JPH0799379A - Manufacture of flexible printed-wiring board - Google Patents
Manufacture of flexible printed-wiring boardInfo
- Publication number
- JPH0799379A JPH0799379A JP6184962A JP18496294A JPH0799379A JP H0799379 A JPH0799379 A JP H0799379A JP 6184962 A JP6184962 A JP 6184962A JP 18496294 A JP18496294 A JP 18496294A JP H0799379 A JPH0799379 A JP H0799379A
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive
- carrier film
- manufacturing
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フレキシブル印刷配線
板の製造方法に関し、特に薄型の銅張積層板を用いたフ
レキシブル印刷配線板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible printed wiring board, and more particularly to a method for manufacturing a flexible printed wiring board using a thin copper clad laminate.
【０００２】[0002]
【従来の技術】一般にフレキシブル印刷配線板は、銅張
積層板を送り出し機で加工装置内に送り込み、その加工
装置内で、銅張積層板の銅箔表面にレジストを塗布し、
導体パターンとして必要な部分以外に塗布されたレジス
トを除去するための露光、現像処理を施した後、露出さ
れた部分の銅箔をエッチングすることにより印刷回路を
形成して、残りのレジストを剥離し、次いでカバーレイ
フィルムをベースフィルムに熱圧着して製造されてい
た。そのときの銅張積層板の搬送形態としては、所定寸
法の板状の銅張積層板を搬送コロ等で加工装置内を移動
させる単板方式や、図５に示したようにロール状に巻か
れた長尺の銅張積層板を、そのロールから繰り出しなが
ら加工装置内に送り込み、加工後の印刷配線板を別のロ
ールに巻き取るロール・ツゥ・ロール（Ｒ−Ｒ）方式等
が一般に用いられている。2. Description of the Related Art Generally, in a flexible printed wiring board, a copper clad laminate is sent into a processing device by a sending machine, and a resist is applied to the copper foil surface of the copper clad laminate in the processing device.
After exposing and developing to remove the resist applied to parts other than the parts required as a conductor pattern, a printed circuit is formed by etching the copper foil on the exposed part, and the remaining resist is peeled off. Then, the cover lay film was then thermocompression bonded to the base film. At that time, the copper-clad laminate is conveyed by a single-plate method in which a plate-shaped copper-clad laminate having a predetermined size is moved inside a processing device by a conveying roller or the like, or a roll-like winding as shown in FIG. Generally used is a roll-to-roll (R-R) method in which a long copper clad laminate that has been cut is sent out from the roll into the processing equipment and the printed wiring board after processing is wound on another roll. Has been.
【０００３】しかし、このような方法において、例えば
厚さ２５μｍ以下のポリイミドベースフィルムに厚さ３
５μｍ以下の銅箔を密着してなるような薄型の銅張積層
板を用いた場合には、エッチング工程等を経て印刷回路
が形成されるまでに、その銅張積層板に折れやしわが生
じ易かった。さらに、単板方式の場合は、その銅張積層
板が薄く、柔軟であるため、搬送ロールやしぼりローラ
に絡みつくことがあり、また、Ｒ−Ｒ方式の場合は、薄
型の銅張積層板の機械的強度が不足しているため、ロー
ル・ロール間の銅張積層板にかかる引張力（ライン・テ
ンション）を通常品レベルまで上げることができないた
め、加工装置内で薄型の銅張積層板が蛇行し、折れやし
わが発生するという問題もあった。However, in such a method, for example, a polyimide base film having a thickness of 25 μm or less has a thickness of 3 μm.
When a thin copper-clad laminate having a copper foil of 5 μm or less adhered thereto is used, the copper-clad laminate has creases or wrinkles before a printed circuit is formed through an etching process or the like. It was easy. Further, in the case of the single plate method, since the copper clad laminate is thin and flexible, it may be entangled with the transport roll or the squeezing roller, and in the case of the RR method, the thin copper clad laminate is Due to the lack of mechanical strength, the tensile force (line tension) applied to the copper-clad laminate between rolls cannot be raised to the level of normal products. There was also a problem of meandering and causing creases and wrinkles.
【０００４】これらの問題を解決するために、例えば、
図６に示すように、短冊状に切断した薄型の銅張積層板
４１を、その短冊状の銅張積層板１の寸法よりやや大き
な切込みを有する治具４２の切込み部分に配置し、短冊
状の銅張積層板１の四隅を粘着テープ４３等で治具４２
に固定した状態で単板方式で製造することが行われてい
る。しかし、このような方法では作業効率が悪く、加工
装置内の薬液や熱処理等によって粘着テープ４３が剥離
することもあり、銅張積層板の折れやしわを完全に防止
することはできなかった。In order to solve these problems, for example,
As shown in FIG. 6, a thin copper clad laminate 41 cut into strips is placed in a cut portion of a jig 42 having a cut slightly larger than the size of the strip-shaped copper clad laminate 1 to form a strip. The four corners of the copper clad laminate 1 of
It is manufactured by a single plate method while being fixed to the. However, in such a method, the work efficiency is poor, and the adhesive tape 43 may be peeled off by a chemical solution in the processing apparatus, heat treatment, or the like, and it is not possible to completely prevent the copper-clad laminate from being broken or wrinkled.
【０００５】そこで、薄型の銅張積層板のベースフィル
ムの片面に、厚膜のキャリアフィルムを粘着力の弱い微
粘着性の粘着剤で張り合わせて補強した状態で、Ｒ−Ｒ
方式により加工する方法も提案されている。その結果、
ベースフィルム厚が２５μｍ以下の薄型のフレキシブル
印刷配線板が効率よく製造できるようになった。しかし
ながら、特に総厚５０μｍ以下の超薄型のフレキシブル
印刷配線板を製造する場合には、剥離時の粘着力をさら
に低下させる必要があった。この微粘着性の粘着剤を用
いる方法では、粘着剤の粘着力は制御されておらず、加
工後にフレキシブル印刷配線板とキャリアフィルムとを
剥離し易くするために粘着力を低下させると、それに先
行する加工工程において粘着力の不足のために剥離が起
こる可能性があった。Therefore, in a state in which a thick carrier film is attached to one surface of a base film of a thin copper-clad laminate by a slightly adhesive adhesive having a weak adhesive force to reinforce RR.
A method of processing by a method has also been proposed. as a result,
A thin flexible printed wiring board having a base film thickness of 25 μm or less can be efficiently manufactured. However, particularly when manufacturing an ultra-thin flexible printed wiring board having a total thickness of 50 μm or less, it is necessary to further reduce the adhesive force at the time of peeling. In the method using this slightly tacky adhesive, the adhesive strength of the adhesive is not controlled, and if the adhesive strength is reduced to facilitate separation of the flexible printed wiring board and the carrier film after processing, it is preceded by that. There is a possibility that peeling may occur in the processing step due to lack of adhesive strength.
【０００６】[0006]
【発明が解決しようとする課題】そこで、本発明におけ
る課題は、薄型の銅張積層板のベースフィルム表面にキ
ャリアフィルムを貼り付けて補強した状態で加工工程を
通し、薄型のフレキシブル印刷配線板を製造する方法に
おいて、その薄型の銅張積層板のベースフィルムとキャ
リアフィルムとが、加工時には十分強く粘着されて剥離
等が起こらず、加工後の剥離時には粘着力が弱く剥離し
易くなり、品質の安定した薄型フレキシブル印刷配線板
を効率よく製造する方法を提供することにある。Therefore, an object of the present invention is to provide a thin flexible printed wiring board through a processing step in which a carrier film is attached to the surface of a base film of a thin copper clad laminate for reinforcement. In the method for producing, the base film and the carrier film of the thin copper clad laminate are sufficiently strongly adhered at the time of processing and peeling does not occur, and the adhesive force is weak at the time of peeling after processing and easily peeled, An object of the present invention is to provide a method for efficiently manufacturing a stable thin flexible printed wiring board.
【０００７】[0007]
【課題を解決する手段】かかる課題は、ベースフィルム
に銅箔を密着してなる薄型の銅張積層板に印刷回路を形
成してフレキシブル印刷配線板を製造する方法におい
て、その銅張積層板の印刷回路を形成する面の反対側表
面に、粘着剤を塗布したキャリアフィルムを貼り合わ
せ、そのキャリアフィルムを貼り合わせた銅張積層板に
印刷回路を形成した後、前記粘着剤の粘着力を低下させ
てから前記キャリアフィルムを剥離することを特徴とす
るフレキシブル印刷配線板の製造方法によって解決でき
る。The object of the present invention is to provide a method for producing a flexible printed wiring board by forming a printed circuit on a thin copper clad laminate obtained by closely adhering a copper foil to a base film. After attaching a carrier film coated with an adhesive to the surface opposite to the side on which the printed circuit is formed and forming a printed circuit on the copper clad laminate laminated with the carrier film, the adhesive strength of the adhesive is reduced. The problem can be solved by a method for manufacturing a flexible printed wiring board, which is characterized in that the carrier film is peeled off after the operation.
【０００８】以下に、本発明の製造方法を図面を参照し
て詳細に説明する。図１は、本発明のフレキシブル印刷
配線板（ＦＰＣと略記）の製造方法の一実施例を示す説
明図であり、（ａ）は本発明の製造方法に使用する材料
の例を示している。図中符号１はシート状の銅張積層板
（ＣＣＬと略記）であり、厚さ２５μｍ以下のポリイミ
ド製ベースフィルム３の片面に厚さ３５μｍ以下の銅箔
４が密着して形成されている。また、符号２はシート状
のキャリアフィルムであり、このキャリアフィルム２
は、厚さ５０〜２００μｍのポリエチレンテレフタレー
ト（ＰＥＴと略記）フィルム５の表面に、紫外線硬化性
樹脂からなる粘着剤６が、例えばスクイズロール、コー
ターナイフ等を用いて均一に塗布されて形成されてい
る。The manufacturing method of the present invention will be described in detail below with reference to the drawings. FIG. 1 is an explanatory view showing an embodiment of a method for manufacturing a flexible printed wiring board (abbreviated as FPC) of the present invention, and FIG. 1 (a) shows an example of a material used in the manufacturing method of the present invention. Reference numeral 1 in the figure is a sheet-shaped copper clad laminate (abbreviated as CCL), and a copper foil 4 having a thickness of 35 μm or less is formed in close contact with one surface of a polyimide base film 3 having a thickness of 25 μm or less. Reference numeral 2 is a sheet-shaped carrier film.
Is formed by uniformly coating the surface of a polyethylene terephthalate (abbreviated as PET) film 5 having a thickness of 50 to 200 μm with an adhesive 6 made of an ultraviolet curable resin using, for example, a squeeze roll or a coater knife. There is.
【０００９】次に、キャリアフィルム２の粘着剤６を塗
布した面に、ＣＣＬ１のポリイミドベースフィルムを接
触させた状態で加圧ローラを通して、図１（ｂ）に示す
ように貼り合わせる。このようにしてキャリアフィルム
２に貼り合わされて補強されたＣＣＬ１を、通常の加工
装置内に送り込み、レジスト塗布、露光、現像、エッチ
ング及びレジスト剥離等の工程を通して印刷回路を形成
する。図１（Ｃ）は、その印刷回路形成後のＣＣＬ１１
及びそれに貼り合わせたキャリアフィルム２の断面を示
している。なお、上記加工装置内の露光工程において
は、ＣＣＬ１の銅箔４によって光が遮られるため、キャ
リアフィルム２の粘着剤６は露光されておらず、従っ
て、この粘着剤６は当初の十分な粘着性を保持してお
り、加工時のＣＣＬ１とキャリアフィルム２との剥離は
起こり難くなっている。この状態で、キャリアフィルム
２のＰＥＴフィルム５側から所定量の紫外線を照射す
る。その紫外線は、ＰＥＴフィルム５を通過して粘着剤
６に達する。この粘着剤６は紫外線硬化性樹脂であるた
め、この紫外線照射によって硬化するとともに粘着性が
低下する。[0009] Next, the CCL 1 polyimide base film is brought into contact with the surface of the carrier film 2 coated with the pressure sensitive adhesive 6, and is passed through a pressure roller to be bonded as shown in FIG. 1 (b). The CCL 1 thus bonded to the carrier film 2 and reinforced is fed into an ordinary processing apparatus, and a printed circuit is formed through steps such as resist application, exposure, development, etching and resist stripping. FIG. 1C shows the CCL 11 after the printed circuit is formed.
And a cross section of the carrier film 2 attached thereto. In the exposure step in the processing device, the light is blocked by the copper foil 4 of the CCL 1, so that the adhesive 6 of the carrier film 2 is not exposed, and therefore, the adhesive 6 is initially sufficient in adhesion. Property is maintained, and peeling between the CCL 1 and the carrier film 2 during processing hardly occurs. In this state, the PET film 5 side of the carrier film 2 is irradiated with a predetermined amount of ultraviolet rays. The ultraviolet rays reach the adhesive 6 through the PET film 5. Since this adhesive 6 is an ultraviolet curable resin, it is cured by this ultraviolet irradiation and its adhesiveness is reduced.
【００１０】引続き、図１（ｄ）に示したように、図示
しないカバーレイフィルムを熱圧着して薄型のＦＰＣ１
１とした後、そのＦＰＣ１１をキャリアフィルム２から
剥離する。この剥離時においては、粘着剤６の粘着性が
低下しているため、ＦＰＣ１１はキャリアフィルム２か
ら容易に剥離することができ、剥離時に過剰の応力がか
かってフィルムに反りを生ずるカール現象も起こり難く
なる。Subsequently, as shown in FIG. 1D, a coverlay film (not shown) is thermocompression-bonded to form a thin FPC1.
After setting to 1, the FPC 11 is peeled from the carrier film 2. At the time of peeling, since the adhesiveness of the pressure sensitive adhesive 6 is lowered, the FPC 11 can be easily peeled off from the carrier film 2, and excessive stress is applied at the time of peeling to cause a curl phenomenon in which the film warps. It will be difficult.
【００１１】上記の実施例にあっては、前記キャリアフ
ィルム２は、ＰＥＴフィルムの全面に粘着剤６が均一に
塗布されて形成されているが、特に、厚さ５０μｍ以下
の超薄型ＣＣＬを用いる場合は、キャリアフィルム２
は、粘着剤６が塗布部分と非塗布部分とを設けて塗布さ
れているのが好ましい。具体的には、例えば図２（ａ）
に示したように、粘着剤６の塗布部分が、ＰＥＴフィル
ム５表面に均一に点在するように塗布したものや、図２
（ｂ）に示したように、粘着剤６が塗布されていない非
塗布部分が、ＰＥＴフィルム５表面に均一に点在するよ
うに塗布したもの等が好ましい。In the above embodiment, the carrier film 2 is formed by evenly applying the pressure sensitive adhesive 6 on the entire surface of the PET film. In particular, an ultrathin CCL having a thickness of 50 μm or less is used. If used, carrier film 2
It is preferable that the adhesive 6 is applied by providing a coated portion and a non-coated portion. Specifically, for example, FIG.
As shown in FIG. 2, the adhesive 6 is applied so that the applied portion is evenly scattered on the surface of the PET film 5, and FIG.
As shown in (b), it is preferable that the non-coated portion not coated with the pressure sensitive adhesive 6 is coated so as to be evenly scattered on the surface of the PET film 5.
【００１２】例えば、図２（ａ）に示したようなキャリ
アフィルムにあっては、いわゆるエンボス模様状に均一
に点在する粘着剤６の塗布部分の周囲を、ＰＥＴフィル
ム５表面が露出した非塗布部分が囲んでいる。逆に、図
２（ｂ）に示したようなキャリアフィルムにあっては、
均一に点在する非塗布部分の周囲を、いわゆる網目模様
状に形成された粘着剤６の塗布部分が取り囲んでいる。
本発明の製造方法で使用されるキャリアフィルムにあっ
ては、これら塗布部分または非塗布部分の形状は特に限
られるものではないが、上述したように、塗布部分また
は非塗布部分が、キャリアフィルムの長さ方向及び幅方
向に渡って、均一に並ぶように配置されているのが好ま
しい。For example, in the carrier film as shown in FIG. 2A, the surface of the PET film 5 is exposed around the area where the adhesive 6 is applied which is uniformly scattered in a so-called embossed pattern. The coated part is enclosed. On the contrary, in the carrier film as shown in FIG.
A so-called mesh pattern-coated portion of the adhesive 6 surrounds the periphery of the non-coated portion which is evenly scattered.
In the carrier film used in the production method of the present invention, the shape of these coated portions or non-coated portions is not particularly limited, but as described above, the coated portions or non-coated portions are the carrier film. It is preferable that they are evenly arranged in the length direction and the width direction.
【００１３】さらに、このように塗布部分と非塗布部分
とを設けて粘着剤を塗布する場合には、キャリアフィル
ム２の幅方向における両端部５１に粘着剤６を全面塗布
するのが好ましい。ここで、キャリアフィルム２の幅方
向における両端部５１とは、幅方向の両端から少なくと
も０．５ｍｍ以上、好ましくは両端から０．５ｍｍ〜２
０ｍｍの領域を指すものとする。Further, when the adhesive is applied by providing the applied portion and the non-applied portion as described above, it is preferable to apply the adhesive 6 to both end portions 51 of the carrier film 2 in the width direction. Here, the both ends 51 in the width direction of the carrier film 2 are at least 0.5 mm or more from both ends in the width direction, preferably 0.5 mm to 2 from both ends.
It refers to a 0 mm area.
【００１４】このように、粘着剤の塗布部分と非塗布部
分とを設けることにより、ＣＣＬのベースフィルムとキ
ャリアフィルムとの間の粘着力がさらに低下し、例えば
厚さ５０μｍ以下の超薄型ＣＣＬを用いた場合でも、Ｃ
ＣＬとキャリアフィルムとを剥離する際にかかる力が小
さくて済み、ＣＣＬの折れを防止できる。また、塗布部
分または非塗布部分が、キャリアフィルムの長さ方向及
び幅方向に渡って均一に並ぶように配置されていれば、
粘着力に偏りがなく、如何なる方向からも剥離すること
ができる。さらに、幅方向の両端部に粘着剤を全面塗布
しておくことにより、ＣＣＬのベースフィルムとキャリ
アフィルムとの間は両端部の粘着剤によって密閉され、
ＣＣＬの加工時の湿式処理において薬液等が浸み込む等
の問題を未然に防止することができる。As described above, by providing the coated portion and the non-coated portion of the adhesive, the adhesive force between the base film and the carrier film of the CCL is further reduced, and for example, an ultrathin CCL having a thickness of 50 μm or less. Even when using
The force applied when peeling the CL and the carrier film is small, and the CCL can be prevented from being broken. Further, if the coated portion or the non-coated portion is arranged so as to be uniformly arranged in the length direction and the width direction of the carrier film,
There is no bias in the adhesive force, and it can be peeled from any direction. Furthermore, by coating the entire surface with the adhesive on both ends in the width direction, the space between the CCL base film and the carrier film is sealed by the adhesive on both ends,
It is possible to prevent problems such as chemical liquids soaking in during wet processing during processing of CCL.
【００１５】このような、塗布部分と非塗布部分を設け
て粘着剤を塗布したキャリアフィルムは、例えば図３に
示したような装置を用いて好適に製造される。図３にお
いて、符号３５は第１のローラであり、その第１のロー
ラ３５表面には、上記エンボス模様あるいは網目模様等
に対応した凹凸が形成されており、この第１のローラ３
５には、第２のローラ３６を介して粘着剤６が供給され
ている。ここで、キャリアフィルムのベースとなるＰＥ
Ｔフィルム５を図における左側から供給すると、そのＰ
ＥＴフィルムの一方の表面が前記第１のローラ３５に押
し付けられ、ローラ３５表面の粘着剤がＰＥＴフィルム
に移し取られてエンボス模様あるいは網目模様をなす塗
布部分が形成される。Such a carrier film having a coated portion and a non-coated portion and coated with a pressure-sensitive adhesive is preferably manufactured by using, for example, an apparatus as shown in FIG. In FIG. 3, reference numeral 35 is a first roller, and the surface of the first roller 35 is provided with irregularities corresponding to the embossed pattern or the mesh pattern.
The adhesive 6 is supplied to the roller 5 via the second roller 36. Here, PE that is the base of the carrier film
When T film 5 is supplied from the left side in the figure, its P
One surface of the ET film is pressed against the first roller 35, and the adhesive on the surface of the roller 35 is transferred to the PET film to form an embossed or meshed application portion.
【００１６】さらに、第１のローラ３５表面の、キャリ
アフィルムの幅方向における両端部に当接する部分は、
平坦に加工されて、キャリアフィルムの該両端部に粘着
剤が全面塗布されるようにするのが好ましい。このよう
にして粘着剤６が塗布されたＰＥＴフィルム５は、乾燥
オーブン３１内を通過して乾燥され、粘着剤６の塗布部
分及び非塗布部分を有するキャリアフィルム２が完成す
る。なお、前記両端部への粘着剤の全面塗布は、上述の
ようにロールを加工して行ってもよいし、前記ロールと
は別にスクイズロールまたはコーターナイフ等を用意
し、それを用いて両端部に全面塗布するようにしてもよ
い。Further, a portion of the surface of the first roller 35, which abuts on both ends in the width direction of the carrier film, is
It is preferable to flatten the surface of the carrier film so that the pressure-sensitive adhesive is applied to the both ends of the carrier film. The PET film 5 coated with the adhesive 6 in this way passes through the drying oven 31 and is dried, and the carrier film 2 having a coated portion and a non-coated portion of the adhesive 6 is completed. The entire surface of the pressure-sensitive adhesive may be applied to both ends by processing a roll as described above, or a squeeze roll or a coater knife or the like may be prepared separately from the roll, and both ends may be prepared using the roll. May be applied over the entire surface.
【００１７】以上、本発明のＦＰＣの製造方法を詳細に
述べてきたが、次に本発明のＦＰＣの製造方法を実施す
るのに好適な装置の一例を説明する。図４は、そのよう
な装置の一例を示す図であり、図示しない別々のロール
から供給されるＣＣＬ１とキャリアフィルム２を、加圧
ローラ２３で貼り合わせ、加工装置２１に送り込む。加
工装置２１内で、レジスト塗布、露光、現像、エッチン
グ、及びレジスト剥離等の処理を経て印刷回路を形成し
た後、搬送ローラ２４を通して紫外線照射装置２２に送
り込み、紫外線を照射して粘着剤の粘着性を低下させ
る。さらにその粘着性を低下させて剥離し易くしたＦＰ
Ｃ１１及びキャリアフィルム２を、搬送ローラ２５を通
して図示しない別々のロールに巻取るようにする。この
ような装置を用いることにより、薄型のＦＰＣをさらに
効率よく安定して製造することができるようになる。The FPC manufacturing method of the present invention has been described above in detail. Next, an example of an apparatus suitable for carrying out the FPC manufacturing method of the present invention will be described. FIG. 4 is a diagram showing an example of such a device, in which the CCL 1 and the carrier film 2 supplied from separate rolls (not shown) are bonded by the pressure roller 23 and fed to the processing device 21. After forming a printed circuit through processing such as resist application, exposure, development, etching, and resist stripping in the processing device 21, the printed circuit is sent to the ultraviolet irradiation device 22 through the conveying roller 24 and irradiated with ultraviolet rays to adhere the adhesive. Reduce sex. Furthermore, the FP made it easier to peel by lowering its adhesiveness.
The C11 and the carrier film 2 are wound around separate rolls (not shown) through the transport roller 25. By using such a device, a thin FPC can be manufactured more efficiently and stably.
【００１８】本発明のＦＰＣの製造方法に使用するＣＣ
Ｌは、通常使用されている薄型のＣＣＬであれば特に限
定されないが、厚さ２５μｍ以下のポリイミドフィルム
に厚さ１２〜３５μｍの銅箔を密着させたＣＣＬが好適
に使用され、特に総厚５０μｍ以下の超薄型ＣＣＬも好
適に使用される。また、上記の例では片面のＣＣＬにつ
いて説明したが、両面銅張積層板を使用してもよい。さ
らに、ＣＣＬではなくアルミニウム、銀等のエッチング
可能な金属をフレキシブルフィルムに密着させた積層板
を用いることもできる。CC used in the FPC manufacturing method of the present invention
L is not particularly limited as long as it is a commonly used thin CCL, but a CCL in which a copper film having a thickness of 12 to 35 μm is closely adhered to a polyimide film having a thickness of 25 μm or less is preferably used, and particularly a total thickness of 50 μm. The following ultra-thin CCL is also preferably used. Moreover, although the above-mentioned example demonstrated CCL of one side, you may use a double-sided copper clad laminated board. Further, instead of CCL, it is possible to use a laminated plate in which an etchable metal such as aluminum or silver is adhered to a flexible film.
【００１９】また、本発明で使用するキャリアフィルム
のベースフィルムとしては、厚さ５０〜２００μｍ、好
ましくは７５〜１２５μｍのポリエチレンテレフタレー
トフィルムが好適に使用されるが、それに限られず、Ｆ
ＰＣの加工工程で通常使用される薬液や熱等に対して安
定な材料であればいずれも使用できる。As the base film of the carrier film used in the present invention, a polyethylene terephthalate film having a thickness of 50 to 200 μm, preferably 75 to 125 μm is preferably used, but the base film is not limited thereto and F
Any material can be used as long as it is a material that is stable against chemicals, heat, etc. that are normally used in the processing step of PC.
【００２０】ＣＣＬとキャリアフィルムとを貼り合わせ
る粘着剤としては、光照射や加熱等の処理によって化学
反応を起こし、粘着力が低下するものであれば特に限定
されないが、処理前の粘着力が２０ｇｆ／ｃｍ以上であ
り、処理後の粘着力が１０ｇｆ／ｃｍ以下、好ましくは
８ｇｆ／ｃｍ以下となるものが好ましい。処理前の粘着
力が２０ｇｆ／ｃｍ未満であると、印刷回路形成の加工
工程においてＣＣＬとキャリアフィルムとが剥離して、
折れしわ等が発生する可能性があり、処理後の粘着力が
１０ｇｆ／ｃｍより大きいと、剥離したＦＰＣにカール
等が発生し易くなる。そのような粘着剤の中でも、従来
の装置をそのまま使用して紫外線照射するという簡単な
処理操作で粘着力を低下させることができる紫外線硬化
性樹脂が好ましい。また、この粘着剤には、必要に応じ
てワニス等を添加してもよい。The pressure-sensitive adhesive for bonding the CCL and the carrier film is not particularly limited as long as it causes a chemical reaction by treatment such as light irradiation or heating to lower the pressure-sensitive adhesive force, but the pressure-sensitive adhesive force before the treatment is 20 gf. / Cm or more and the adhesive strength after treatment is 10 gf / cm or less, preferably 8 gf / cm or less. If the adhesive strength before the treatment is less than 20 gf / cm, the CCL and the carrier film may peel off in the process of forming the printed circuit,
Folds and wrinkles may occur, and if the adhesive strength after the treatment is larger than 10 gf / cm, the peeled FPC is likely to be curled. Among such pressure-sensitive adhesives, a UV-curable resin that can reduce the pressure-sensitive adhesive force by a simple treatment operation of irradiating UV rays using a conventional apparatus as it is is preferable. Moreover, you may add varnish etc. to this adhesive as needed.
【００２１】さらに、キャリアフィルムが粘着剤の塗布
部分と非塗布部分とを設けて形成された場合には、処理
後の粘着力が５ｇｆ／ｃｍ以下となるように設定するの
が好ましい。粘着力が５ｇｆ／ｃｍより大きいと、総厚
５０μｍ以下の超薄型ＦＰＣを用いた場合、剥離時にＦ
ＰＣがキャリアフィルムに追従して折れ跡が発生するこ
とがある。Further, when the carrier film is formed by providing a coated portion and a non-coated portion of the adhesive, it is preferable to set the adhesive strength after the treatment to be 5 gf / cm or less. If the adhesive strength is larger than 5 gf / cm, when an ultra-thin FPC with a total thickness of 50 μm or less is used, it is
The PC may follow the carrier film and generate creases.
【００２２】また、ＣＣＬとキャリアフィルムを貼り合
わせる手段は、加圧ローラー、圧着ラミネーター等が好
適であるが、それらフィルムの幅方向で均一に加圧でき
る手段であれば、特に限定されない。さらに、そのよう
にしてキャリアフィルムで強化されたＣＣＬに印刷回路
を形成する手段は、通常のＦＰＣ製造用の装置、方法が
そのまま使用される。また、そのような加工は、単板方
式、Ｒ−Ｒ方式のいずれによって行われてもよい。A means for adhering the CCL and the carrier film is preferably a pressure roller, a pressure laminator or the like, but is not particularly limited as long as it can uniformly press the film in the width direction. Further, as the means for forming a printed circuit on the CCL thus reinforced with the carrier film, the usual FPC manufacturing apparatus and method are used as they are. Further, such processing may be performed by either the single plate method or the RR method.
【００２３】以下に、具体例を示して本発明の製造方法
をさらに詳細に説明する。 （実施例１）ＣＣＬとして片面銅張りポリイミドフィル
ム（銅箔厚１８μｍ、ポリイミドフィルム厚１２．５μ
ｍ、信越化学工業社製）を用い、キャリアフィルムとし
て片面に紫外線硬化性樹脂が均一に全面塗布されたＰＥ
Ｔフィルム（ＰＴ−１２５ＵＶ（Ａ）、モダンプラスチ
ック社製）を用いた。Hereinafter, the production method of the present invention will be described in more detail with reference to specific examples. (Example 1) One side copper-clad polyimide film as CCL (copper foil thickness 18 μm, polyimide film thickness 12.5 μ
PE manufactured by Shin-Etsu Chemical Co., Ltd.) with a UV curable resin evenly coated on one side as a carrier film.
A T film (PT-125UV (A), manufactured by Modern Plastics Co., Ltd.) was used.
【００２４】まず、これらのフィルムを圧着ラミネータ
ーを用いてＲ−Ｒ方式で貼り合わせた。このときの粘着
力は４０．４ｇｆ／ｃｍであった。次に、このキャリア
フィルムで強化されたＣＣＬを、通常の加工装置内に送
り込み、レジスト塗布、露光、現像、エッチング等の工
程を通して印刷回路を形成した。この加工工程で使用し
た薬液の、ＣＣＬとキャリアフィルムとの貼り合わせ部
分（粘着剤層）への浸み込みの程度を観察したところ、
いずれの薬液も０．５ｍｍ以下しか浸み込まないことが
わかった。さらにそれを切断し、カバーレイフィルムを
仮圧着した後、連続式紫外線照射炉内に導入し、キャリ
アフィルム側から光量２００ｍＪ／ｃｍ2の紫外線を照
射した。その後、ＦＰＣをキャリアフィルムから剥離し
た。この剥離時の粘着力は、８．９ｇｆ／ｃｍであっ
た。また、剥離後のＦＰＣには、カールや折れしわが発
生しておらず、高品質の薄型ＦＰＣが作製できた。それ
らの結果を表１に示す。First, these films were laminated by the RR method using a pressure laminator. The adhesive force at this time was 40.4 gf / cm. Next, the CCL reinforced with the carrier film was fed into an ordinary processing apparatus, and a printed circuit was formed through steps such as resist coating, exposure, development and etching. Observing the degree of penetration of the chemical solution used in this processing step into the bonded portion (adhesive layer) between the CCL and the carrier film,
It was found that all the chemicals penetrate only 0.5 mm or less. After further cutting it and temporarily pressing the coverlay film, it was introduced into a continuous ultraviolet irradiation furnace and irradiated with ultraviolet light having a light amount of 200 mJ / cm 2 from the carrier film side. Then, the FPC was peeled off from the carrier film. The adhesive strength at the time of peeling was 8.9 gf / cm. In addition, the FPC after peeling did not have curls or creases, and a high-quality thin FPC could be manufactured. The results are shown in Table 1.
【００２５】（実施例２）キャリアフィルムとして、片
面に紫外線硬化性樹脂が均一塗布されたＰＥＴフィルム
（ＰＴ−１２５ＵＶ（Ｂ）、モダンプラスチック社製）
を用いた以外は、実施例１と同様にして、薄型ＦＰＣを
作製した。そのときの粘着力、薬液の浸み込みの程度を
表１に示す。(Example 2) As a carrier film, a PET film (PT-125UV (B), manufactured by Modern Plastics Co., Ltd.) on one side of which an ultraviolet curable resin was uniformly applied.
A thin FPC was manufactured in the same manner as in Example 1 except that was used. Table 1 shows the adhesive strength and the degree of penetration of the chemical solution at that time.
【００２６】（比較例１）キャリアフィルムとして、片
面に紫外線硬化性樹脂が均一塗布されたＰＥＴフィルム
を用い、紫外線照射量を１３００ｍＪ／ｃｍ2とした以
外は、実施例１と同様にして、薄型ＦＰＣを作製した。
そのときの粘着力、薬液の浸み込みの程度を表１に示
す。(Comparative Example 1) A thin film was prepared in the same manner as in Example 1 except that a PET film having one surface coated with an ultraviolet curable resin was used as the carrier film and the irradiation amount of the ultraviolet rays was 1300 mJ / cm 2. An FPC was produced.
Table 1 shows the adhesive strength and the degree of penetration of the chemical solution at that time.
【００２７】（比較例２）キャリアフィルムとして、片
面に接着性の弱い微粘着性樹脂が均一塗布されたＰＥＴ
フィルムを用い、紫外線照射をせずに剥離した以外は、
実施例１と同様にして、薄型ＦＰＣを作製した。そのと
きの粘着力、薬液の浸み込みの程度を表１に示す。(Comparative Example 2) As a carrier film, PET on one surface of which a slightly adhesive resin with weak adhesion is uniformly applied
Using a film, except peeling without irradiating UV,
A thin FPC was manufactured in the same manner as in Example 1. Table 1 shows the adhesive strength and the degree of penetration of the chemical solution at that time.
【００２８】実施例１及び２の粘着剤は、紫外線照射前
の粘着力が２０ｇｆ／ｃｍ2以上あり、加工工程で使用
する種々の薬剤の浸み込みも０．５ｍｍ以下である。紫
外線照射後では、その粘着力が１０ｇｆ／ｃｍ以下に低
下して剥離し易くなり、剥離後のＦＰＣにはカールも折
れしわも発生しなかった。比較例１の粘着剤では、紫外
線照射前の粘着力が非常に高く、薬液の浸み込みの程度
も良好であるが、紫外線照射後の粘着力も３０ｇｆ／ｃ
ｍ以上と大きいため剥離し難く、剥離後のＦＰＣにカー
ルや折れしわが発生している。また、微粘着性の粘着剤
を用いた比較例２では、加工工程での薬液の浸み込み程
度が大きくなっており、残留した薬液の影響により印刷
回路の銅箔表面に変色が発生した。今回の例では剥離し
て折れしわ等が発生することはなかったが、さらに過酷
な条件下で使用した場合には剥離する可能性があると思
われる。The pressure-sensitive adhesives of Examples 1 and 2 have a pressure-sensitive adhesive force of 20 gf / cm 2 or more before ultraviolet irradiation, and the penetration of various chemicals used in the processing step is 0.5 mm or less. After the ultraviolet irradiation, the adhesive strength was reduced to 10 gf / cm or less and peeling was facilitated, and neither curl nor crease was generated on the FPC after peeling. The pressure-sensitive adhesive of Comparative Example 1 had a very high pressure-sensitive adhesive force before being irradiated with ultraviolet rays and had a good degree of penetration of a chemical solution, but the pressure-sensitive adhesive force after being irradiated with ultraviolet rays was 30 gf / c.
Since it is as large as m or more, it is difficult to peel it off, and the FPC after peeling has curls and creases. Further, in Comparative Example 2 using the slightly tacky adhesive, the degree of immersion of the chemical liquid in the processing step was large, and discoloration occurred on the copper foil surface of the printed circuit due to the influence of the residual chemical liquid. In this example, there was no peeling and no creases or the like, but it seems that there is a possibility of peeling when used under more severe conditions.
【００２９】（実施例３）図３に示したような装置を用
い、ＰＥＴフィルムの片面に図２（ａ）のようなエンボ
ス模様の塗布部分を有するように粘着剤を塗布してキャ
リアフィルムを作製した。そのキャリアフィルムを用い
た以外は、実施例１と同様にして薄型ＦＰＣを作製し
た。ただし、キャリアフィルムの幅方向の両端部には、
幅＿＿ｍｍに渡り粘着剤を全面塗布した。そのときの粘
着力、薬液の浸み込みの程度を表２に示す。(Embodiment 3) Using a device as shown in FIG. 3, an adhesive is applied to one side of a PET film so as to have an embossed pattern applied portion as shown in FIG. It was made. A thin FPC was produced in the same manner as in Example 1 except that the carrier film was used. However, at both ends in the width direction of the carrier film,
The adhesive was applied over the entire width __mm. Table 2 shows the adhesive strength and the degree of penetration of the chemical solution at that time.
【００３０】（実施例４）塗布部分の形状を、図２
（ｂ）に示したような網目模様とした以外は、実施例３
と同様にして薄型ＦＰＣを作製した。そのときの粘着
力、薬液の浸み込みの程度を表２に示す。実施例３及び
４の結果より、粘着剤を全面塗布せずに塗布部分と非塗
布部分とを設けることにより、ＦＰＣとキャリアフィル
ムとの剥離時の粘着性が、さらに低下し、剥離に伴う折
れの発生が防止できることがわかる。(Embodiment 4) The shape of the coated portion is shown in FIG.
Example 3 except that the mesh pattern as shown in FIG.
A thin FPC was manufactured in the same manner as in. Table 2 shows the adhesive strength and the degree of penetration of the chemical solution at that time. From the results of Examples 3 and 4, the adhesiveness at the time of peeling between the FPC and the carrier film was further reduced by providing the coated portion and the non-coated portion without applying the entire surface of the pressure-sensitive adhesive, and the crease caused by peeling It can be seen that the occurrence of
【００３１】[0031]
【発明の効果】本発明のフレキシブル印刷配線板の製造
方法によれば、ベースフィルムに銅箔を密着してなる薄
型の銅張積層板に、キャリアフィルムを貼り合わせて補
強した状態で加工工程を通し、印刷回路を形成して薄型
のフレキシブル印刷配線板を製造するので、銅張積層板
に折れしわ等が発生せず、搬送ロール等に巻き付くこと
もなくなる。According to the method for producing a flexible printed wiring board of the present invention, the thin copper clad laminate obtained by closely adhering the copper foil to the base film is bonded to the carrier film to reinforce the processing step. Since a thin printed circuit board is manufactured by forming a printed circuit by passing through it, the copper clad laminate does not have creases or the like and is not wound around a transport roll or the like.
【００３２】また、その薄型の銅張積層板とキャリアフ
ィルムとが、加工時には強く粘着されて剥離等が起こら
ず、加工後の剥離時には粘着力が弱く剥離し易くなるた
め、剥離時に過剰な応力がかかってカールが発生するこ
とも避けることができる。特に、キャリアフィルムに粘
着剤の塗布部分と非塗布部分とを設けることにより、Ｆ
ＰＣとキャリアフィルムの剥離時の粘着性がさらに低下
し、例えば総厚５０μｍ以下の超薄型ＦＰＣ製造時に折
れ等の発生を防止できる。Further, since the thin copper clad laminate and the carrier film are strongly adhered to each other during processing and peeling does not occur, and the adhesive strength is weak at the time of peeling after processing so that the carrier film is easily peeled off. It is possible to avoid the occurrence of curling and curling. In particular, when the carrier film is provided with an adhesive coated portion and a non-coated portion,
The adhesiveness at the time of peeling the PC and the carrier film is further reduced, and it is possible to prevent the occurrence of breakage or the like when manufacturing an ultrathin FPC having a total thickness of 50 μm or less.
【００３３】さらに、その貼り合わせに使用される粘着
剤が、紫外線硬化性樹脂や熱硬化性樹脂等の、従来の装
置をそのまま使用して簡単な処理操作で粘着力を低下さ
せられるものであるため、コストもかからず、従来に比
較して効率よく薄型フレキシブル印刷配線板を安定して
製造することができる。Further, the pressure-sensitive adhesive used for the bonding is a UV-curable resin, a thermosetting resin or the like, which can reduce the pressure-sensitive adhesive force by a simple treatment operation using the conventional apparatus as it is. Therefore, the thin flexible printed wiring board can be stably manufactured more efficiently than in the past, at low cost.
【００３４】[0034]
【表１】 [Table 1]
【００３５】[0035]
【表２】 [Table 2]
【００３６】[0036]
【図１】 本発明の薄型フレキシブル印刷配線板の製造
方法の一実施例を示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of a method for manufacturing a thin flexible printed wiring board of the present invention.
【図２】 塗布部分と非塗布部分を設けて形成したキャ
リアフィルムの例を示す図である。FIG. 2 is a diagram showing an example of a carrier film formed by providing a coated portion and a non-coated portion.
【図３】 キャリアフィルムを製造するのに好適な装置
の一例を示す図である。FIG. 3 is a diagram showing an example of an apparatus suitable for manufacturing a carrier film.
【図４】 本発明の薄型フレキシブル印刷配線板の製造
方法を実施するのに好適な装置の一例を示す図である。FIG. 4 is a diagram showing an example of an apparatus suitable for carrying out the method for manufacturing a thin flexible printed wiring board of the present invention.
【図５】 ロール状に巻いた長尺の銅張積層板を示す斜
視図である。FIG. 5 is a perspective view showing a long copper-clad laminate rolled into a roll.
【図６】 薄型の銅張積層板を用いた場合の従来のフレ
キシブル印刷配線板の製造方法を説明するための図であ
る。FIG. 6 is a diagram for explaining a conventional method for manufacturing a flexible printed wiring board when a thin copper clad laminate is used.
１…銅張積層板、２…キャリアフィルム、３…ポリイミ
ドベースフィルム、４…銅箔、５…ＰＥＴフィルム、６
…粘着剤、１１…フレキシブル印刷配線板、２１…加工
装置、２２…紫外線照射装置、３１…乾燥オーブン1 ... Copper clad laminate, 2 ... Carrier film, 3 ... Polyimide base film, 4 ... Copper foil, 5 ... PET film, 6
... adhesive, 11 ... flexible printed wiring board, 21 ... processing device, 22 ... ultraviolet irradiation device, 31 ... drying oven
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/00 Ｘ Ｚ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location H05K 3/00 X Z
Claims (7)
型の銅張積層板に印刷回路を形成してフレキシブル印刷
配線板を製造する方法において、 その銅張積層板の印刷回路を形成する面の反対側表面
に、粘着剤を塗布したキャリアフィルムを貼り合わせ、
そのキャリアフィルムを貼り合わせた銅張積層板に印刷
回路を形成した後、前記粘着剤の粘着力を低下させてか
ら前記キャリアフィルムを剥離することを特徴とするフ
レキシブル印刷配線板の製造方法。1. A method for manufacturing a flexible printed wiring board by forming a printed circuit on a thin copper-clad laminate obtained by closely adhering a copper foil to a base film, the surface of the copper-clad laminate on which the printed circuit is formed. Attach a carrier film coated with an adhesive to the surface on the opposite side of
A method for manufacturing a flexible printed wiring board, comprising: forming a printed circuit on a copper clad laminate having the carrier films attached thereto, and then reducing the adhesive force of the adhesive before peeling the carrier film.
粘着剤の粘着力を低下させる手段が光照射であることを
特徴とする請求項１記載の製造方法。2. The manufacturing method according to claim 1, wherein the adhesive is a photocurable resin, and the means for reducing the adhesive strength of the adhesive is light irradiation.
片面に、塗布部分と非塗布部分とを有するように塗布さ
れたことを特徴とする請求項１記載の製造方法。3. The method according to claim 1, wherein the pressure-sensitive adhesive is applied to one surface of the carrier film so as to have a coated portion and a non-coated portion.
フィルムの幅方向における両端部に塗布されたことを特
徴とする請求項３記載の製造方法。4. The manufacturing method according to claim 3, wherein the pressure-sensitive adhesive is applied to at least both end portions in the width direction of the carrier film.
キャリアフィルムの長さ方向及び幅方向に渡って均一に
点在することを特徴とする請求項３記載の製造方法。5. The manufacturing method according to claim 3, wherein the coated portion or the non-coated portion is evenly scattered in the length direction and the width direction of the carrier film.
とを特徴とする請求項５記載の製造方法。6. The manufacturing method according to claim 5, wherein the applied portion has an embossed pattern.
特徴とする請求項５記載の製造方法。7. The manufacturing method according to claim 5, wherein the applied portion has a mesh pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6184962A JPH0799379A (en) | 1993-08-05 | 1994-08-05 | Manufacture of flexible printed-wiring board |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19498093 | 1993-08-05 | ||
| JP5-194980 | 1993-08-05 | ||
| JP6184962A JPH0799379A (en) | 1993-08-05 | 1994-08-05 | Manufacture of flexible printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0799379A true JPH0799379A (en) | 1995-04-11 |
Family
ID=26502817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6184962A Pending JPH0799379A (en) | 1993-08-05 | 1994-08-05 | Manufacture of flexible printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0799379A (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1088072A (en) * | 1996-09-11 | 1998-04-07 | Toyo Seimitsu Kogyo Kk | Sheet for temporarily holding thin metal piece for facilitating automatic supply and its production |
| WO2001004228A1 (en) * | 1999-07-08 | 2001-01-18 | Somar Corporation | Pressure-sensitive adhesive film being easy to peel |
| WO2003009657A1 (en) * | 2001-07-19 | 2003-01-30 | Toray Industries, Inc. | Circuit board, circuit board-use member and production method therefor and method of laminating fexible film |
| JP2003078230A (en) * | 2001-09-06 | 2003-03-14 | Toray Ind Inc | Method of manufacturing circuit board |
| JP2004281616A (en) * | 2003-03-14 | 2004-10-07 | Toray Ind Inc | Manufacturing method and manufacturing apparatus of circuit board |
| JP2005116857A (en) * | 2003-10-09 | 2005-04-28 | Toray Ind Inc | Method for manufacturing circuit board and circuit board member |
| JP2005340524A (en) * | 2004-05-27 | 2005-12-08 | Goo Chemical Co Ltd | Substrate holder for wiring board, intermediate material for wiring board, and process for producing wiring board |
| JP2005340523A (en) * | 2004-05-27 | 2005-12-08 | Goo Chemical Co Ltd | Process for producing wiring board |
| JP2006173535A (en) * | 2004-12-20 | 2006-06-29 | Sony Corp | Flexible substrate and its connecting method |
| JP2007123676A (en) * | 2005-10-31 | 2007-05-17 | Olympus Corp | Structure for inspecting substrate, and method for inspecting wiring substrate |
| WO2007060736A1 (en) * | 2005-11-25 | 2007-05-31 | Goo Chemical Co., Ltd. | Process for producing base material holding tool for wiring board, base material holding tool for wiring board, intermediate material for wiring board, and process for producing wiring board |
| JP2007150279A (en) * | 2005-10-27 | 2007-06-14 | Toray Ind Inc | Member for circuit board and method of manufacturing circuit board |
| JP2010067957A (en) * | 2008-09-15 | 2010-03-25 | Ind Technol Res Inst | Substrate structure applied in flexible electronic device and fabrication method thereof |
| KR101019423B1 (en) * | 2009-02-27 | 2011-03-07 | 주식회사 심텍 | Method for fabricating printed-circuit-board including buried pattern |
| US7963029B2 (en) * | 2002-11-01 | 2011-06-21 | Daisho Denshi Co., Ltd. | Holding/convey jig and holding/convey method |
| JP2012028817A (en) * | 2011-10-27 | 2012-02-09 | Fujimori Kogyo Co Ltd | Protective film for fpc, resin conductor foil laminate with protective film for fpc, and method of manufacturing flexible printed wiring board using it |
| US8273439B2 (en) | 2008-12-08 | 2012-09-25 | Industrial Technology Research Institute | Release layer materials, substrate structures comprising the same and fabrication method thereof |
| JP2014123755A (en) * | 2014-02-03 | 2014-07-03 | Fujimori Kogyo Co Ltd | Protective film for fpc, resin conductor foil laminate with protective film for fpc, and method of manufacturing flexible printed wiring board using it |
| WO2019155948A1 (en) * | 2018-02-09 | 2019-08-15 | 日本メクトロン株式会社 | Production method for flexible printed circuit boards |
| KR102497868B1 (en) * | 2021-11-12 | 2023-02-10 | 윤영도 | Roll to roll manufacturing method of flexible printed circuit board using uv carrier film |
-
1994
- 1994-08-05 JP JP6184962A patent/JPH0799379A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1088072A (en) * | 1996-09-11 | 1998-04-07 | Toyo Seimitsu Kogyo Kk | Sheet for temporarily holding thin metal piece for facilitating automatic supply and its production |
| WO2001004228A1 (en) * | 1999-07-08 | 2001-01-18 | Somar Corporation | Pressure-sensitive adhesive film being easy to peel |
| US7105221B2 (en) | 2001-07-19 | 2006-09-12 | Toray Industries, Inc. | Circuit board, laminated member for circuit board, and method for making laminated member for circuit board |
| WO2003009657A1 (en) * | 2001-07-19 | 2003-01-30 | Toray Industries, Inc. | Circuit board, circuit board-use member and production method therefor and method of laminating fexible film |
| US7534361B2 (en) | 2001-07-19 | 2009-05-19 | Toray Industries, Inc. | Methods for making laminated member for circuit board, making circuit board and laminating flexible film |
| JP2003078230A (en) * | 2001-09-06 | 2003-03-14 | Toray Ind Inc | Method of manufacturing circuit board |
| US7963029B2 (en) * | 2002-11-01 | 2011-06-21 | Daisho Denshi Co., Ltd. | Holding/convey jig and holding/convey method |
| JP2004281616A (en) * | 2003-03-14 | 2004-10-07 | Toray Ind Inc | Manufacturing method and manufacturing apparatus of circuit board |
| JP2005116857A (en) * | 2003-10-09 | 2005-04-28 | Toray Ind Inc | Method for manufacturing circuit board and circuit board member |
| JP2005340524A (en) * | 2004-05-27 | 2005-12-08 | Goo Chemical Co Ltd | Substrate holder for wiring board, intermediate material for wiring board, and process for producing wiring board |
| JP2005340523A (en) * | 2004-05-27 | 2005-12-08 | Goo Chemical Co Ltd | Process for producing wiring board |
| JP4571436B2 (en) * | 2004-05-27 | 2010-10-27 | 互応化学工業株式会社 | Wiring board manufacturing method |
| JP2006173535A (en) * | 2004-12-20 | 2006-06-29 | Sony Corp | Flexible substrate and its connecting method |
| JP2007150279A (en) * | 2005-10-27 | 2007-06-14 | Toray Ind Inc | Member for circuit board and method of manufacturing circuit board |
| JP2007123676A (en) * | 2005-10-31 | 2007-05-17 | Olympus Corp | Structure for inspecting substrate, and method for inspecting wiring substrate |
| WO2007060736A1 (en) * | 2005-11-25 | 2007-05-31 | Goo Chemical Co., Ltd. | Process for producing base material holding tool for wiring board, base material holding tool for wiring board, intermediate material for wiring board, and process for producing wiring board |
| JP2010067957A (en) * | 2008-09-15 | 2010-03-25 | Ind Technol Res Inst | Substrate structure applied in flexible electronic device and fabrication method thereof |
| US8173249B2 (en) | 2008-09-15 | 2012-05-08 | Industrial Technology Research Institute | Substrate structures applied in flexible electrical devices and fabrication method thereof |
| US8388779B2 (en) | 2008-09-15 | 2013-03-05 | Industrial Technology Research Institute | Substrate structures applied in flexible electrical devices and fabrication method thereof |
| US8273439B2 (en) | 2008-12-08 | 2012-09-25 | Industrial Technology Research Institute | Release layer materials, substrate structures comprising the same and fabrication method thereof |
| KR101019423B1 (en) * | 2009-02-27 | 2011-03-07 | 주식회사 심텍 | Method for fabricating printed-circuit-board including buried pattern |
| JP2012028817A (en) * | 2011-10-27 | 2012-02-09 | Fujimori Kogyo Co Ltd | Protective film for fpc, resin conductor foil laminate with protective film for fpc, and method of manufacturing flexible printed wiring board using it |
| JP2014123755A (en) * | 2014-02-03 | 2014-07-03 | Fujimori Kogyo Co Ltd | Protective film for fpc, resin conductor foil laminate with protective film for fpc, and method of manufacturing flexible printed wiring board using it |
| WO2019155948A1 (en) * | 2018-02-09 | 2019-08-15 | 日本メクトロン株式会社 | Production method for flexible printed circuit boards |
| JP2019140214A (en) * | 2018-02-09 | 2019-08-22 | 日本メクトロン株式会社 | Manufacturing method of flexible printed circuit board |
| KR102497868B1 (en) * | 2021-11-12 | 2023-02-10 | 윤영도 | Roll to roll manufacturing method of flexible printed circuit board using uv carrier film |
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