationship of the lower case is shown. (B) is a cross-sectional view taken along the line BB of the completed assembly diagram of the liquid crystal display module shown in FIG. 2, showing the relative position of the lamp cable LPC.

FIG. 21 is a block diagram showing an equivalent circuit of the TFT liquid crystal display module of this embodiment.

22 is a diagram showing an equivalent circuit of 1 dot of the TFT liquid crystal display panel shown in FIG.

23 is a diagram showing a capacitance connected to each gate signal line of an equivalent circuit of one pixel of the TFT liquid crystal display panel shown in FIG.

FIG. 24 is a plan view showing a configuration around a gate wiring, a drain wiring, and a wiring drawing portion of the TFT liquid crystal display panel of this embodiment.

FIG. 25 is a block diagram showing a schematic configuration of each driver of the TFT liquid crystal display module of the present embodiment and a signal flow.

FIG. 26 is a diagram showing a common voltage applied to a common electrode, a drain voltage applied to a drain electrode, a level of a gate voltage applied to a gate electrode, and waveforms thereof, in the TFT liquid crystal display module of this example. .

FIG. 27 is a diagram showing the flow of display data and clock signals from the display controller to the gate and drain drivers in the TFT liquid crystal display module of this embodiment.

FIG. 28 is a diagram showing a correspondence relationship between input display data and red, green, and blue dots in two pixels in the TFT liquid crystal display module of the present embodiment.

FIG. 29 is a block diagram showing a schematic configuration of the display control device shown in FIG. 27.

30 is a circuit diagram showing a main part of a cycle processing circuit of the display control device shown in FIG. 29.

FIG. 31 is a diagram showing a timing chart of display data input from the main body computer to the display control device and signals output from the display control device to the gate and the drain in the TFT liquid crystal display module of the present embodiment.

32 is a timing chart of FIG.
It is a figure which shows the timing of the display data input and the display data output to a drain driver.

FIG. 33 is a plan view showing the outer shape of the display control integrated circuit element TCON.

FIG. 34 is a perspective view of a notebook personal computer or a word processor in which the liquid crystal display module of the present embodiment is mounted.

FIG. 35 is a diagram showing a connection part between the display control integrated circuit element TCON and the interface I / F1 in the TFT liquid crystal display module of the present embodiment.

FIG. 36 is a diagram showing a connection part between the display control integrated circuit element TCON and the interface I / F1 in the TFT liquid crystal display module of the present embodiment.

FIG. 37 is a diagram showing a connection portion of a signal input / output to / from a gate drive IC and an input signal from the drain driver substrate side in the TFT liquid crystal display module of the present embodiment.

FIG. 38 is a diagram showing a connection portion of signals input / output to / from the gate drive IC and input signals from the drain driver substrate side in the TFT liquid crystal display module of the present embodiment.

FIG. 39 is a diagram showing a connection portion between the interface I / F 4 and a signal input to the drain driving IC and a connection portion of an output from the drain driving IC in the TFT liquid crystal display module of the present embodiment.

FIG. 40 is a diagram showing a connection portion between the interface I / F 4 and a signal input to the drain driving IC and a connection portion of an output from the drain driving IC in the TFT liquid crystal display module of the present embodiment.

FIG. 41 shows the connection between the interface I / F 4 and the signal input to the drain driving IC, and the connection between the output from the drain driving IC and the output to the gate driver substrate side in the TFT liquid crystal display module of the present embodiment. It is a figure.

FIG. 42 is a diagram showing a connection portion between the interface I / F 5 and a signal input to the drain driving IC and a connection portion of an output from the drain driving IC in the TFT liquid crystal display module of the present embodiment.

FIG. 43 shows the connection between the interface I / F 5 and the signal input to the drain drive IC, and the connection between the output from the drain drive IC and the output to the gate driver substrate side in the TFT liquid crystal display module of the present embodiment. It is a figure.

FIG. 44 is a diagram showing a circuit configuration of an actual liquid crystal drive circuit, which is a connection portion between the input interface on the host side and the output interface to the drain driver substrate side in the TFT liquid crystal display module of the present embodiment.

FIG. 45 is a diagram showing a circuit configuration of an actual liquid crystal drive circuit, which is a connection portion between an input interface on the host side and an output interface to the drain driver substrate side in the TFT liquid crystal display module of the present embodiment.

[Explanation of symbols]

PNL ... Liquid crystal display element (panel), SUB1 ... Transparent insulating substrate 1, SUB2 ... Transparent insulating substrate 2, SHD ... Shield case, IC ... Drive driver, FPC1-3 ... Multi-layer flexible substrate, FML ... Three or more layers in multi-layer flexible substrate , A portion composed of three or more conductor layers in the multi-layer flexible substrate, a bent portion of the multi-layer flexible substrate, ALMC, ALMD, ALMG ... Alignment mark, CHD, CHG ... Chip Parts, ERH ... Solid or mesh conductor pattern of DC voltage, PCB ... Interface circuit board, ACF1, ACF2 ... Anisotropic conductive film, TCON ... Display control integrated circuit element, PCN ... Position near convex portion of sealing port BL provided on the peripheral substrate
… Backlight, LP… Fluorescent tube, LPC… Lamp cable

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masumi Nagare 3300, Hayano, Mobara, Chiba Prefecture, Electronic Devices Division, Hitachi, Ltd. (72) Inventor, Katsuhiko Shibata 3300, Hayano, Mobara, Chiba Hitachi, Ltd. Electronic Device Business (72) Inventor Yoichi Igarashi 3300 Hayano, Mobara, Chiba Prefecture Electronic Device Division, Hitachi, Ltd. (72) Naoto Kobayashi 3681 Hayano, Mobara, Chiba Hitachi Device Engineering Co., Ltd.

Claims (15)

[Claims] 1. A chip-on-glass type liquid crystal display device having a drive IC mounted on one of two transparent insulating substrates that are stacked together, and arranged on at least one side of an outer peripheral portion of the liquid crystal display device. And a multi-layer flexible substrate having three or more conductor layer portions electrically connected to the input terminal pattern of the drive IC. 2. A chip-on-glass type liquid crystal display device in which a driving IC is mounted on one of two transparent insulating substrates that are stacked together, and one of the four sides of the liquid crystal display device is long. A portion of the conductor layer of three or more layers, which is disposed on the outer periphery of the side and one short side on the two sides, and is electrically connected to the input terminal pattern of the drive IC on the two sides. A liquid crystal display device comprising a multilayer flexible substrate having the liquid crystal display device. 3. A chip-on-glass type liquid crystal display device in which a driving IC is mounted on one of two transparent insulating substrates stacked together, and two facing ones of the four sides of the liquid crystal display device. Are arranged on the outer periphery of the long side and one short side, and are electrically connected to the input terminal pattern of the drive IC on each of the two long sides and one short side. Will be 3
A liquid crystal display device comprising a multi-layered flexible substrate having conductor layers of two or more layers. 4. A pattern portion of a multilayer flexible substrate electrically connected to a pattern for an input terminal of a drive IC on the transparent insulating substrate is composed of a conductor layer of two layers or less or a plated conductor layer, and is anisotropic. 4. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is electrically connected to the input terminal pattern of the drive IC by a conductive conductive film. 5. The liquid crystal display element according to claim 1, 2 or 3, wherein the wiring is arranged on the outer peripheral portion on one side of the liquid crystal display element, and the wiring for the display control circuit and the wiring for the power supply circuit is formed of a multilayer printed board. Liquid crystal display device. 6. The liquid crystal display device according to claim 1, wherein the multilayer flexible substrate has a structure in which it can be bent, and the bent portion is composed of a multilayer flexible substrate composed of two or less conductor layers. . 7. The liquid crystal display device according to claim 1, wherein electronic parts are mounted only on one side in a portion of the multilayer flexible substrate having three or more conductor layers. 8. An electronic component mounted on only one side of a multilayer flexible substrate having three or more conductor layers,
The liquid crystal display device according to claim 1, wherein the liquid crystal display device is located in the opening of the shield case. 9. An electronic component is mounted only on the front surface side of a bent multilayer flexible substrate having three or more conductor layers, and the electronic component is located in the opening of the shield case. The liquid crystal display device according to claim 1, 2 or 3, wherein the back surface side is adhered to the back surface side of a transparent insulating substrate on which a drive IC for the liquid crystal display element is mounted. 10. A drive IC formed on a transparent insulating substrate.
2. The conductor layer portion of two or less layers of the multilayer flexible substrate electrically connected to the input wiring pattern to the drive circuit has a convex shape separated for each drive IC.
2. The liquid crystal display device according to 2 or 3. 11. A drive IC formed on a transparent insulating substrate.
The portion of the multilayer flexible substrate electrically connected with the input wiring pattern to the
A liquid crystal display device comprising: a convex-shaped portion separated for each C; and a mark that can be aligned with a wiring on a transparent insulating substrate is formed in the convex-shaped portion. 12. A multilayer flexible substrate having a surface conductor layer formed of a pad pattern portion for mounting components, a through hole for electrical connection, and a solid or mesh pattern portion of a DC power source such as a ground or 5 volts. The liquid crystal display device according to claim 1, 2 or 3, which is composed of: 13. A multilayer flexible substrate having a surface conductor layer formed of a pad pattern portion for mounting components, a through hole for electrical connection, and a solid or mesh pattern portion of a DC power source such as a ground or 5 volts. A first substrate, and a display data control circuit having a hole for electrical connection, a front surface conductor layer formed of a ground solid or mesh pattern portion, and a back surface conductor layer on which an electronic component is mounted on one side. And a power source circuit multilayer wiring substrate as a second substrate, and the solid or mesh pattern portions of the grounds of the first and second substrates are the same as the ground pads of the same metal shield case 4. The liquid crystal display device according to claim 1, 2 or 3, wherein the liquid crystal display device is electrically connected. 14. A structure in which the wirings of a plurality of multilayer flexible substrates, which are peripheral driving circuits, are electrically connected to each other through a metal wiring pattern on a transparent insulating substrate. Or the liquid crystal display device according to item 3. 15. A multilayer flexible substrate for a peripheral drive circuit and a multilayer wiring substrate for a display control circuit and a power supply circuit are electrically connected using an anisotropic conductive film. 2. The liquid crystal display device according to 2 or 3.