JPH08102635A - Composite parts of lcr - Google Patents

Abstract

PURPOSE: To reduce an occupied floor area and to inexpensively manufacture composite LCR parts by working and forming terminal electrodes of prescribed sizes. CONSTITUTION: Composite LCR circuits consisting of a resistor part 2, an inductor part 3 and a capacitor part 4 are formed on an alumina insulating base block 2 by alumina vapor deposition or the like. After an anodizing treatment is applied on the surface of an alumina conductor, an electrically insulated dielectric film 7 is formed. An Fe-Ni magnetic film 6 is formed on the inductor part 3. Finally conductive paste is applied to three positions of the side faces of the block 2 as terminal electrodes 1a, 1b, 1c of an LCR circuit, baked and then soldered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type LCR composite component used in a circuit of an electronic device.

[0002]

2. Description of the Related Art A conventional LC incorporated in a circuit such as a signal line of an electronic device for noise blocking and impedance matching.
In the R composite circuit, as shown in FIG. 6, an LC circuit is constructed by connecting a surface mounting type small coil 12 and a surface mounting type capacitor 13 in parallel, and a resistor 14 formed by a printed circuit board pattern is connected to the LC circuit. They were arranged in series to form an LCR circuit. Further, as shown in FIG. 7, two cylindrical ferrite cores 15 are used to form a through inductor, a small ceramic capacitor or the like is connected to the center thereof to form an LC circuit, and these are sealed with resin 16. And LC
It was a composite part. As described above, in the conventional LCR composite circuit, the circuit is formed by a combination of a small coil, a small capacitor, and a resistor, or an expensive LC composite component that occupies a relatively large floor area is selected and the resistance is increased. The circuit was formed in combination with.

[0003]

However, in order to reduce the size and weight of the electronic device and to reduce the price thereof, the improvement of the surface mounting density of the electronic parts becomes an issue, while the LCR composite circuit has the above-mentioned structure. There is a problem that it is difficult to reduce the occupied floor area of the.

An object of the present invention is to provide a surface mountable LCR composite component which can reduce the occupied floor area of the LCR composite circuit, can be manufactured at low cost, and has high reliability. .

[0005]

In the LCR composite component of the present invention, an inexpensive insulating substrate such as alumina is divided in part or in advance, or a cut groove or the like is formed in the insulating substrate, and thereafter, A structure in which a conductor film, a dielectric film, and the like are laminated to provide an LCR composite circuit, and a terminal electrode is further formed and processed into a predetermined size, or after the terminal electrode is processed into a predetermined size and formed. Is characterized by.

That is, according to the present invention, on the insulating substrate block,
A conductor film, a dielectric film, and, if necessary, a magnetic film and an electric insulating film are laminated to form a circuit including an inductor portion, a capacitor portion, and a resistor portion, and a terminal electrode connected to the circuit is connected to the insulating substrate block. The LCR composite component is characterized in that it is formed on the side surface of.

[0007]

In the present invention, the floor area of the components is reduced and the terminal treatment corresponding to the surface mounting is performed, whereby the floor area occupied by the conventional LCR composite circuit can be greatly reduced. Further, by using the surface mount component, high density mounting can be realized by an automatic mounter together with other components. Since the height of the components is low, the stability of the components is improved when the components are arranged before mounting. Further, by using an inexpensive insulating substrate as the circuit substrate, cost reduction can be achieved as compared with the conventional product.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is an external perspective view of an LCR composite component of a first embodiment showing a typical component structure of the present invention. The manufacturing procedure of the LCR composite component in FIG. 1 is as follows. Alumina insulating substrate block 2 with a thickness of 0.63 mm cut out to 2 mm x 1.2 mm
The inductor portion 3, the capacitor portion 4, and the register portion 2 were formed on the above using aluminum deposition and photolithography technology.

The aluminum conductor surfaces corresponding to the inductor portion 3 and the capacitor portion 4 are anodized by an anodic oxidation method to form an electrically insulating dielectric film 7, and then only the inductor portion 3 or the inductor portion 3 is formed. A Fe-Ni magnetic film 6 is formed on the surface of the element including
The film was formed by the sputtering method.

On the side surface of the insulating substrate block 2 made of alumina, a conductive paste containing Ag as a main component is applied and baked, and then Ni and solder are plated to form terminal electrodes 1a, 1b, 1c of the LCR circuit, It has a surface mountable shape.

(Embodiment 2) FIG. 2 shows a second embodiment of the present invention. As shown in Fig. 2, first, 2 mm x 1.2 m
A plurality of linear conductors 17, 18, 1 having an inductance and a resistance produced by electroless plating of copper and photolithography technology on an insulating substrate block 2 of alumina having a thickness of 0.63 mm cut out to m.
9. An LCR composite comprising an inductor part 3 and a register part 5 formed of 9 and a capacitor part 4 formed of a conductor film 20 facing the linear conductor formed on the lower or upper part of the linear conductor and the dielectric film 7 therebetween. Formed a circuit.

Further, the insulating substrate block 2 made of alumina is used.
Terminal electrodes 17a, 17c electrically connected to both ends of the linear conductor 17 and terminal electrodes 1 electrically connected to both ends of the linear conductor 18 as terminal electrodes of the LCR circuit on the side surface of the
8a, 18c, and terminal electrodes 19a, 19c electrically connected to both ends of the linear conductor 19, and terminal electrodes 1b electrically connected to the conductor film 20 are coated with a conductive paste containing Ag as a main component, After baking, it was formed by plating Ni and solder to obtain a surface mountable shape. The dielectric film 7 is formed by depositing SiO ₂ in a thickness of 1 μm by the AC sputtering method so as to have the structure shown in the sectional view of FIG.

(Embodiment 3) FIG. 4 shows a third embodiment of the present invention. The LCR composite component of this example is configured as follows. 2 is an insulating block, 3 is an inductor part, 4 is a capacitor part, 5 is a register part, 1a, 1b,
1c is a terminal electrode.

Further, FIG. 5 shows an example of the manufacturing method. As shown in FIG. 5, a 0.63 mm-thick alumina insulating substrate block 2 cut out to a size of 2 mm × 1.2 mm
A first conductor film 81 was formed thereon by electroless plating of copper to a film thickness of 1 μm.

Next, using a photolithography technique, after etching into a desired shape, a dielectric film 7b was formed on the first conductor film 81 by the CVD method. Further, a second conductor film 82 is formed on the dielectric film 7b by electroless plating of copper to a film thickness of 1 μm, and is etched using a photolithography technique so as to have a spiral shape in which a circle is drawn on a plane. did.

Further, after forming SiO ₂ as the electric insulating film 9 with a film thickness of 1 μm on the second conductor film 82 by the AC sputtering method, the end portion of the spiral second conductor film 82 and the later formed film are formed. In order to enable electrical connection with the third conductor film to be formed,
Through holes 10 were formed in the insulating film 9 by etching using a photolithography technique.

Next, a third conductor film 83 is formed on the insulating film 9 by electroless plating of copper to a film thickness of 1 μm, and the end portion of the second conductor film 82 is pulled out by using the photolithography technique. The etching pattern is formed so as to be drawn out to the side opposite to the side where the first conductor film 81 and the second conductor film 8 are formed.
The conductive paste containing Ag as a main component is applied to the side surface of the insulating substrate block 2 so as to be electrically connected to the end portions of the second and third conductor films 83, baked, and then plated with Ni and solder. The terminal electrodes 1a, 1b, 1c are formed (see FIG. 4).
State). Finally, for the purpose of protecting the circuit, the circuit protection film 1
No. 0 was used and a polyimide resin was baked on the upper surface of the device shown in FIG.

The present invention is not limited to the above embodiment, but various modifications can be made. For example, in the manufacturing procedure, the LCR composite circuit may be formed on the insulating substrate, and then cut and divided into a predetermined size to form the terminal electrode on the side surface of the substrate block.

The size of the LCR composite component of the present invention is preferably 3 mm square or less in order to support high-density mounting. Further, in order to realize that the height of the component is within 1 mm, the thickness of the insulating substrate is preferably within 1 mm.

[0021]

According to the LCR composite component of the present invention as described above, the occupied floor area can be greatly reduced, the cost can be reduced, and the high reliability can be secured.

[Brief description of drawings]

FIG. 1 is an external perspective view illustrating an LCR composite component according to a first embodiment of the present invention.

FIG. 2 is an external perspective view illustrating an LCR composite component according to a second embodiment of the present invention.

FIG. 3 is a partial sectional view illustrating an LCR composite component according to a second embodiment of the present invention.

FIG. 4 is an external perspective view illustrating an LCR composite component according to a third embodiment of the present invention.

FIG. 5 is an explanatory diagram of a method for manufacturing an LCR composite component according to a third embodiment of the present invention.

FIG. 6 is an explanatory view of a conventional LCR composite part.

FIG. 7 is an explanatory view of a conventional LC composite component.

[Explanation of symbols]

 1a, 1b, 1c, 17a, 17c Terminal electrode 18a, 18c, 19a, 19c Terminal electrode 2 Insulating substrate block 3 Inductor section 4 Capacitor section 5 Register section 6 Magnetic film 7, 7b Dielectric film 9 (Electrical) insulation Film 10 Through hole 11 Circuit protective film 12 Coil 13 Capacitor 14 Resistor 15 Ferrite core 16 (Sealing) resin 17, 18, 19 Linear conductor 20 Conductor film 81 First conductor film 82 Second conductor film 83 Third conductor film 83

Claims (1)

[Claims] 1. A conductive film, a dielectric film, and optionally a magnetic film and an electric insulating film are laminated on an insulating substrate block,
A circuit comprising an inductor section, a capacitor section, and a register section, and a terminal electrode connected to the circuit is formed on a side surface of the insulating substrate block.
R composite parts.