JPH07235778A - Electronic device housing - Google Patents

Electronic device housing

Info

Publication number
JPH07235778A
JPH07235778A JP2530894A JP2530894A JPH07235778A JP H07235778 A JPH07235778 A JP H07235778A JP 2530894 A JP2530894 A JP 2530894A JP 2530894 A JP2530894 A JP 2530894A JP H07235778 A JPH07235778 A JP H07235778A
Authority
JP
Japan
Prior art keywords
electronic device
device housing
finger
wall surface
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2530894A
Other languages
Japanese (ja)
Inventor
Akira Sugiyama
山 彰 杉
Tsutomu Hoshino
野 勉 星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2530894A priority Critical patent/JPH07235778A/en
Publication of JPH07235778A publication Critical patent/JPH07235778A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE:To easily hold an electronic device housing at a finger holding part and to prevent detrimental effect on a built-in electronic device by an opening part by forming a finger hook part by forming a recessed part in an upper part and a lower part of a rear and by forming an opening part for dissipating inner heat and an opening part for introducing air in the recessed part. CONSTITUTION:An electronic device housing 10 is held by putting a finger on a finger holding part 14 from inside a lateral groove 12a of an upper part of a base 12 and inside a lateral groove of a lower part thereof. An attachment seat 16 is brought into contact with a wall surface 20 and the electronic device housing 10 is attached. When used after attached, electronic devices 18, 19 generate heat and air inside the electronic device housing 10 rises. Thereby, air is ejected from an opening part 12c of an upper part of the base 12 and heat inside the electronic device housing 10 is removed. Since the opening part 12c is formed in a bottom part of the lateral groove 12a, dust, etc., is hard to enter the electronic device housing 10. Furthermore, attachment of an electronic device housing to a wall surface conceals an opening part and realizes good appearance.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電子機器筐体に係り、特
に基板を介して電子機器を内臓し、裏面を壁面に接触さ
せて壁面に取付けられる電子機器筐体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing, and more particularly to an electronic device housing which has an electronic device built in via a substrate and which is attached to a wall surface with its back surface in contact with the wall surface.

【0002】[0002]

【従来の技術】図5において、符号1は、ボタン電話主
装置等の電子機器の筐体を示しており、この筐体1はベ
ース2及びカバー3を備えている。カバー3の4隅には
取付穴3aが形成され、ベース2とカバー3とは取付穴
3aに貫通された取付ねじを介して一体になるように結
合されている。カバー3の上方部及び下方部にはそれぞ
れ縦溝3b、3b…が形成され、溝底の近くには開口部
3c、3c…(図6、図7参照)が形成されている。電
子機器筐体1に内臓された基板には電子部品類が取付け
られ、電子機器類を介して局線、内線端末及び電源等が
電気的に接続されている。
2. Description of the Related Art In FIG. 5, reference numeral 1 denotes a housing of an electronic device such as a main unit of a button telephone, and the housing 1 includes a base 2 and a cover 3. Mounting holes 3a are formed at the four corners of the cover 3, and the base 2 and the cover 3 are integrally coupled via a mounting screw penetrating the mounting hole 3a. Vertical grooves 3b, 3b ... Are formed in the upper part and the lower part of the cover 3, respectively, and openings 3c, 3c, ... (See FIGS. 6 and 7) are formed near the groove bottom. Electronic components are attached to a substrate incorporated in the electronic device housing 1, and a local line, an extension terminal, a power source, and the like are electrically connected via the electronic devices.

【0003】ところで、上述したボタン電話主装置の筐
体1は、壁面に取付けて使用され、ボタン電話主装置が
作動すると電子機器類が発熱する。発熱した熱はカバー
3の上端部に形成された開口部3c、3c…を介して電
子機器筐体1の外部に放熱される。同時に、カバー3の
下端部に形成された開口部3c、3c…を介して電子機
器筐体1の外部から電子機器筐体1内に外気が導入され
る。
By the way, the casing 1 of the above-mentioned key telephone main unit is used by being attached to a wall surface, and when the key telephone main unit operates, electronic devices generate heat. The generated heat is radiated to the outside of the electronic device housing 1 through the openings 3c, 3c ... Formed in the upper end of the cover 3. At the same time, outside air is introduced into the electronic device housing 1 from the outside of the electronic device housing 1 through the openings 3c, 3c, ... Formed in the lower end portion of the cover 3.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、開口部
3c、3c…がカバー3の表面に形成されているので開
口部3c、3c…を介してゴミ等が電子機器筐体1内に
容易に侵入し、電子機器筐体1内に侵入したゴミ等で電
子機器類が悪影響を受けるという問題がある。また、カ
バー3の表面に開口部3c、3c…が形成されているの
でボタン電話主装置の外観が美しくないという問題があ
る。さらに、ボタン電話主装置には指を掛ける箇所がな
いのでボタン電話主装置が持ちにくいという問題があ
る。したがって、本発明の目的は上記従来技術が有する
問題を解消し、電子機器筐体内への塵埃の侵入を防止
し、また、外観が美しく、さらに、持ち易い電子機器筐
体を提供することにある。
However, since the openings 3c, 3c ... Are formed on the surface of the cover 3, dust and the like easily enter the electronic equipment casing 1 through the openings 3c, 3c. However, there is a problem that electronic devices are adversely affected by dust and the like that has entered the electronic device housing 1. Further, since the openings 3c, 3c ... Are formed on the surface of the cover 3, there is a problem that the external appearance of the key telephone main device is not beautiful. Further, there is a problem that it is difficult to hold the key telephone main unit because the key telephone main unit does not have a portion for hanging a finger. Therefore, it is an object of the present invention to solve the problems of the above-mentioned conventional techniques, prevent dust from entering the housing of an electronic device, and provide an electronic device housing that has a beautiful appearance and is easy to hold. .

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、基板を介して電子機器を内臓し、裏面を
壁面に接触させて壁面に取付けられる電子機器筐体にお
いて、前記裏面の上端部及び下端部に指が嵌入可能な凹
部を形成して前記裏面の上縁及び下縁にそれぞれ凸状の
指掛部を形成し、前期指掛部と前記裏面との隙間が指の
太さより大きくなるように前記指掛部の高さを前記裏面
より低く設定し、前記上端部の凹部に内部熱を放熱する
開口部を形成し、かつ、前記下端部の凹部に外気を導入
する開口部を形成したことを特徴とする。
In order to achieve the above object, the present invention provides an electronic equipment housing in which an electronic equipment is built in via a substrate, and the back surface is brought into contact with a wall surface to be attached to the wall surface. A concave portion into which a finger can be fitted is formed at the upper end portion and the lower end portion, and convex finger hook portions are formed at the upper edge and the lower edge of the back surface, respectively. The height of the finger-holding portion is set to be lower than that of the back surface so as to be larger than the thickness, an opening portion for radiating internal heat is formed in the concave portion of the upper end portion, and external air is introduced into the concave portion of the lower end portion It is characterized in that an opening is formed.

【0006】[0006]

【作用】本発明によれば、電子機器が内臓され、壁面に
取付けられて使用される電子機器筐体において、電子機
器筐体の裏面の上端部及び下端部に指が嵌入可能な凹部
を形成して、電子機器筐体の裏面の上縁及び下縁にそれ
ぞれ凸状の指掛部を形成した。この指掛部は高さを電子
機器筐体の裏面より低く設定して、指掛部と裏面との隙
間を指の太さより大きくした。したがって、電子機器筐
体を壁面に取付ける場合に壁面と指掛部とに指の太さ以
上の隙間ができるので、指掛部に指を掛けることができ
る。
According to the present invention, in an electronic equipment housing in which an electronic equipment is built-in and attached to a wall surface for use, a recess into which a finger can be fitted is formed at an upper end portion and a lower end portion of a back surface of the electronic equipment housing. Then, convex finger hooks were formed on the upper edge and the lower edge of the back surface of the electronic device housing. The height of this finger hook is set lower than the back surface of the electronic device housing, and the gap between the finger hook and the back is made larger than the thickness of the finger. Therefore, when the electronic device housing is mounted on the wall surface, a gap larger than the thickness of the finger is formed between the wall surface and the finger hooking portion, so that the finger hooking portion can be hooked.

【0007】また、電子機器筐体の裏面の上端部及び下
端部に形成された凹部に電子機器筐体の内部と外部とを
連通する開口部を形成した。したがって、開口部が電子
機器筐体の裏面から凹んだ位置に形成されるので、指掛
部が開口部を介して電子機器筐体内にゴミ等が侵入する
ことを阻止する。さらに、開口部を電子機器筐体の裏面
に形成したので電子機器筐体を壁面に取り付けると、開
口部が隠れて見えなくなる。
Further, openings are formed in the recesses formed at the upper end and the lower end of the back surface of the electronic equipment casing to connect the inside and outside of the electronic equipment casing. Therefore, since the opening is formed at a position recessed from the back surface of the electronic device housing, the finger hook portion prevents dust and the like from entering the electronic device housing through the opening. Further, since the opening is formed on the back surface of the electronic device housing, when the electronic device housing is attached to the wall surface, the opening is hidden and cannot be seen.

【0008】[0008]

【実施例】以下本発明による電子機器筐体の実施例を図
1乃至図4を参照して説明する。図1において、全体を
符号10で示した電子機器筐体はベース12及びカバー
13を有し、カバー13の4隅には取付穴13aが形成
されている。ベース12とカバー13とは取付穴13a
に貫通されたねじ(図示せず)を介して一体となるよう
に結合されている。図2に示すように、ベース12の上
方部及び下方部にはそれぞれ横溝12a、12bが形成
され、横溝12a、12bの溝幅寸法は指を嵌入するこ
とができるような大きさに設定されている。このように
ベース12の上方部及び下方部にそれぞれ横溝12a及
び横溝12bを形成することにより、ベース12の上縁
及び下縁にそれぞれ凸状の指掛部14及び指掛部15が
形成される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of an electronic equipment casing according to the present invention will be described below with reference to FIGS. In FIG. 1, an electronic device housing generally designated by reference numeral 10 has a base 12 and a cover 13, and mounting holes 13 a are formed at four corners of the cover 13. The base 12 and the cover 13 have mounting holes 13a
They are integrally connected via a screw (not shown) which is penetrated through. As shown in FIG. 2, lateral grooves 12a and 12b are formed in the upper part and the lower part of the base 12, and the groove width dimension of the lateral grooves 12a and 12b is set so that a finger can be fitted therein. There is. By forming the lateral groove 12a and the lateral groove 12b in the upper portion and the lower portion of the base 12 in this way, the convex finger-hooking portion 14 and the finger-hooking portion 15 are formed in the upper edge and the lower edge of the base 12, respectively. .

【0009】指掛部14、15の高さはベース12の外
側面12eより低く設定され、これにより、後述する取
付座16から指掛部14、15の頂部までにはh1の隙
間が生じる。隙間h1は指の太さより大きくなるように
設定されている。さらに、横溝12a、12bは溝深さ
寸法が取付座16からh2になるように設定されてい
る。そして、指掛部14、15の頂部から横溝12a、
12bの底部までの距離(h2−h1)、すなわち指掛
部14、15の高さ寸法は、指掛部14、15に指が掛
かる高さになるように設定されている。
The height of the finger hooks 14 and 15 is set to be lower than that of the outer surface 12e of the base 12, so that a gap of h1 is formed from the mounting seat 16 described later to the tops of the finger hooks 14 and 15. The gap h1 is set to be larger than the thickness of the finger. Further, the lateral grooves 12a and 12b are set so that the groove depth dimension is from the mounting seat 16 to h2. Then, from the tops of the finger hooks 14 and 15 to the lateral groove 12a,
The distance (h2-h1) to the bottom of 12b, that is, the height dimension of the finger hooks 14 and 15 is set to be the height at which the finger hooks 14 and 15 are hooked.

【0010】また、横溝12aの底部には開口部12
c、12c…が形成され、横溝12bの底部には開口部
12d、12d…が形成されている。一方、電子機器筐
体10をボタン電話主装置のケーシングとして使用する
場合、電子機器筐体10内には基板17を介して電子部
品18、19等が取付けられ、電子部品18、19等を
介して局線、内線端末及び電源等が電気的に接続され
る。そして、電子機器筐体10は壁面20に取り付けら
れる。この場合、壁面20には取付座16、16…が当
接し、取付座16、16…はベース12の4隅に設けら
れる。したがって、ボタン電話主装置が作動して電子部
品18、19が発熱すると上方部の開口部12c、12
c…を介して電子機器筐体10内の熱が外部に放熱さ
れ、同時に、下方部の開口部12d、12d…を介して
外部から電子機器筐体10内に空気が侵入する。
An opening 12 is formed at the bottom of the lateral groove 12a.
are formed, and openings 12d, 12d ... Are formed at the bottom of the lateral groove 12b. On the other hand, when the electronic device casing 10 is used as a casing of the key telephone main unit, the electronic components 18, 19 and the like are mounted in the electronic device casing 10 via the board 17, and the electronic components 18, 19 and the like are used. The central office line, extension terminal, power supply, etc. are electrically connected. Then, the electronic device housing 10 is attached to the wall surface 20. In this case, the mounting seats 16, 16 ... Abut on the wall surface 20, and the mounting seats 16, 16 ... Are provided at the four corners of the base 12. Therefore, when the key telephone main device is activated and the electronic components 18 and 19 generate heat, the upper openings 12c and 12 are formed.
The heat in the electronic device housing 10 is radiated to the outside via c ..., At the same time, the air enters the electronic device housing 10 from the outside through the openings 12d, 12d.

【0011】次に前記のように構成された本発明による
電子機器筐体の作用を説明する。先ず、電子機器筐体1
0を壁面20に取り付ける場合について説明する。ベー
ス12の上方部の横溝12a内及び下方部の横溝12b
内に指を嵌入して指掛部14、15に指を掛けて電子機
器筐体10を持つ。そして、ベース12の4隅に設けら
れた取付座16、16…を壁面20に当接して電子機器
筐体10を壁面20に取り付ける。この場合、壁面20
から指掛部14、15の頂部までの隙間h1は指の太さ
より大きく設定されているので、指掛部14、15に指
を掛けて電子機器筐体10を持って壁面20に取り付け
ることができる。なお、電子機器筐体10を壁面20か
ら外す場合も取り付ける場合と同様に電子機器筐体10
を持って行うことができる。
Next, the operation of the electronic equipment casing of the present invention constructed as described above will be described. First, the electronic device housing 1
A case where 0 is attached to the wall surface 20 will be described. Inside the lateral groove 12a in the upper part of the base 12 and in the lateral groove 12b in the lower part
The electronic device housing 10 is held by inserting a finger into the inside and hooking the fingers on the finger hook portions 14 and 15. Then, the mounting seats 16, 16 ... Provided at the four corners of the base 12 are brought into contact with the wall surface 20 to mount the electronic device housing 10 on the wall surface 20. In this case, the wall surface 20
Since the clearance h1 from the top to the tops of the finger hooks 14 and 15 is set to be larger than the thickness of the finger, it is possible to mount the electronic device housing 10 on the wall surface 20 by holding the finger hooks 14 and 15 with a finger. it can. Note that when the electronic device housing 10 is detached from the wall surface 20, the electronic device housing 10 is mounted in the same manner as when mounting the electronic device housing
Can be done with.

【0012】次に、電子機器筐体10内の熱を外部に放
熱する場合について説明する。電子機器筐体10を壁面
20に取り付けた後、ボタン電話主装置を使用すると電
子機器18、19が発熱して電子機器筐体10内の空気
温度が高くなる。これにより、電子機器筐体10内の空
気が上昇して、図3の破線21で示すように、ベース1
2の上方部の開口部12c、12c…を介して電子機器
筐体10の外部に放出されて、電子機器筐体10内の熱
が放熱される。同時に、図4の破線22で示すように、
ベース12の下方部の開口部12d、12d…を介して
外気が電子機器筐体10内に侵入する。
Next, a case where the heat in the electronic equipment casing 10 is radiated to the outside will be described. When the key telephone main unit is used after the electronic device housing 10 is attached to the wall surface 20, the electronic devices 18 and 19 generate heat and the air temperature inside the electronic device housing 10 becomes high. As a result, the air inside the electronic device housing 10 rises, and as shown by the broken line 21 in FIG.
The heat in the electronic device housing 10 is radiated to the outside of the electronic device housing 10 through the openings 12c, 12c ... At the same time, as indicated by the broken line 22 in FIG.
Outside air enters the electronic device housing 10 through the openings 12d, 12d, ... At the lower part of the base 12.

【0013】そして、ベース12の上方部の開口部12
c、12c…及び下方部の開口部12d、12d…は、
それぞれ上方部の横溝12a及び下方部の横溝12bの
底部に形成されているので、開口部12c、12c…及
び開口部12d、12d…から電子機器筐体10内に塵
埃等が侵入しにくい。また、開口部12c、12c…及
び開口部12d、12d…を電子機器筐体10の裏面側
に形成したので、電子機器筐体10を壁面20に取り付
けると開口部12c、12c…及び開口部12d、12
d…が見えなくなり電子機器筐体10の外観が美しくな
る。前記実施例では電子機器筐体10をボタン電話主装
置のケーシングに使用した場合について説明したが、こ
れに限らず、その他の電子機器装置のケーシングに使用
してもよい。
The opening 12 in the upper part of the base 12
c, 12c ... and the lower openings 12d, 12d ...
Since they are formed at the bottoms of the upper lateral groove 12a and the lower lateral groove 12b, dust and the like are less likely to enter the electronic device housing 10 through the openings 12c, 12c ... And the openings 12d, 12d. Further, since the openings 12c, 12c ... And the openings 12d, 12d ... Are formed on the back surface side of the electronic device housing 10, when the electronic device housing 10 is attached to the wall surface 20, the openings 12c, 12c. , 12
d ... disappears and the appearance of the electronic device housing 10 becomes beautiful. Although the case where the electronic device housing 10 is used as the casing of the key telephone main device has been described in the above embodiment, the present invention is not limited to this and may be used as the casing of other electronic device devices.

【0014】[0014]

【発明の効果】以上の説明から明らかなように、本発明
による電子機器筐体によれば、電子機器筐体の裏面の上
方部及び下方部に指が嵌入可能な凹部を形成して、電子
機器筐体の裏面の上縁及び下縁にそれぞれ凸状の指掛部
を形成した。この指掛部は高さを電子機器筐体の裏面よ
り低く設定して、指掛部と裏面との隙間を指の太さより
大きくした。したがって、電子機器筐体を壁面に取付け
る場合に壁面と指掛部とに指の太さ以上の隙間ができる
ので、指掛部に指を掛けて電子機器筐体を容易に持つこ
とができる。また、電子機器筐体の裏面の上方部及び下
方部に形成された凹部に電子機器筐体の内部と外部とを
連通する開口部を形成した。したがって、開口部が電子
機器筐体の裏面から凹んだ位置に形成されるので、指掛
部が開口部を介して電子機器筐体内にゴミ等が侵入する
ことを阻止して、電子機器筐体に内臓された電子機器に
悪影響を与えることを防止する。さらに、開口部を電子
機器筐体の裏面に形成したので電子機器筐体を壁面に取
り付けると、開口部が隠れて見えなくなり外観が美しく
なる。
As is apparent from the above description, according to the electronic equipment housing of the present invention, the recesses into which the fingers can be fitted are formed in the upper and lower portions of the back surface of the electronic equipment housing to form the electronic equipment housing. Convex finger hooks were formed on the upper and lower edges of the back surface of the device housing. The height of this finger hook is set lower than the back surface of the electronic device housing, and the gap between the finger hook and the back is made larger than the thickness of the finger. Therefore, when mounting the electronic device housing on the wall surface, a gap larger than the thickness of the finger is formed between the wall surface and the finger hook portion, so that the electronic device housing can be easily held by hooking the finger on the finger hook portion. In addition, openings are formed in the recesses formed in the upper and lower portions of the back surface of the electronic device housing to connect the inside and outside of the electronic device housing. Therefore, the opening is formed at a position recessed from the back surface of the electronic device housing, so that the finger hook portion prevents dust and the like from entering the electronic device housing through the opening, and Prevents adverse effects on the built-in electronic devices. Further, since the opening is formed on the back surface of the electronic device housing, when the electronic device housing is attached to the wall surface, the opening is hidden and cannot be seen, and the appearance becomes beautiful.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による電子機器筐体の一実施例を正面よ
り見た斜視図。
FIG. 1 is a front perspective view of an embodiment of an electronic device housing according to the present invention.

【図2】本発明による電子機器筐体の一実施例を示した
背面図。
FIG. 2 is a rear view showing an embodiment of an electronic device casing according to the present invention.

【図3】図2のA−A線に沿って切断して示した縦断面
図。
3 is a vertical cross-sectional view cut along the line AA of FIG.

【図4】図2のB−B線に沿って切断して示した縦断面
図。
FIG. 4 is a vertical cross-sectional view taken along the line BB of FIG.

【図5】従来の電子機器筐体を正面より見た斜視図。FIG. 5 is a perspective view of a conventional electronic device housing viewed from the front.

【図6】従来の電子機器筐体の開口部を拡大して示した
要部拡大図。
FIG. 6 is an enlarged view of a main part showing an enlarged opening of a conventional electronic device housing.

【図7】図6のC−C線に沿って切断して示した横断面
図。
FIG. 7 is a cross-sectional view taken along the line CC of FIG.

【符号の説明】[Explanation of symbols]

10 電子機器筐体 12a、12b 凹部 12c、12d 開口部 12e 外側部(裏面) 14、15 指掛部 17 基板 18、19 電子部品 20 壁面 DESCRIPTION OF SYMBOLS 10 Electronic device housing 12a, 12b Recess 12c, 12d Opening 12e Outer side (rear side) 14, 15 Finger hook 17 Board 18, 19 Electronic component 20 Wall surface

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】基板を介して電子機器を内臓し、裏面を壁
面に接触させて壁面に取付けられる電子機器筐体におい
て、前記裏面の上方部及び下方部に指が嵌入可能な凹部
を形成して前記裏面の上縁及び下縁にそれぞれ凸状の指
掛部を形成し、前記指掛部と前記裏面との隙間が指の太
さより大きくなるように前記指掛部の高さを前記裏面よ
り低く設定し、前記上方部の凹部に内部熱を放熱する開
口部を形成し、かつ、前記下方部の凹部に外気を導入す
る開口部を形成したことを特徴とする電子機器筐体。
1. An electronic device housing in which an electronic device is built in via a substrate and which is attached to a wall surface by bringing the back surface into contact with the wall surface, and a recess into which a finger can be fitted is formed in an upper portion and a lower portion of the back surface. And convex finger-hook portions are formed on the upper edge and the lower edge of the back surface, respectively, and the height of the finger-hook portion is adjusted so that the gap between the finger-hook portion and the back surface is larger than the thickness of the finger. An electronic device housing, which is set to a lower height, in which an opening for radiating internal heat is formed in the recess of the upper portion, and an opening for introducing outside air is formed in the recess of the lower portion.
JP2530894A 1994-02-23 1994-02-23 Electronic device housing Pending JPH07235778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2530894A JPH07235778A (en) 1994-02-23 1994-02-23 Electronic device housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2530894A JPH07235778A (en) 1994-02-23 1994-02-23 Electronic device housing

Publications (1)

Publication Number Publication Date
JPH07235778A true JPH07235778A (en) 1995-09-05

Family

ID=12162384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2530894A Pending JPH07235778A (en) 1994-02-23 1994-02-23 Electronic device housing

Country Status (1)

Country Link
JP (1) JPH07235778A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009015870A (en) * 2008-10-03 2009-01-22 Toshiba Corp Electronic equipment
US7511956B2 (en) 2006-05-23 2009-03-31 Kabushiki Kaisha Toshiba Electronic apparatus
JP2011034309A (en) * 2009-07-31 2011-02-17 Toshiba Corp Electronic apparatus
JP2018107287A (en) * 2016-12-27 2018-07-05 オンキヨー株式会社 Housing for electronic apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7511956B2 (en) 2006-05-23 2009-03-31 Kabushiki Kaisha Toshiba Electronic apparatus
US7701709B2 (en) 2006-05-23 2010-04-20 Kabushiki Kaisha Toshiba Electronic apparatus
US7903402B2 (en) 2006-05-23 2011-03-08 Kabushiki Kaisha Toshiba Electronic apparatus
JP2009015870A (en) * 2008-10-03 2009-01-22 Toshiba Corp Electronic equipment
JP2011034309A (en) * 2009-07-31 2011-02-17 Toshiba Corp Electronic apparatus
US8270165B2 (en) 2009-07-31 2012-09-18 Kabushiki Kaisha Toshiba Electronic apparatus
JP2018107287A (en) * 2016-12-27 2018-07-05 オンキヨー株式会社 Housing for electronic apparatus

Similar Documents

Publication Publication Date Title
USD449279S1 (en) Electrical equipment housing cover
JPH07235778A (en) Electronic device housing
JPH11179026A (en) Board housing box for pachinko machine
JP2000196977A (en) Shield structure for plasma display device
JPH023346B2 (en)
CN210177178U (en) Key module and washing machine
JPH0637582Y2 (en) Wire connection device
JP2923490B1 (en) Desk wiring duct device
USD481708S1 (en) Mounted compact disk storage unit
JP2003264376A (en) Structure for mounting electronic apparatus casing
JP3097279B2 (en) How to attach the earphone cap
JP3286075B2 (en) Wall mounting device
US6219430B1 (en) Electronic appliance with loudspeaker unit
JPS59193786U (en) motorcycle rear trunk
JP2003124645A (en) Box body fixing structure
JP3119991B2 (en) Cordless telephone
JP3717152B2 (en) Electronics
JP2707043B2 (en) Wiring hole device such as desk top plate
JPS62120763A (en) Modulator jack with tone ringer
JPH07219676A (en) Information processor
JPS5932789Y2 (en) Storage device for power cords, etc.
JP4059096B2 (en) Plasma display device
JPH0138930Y2 (en)
JP2000049486A (en) Mounting structure of cover of electronic equipment
JPH09162559A (en) Wall type equipment of wall type apparatus