JPH0732993U - Heat dissipation structure for electronic devices - Google Patents

Abstract

(57) [Abstract] [Purpose] Dissipate heat efficiently without impairing the appearance of electronic equipment. [Structure] The cover 15 has a radiation fin 13a, 13b, 1
The slits 16a, 16b, 16c are provided corresponding to 3c, and when fitted with the housing 12, the radiation fins 13a, 13c
These are formed so that b and 13c slightly project from the slits 16a, 16b and 16c, and a gap 17 is formed. Therefore, the heat radiated to the outside directly from the tips of the heat radiation fins 13 a to 13 c protruding to the outside, and the heat radiated from the vicinity of the base end portions of the heat radiation fins 13 a to 13 c in the lid body 15 pass through the gap 17. Since it is cooled by the inflowing outside air, heat can be prevented from being trapped between the housing 12 and the lid 15, and heat can be radiated. In addition, the entire radiation fins 13a to 13c are not exposed to the outside, and the aesthetic appearance is not impaired.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat dissipation structure for an electronic device, which is preferably implemented in an on-vehicle sound reproducing device, a wireless device, or the like.

[0002]

[Prior art]

 It is embedded in an automobile console or instrument panel, and used to play back recording media such as magnetic tape and to increase the power of the played sound signal to drive the speaker to play the sound in the vehicle. In devices and wireless devices that receive data such as dispatch instructions, the amount of heat generated inside the devices is increasing due to the recent increase in the power of amplifiers. However, if the temperature of recording media such as compact discs and cassette packs becomes high, the operator may get burned when the recording media are exchanged, or the stable operation of the device cannot be compensated. There is a problem.

Therefore, for example, with the goal of keeping the temperature rise of the cassette pack below the specified temperature when the four-channel speaker is driven continuously at the specified output for several hours, the heat dissipation structure of the above-mentioned equipment is set. Is being designed. Further, in the case of a compact disk reproducing device, the operation guarantee temperature of the optical pickup is low, and a more efficient heat dissipation structure is required. Similarly, in wireless devices, an efficient heat dissipation structure is required to ensure stable operation of devices and improve sensitivity and selectivity.

FIG. 4 is a perspective view for explaining a typical prior art heat dissipation structure. The wireless device 1 roughly includes a transmission system that amplifies a voice signal or a data signal and frequency-modulates it, and a reception system that converts the received wave into an intermediate frequency and then detects it to obtain the voice signal or the data signal. A demultiplexer that selectively connects the transmission system and the reception system to an antenna and a microcomputer that controls these constituent elements are housed in a housing 2. As one of the heat-generating components included in these components, for example, there is a power IC that amplifies the audio signal or the data signal.

The power IC is fixed to a heat radiating member 3 attached to a rear end portion 2 a of the housing 2 via a holder. Therefore, the heat generated by the power IC is transmitted to the heat dissipation member 3 via the holder and is dissipated to the outside from the heat dissipation fins 3a, 3b, 3c of the heat dissipation member 3.

Therefore, in such a conventional technique, the shape of the heat radiating member 3 such as the plate thickness of the heat radiating member 3, the height H1 of the heat radiating fins 3a, 3b, 3c and the arrangement pitch W1 and the casing 2 are formed in black. By examining the shape of the housing 2 such as improving the radiation efficiency by doing so, the design is made so as to obtain the desired heat radiation characteristics.

[0007]

[Problems to be solved by the device]

 However, in such a conventional technique, since the heat dissipation member 3 is entirely exposed to the outside, the appearance is not good.

An object of the present invention is to provide a heat dissipation structure for an electronic device that can efficiently dissipate heat without impairing the appearance.

[0009]

[Means for Solving the Problems]

 The present invention provides an electronic device including a housing provided with a heat dissipation member, wherein a lid body fitted to the housing body is provided, and when the lid body is fitted to the housing body, the heat dissipation member is provided. The heat dissipation structure of the electronic device is characterized in that the tip of the device protrudes from the surface of the lid, and a slit is provided between the heat dissipation member and the heat dissipation member to form a slit.

[0010]

[Action]

 According to the present invention, an electronic device such as a wireless device including a housing provided with a heat dissipation member is provided with a lid fitted to the housing. The lid is provided with at least one slit, and when the lid is fitted to the housing, the tip of the heat dissipation member protrudes from the surface of the lid through the slit, and the heat dissipation member and the A flow path for cooling air flowing from the outside is formed between the cover body and the lid.

Therefore, the heat radiated from the tip of the heat radiating member directly to the outside and also radiated from the vicinity of the base end of the heat radiating member is released to the outside without the heat being accumulated in the lid body. The heat radiating member provided at the upper part can efficiently radiate heat without spoiling the appearance.

[0012]

【Example】

 1 is an exploded perspective view for explaining a heat dissipation structure according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA of FIG. The wireless device 11, which is an electronic device, is used by being embedded in an automobile console or an instrument panel, receives a data signal such as a voice signal or a vehicle dispatch instruction, and after power amplification, outputs to a speaker. In addition, a voice signal and a response signal can be transmitted.

Therefore, in the housing 12, in addition to the reception system and the transmission system for receiving or transmitting the voice signal and the data signal, the duplexer for selectively connecting the transmission system and the reception system to the antenna. It also houses a microcomputer that controls these components. Further, the connector 19 is connected to a press talk switch for switching between transmission and reception, and a handset incorporating a microphone or the like.

A heat radiating member 13 is arranged at the rear end 12 a of the housing 12. The heat dissipating member 13 is composed of a support 14 having a plurality of heat dissipating fins 13a, 13b, and 13c provided upright, and is made of a material having good heat conductivity such as iron or aluminum. A power module 18 such as a power IC that amplifies a signal to be transmitted is mounted on the surface of the support base 14 opposite to the surface on which the heat radiation fins 13a to 13c are erected.

The heat generated from the power module 18 is propagated from the support 14 of the heat dissipation member 13 to the heat dissipation fins 13a, 13b, 13c and dissipated. By forming the radiation fins 13a, 13b, 13c from the support 14 on which the power module 18 is mounted, the radiation area can be expanded.

A lid 15 is formed so that the lid 15 can be fitted to the back of the housing 12 including the heat dissipation member 13. A support piece 20 and a support base 21 are provided on the housing 12 so as to support the fitted lid body 15. The lid 15 is provided with slits 16a, 16b, 16c corresponding to the respective radiation fins 13a, 13b, 13c, and when fitted with the housing 12, the radiation fins 13a, 13b, 13c are removed from the slits 16a, 16b, 16c. The positions where the slits 16a, 16b, 16c are formed and the height H2 between the support piece 20 and the support base 21 are adjusted so as to match the arrangement pitch W2 and the height H2 of the radiation fins 13a, 13b, 13c so as to slightly project. Has been adjusted.

That is, the height H2 of the support piece 20 and the support base 21 is set so that the radiation fins 13a, 13b, 13c can protrude from the slits 16a, 16b, 16c of the lid 15. It is formed to be slightly smaller than H3. In addition, the width and depth of the slits 16a, 16b, 16c are generally larger than those of the heat radiation fins 13a, 13b, 13c, and as a result, as shown in FIG. When fitted and the heat radiation fins 13a, 13b, 13c project from the slits 16a, 16b, 16c, a gap 17 is formed between the heat radiation fins 13a, 13b, 13c and the slits 16a, 16b, 16c.

Therefore, the heat generated from the power module 18 is propagated to the heat radiating member 13 and is directly radiated to the outside from the tips of the heat radiating fins 13 a, 13 b, and 13 c protruding to the outside, and at the same time, inside the lid 15. The heat dissipated from the vicinity of the base ends of the dissipating fins 13a, 13b, 13c is cooled by the outside air flowing in through the gap 17, so that the heat is prevented from being trapped between the housing 12 and the lid 15. You can radiate heat with.

As a result, it is possible to hold the electronic device such as the wireless device 11 within the operation guarantee temperature and perform a stable operation. Further, since the lid body 15 is fitted to the housing 12, the entire radiation fins 13a, 13b, 13c are not exposed to the outside, and the appearance is not impaired.

FIG. 3 is a sectional view showing a heat dissipation structure according to another embodiment of the present invention. The difference from the embodiment shown in FIG. 2 is that the height H4 of the heat radiation fins 23a to 23c is low, and the housing 25 directly contacts and fits into the support base 24 of the heat radiation member 23.

Therefore, the heat from the power module 18 is also radiated from the tips of the heat radiation fins 23 a, 23 b, and 23 c and the gap 17, and at the same time, propagates from the support base 24 through the lid body 25 and the lid body 25. Dissipated efficiently.

The present invention is not limited to vehicle-mounted electronic devices in which the heat radiation fins 13a to 13c; 23a to 23c are formed on the upper surfaces of the housings 12 and 22, but also to household electronic devices formed on the rear surface or the like. It can be suitably implemented.

[0023]

[Effect of device]

 As described above, according to the present invention, the tip of the heat dissipation member is projected from the surface of the lid through the slit, and a flow path of cooling air flowing from the outside is formed between the heat dissipation member and the lid. Therefore, it is possible to efficiently radiate heat without spoiling the appearance by the heat radiating member provided in the housing.

[Brief description of drawings]

FIG. 1 is an exploded perspective view illustrating a heat dissipation structure according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the section line AA of FIG.

FIG. 3 is a sectional view showing a heat dissipation structure of another embodiment of the present invention.

FIG. 4 is a perspective view for explaining a typical prior art heat dissipation structure.

[Explanation of symbols]

11 wireless device 12,22 housing 13,23 heat dissipation member 13a, 13b, 13c; 23a, 23b, 23c heat dissipation fin 14, 24 support base 15, 25 lid 16a, 16b, 16c slit 17 gap 20 support piece

Claims (1)

[Scope of utility model registration request] 1. An electronic device including a housing provided with a heat dissipation member, wherein a lid fitted to the housing is provided, and when the lid is fitted to the housing, the heat radiation is performed. A heat dissipation structure for an electronic device, wherein a tip of a member is projected from a surface of the lid, and a slit is provided so as to form a cooling air flow path with the heat dissipation member.