JPH08112762A - Thick film pattern forming method - Google Patents

Abstract

PURPOSE: To form a pattern forming layer of flat film surface in a desired part on a substrate, so that on this pattern forming layer, a good mask layer can be provided, in the case of forming a thick film pattern by a sandblast method. CONSTITUTION: In a thick film pattern forming method forming a pattern forming layer on a substrate, providing on this pattern forming layer a mask layer of desired pattern having sandblast resistance, performing a sandblast process through the mask layer, thereafter removing the mask layer, and forming an aimed thick film pattern, by using a paste of high viscosity in a lower layer part and a paste of low viscosity in an upper layer part, the pattern forming layer is formed by lap screen printing. When printed the lower layer part, an irregularity part is generated in a surface by a thin seam of a screen print, but by laminating the paste of low viscosity from above the irregularity part, it is buried to provide flatness.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a thick film pattern in a manufacturing process of a plasma display panel, a liquid crystal display device, a fluorescent display device, a hybrid integrated circuit and the like.

[0002]

2. Description of the Related Art Conventionally, as one of methods for forming a thick film pattern on a substrate such as glass or ceramic with a ceramic material, a method by sandblasting is known.
That is, a resist layer is formed on a pattern forming layer formed on a substrate, a mask layer having a desired pattern is formed by performing exposure and development, and a sandblasting treatment is performed through the mask layer, and then a release agent is used. The target thick film pattern is obtained by removing the mask layer using the above method. Then, this pattern forming layer is formed by a screen printing method or a blade coating method.

[0003]

However, when the pattern forming layer is formed by the screen printing method, the conventional method is 1
Since pastes with different viscosities are used, when the layers are overprinted and laminated, a difference in the film thickness can occur due to the gauze of the screen plate. No flat film surface was obtained. Therefore, the mask layer having sandblast resistance for forming a pattern by sandblast cannot be formed well. On the other hand, when the pattern forming layer is formed by the blade coating method, a flat film surface is obtained, so that a good mask layer can be provided, but it can be applied only to the entire surface of the substrate, and thus it is possible to apply it like screen printing. In addition, since it cannot be formed in only a part, a pattern forming layer is formed in an extra place, resulting in a lot of waste and poor workability.

The present invention has been made in view of the above problems. When forming a thick film pattern by a sandblast method, a pattern forming layer having a flat film surface is formed at a desired position on a substrate. An object of the present invention is to provide a thick film pattern forming method capable of providing a good mask layer thereon.

[0005]

In order to achieve the above object, a method of forming a thick film pattern according to the present invention comprises forming a pattern forming layer on a substrate, and forming a mask layer of a desired pattern having sandblast resistance on the pattern forming layer. In the thick film pattern forming method of forming a desired thick film pattern by removing the mask layer after performing sandblasting through the mask layer, a high-viscosity paste is applied to the lower layer as a low-viscosity paste. It is characterized in that the pattern forming layer is formed by screen printing overprinting using a paste having a viscosity.

As the above high-viscosity paste, 80,000-1
50,000 cps. As a low-viscosity paste, 20,000 to 40,000 cps. It is preferred to use In addition, the viscosity here is measured using a No. 2 rotor with "VT-04 type" manufactured by Lyon Co., Ltd.

[0007]

In the thick film pattern forming method having the above-mentioned structure, when the lower layer portion of the pattern forming layer is screen-printed using a high-viscosity paste, unevenness occurs on the surface due to the mesh of the screen plate. By laminating a low-viscosity paste by screen printing, the low-viscosity paste is embedded in the irregularities on the surface of the lower layer, and a flat pattern forming layer film can be formed.

[0008]

【Example】

(Example) First, 100,000 cps.
5-8 by screen printing using the glass paste of
The layers were laminated. Subsequently, 40,000 cps. By laminating 1-2 layers by screen printing using the glass paste of
150μ with no visible steps due to the gauze on the screen
A pattern forming layer having a flat film surface having a thickness of m was formed.

Next, in order to form a mask layer for sandblasting, a resist layer is formed on the pattern forming layer with a dry film or a liquid resist. In this embodiment, a dry film is used, laminated on the pattern forming layer, and then exposed to a dose of 70 mJ / cm ² for irradiation with Na ₂
By developing with a 1 wt% CO ₃ aqueous solution, a mask layer having a desired pattern having sandblast resistance could be obtained.

Next, alumina # 1000 is used as an abrasive.
After performing sand blasting treatment with a spraying pressure of 3 kgf / cm ² , the resist layer was peeled off using a 3% aqueous solution of NaOH, whereby a desired thick film pattern could be obtained.

Comparative Example 80,000 cp on a glass substrate
s. 6 by screen printing using the glass paste of
-8 layers were laminated to form a pattern forming layer. With this conventional method, the step due to the gauze of the screen plate is close to 20 μm in a large area, so that the adhesion state between the resist film and the paste is poor, and a good resist film cannot be formed on the pattern forming layer. The desired mask layer could not be formed.

[0012]

As described above, according to the thick film pattern forming method of the present invention, when the thick film pattern is formed by the sandblast method, the high viscosity paste is used as the lower layer and the low viscosity paste is used as the upper layer. Since it was used to form the pattern forming layer by screen printing overprinting, a flat pattern forming layer can be obtained by filling the unevenness of the surface generated when printing the lower layer portion with the low viscosity paste of the upper layer portion, Therefore, a good mask layer can be formed thereon.

Claims (1)

[Claims] 1. A pattern forming layer is formed on a substrate, a mask layer having a desired pattern having sandblast resistance is provided on the pattern forming layer, sandblasting is performed through the mask layer, and then the mask layer is removed. In the thick film pattern forming method for forming a desired thick film pattern, forming the pattern forming layer by overprinting of screen printing using a high viscosity paste in the lower layer part and a low viscosity paste in the upper layer part. A featured method for forming a thick film pattern.