JPH0748330B2 - Electronic component resin molded case with built-in flexible substrate and method of manufacturing the same - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a resin molded case for an electronic component having a built-in flexible board, which has a structure in which a flexible board is inserted into a case made of synthetic resin.

[Conventional technology]

Conventionally, various electronic components such as rotary switches, rotary variable resistors, slide variable resistors, rotary cord switches or slide cord switches used in electronic devices have rotary switch patterns, resistor patterns, and current collecting patterns. The structure has a structure in which a sliding body having a metal slider that slidably contacts the various patterns is placed on a hard substrate on which various patterns such as an insulating pattern are formed, and a case is placed on the sliding body. Was there.

And in order to reduce the size and thickness of this type of electronic component,
A flexible substrate in which various patterns are formed on a synthetic resin film has been developed instead of the hard substrate.

[Problems to be Solved by the Invention]

However, in the conventional electronic components as described above,
Since the various patterns are mounted on the hard substrate or the flexible substrate, the surface of the various patterns is higher than the surface of the substrate, and a step can be formed between them by the thickness of the various patterns. When there is a step between the substrate surface and the various patterns in this way, when the sliding contact of the slider reciprocates between the various pattern surfaces and the substrate surface, the various patterns are not worn or damaged. There was a problem that it would occur.

The present invention has been made in view of the above-mentioned points, and a step is unlikely to occur between a substrate and various patterns mounted on the substrate, and a resin molded case for an electronic component with a built-in flexible substrate capable of smoothing the two And to provide a manufacturing method thereof.

[Means for Solving the Problems]

In order to solve the above-mentioned problems, the present invention provides a flexible substrate having various patterns formed on a synthetic resin film, the patterns including one layer or two or more layers in which the contacts of a metallic slider are in sliding contact with each other. It is a resin molded case with a built-in flexible board that has a structure in which the case is integrally attached to the lower surface and the periphery of the flexible board by insert molding in a case made of synthetic resin so that the formed surface is exposed to the outside. The synthetic resin film forming the flexible substrate is made of a material that is deformed by the temperature and / or pressure of the synthetic resin when the synthetic resin forming the case is melted and insert-molded. The synthetic resin film that constitutes the flexible substrate is the exposed surface up to the surface of the uppermost layer of the various patterns. It is allowed pushed deformation, its lower surface and said case around is configured to be molded in this state.

Further, according to the present invention, a flexible board is formed by forming various patterns of one layer or two or more layers in which contacts of a metal slider are slidably contacted on a synthetic resin film, and the flexible board is inserted into a mold. In addition, by pressing the molten synthetic resin into the mold together, the flexible substrate is insert-molded into the case so that the surface on which various patterns are formed is exposed to the outside. In the manufacturing method, the material of the synthetic resin film that constitutes the flexible substrate is a material that is deformed by the temperature and / or pressure of the molten synthetic resin that is press-fitted into the mold, and the flexible substrate is placed inside the mold. When inserting, the flat surface formed on the mold is brought into direct contact with the surface of the flexible substrate on which various patterns are formed, The synthetic resin melted in the mold is press-fitted so that the surface of the flexible substrate on which various patterns are formed is pressed against the flat surface of the mold, and the flexible substrate is constructed by the heat and / or pressure of the synthetic resin that is press-fitted. The synthetic resin film described above was constructed so as to push up and deform the other exposed surface to the surface of the uppermost layer of the various patterns.

[Action]

According to the electronic component resin molded case with a built-in flexible substrate and the manufacturing method thereof, as described above, the synthetic resin film itself constituting the flexible substrate is deformed by the molten synthetic resin that is press-fitted, and the flexible substrate and the flexible substrate. It is possible to make the step difference between the various patterns attached on the top small and smooth the two. In other words, simply by using the usual insert molding means of forming various patterns on the flexible substrate and insert-molding this into the case, it is easy to use without using any special means or complicated steps. ,
It is possible to smooth the various pattern forming surfaces of the flexible substrate.

In addition, even when various patterns formed on the flexible substrate have a one-layer portion and two-layer or more layer portions and there is a step in the various patterns themselves, the flexible substrate is configured. By deforming the synthetic resin film itself, the portion of the lower layer is pushed up to the surface of the uppermost layer and deformed, and the steps of the various patterns themselves can be made minute and smoothed.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing a structure of a case of a rotary switch with a built-in flexible substrate according to an embodiment of the present invention.
The figure (a) is a top view, the figure (b) is AA of the figure (a).
A sectional view on the upper side of the line, and FIG.

As shown in the figure, Case 1 of this rotary switch
From the side of the resin-molded case 1 to the metal terminals 15
A flexible substrate 13 is inserted inside the case 1.

The case 1 to be resin-molded has a circular inside, a side wall 113 is provided at an edge portion thereof, and a column 117 for rotatably supporting a rotary slider described later is provided at a central portion of a bottom portion thereof. There is.

The flexible substrate 13 has a rotary switch pattern (common pattern 131 and switching pattern 132) made of a conductor formed on the upper surface of the resin film. The rotary switch pattern of the flexible substrate 13 is exposed at the bottom of the case 1.

The structure, shape, and manufacturing method of each part of the case 1 of the rotary switch will be described below.

2 and 3 show the case 1 of the rotary switch.
The metal terminal 15 on the flexible substrate 13 inserted in
It is a figure which shows the method of connecting.

As shown in FIG. 2, in order to form the flexible substrate 13, first, a strip of polyethylene terephthalate (PET) film is prepared, and a metal foil (for example, copper or aluminum) is adhered onto the film, or the film is adhered onto the film. These metals are vapor-deposited on. Next, the metal foil is etched to form a rotary switch pattern (common pattern 131 and switching pattern 132) having a desired shape and a terminal connecting pattern 13 for connecting to each rotary switch pattern.
3 is formed (it goes without saying that these patterns may be created by other methods such as screen printing). Then, after that, the strip-shaped film is cut into a shape as shown in FIG. 2 to make a large number of flexible substrates 13 connected by the supporting portions 130. In addition to the above materials, polyetherimide (PEI), polyparabanic acid (PPA), etc. may be used as the material of the film of this synthetic resin.

Next, a metal terminal 15 formed integrally with the supporting member 150 is prepared, and a tip end portion of the metal terminal 15 is formed on the terminal connecting pattern 133 of the flexible substrate 13 to form a hot-melt type conductive adhesive layer. Place on top.

Next, the terminal fixing film 17 of a synthetic resin film having the same quality as the flexible substrate 13 is placed on the metal terminals 15 placed on the flexible substrate 13.

Subsequently, as shown in FIG. 3, an ultrasonic wave emitting horn (not shown) is placed on a portion of the terminal fixing film 17 where the metal terminal 15 is not located (a portion 171 in the same figure). Ultrasonic waves are emitted from the horn to locally and firmly melt and fix the terminal fixing film 17 and the synthetic resin film forming the flexible substrate 13 by ultrasonic heating.

Next, by heating the part of the metal terminal 15 from above the terminal fixing film 17 or the flexible substrate 13 with a heating iron, and melting the conductive adhesive layer, the metal terminal 15 is surely placed on the terminal connecting pattern 133. Stick to.

Since the fusion fixing of the synthetic resin film by ultrasonic heating is strong, the adhesion with the conductive adhesive may be omitted in some cases.

Next, a method of inserting the flexible substrate 13 into the synthetic resin case 1 shown in FIG. 1 will be described.

First, as shown in FIG. 4A, the flexible substrate 13 is sandwiched between the first mold A and the second mold B.

Here, the first mold A has a planar flat surface A1 formed in the center thereof, a circumferential groove A2 is formed around the flat surface A1, and a hole A3 is formed in the center of the flat surface A1. Has been formed.

Here, the flat surface A1 is a surface that directly contacts the rotary switch pattern on the flexible substrate 13 shown in FIG.
The circumferential groove A2 is a groove in which the side wall 113 of the case 1 is formed,
Further, the hole A3 is a hole in which the pillar 117 of the case 1 is formed.

In the second mold B, a recess B1 is formed in a portion corresponding to the flat surface A1 and the circumferential groove A2 of the first mold A, and a through hole B2 is formed substantially in the center of the recess B1. There is.

Here, the recess B1 is a recess for forming the bottom portion 11 of the case 1.

Next, polybutylene terephthalate (PBT) that has been heated and melted is press-fitted from the through hole B2 of the second mold B (arrow D1),
The molten resin material is filled in the recess B1 of the second mold B and the circumferential groove A2 of the first mold A. The temperature of the molten resin material in this example is 260 ° C., and the press-fitting pressure is 1000 kgF / cm ² . The mold temperature at this time was 80 ° C to 140 ° C, and the press-fitting time was 20 to 40 seconds.

The material of this molten resin is polyethylene terephthalate (PETP), polyphenylene sulfide (PP).
It may be made of synthetic resin such as S) and liquid crystal polymer (LCP).

At this time, as shown in FIG. 4B, the holes of the first mold A of the flexible substrate 13 are formed by the press-fitting pressure of the molten resin material.
The portion corresponding to A3 is pierced, and the molten resin material is filled in the hole A3 forming the column 117 of the case 1 (arrow D2).
At this time, the pierced flexible substrate 13 comes into close contact with the inner surface of the hole A3 and is not peeled off.

Here, FIG. 5 shows how the flat surface A1 of the first mold A, the flexible substrate 13 that adheres to the flat surface A1, and the switching pattern 132 formed on the flexible substrate 13 change when the molten resin material is press-fitted. It is a figure which shows whether to do.

As shown in FIG. 3A, since the switching pattern 132 is formed on the flexible substrate 13, there is a step between the surface of the flexible substrate 13 and the surface of the switching pattern 132.

Then, as shown in FIG. 3B, the flat surface A1 of the first mold A is brought into close contact with the switching pattern 132 of the flexible substrate 13.

Next, as shown in FIG. 3C, the molten resin material is press-fitted into the back surface side of the flexible substrate 13. At this time, the flexible substrate 13 is deformed by the heat and pressure of the molten resin material, and the portion of the flexible substrate 13 where the switching pattern 132 is not formed also comes into close contact with the flat surface A1 as shown in FIG. Become.

As a result, the surface of the switching pattern 132 and the surface of the flexible substrate 13 become substantially the same surface.

FIG. 6 is a diagram showing measured values obtained by actually measuring the level difference between the flexible substrate 13 and the switching pattern 132 before and after the molten resin material is press-fitted. FIG. 6A shows the measured value before press-fitting (see FIG. 5A). FIG. 5B shows the state after press-fitting (in the state of FIG. 5D).

As shown in FIG. 3A, before the molten resin material is press-fitted,
Although there is a step of about 36 μm between the surface of the flexible substrate 13 and the surface of the switching pattern 132, after the molten resin material is press-fitted as shown in FIG. It can be seen that there is no step between the surfaces and the surface is flat as a whole.

Note that the present invention is not limited to the materials of the flexible substrate 13 and the molten resin material shown above, but the point is that the material of the synthetic resin film forming the flexible substrate is the temperature and pressure of the molten resin material (in some cases, only the temperature). It is needless to say that a combination of a flexible substrate and a molten resin material of any material may be used as long as the material is a material that is deformed by pressure (or only pressure).

As described above, after the molten resin material is filled between the first mold A and the second mold B to solidify the molten resin material, the first mold A and the second mold B are removed. , This flexible board 13
3 is cut along the line B-B, the line C-C and the line D-D in FIG. 3, the case of the rotary switch with a built-in flexible substrate as shown in FIG. 1 is completed.

FIG. 7 is an exploded perspective view showing a rotary switch using the case 1.

As shown in the figure, this rotary switch includes a case 1 and a slider 23 made of metal and a sliding type article 21 made of synthetic resin.
By inserting the slider 23 and the sliding mold 21
It has a sliding body 2 which is integrated with the above, and a cover 3, the sliding body 2 is housed in a case 1, and the upper portion of the sliding body 2 is covered with a cover 3.

FIG. 8 is a diagram showing another embodiment of the case of a rotary switch with a built-in flexible substrate according to the present invention.

As shown in the figure, in the case 1'according to this embodiment, the same film as the flexible substrate 13 is provided in the case 1'without providing the metal terminal 15 as shown in FIG. And a terminal pattern 192 is formed at the tip through the conductor pattern 191.

Also in this embodiment, if the synthetic resin film forming the flexible substrate 13 is made of a material that is deformed by the temperature and / or pressure of the molten synthetic resin press-fitted into the mold, Similarly, smoothing between the surface of the flexible substrate and the surface of the rotary switch pattern can be achieved.

FIG. 9 is a diagram showing a case where the present invention is applied to a case of a rotary cord switch, in which FIG. 9 (a) is a rear view, FIG. 9 (b) is a side view, and FIG. 9 (c) is a front view. is there.

As shown in the figure, the rotary cord switch has substantially the same shape and structure as the rotary switch shown in FIG. 1, and the manufacturing method thereof is also the same.

This embodiment differs from the rotary switch shown in FIG. 1 in that the pattern formed on the flexible substrate 73 is a code pattern. This code pattern is formed by first bonding a copper foil onto the upper surface of a flexible substrate 73 made of a synthetic resin film, and then etching the copper foil to form five current collecting patterns 731 having a desired shape. Of course, other methods such as screen printing may be used). Then, a code pattern is formed by forming an insulator pattern 732 on a predetermined portion of the current collecting pattern 731.

Then, the flexible substrate 73 is sandwiched by a mold (not shown), and a molten resin material is press-fitted therein, whereby the rotary cord switch 7 is completed.

At this time, the flexible substrate 73 is made of a material that is deformed by the temperature and / or pressure of the molten resin material that is press-fitted, and the flat surface of the mold is directly adhered to the code pattern of the flexible substrate 73. To do so.

By doing so, the flexible substrate 73 is deformed by the temperature and pressure of the molten resin material, and the step between the code pattern surface and the flexible substrate surface is smoothed as in the above-described embodiments.

Here, FIG. 10 shows that the flat surface A′1 of the first mold A ′, the flexible substrate 73 that is in close contact with the flat surface A′1, the current collecting pattern 731 and the insulator pattern 732 formed on the flexible substrate 73,
It is a figure which shows how it changes at the time of press-fit of the said molten resin material in the length direction of each said pattern.

As shown in FIG. 7A, since the current collecting pattern 731 and the insulator pattern 732 are formed on the flexible substrate 73, the current collecting pattern 731 is formed in the length direction of each pattern.
There is a step between the surface of and the surface of the insulator pattern 732.

Then, as shown in FIG. 3B, the flat surface A′1 of the first mold A ′ is formed on the insulator pattern 732 of the flexible substrate 73.
And the molten resin material is pressed into the back surface side of the flexible substrate 73. At this time, the flexible substrate 73 is deformed by the heat and pressure of the molten resin material, and the portion of the current collecting pattern 731 where the insulator pattern 732 is not formed also becomes a flat surface A′1 as shown in FIG. It will come into close contact.

By this, the surface of the current collecting pattern 731 and the insulator pattern 732
The surfaces are substantially the same in the length direction.

FIG. 11 is a diagram showing a case where the present invention is applied to a rotary variable resistor with a switch. FIG. 11 (a) is a plan view and FIG. 11 (b) is a sectional view taken along line AA of FIG. 11 (a). Side view, same figure (c)
Is a back view.

As shown in the figure, the case 9 according to this embodiment has the same shape and structure as the case 1 of the rotary switch shown in FIG. 1, but the pattern formed on the flexible substrate 93 is different. .

That is, the patterns formed on the flexible substrate 93 are a doughnut-shaped resistor pattern 931 and a current collecting pattern 932.
A conductive pattern 933 made of silver paste is formed on one end side of the resistor pattern 931. A predetermined gap is provided between the resistor pattern 931 and the conductive pattern 933. Therefore, in the same figure (a), when the slider is in sliding contact between the resistor pattern 931 and the current collecting pattern 932, the resistance value between the two metal terminals 15 on the left side changes. When the child slides between the current collecting pattern 932 and the conductive pattern 933, the two metal terminals 15 on the right side are turned on.

Also in this embodiment, if the material of the synthetic resin film forming the flexible substrate 93 is made of a material that is deformed by the temperature and / or pressure of the molten synthetic resin press-fitted into the mold, the above-mentioned respective embodiments Similar to the above, smoothing between the surface of the flexible substrate and the surface of each pattern can be achieved. Therefore, the slider moves from the resistor pattern 931 to the flexible substrate 93.
The sliding is also smooth when moving to the conductive pattern 933 through the surface.

FIG. 12 is a diagram showing a case where the present invention is applied to a slide type variable resistor with a switch. FIG. 12 (a) is a plan view, FIG. 12 (b) is a partially cutaway side view thereof, and FIG. ) Is a back view.

As shown in the figure, in the case 4 according to this embodiment, a flexible substrate 43 having a linear resistor pattern 431, a conductive pattern 433 made of silver paste, and a current collecting pattern 432 is inserted into the case 4, and Three metal terminals 45 are projected from both sides of the case 4.

Further, the metal terminals 45 are connected and fixed to the flexible substrate 43 by threes at both ends thereof in the same manner as the terminal connection method in the rotary switch shown in FIGS. 2 and 3.

The case 4 is manufactured by the same method as the case 1 shown in FIG.

That is, as shown in FIG. 13, the flexible substrate 43 is sandwiched between two molds A ″ and B ″, and the molten resin material is inserted from the two holes B ″ 3 formed in the second mold B ″ into the mold. After press-fitting and solidifying, the mold is removed. This completes Case 4 shown in FIG.

In addition, in FIG. 12, the resistor pattern of this case 4
A predetermined gap is provided between 431 and the conductive pattern 433. Therefore, in the same figure (a), when the slider is in sliding contact with the resistor pattern 431 and the current collecting pattern 432, the resistance value between the metal terminals 45 connected to these patterns changes, When the slider makes sliding contact with the current collecting pattern 432 and the conductive pattern 433, the metal terminals 45 connected to these patterns are turned on.

Also in this embodiment, if the material of the synthetic resin film forming the flexible substrate 43 is made of a material that is deformed by the temperature and / or pressure of the molten synthetic resin that is press-fitted into the mold, the above-mentioned respective embodiments Similar to the above, smoothing between the surface of the flexible substrate and the surface of each pattern can be achieved.

Therefore, when the slider moves from the resistor pattern 431 through the surface of the flexible substrate 43 to the conductive pattern 433,
The sliding becomes smooth.

FIG. 14 is a side sectional view showing the structure of a slide type variable resistor with a switch using this case 4.

As shown in the figure, a sliding body 4 having a metallic slider 47a on a flexible substrate 43 inserted in the case 4.
Place 7. By covering the sliding body 47 with the cover 49, the sliding variable resistor with a switch is completed. The cover 49 is fixed by the protrusion 415 provided on the case 4. The slide type variable resistor with switch is attached to the substrate 48. At this time, the protrusion 417 formed on the case 4 and the metal terminal 45 are inserted into the holes formed in the substrate 48.

The embodiments of the electronic component resin molded case with a built-in flexible substrate and the manufacturing method thereof according to the present invention have been described above in detail, but the present invention is not limited to these and various modifications can be made.

That is, what kind of structure can be used for a resin molded case of an electronic component having a structure in which a flexible substrate having various patterns in which the contacts of a metal slider are slid on a synthetic resin film is inserted into a case made of synthetic resin? The present invention can also be applied to products.

〔The invention's effect〕

As described in detail above, the present invention has the following excellent effects.

Since the material of the synthetic resin film that composes the flexible substrate is made of a material that is deformed by the temperature and / or pressure of the molten synthetic resin, simply form various patterns on the flexible substrate and insert it into the case. By using the ordinary insert molding means of molding, it easily occurs between the portion where various patterns of the flexible substrate are provided and the portion where it is not provided without using any special means or complicated steps. The step can be made minute and smoothing can be achieved between the two.

Even if the various patterns formed on the flexible substrate have one layer portion and two or more layer portions and there is a step in the various patterns themselves, the surface of the uppermost layer Since the lower layer portion is pushed up and deformed, the steps of the various patterns themselves can be made minute and smoothed.

[Brief description of drawings]

FIG. 1 is a view showing the structure of a case of a rotary switch with a built-in flexible substrate according to an embodiment of the present invention.
FIG. 3 and FIG. 3 are views showing a method of connecting the metal terminals 15 to the flexible board 13 inserted into the case 1 of the rotary switch, and FIG. 4 is a view showing a method of inserting the flexible board 13 into the case 1. FIG. 5 shows a flat surface A1 of the first mold A, a flexible substrate 13 which is in close contact with the flat surface A1, and a switching pattern 13 formed on the flexible substrate 13.
2 shows a state in which the molten resin material changes during press-fitting, and FIG. 6 shows a flexible substrate before and after the molten resin material is press-fitted.
FIG. 7 is a diagram showing measured values obtained by actually measuring the step between 13 and the switching pattern 132, FIG. 7 is an exploded perspective view showing a rotary switch using the case 1, and FIG. 8 is a case of a rotary switch incorporating a flexible substrate according to the present invention. FIG. 9 shows another embodiment of the present invention, FIG. 9 shows the case where the present invention is applied to the case of a rotary cord switch, and FIG. 10 shows the flat surface A′1 of the first mold A ′ and the flat surface A′1. FIG. 11 is a view showing a state in which the flexible substrate 73 that is in close contact with the current collector pattern 731 and the insulator pattern 732 formed on the flexible substrate 73 change when the molten resin material is press-fitted. FIG. 12 is a diagram showing a case where the present invention is used for a resistor, FIG. 12 is a diagram showing a case where the present invention is used for a slide type variable resistor with a switch,
FIG. 13 is a view showing a method of inserting the flexible substrate 43 into the case 4, and FIG. 14 is a side sectional view showing a structure of a slide type variable resistor with a switch using the case 4. In the figure, 1,1 ', 4,7,9 ... case, 13,43,73,93 ... flexible board, 131 ... common pattern, 132 ... switching pattern,
431,931 ... Resistor pattern, 432,731,932 ... Current collecting pattern, 433,933 ... Conductive pattern, 732 ... Insulator pattern, A,
A ′, A ″… first mold, A1, A′1, A ″ 1… flat surface, B, B ″
... second mold, 23,47a ... slider.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication location H01H 19/08 Z (72) Inventor Yasutoshi Kaku 335 Kayajuku, Nakahara-ku, Kanagawa Prefecture Imperial Telecommunications Kogyo Co., Ltd. (72) Inventor Shinji Mizuno, 335, Kayajuku, Nakahara-ku, Kawasaki-shi, Kanagawa Teikoku Kogyo Kogyo Co., Ltd. (56) Reference JP-A-54-132770 (JP, A) Actual development Sho-62-150832 (JP) , U)

Claims (2)

[Claims] 1. A flexible substrate having various patterns formed of one layer or two or more layers in which contacts of a metal slider are slidably contacted on a synthetic resin film, and the surface having the various patterns is externally provided. An electronic component resin molded case with a built-in flexible board, wherein the case is integrally attached to the lower surface and the periphery of the flexible board by insert molding in a case made of synthetic resin so as to expose the flexible board. The synthetic resin film that comprises
The synthetic resin film forming the flexible substrate is made of a material that is deformed by the temperature and / or pressure of the synthetic resin when the synthetic resin forming the case is melted and insert-molded. Of the uppermost layer, the other exposed surface is deformed so as to be pushed up, and in this state, the case is molded on the lower surface and the periphery thereof. Resin molded case. 2. A flexible substrate is formed by forming various patterns of one layer or two or more layers in which contacts of a metal slider are slidably contacted on a synthetic resin film, and the flexible substrate is inserted into a mold. In addition, by pressing the molten synthetic resin into the mold together, the flexible substrate is insert-molded into the case so that the surface on which various patterns are formed is exposed to the outside. In the manufacturing method, the material of the synthetic resin film that constitutes the flexible substrate is a material that is deformed by the temperature and / or pressure of the molten synthetic resin that is press-fitted into the mold, and the flexible substrate is placed inside the mold. When inserting, the flat surface formed on the mold is brought into direct contact with the surface of the flexible substrate on which various patterns are formed, The molten synthetic resin surface to form the various patterns of the flexible substrate pressed to press the flat surface of the mold into the mold,
The synthetic resin film forming the flexible substrate is deformed by the heat and / or pressure of the synthetic resin that has been press-fitted so that the other exposed surface is pushed up to the surface of the uppermost layer of the various patterns. A method for manufacturing a resin molded case of an electronic component having a built-in flexible substrate, the method comprising: