JPH0758641B2 - Chip resistor - Google Patents
Chip resistorInfo
- Publication number
- JPH0758641B2 JPH0758641B2 JP61261410A JP26141086A JPH0758641B2 JP H0758641 B2 JPH0758641 B2 JP H0758641B2 JP 61261410 A JP61261410 A JP 61261410A JP 26141086 A JP26141086 A JP 26141086A JP H0758641 B2 JPH0758641 B2 JP H0758641B2
- Authority
- JP
- Japan
- Prior art keywords
- resistance film
- film
- resistance
- substrate
- chip resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、セラミック等の絶縁体製の基板の表面に、抵
抗被膜を形成して成るチップ抵抗器の改良に関するもの
である。Description: TECHNICAL FIELD The present invention relates to an improvement of a chip resistor formed by forming a resistance coating on the surface of a substrate made of an insulator such as ceramics.
この種のチップ抵抗器は、セラミック等の絶縁体製の基
板１の表面に、先づ第４図及び第５図に示すようにその
左右両端部に電極膜2a,2bを塗着し、次いで、該両電極
膜2a,2b間の部分に抵抗膜３を両電極膜2a,2bに跨るよう
にして塗着し、この抵抗膜３をガラス膜４にて覆ったの
ち、ガラス膜４の上から前記抵抗膜３にレーザートリミ
ングによるトリミング溝５を刻設することにより、所定
の抵抗値を得るようにしたものであり、所定の抵抗値を
得るための前記レーザートリミングによるトリミング溝
５の刻設加工は、自動機によって行なわれるものであ
る。In this type of chip resistor, electrode films 2a and 2b are first applied to the left and right end portions of the surface of a substrate 1 made of an insulator such as ceramic as shown in FIGS. The resistance film 3 is applied to a portion between the two electrode films 2a and 2b so as to extend over the two electrode films 2a and 2b, and the resistance film 3 is covered with the glass film 4 and then the glass film 4 is formed. The resistance film 3 is provided with a trimming groove 5 by laser trimming to obtain a predetermined resistance value. The trimming groove 5 is obtained by laser trimming for obtaining a predetermined resistance value. The processing is performed by an automatic machine.
しかし、基板１に対する抵抗膜３の塗着は、スクリーン
印刷によって行なわれ、基板１に対する抵抗膜３の塗着
位置には、常にずれが存在するものであるから、前記レ
ーザートリミングによるトリミング溝５を刻設する位置
を、基板１の側面を基準として、この側面から寸法によ
って求める方法では、抵抗膜３に対して所定寸法のトリ
ミング溝５を刻設することができず、前記抵抗膜３にお
ける抵抗値にバラ付きが発生することになる。However, the resistance film 3 is applied to the substrate 1 by screen printing, and there is always a deviation in the position where the resistance film 3 is applied to the substrate 1. Therefore, the trimming groove 5 by the laser trimming is formed. In the method of obtaining the position to be engraved with the dimension from the side surface of the substrate 1 as a reference, the trimming groove 5 of a predetermined dimension cannot be engraved in the resistance film 3, so that the resistance in the resistance film 3 is reduced. The value will vary.
そこで、先行技術としての特開昭58−14502号公報は、
抵抗膜３の色と基板１の表面の色との間に明度の差があ
ることに着目し、基板の表面に抵抗膜３を塗着するとき
同時に、第４図に示すように、当該抵抗膜３と同じ材料
で認識マーク６を塗着しておき、この認識マーク６を光
学的に明度の差によって読み取り、この認識マーク６の
位置を基準として、トリミング溝５を刻設することを提
案している。Therefore, JP-A-58-14502 as a prior art,
Paying attention to the difference in brightness between the color of the resistance film 3 and the color of the surface of the substrate 1, when the resistance film 3 is applied to the surface of the substrate, at the same time as shown in FIG. It is proposed that the recognition mark 6 is applied with the same material as the film 3, the recognition mark 6 is optically read by a difference in brightness, and the trimming groove 5 is formed based on the position of the recognition mark 6. is doing.
しかし、基板１の表面の両端部における電極膜2a,2b
も、前記抵抗膜３と同様に、スクリーン印刷によって塗
着されるものであり、この両電極膜2a,2bの基板１に対
する塗着位置にも、ずれが存在するものであるから、抵
抗膜３にトリミング溝５を刻設する位置を、前記先行技
術のように抵抗膜３と同時に塗着した認識マーク６によ
って求める方法では、第６図に示すように、両電極膜2
a,2bのうち一方の電極膜2aが他方の電極膜2bよりも長く
なるようにずれると共に、抵抗膜３が前記一方の電極膜
2a側にずれている場合には、抵抗膜３と同時に塗着した
認識マーク６を基準として刻設されるトリミング溝５
は、その一部が、前記一方の電極膜2aにかかってしま
い、抵抗値を所定値に調整できないと言う不良品が発生
する点に問題があった。However, the electrode films 2a, 2b on both ends of the surface of the substrate 1
Also, like the resistance film 3, the resistance film 3 is applied by screen printing, and there is a deviation between the application positions of the two electrode films 2a and 2b with respect to the substrate 1. In the method of obtaining the position where the trimming groove 5 is formed by the recognition mark 6 applied simultaneously with the resistance film 3 as in the prior art, as shown in FIG.
One electrode film 2a of a and 2b is displaced so as to be longer than the other electrode film 2b, and the resistance film 3 is formed of the one electrode film 2a.
When it is shifted to the 2a side, the trimming groove 5 is engraved with the recognition mark 6 applied at the same time as the resistance film 3 as a reference.
However, there is a problem in that a part of it is caught on the one electrode film 2a, and a defective product in which the resistance value cannot be adjusted to a predetermined value is generated.
本発明は、この問題を解消することを目的とするもので
ある。The present invention aims to solve this problem.
この目的を達成するために本発明は、 「絶縁体製の基板の表面に、その両端部に電極膜を、該
両電極膜に跨って抵抗膜を各々形成し、前記抵抗膜に、
その抵抗値調整用のトリミング溝を刻設して成るチップ
抵抗器において、前記抵抗膜の両端部分に、幅方向への
突出部を一体的に設け、この両突出部の間に、前記トリ
ミング溝を配設する。」 と言う構成にした。In order to achieve this object, the present invention provides, "On the surface of a substrate made of an insulator, electrode films are formed on both ends of the substrate, and a resistance film is formed so as to extend over the both electrode films.
In a chip resistor formed by engraving trimming grooves for adjusting the resistance value, protruding portions in the width direction are integrally provided at both end portions of the resistance film, and the trimming groove is provided between both protruding portions. To arrange. "
以下、本発明の実施例を、図面について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図及び第２図において、符合１はセラミック等の絶
縁体製の基板を、符合2a,2bは前記基板１の表面におけ
る両端部分に塗着した電極膜を、符合３は前記基板１の
表面において前記両電極膜2a,2b間の部分に両電極膜2a,
2bに跨るように塗着した抵抗膜を、そして、符合４は前
記抵抗膜３を覆うように塗着したガラス膜を各々示す。In FIGS. 1 and 2, reference numeral 1 is a substrate made of an insulator such as ceramics, reference numerals 2a and 2b are electrode films applied to both end portions of the surface of the substrate 1, and reference numeral 3 is a substrate of the substrate 1. Both electrode films 2a, 2b on the surface between the two electrode films 2a, 2b
Reference numeral 4 denotes a resistance film applied so as to extend over 2b, and reference numeral 4 denotes a glass film applied so as to cover the resistance film 3.
そして、前記抵抗膜３の両端部分には、幅方向への突出
部3a,3bを、抵抗膜３の長手方向の適宜寸法Ｌの間隔を
隔てて一体的に形成する。Then, on both end portions of the resistance film 3, protrusions 3a, 3b in the width direction are integrally formed with an interval of an appropriate dimension L in the longitudinal direction of the resistance film 3.
なお、この幅方向への突出部3a,3bは、抵抗膜３の左右
両側面に設けても良く、また、第３図に示す第２の実施
例のように、抵抗膜３の両端部を幅広にした形態にして
も良い。The protrusions 3a, 3b in the width direction may be provided on both left and right side surfaces of the resistance film 3, and both end portions of the resistance film 3 may be formed as in the second embodiment shown in FIG. It may be widened.
このように構成すると、抵抗膜３に、自動レーザートリ
ミングにてトリミング溝５を刻設することによって抵抗
値を所定値にするに際して、光学的に、前記抵抗膜３に
おける長手側面3c及び両突出部3a,3bを検出し、この長
手側面3c及び両突出部3a,3bを基準として、前記トリミ
ング溝５の位置を設定することにより、長手側面3cから
幅方向への切欠溝５の切込み深さＳを、所定寸法に正確
に規定することができると共に、このトリミング溝５
を、前記両当該突出部3a,3b間の寸法Ｌの範囲内に位置
することが確実にできるのである。According to this structure, when the resistance value is set to a predetermined value by engraving the trimming groove 5 on the resistance film 3 by the automatic laser trimming, the longitudinal side surfaces 3c and both protrusions of the resistance film 3 are optically optically. 3a, 3b are detected, and the position of the trimming groove 5 is set with reference to the longitudinal side surface 3c and the both protruding portions 3a, 3b, so that the cutting depth S of the notch groove 5 in the width direction from the longitudinal side surface 3c. Can be accurately specified to a predetermined dimension, and the trimming groove 5
Can be reliably positioned within the range of the dimension L between the protrusions 3a and 3b.
以上の本発明によると、抵抗膜の両端部分に、幅方向へ
の突出部を設け、この両突出部の間に、抵抗値調整用の
トリミング溝を配設したことにより、自動レーザートリ
ミングによるトリミング溝の抵抗膜に対する幅方向への
切込み深さを正確に所定寸法にできるのであり、しか
も、抵抗膜に対するトリミング溝を、前記両突出部の範
囲内に位置することが正確に且つ確実にできることによ
り、基板に対する抵抗膜の位置のずれにより前記先行技
術のようにトリミング溝が、一方の電極膜にかかるよう
なことを確実に少なくできるから、不良品の発生を大幅
に低減できる効果を有する。According to the present invention as described above, the widthwise protrusions are provided at both end portions of the resistance film, and the trimming groove for adjusting the resistance value is provided between the both protrusions. The depth of cut of the groove in the width direction with respect to the resistance film can be accurately set to a predetermined dimension, and moreover, the trimming groove with respect to the resistance film can be accurately and surely positioned within the range of the both protrusions. Since it is possible to reliably reduce the occurrence of the trimming groove on one of the electrode films as in the prior art due to the displacement of the resistance film with respect to the substrate, it is possible to significantly reduce the occurrence of defective products.
第１図は本発明の第１実施例チップ抵抗器の平面図、第
２図は第１図のII−II視拡大断面図、第３図は本発明第
２実施例チップ抵抗器の平面図、第４図は従来のチップ
抵抗器の平面図、第５図は第４図のＶ−Ｖ視拡大断面
図、第６図は従来のチップ抵抗器において電極膜及び抵
抗膜がずれた場合の平面図である。 １……基板、2a,2b……電極膜、３……抵抗膜、3a,3b…
…突出部、４……ガラス膜、５……トリミング溝。FIG. 1 is a plan view of a first embodiment chip resistor of the present invention, FIG. 2 is an enlarged sectional view taken along line II-II of FIG. 1, and FIG. 3 is a plan view of a second embodiment chip resistor of the present invention. FIG. 4 is a plan view of a conventional chip resistor, FIG. 5 is an enlarged sectional view taken along line VV of FIG. 4, and FIG. 6 is a conventional chip resistor when an electrode film and a resistance film are displaced. It is a top view. 1 ... Substrate, 2a, 2b ... Electrode film, 3 ... Resistive film, 3a, 3b ...
… Protruding part, 4 …… Glass film, 5 …… Trimming groove.
Claims (1)
極膜を、該両電極膜に跨って抵抗膜を各々形成し、前記
抵抗膜に、その抵抗値調整用のトリミング溝を刻設して
成るチップ抵抗器において、前記抵抗膜の両端部分に、
幅方向への突出部を一体的に設け、この両突出部の間
に、前記トリミング溝を配設したことを特徴とするチッ
プ抵抗器。1. A substrate made of an insulator is provided with electrode films at both ends thereof, and a resistance film is formed so as to straddle the two electrode films, and a trimming groove for adjusting the resistance value is formed in the resistance film. In a chip resistor formed by engraving, on both end portions of the resistance film,
A chip resistor characterized in that a protrusion in the width direction is integrally provided, and the trimming groove is disposed between both protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261410A JPH0758641B2 (en) | 1986-10-31 | 1986-10-31 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61261410A JPH0758641B2 (en) | 1986-10-31 | 1986-10-31 | Chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115301A JPS63115301A (en) | 1988-05-19 |
| JPH0758641B2 true JPH0758641B2 (en) | 1995-06-21 |
Family
ID=17361482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61261410A Expired - Lifetime JPH0758641B2 (en) | 1986-10-31 | 1986-10-31 | Chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0758641B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5979603A (en) * | 1982-10-28 | 1984-05-08 | Sony Corp | Antenna |
| JPS6071102U (en) * | 1983-10-20 | 1985-05-20 | 三洋電機株式会社 | thick film resistor |
-
1986
- 1986-10-31 JP JP61261410A patent/JPH0758641B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63115301A (en) | 1988-05-19 |
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