JPH0798302B2 - Flat polishing machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a surface polishing apparatus.

[Prior Art] When one-side polishing of a work such as a semiconductor wafer is performed by a flat polishing device, a work holding block is attached to a pressure plate at the lower end of the processing shaft, and the work held by this block is pressed against the polishing surface of a surface plate. However, since the quality of the work that has been polished is likely to deteriorate due to sticking of the polishing agent, etching, etc., it is necessary to remove it and clean it as soon as possible after the completion of polishing. . In addition, depending on the type of the work, it may be necessary to compete for cleaning after polishing, and it is desired to develop a flat polishing apparatus capable of coping with the cleaning.

Therefore, the inventor of the present invention has found that Japanese Patent Application No. 57-127334 (Japanese Utility Model Application No. 59-32)
No. 350), a flat-surface polishing apparatus capable of immediately cleaning a work after polishing was proposed. As shown in FIGS. 4 and 5, this is because a support shaft 42 is rotatably supported by a vertical shaft 41 standing around a surface plate 40, and a pressurizing cylinder 43 fixed to the support arm 42. The pressure plate 44 is attached to the rod of the work plate, the work holding block 45 is clamped to the pressure plate 44, and the work 46 adhered and held on the block 45 is pressed against the surface plate 40 for polishing. Upon completion, the pressure plate 44 rises and the support arm 42 rotates, and the cleaning tank
The work 46 is cleaned at 47.

However, the above-mentioned conventional surface polishing apparatus is
Since the method of rotating 42 around the vertical shaft 41 by the rotating cylinder 48 makes the mechanism complicated, it is difficult to rotate the support arm quickly due to the action of centrifugal force.

Further, the vertical shaft 41 and the rotation cylinder 48 located around the surface plate 40 may interfere with the work loading and unloading work,
Since each support arm 42 occupies a wide rotation space, there is a problem that it is difficult to save space and downsize the device.

[Problems to be Solved by the Invention] An object of the present invention is to solve the above-mentioned conventional problems and to provide a flat-surface polishing apparatus capable of quickly cleaning a work after polishing.

[Means for Solving the Problems] In order to solve the above-mentioned problems, a plane polishing apparatus of the present invention includes a surface plate which can be driven and rotated and which grinds a workpiece pressed against a grinding surface; And a work cleaning section, each of which is provided with a cradle on which a work holding block can be placed and a nozzle for injecting a cleaning liquid; and the work holding block can be clamped on the rod of the pressurizing cylinder. A plurality of pressurizing mechanisms, which are mounted on the surface of the surface plate and are pressed against the polishing surface of the surface plate, and are arranged in the upper space of the surface plate so as to cross the surface plate. Rails that support the pressure mechanisms adjacent to each other and guide the linear movement from the polishing position to the cleaning unit on the surface plate, and a plurality of rails that convey the pressure mechanisms in opposite directions along the rails. With the transfer cylinder And a supporting / conveying unit disposed in the moving region of the other pressing mechanism along the rail, respectively.

[Operation] When the block to which the work is adhered is placed on the pedestal in each cleaning unit, the pressure mechanism transferred to the cleaning unit by the pressure transfer mechanism is moved down to hold the block. Be seen.

When the pressure plate holding the block rises, the pressure mechanism is conveyed onto the surface plate, and the work is pressed against the polishing surface of the surface plate to perform the polishing.

When polishing is completed after a certain period of time, the pressure plate moves up, the pressure mechanism is conveyed to the cleaning unit, and the cleaning liquid is sprayed from each nozzle toward the work.

The transfer to the cleaning section of the pressurizing mechanism is performed linearly along the rail, and the transfer distance is shorter than that of the conventional rotation method, so that the transfer operation can be performed quickly and smoothly. Moreover, the apparatus can be downsized because the transport space is small.

Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings.

In FIGS. 1 to 3, 1 is a machine base of a flat polishing apparatus, 2
Is a surface plate for polishing the work, which is arranged on the upper surface of the machine base 1 so as to be rotatable by a drive source (not shown), and 3, 3, ... are applied to press the work against the polishing surface of the surface plate 2. Pressure mechanism, 4
Are the supporting and transporting parts that movably support these pressurizing mechanisms 3, and 5,5, ... Are cleaning parts that are arranged around the surface plate to clean the polished work.

The pressurizing mechanism 3 is configured such that a pressure plate 12 is attached to a rod 10a of a pressurizing cylinder 10 via a clamping cylinder 11, and a work holding block 14 is detachably attached to the pressure plate 12 by a clamper 13. As is clear from FIG. 3, the clamper 13 is mounted so as to be rotatable around the pin 16, and the clamp cylinder 11 is
It is designed to be rotated by a spring and a spring 15, and the block 14 is held or released by the rotation.

Incidentally, reference numeral 17 in the figure denotes a stopper for positioning the block 14.

Further, the supporting / conveying unit 4 supporting the pressurizing mechanism 3 is provided in the upper space of the surface plate 2 and has a substrate 20 arranged so as to cross the center of the surface plate 2. . A pair of upper and lower rails 21 and 21 are formed on both side surfaces of the substrate 20, and two guides 22 and 22 are slidably mounted on the rails 21 and 21, and the guides 22 and 22 are provided with the above-mentioned members. The pressurizing cylinders 10 of the pressurizing mechanism 3 are individually fixed, and the guides 22, 22 are provided on the side surface of the board 20 with the rails 21, 21.
Transport cylinders 23, 23 that are driven along are attached. That is, the support / conveyance unit 4 has two pressurizing mechanisms 3, 3 supported on both sides of the substrate 20 with the substrate 20 sandwiched therebetween, and the pressurizing mechanisms 3, 3 are conveyed in the opposite directions on the same straight line. Two transfer cylinders that are arranged to reciprocate between the surface plate 2 and the cleaning unit 5 and are located on one side of the substrate 20.
23 and 23 are the pressurizing mechanisms of the other, which are vertically displaced from each other.
It is installed in the moving area of 3,3, and by doing so, the installation space of the two transfer cylinders 23, 23 is made small and the apparatus is made compact.

Further, the cleaning unit 5 corresponding to each of the pressurizing mechanisms 3 is provided with a cylindrical pedestal 30 having an upper end on which the block 14 is placed. The main nozzle 31 for injecting the cleaning liquid toward the work 35 on the lower surface of the block 14 placed on the pedestal is provided, and the plurality of sub-nozzles 32 are provided at positions biased to the surface plate 2 side. Stand 30
A plurality of upper nozzles 33 are also provided above. Further, an intermediate nozzle 34 for injecting a cleaning liquid toward a work 35 which is being conveyed from the pressurizing position to the cleaning unit 5 is provided between the receiving table 30 and the surface plate 2.

In the figure, 36 indicates a polishing agent supply pipe, and 37 indicates a cover.

The operation of the flat polishing apparatus having the above configuration will be described.

When the block 14 to which the work 35 is adhered is placed on the pedestal 30 in each cleaning unit 5, the pressurizing mechanism 3 standing by above the surface plate 2 is moved along the rail 21 by the transfer cylinder 23. It is transported to the cleaning unit 5.

When the pressurizing mechanism 3 reaches the cleaning unit 5, the pressurizing cylinder 10
Is activated, the pressure plate 12 is lowered, and the block 14
Is held. In order to hold this block, the clamper 13 is lowered in advance to turn the clamper 13 to the release position, and when the pressure plate 12 comes into contact with the block 14, the clamp cylinder 11 moves upward and the clamper 13 is held. Is rotated to the locking position.

Thus, when the block 14 is held, the pressure plate 12 rises and the pressing mechanism 3 is conveyed onto the surface plate 2.

On the surface plate 2, the pressure plate 12 is lowered by the operation of the pressurizing cylinder 10, and the work 35 is pressed against the polishing surface of the surface plate 2 to perform the polishing.

When polishing is completed after a certain period of time, the pressure plate 12 starts rising, and the transfer cylinder 23
At the same time that the conveyance of the pressurizing mechanism 3 by the above is started, the cleaning liquid is jetted from the intermediate nozzle 34 and the sub nozzle 32 toward the workpiece 35 being conveyed.

When the pressure mechanism 3 reaches the cleaning unit 5, the pressure plate
12 descends and the block 14 is placed on the pedestal 30, and the spray from the intermediate nozzle 34 and the sub nozzle 32 is stopped and the cleaning liquid is sprayed from the main nozzle 31. In addition, the clamp cylinder 11 is rotated by the clamp cylinder 11,
14 is released.

The transfer of the pressurizing mechanism 3 to the cleaning unit 5 is performed linearly along the rail 21, and therefore, the transfer distance is shorter than that of the conventional rotation method, and the transfer operation is performed quickly and smoothly. Will be seen.

In addition, two pressurizing mechanisms 3 and 3 are respectively supported with the substrate 20 sandwiched therebetween, and these pressurizing mechanisms 3 and 3 are conveyed in opposite directions along lanes located on the same straight line. Therefore, the space required for carrying the pressurizing mechanism is very small, and moreover, it is arranged on one side of the substrate 20.
Since the transfer cylinders 23, 23 for driving the one pressurizing mechanism 3, 3 are arranged in the moving area of the other pressurizing mechanism,
The installation space for them is saved and the device can be downsized.

When the block 14 is released in the cleaning unit 5 as described above, the pressure plate 12 rises and the pressurizing mechanism 3 moves to the surface plate side and takes the standby position.

Subsequently, the cleaning liquid is sprayed from the upper nozzle 33 to the block 14 for a certain period of time.

Thus, when the cleaned block 14 is carried out from the cleaning unit 5, the main nozzle 31 and the upper nozzle 33 are stopped, and one polishing cycle is completed.

The above series of operations can be automatically performed by using an appropriate control circuit or computer, but can also be manually operated.

[Effects of the Invention] As described in detail above, according to the present invention, a plurality of pressurizing mechanisms are supported so as to be adjacent to rails that are positioned so as to cross the surface plate, and the pressurizing mechanisms are oriented in opposite directions along the rails. Since the work is moved linearly from the processing position to the cleaning unit, it is possible to transfer the cleaned workpiece to the cleaning unit in a short time with a short transfer distance for cleaning. It is possible to reliably prevent the deterioration of quality due to the adhesion of the agent or the etching.

Further, by arranging the transport cylinders that transport the adjacent pressure mechanisms in opposite directions to each other so as to be located in the moving region of the other pressure mechanism along the rail,
Compared with the case where these transfer cylinders are provided at the rail ends of the corresponding pressurizing mechanism side, the transfer cylinders are prevented from significantly protruding from the rail ends, and the installation space is significantly saved. This makes it possible to downsize the entire device and reduce the installation space.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing an embodiment of the present invention.
Figure is a plan view with the cover removed, and Figure 3 is the first
FIG. 4 is a partial front view and a plan view of a conventional example, and FIG. 4 and FIG. 2 ... Surface plate, 3 ... Pressure mechanism, 4 ... Support transfer section, 5 ... Washing section, 10 ... Pressure cylinder, 12 ... Pressure plate, 14 ... Block, 21 ... Rail, 23 …… Transport cylinder, 30 …… stand, 31 …… main nozzle, 32 …… sub nozzle, 33 …… upper nozzle, 34 …… intermediate nozzle, 35 …… work.

Claims (2)

[Claims] 1. A surface plate having a drive circuit, which grinds a work pressed against a grinding surface, the platens being disposed at positions facing each other with the surface plate sandwiched therebetween.
A work washing part having a cradle on which a work holding block can be placed and a nozzle for injecting a washing liquid; and a pressure plate capable of clamping the work holding block attached to the rod of the pressurizing cylinder. A plurality of pressurizing mechanisms for pressing the workpiece held by the pressurizing surface against the polishing surface of the surface plate; arranged in the upper space of the surface plate so as to traverse the surface plate, and supporting the pressurizing mechanisms adjacent to each other. A rail that guides the linear movement from the polishing position on the surface plate to the cleaning unit, and a plurality of transfer cylinders that transfer the pressing mechanism in opposite directions along the rail, A planar polishing apparatus comprising: a transporting cylinder; and a supporting and transporting unit disposed along the rail in the moving regions of the other pressing mechanisms. 2. A support conveying section is provided with two pressurizing mechanisms and two conveying cylinders on the front surface side and the rear surface side, respectively. Surface polishing machine.