JPH07202275A - Aggregate of electronic cooling element - Google Patents

Abstract

PURPOSE:To enable heat transmission by an extremely small heat resistance by compressing a thin plate held between heat conductors from both sides making copper bands face each other with a semiconductor between in parallel with each other shifting a half pitch and by welding the semiconductor and the copper band by solder, etc. CONSTITUTION:An aggregate 1 of a half-completed electronic cooling element and a polyimide sheet 2-based polyimide sheet 13 wherein a copper band 11 alone is adhered by adhesive are combined to make copper bands 5, 11 face each other with semiconductor elements 6, 7 between in parallel with each other shifting a half pitch. In the state, a heat conductor 16 at a HOT side and a heat conductor 17 at a COLD side are compressed by a bolt 18 and a nut 19 and a heat conductor 15 at a side of the polyimide sheet 13 is heated to melt solder. Thereby, heat can be transmitted by an extremely small heat resistance to fluid at the sides of HOT and COLD whereto heat is transmitted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a facility for practically applying the Peltier effect for cooling.

[0002]

2. Description of the Related Art A conventional assembly of electronic cooling elements of this kind has a substantially rectangular shape in which a pair of semiconductors or tens or hundreds of paired semiconductors are divided into the same number to generate a Peltier effect when a DC voltage is applied. A pair of ceramic or other electrical insulator plates sandwiched between electrical conductor plates arranged by etching or the like, and electrically connected by soldering in series and fixed to the outside of which a heat conductor plate is further provided. Was attached and commercialized as an assembly of one electronic cooling element.

[0003]

However, in the above-described assembly of electronic cooling elements, since a plurality of pairs of semiconductors are accommodated in a predetermined substantially rectangular space, a large number of semiconductors are continuously arranged in a straight line. Instead, it has a shape that turns several times or dozens of times within the length of the side of a given square,
It was inconvenient for industrial continuous mass production.

Further, since the outer shape of the conventional assembly of thermoelectric cooling elements is rectangular and planar, the shape of the contact portion with the heat conductor, which is the main purpose of the assembly, is inevitably flat, and the unit alone has to be flat. In order to obtain the strength of the semiconductor and to maintain the insulation between the conductive parts of each pair of semiconductors, the outer surface is covered with an electrically insulating plate such as ceramic with a certain thickness. Not only does it have a considerable thermal resistance up to the end, but also a cylindrical pipe that is convenient for heat exchange with liquids that flow, and a fin-shaped heat conductor that has high density and is convenient for convective heat transfer with gas. It is not easy to connect, and if you try to forcibly form a heat conductor, the heat conductor becomes large and the heat passage resistance to the target fluid becomes large, so that the temperature difference between both ends of the assembly of electronic cooling elements becomes large. Becomes larger and Efficiency of the cooling effect of was suppressed to win low.

In addition, the DC voltage suitable for applying to a pair of semiconductors is extremely low at 0.1 V or less in the existing semiconductors, and therefore thousands of semiconductors are connected in series in order to be used at a commercial power supply voltage of 100 to 200 V. They have to be connected, which is not easy with conventional manufacturing methods, and even if any one of the series connections is broken, the thousands of rows of semiconductors leading to the set are quite effective. There was also a drawback in terms of reliability, such as the disappearance.

[0006] Therefore, the electronic cooling can produce a cooling effect by using an extremely simple device without using an operating part as compared with a compression type refrigerator and the like, without using a chlorofluorocarbon refrigerant or petrochemical fuel. Because of its high cost and lack of practicality due to its shape, it could hardly be put to commercial use.

[0007]

The present invention has been made to improve this point. As described in the claims, a heat-resistant adhesive is used on a thin plate of heat-resistant and flexible resin, and thin flexible copper strips of a certain width are kept at intervals narrower than the certain width. Bonded in parallel or formed by etching, and generate a Peltier effect when a DC voltage is applied along the longitudinal direction of the copper strips. The paired semiconductors are arranged in the same direction with a constant space and are welded by soldering. An assembly of the semi-finished electronic cooling elements is prepared according to the dimensions of the heat conductor to which it is attached. The same copper strips as described above are attached in parallel with a heat-resistant adhesive at the same intervals, or a thin strip of heat-resistant and flexible resin formed by etching is used to sandwich the copper strips between the semiconductor strips. The assembly of electronic cooling elements is completed by welding with solder so that the copper strips face each other and are offset by a half pitch so that they are parallel to each other.

When heat exchange with the gas is performed on both the COLD side and the HOT side of the electronic cooling element, it is desirable that the joint surface between the heat conductor and the electronic cooling element is a flat surface. In this case, the assembly of the semi-finished electronic cooling elements. Cream solder is applied to the surface of the semiconductor to be solder-joined, and the copper strip of the resin thin plate with only the copper strip is solder-plated, and both are bonded to the heat conductor on the COLD side and to the HOT side. It is sandwiched between the heat conductors so that the copper strips are parallel to each other with a half-pitch offset, and is then crimped by a method such as bolt tightening and heated to a temperature at which the solder melts. To join. In this way, the assembly of the electronic cooling elements is completed in a state where the heat conductors on the COLD side and the HOT side are in complete contact.

When both the COLD side and the HOT side of the electronic cooling element exchange heat with the liquid, or one with the liquid and the other with the gas, the assembly of the electronic cooling elements is provided in the gap between the concentric double tubes having different diameters. In this case, the semi-finished assembly of electronic cooling elements is wrapped around the outer surface of the inner tube with a small diameter with a thin resin plate so that the copper strip is perpendicular to the axis of the tube. A semi-finished electronic device in which cream solder is applied to the surfaces to be soldered, the copper strip of the resin thin plate with only the copper strip is solder-plated, and the copper strip is wound inside the inner tube. Wrap the copper strips on the outside of the assembly of cooling elements so that the copper strips are perpendicular to the axis of the pipe and the copper strips are parallel to each other with a half-pitch offset. Expand from the inside of the tube and electronically cool it inside the outer tube and outside the inner tube. As thin plates both sides of the resin of the assembly element is crimped, bonded by heating the outer tube to the melting temperature solder. In this way, the assembly of the electronic cooling elements is completed in a state of being sandwiched between the concentric double tubes and closely contacting both tubes.

In the case of exchanging heat with the liquid flowing through both the HOT side and the COLD side, a concentric jacket is attached to the outer side of the outer pipe, and each liquid is passed through both the jacket and the inner pipe. Good. When one of the HOT side and the COLD side is gas and the other is liquid, a fin may be attached to the outside of the outer tube so that the gas flows through the fin side and the liquid flows through the inner tube.

Paragraph

[0009] and

In any of the above cases, when the temperature difference between the HOT side and the COLD side is large, an assembly of a plurality of the electronic cooling elements is superposed with a plate of a heat conductor interposed therebetween to form a plurality of electronic cooling elements. It is sufficient to form an aggregate.

[0012]

In the present invention, a thin plate of heat-resistant and flexible resin having a width close to the size actually used in manufacturing an assembly of electronic cooling elements is used, and the length or endless state actually used is used. Then, the flexible thin copper strip having a constant width is formed by parallel bonding or etching with a heat-resistant adhesive while keeping a narrower space than the predetermined width, and along the longitudinal direction of the copper strip, A pair of semiconductors that produce a Peltier effect when a DC voltage is applied are arranged in the same direction at regular intervals and are welded to a copper strip with solder to form a semi-finished assembly of electronic cooling elements. Thin and heat-resistant and flexible copper foils of the same size and thin and having a constant width are formed by sticking them in parallel with a heat-resistant adhesive at intervals smaller than the predetermined width or by etching. Resin plate Such as by solder paste or solder plating on the surface to be field joined prepared, actually H
When assembled into the thermal conductors on the OT side and the COLD side, the both are arranged so as to face each other in a normal positional relationship, and are heated in a state of being crimped to melt and weld the solder to complete an assembly of electronic cooling elements. As a result, it is easier to carry out continuous mass production industrially than a unit of a small electronic cooling element made by a conventional method.

Since the assembly of the electronic cooling elements in a semi-finished state uses a thin flexible resin plate as a base material, it can be stored flatly or rolled into a roll. It has a sufficient strength even if it is transported, and it is much thinner than a ceramic plate used for conventional units with a certain thickness to maintain the strength and electrical insulation. Heat can be transferred efficiently.

Further, the assembly of electronic cooling elements according to the present invention is prepared in two pieces in a semi-finished state as described above.
Since it is sandwiched between the heat conductors on the HOT side and the COLD side, which are actually incorporated, so that they have a normal positional relationship with each other, they are heated and soldered to complete the assembly of electronic cooling elements. Whether the shape of the heat conductor is planar or cylindrical, it is directly formed in close contact according to the shape, so that the HOT that tries to transfer heat to the heat conductor as well.
Heat can be transferred to the fluids on the side and COLD side with very low thermal resistance.

Further, in the assembly of electronic cooling elements according to the present invention, several hundred semiconductor elements connected in series in electrical series are electrically connected in parallel by the copper strips on the respective surfaces facing each other with the semiconductor element interposed therebetween. Even if an electrical disconnection occurs, it does not affect the semiconductors other than the pair of semiconductors that have the disconnection, and all other semiconductors can effectively exhibit the cooling effect. .

Two sets of the thermoelectric cooler assembly are arranged with one heat conductor plate sandwiched between them, and further the HOT is placed on the soft side.
In the assembly of the two-layer type electronic cooling elements that are tightly formed by sandwiching between the heat conductors on the side of COL and the side of COL, the HO
Similar cooling performance can be obtained even if the temperature difference between the T side and the COLD side is doubled.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an assembly 1 of semi-finished electronic cooling elements according to the invention. In the figure, 2 is a heat-resistant polyimide sheet having a thickness of 20 microns as a basic material, 3 is a 25-micron layer of heat-resistant adhesive in which a 35-micron copper foil is attached to the polyimide sheet 2, 4 is a 0.5 mm gap between the copper strips 5 formed by etching so that the copper foil remains at a 2.5 mm width at 0.5 mm intervals, and 6 and 7 are the 2.5 mm width copper. Aligned in the same direction on the strip 5 and keeping an interval 8 of 0.5 mm from each other, 3 in the longitudinal direction of the copper strip 5.
A pair of 1-mm cubic semiconductor elements that produce a Peltier effect when a DC voltage deposited on the solder layer 10 is applied while maintaining a 9-mm interval 9 is shown.

[0018]

[Figure 2]

1 is a polyimide sheet in which a solder layer 12 is formed on the surface of a copper strip 11 by solder plating in the same state as before the semiconductor elements 6 and 7 are welded to the assembly 1 of semi-finished electronic cooling elements shown in FIG. 13 is shown.

[0019]

FIG. 3 is a processed polyimide sheet mainly composed of a heat-resistant polyimide sheet 2 in which only the assembly 1 of the semi-finished electronic cooling elements and the copper strip 11 are bonded by a heat-resistant adhesive layer 4; 13 and 13 so that the copper strips 5 and 11 face each other in parallel with the semiconductor elements 6 and 7 sandwiched therebetween, and the copper strips 5 and 11 are offset from each other by a half pitch, that is, 1.5 mm in this embodiment. Indicates.

As is clear from FIG. 3, if both are welded by solder, the semiconductor elements 6 and 7 of each pair are electrically connected in series through the copper strips 5 and 11 on both sides and simultaneously in parallel through the copper strips on one side. Connected to.

[0020]

FIG. 4 shows a cream solder on a surface 14 of the semiconductor element 6 or 7 of the assembly 1 of the semi-finished electronic cooling elements, which is to be in contact with the copper strip 11 of the processed polyimide sheet 13 having only the copper strip. 15 is applied to form a processed polyimide sheet 13 having only the assembly 1 of the semi-finished electronic cooling elements and the copper strip 11 attached thereto.

FIG. 3 is a combination of the state of FIG. 3 and the heat conductors 16 and C on the HOT side.
It is sandwiched between the heat conductors 17 on the OLD side and pressure-bonded using bolts 18 and nuts 19 to heat the heat conductors 15 on the side of the polyimide sheet 13 and weld the solder to form a flat heat transfer surface. An assembly 20 of electronic cooling elements is shown.

[0021]

FIG. 5 shows a semi-finished assembly 1 of electronic cooling elements having a diameter of 10
The copper strip 5 is wound around the millimeter copper tube 21 so that the copper strip 5 is perpendicular to the axis of the copper tube 21.
Apply the cream solder 15 to the outer surface of the copper strip 11
A processed polyimide sheet 13 with a chisel is formed so that the copper strip 11 is inside, and is perpendicular to the axis of the copper tube 21, and
The copper strip 5 of the assembly 1 of semi-finished electronic cooling elements is wound so as to be shifted by a half pitch, that is, 1.5 mm, and is inserted into the center of a copper tube 22 having an inner diameter of 13 mm and a wall thickness of 1 mm, and then the inner side. The copper tube 21 is expanded from the inside by applying pressure mechanically or through a fluid, and the inner surface of the assembly 1 of the semi-finished electronic cooling elements and the outer surface of the inner copper tube 21 of the semi-finished electronic cooling element Cream solder 1 for semiconductor elements 6 and 7 of assembly 1
The outer surface 14 coated with 5 and the inner surface of the copper strip 11 of the processed polyimide sheet 13 having only the copper strip 11 attached thereto, and the outer surface of the polyimide sheet 13 and the inner surface of the outer copper tube 22 are in close contact with each other. An assembly 23 of electronic cooling elements having a cylindrical heat transfer surface completed by heating the outer copper tube 22 and welding solder is shown.

[0022]

[Figure 6]

FIG. 3 shows a set of semi-finished electronic cooling element assemblies 1 and a processed polyimide sheet 13 on the outer side of the assembly 23 of electronic cooling elements having a cylindrical heat transfer surface.

A copper tube 24 having an inner diameter of 18 mm is wound in the same manner as described above, heated to about 400 ° C., and inserted into the center of the copper tube 24. The inner surface of the copper tube 24 is cooled by heat contraction. 2 shows an assembly 25 of electronic cooling elements having a two-layered cylindrical heat transfer surface, which is completed by welding solder while being crimped to. This is, of course, possible to manufacture an assembly of thermoelectric cooling elements having a multilayer cylindrical heat transfer surface of three or more layers, and an assembly of electronic cooling elements having a multilayer planar heat transfer surface. Means

[0023]

[Figure 7]

FIG. 5 shows a water pipe jacket 26 made of a copper pipe having an inner diameter of 20 mm attached to the outer side of the copper pipe 22 outside the assembly 20 of the electronic cooling elements having the cylindrical heat transfer surface shown in FIG. Both of the COLD side and the COLD side show an assembly 27 of electronic cooling elements having a heat conductor for a liquid to a liquid, which has a shape suitable for flowing a liquid as a heat medium.

[0024]

[Figure 8]

FIG. 5 is a fin made of aluminum having a thickness of 0.3 mm in which a copper ring 22 on the outer side of an assembly 20 of electronic cooling elements having a cylindrical heat transfer surface shown in FIG. Two
HOT with 8 fixed in 3 mm pitch
When either one of the heat mediums on the side and the COLD side is a liquid and the other is a gas, the liquid heat medium is brought into contact with the inside of the copper tube 20 and the gas heat medium is brought into contact with the outer fins 28. 3 shows an assembly 29 of electronic cooling elements having a liquid-to-gas heat conductor having a shape suitable for.

[0025]

According to the present invention,

[Figure 1]

As shown in FIG. 3, since a flexible polyimide sheet is used as a basic material and a semiconductor element for electronic cooling is attached to this to form an assembly of electronic cooling elements, the sheet is fitted to a large-sized standard polyimide sheet. In addition, it is possible to manufacture continuously and mass-produced industrially because it can be manufactured in an endless shape with a certain width or in a free size according to the size of one product suitable for use. It was

Since the flexible polyimide sheet used as the basic material is extremely thin, the thermal resistance from the electronic cooling semiconductor element to the heat conductor is small and the temperature difference between the HOT side and the COLD side of the assembly of electronic cooling elements is small. Can be reduced. Therefore, it became possible to practically increase the efficiency of the cooling effect for electric input.

[0027]

[Fig. 3] As shown in Fig. 3, an assembly of semi-finished electronic cooling elements and a polyimide seed with only copper strips are welded with solder by shifting the copper strips in parallel with each other and shifting them by a half pitch. Since the semiconductor elements for electronic cooling forming the assembly of are electrically connected in series by the copper strip and electrically in parallel along the copper strip, it is possible to prevent disconnection accidents of individual semiconductor elements. It was possible to prevent the whole or a large range of accidents resulting from it, and it was possible to improve the reliability of the entire assembly of electronic cooling elements by several hundred times.

[0028]

[Fig. 4] As shown in Fig. 4, the assembly of the electronic cooling elements is sandwiched and closely contacted with each other in the gap between the two thermal conductors, and heating and soldering are performed. It was extremely good, and the difference in surface temperature between the heat medium and the assembly of electronic cooling elements was reduced, and the efficiency of the cooling effect for electric input could be further improved.

[0029]

[Fig. 5] As shown in Fig. 5, the assembly of the electronic cooling elements is closely inserted into the gap between the thermal conductors of the double tubes having different concentric diameters and solder-bonded to each other. The adhesion of the assembly was good, and the difference in surface temperature between the heat medium and the assembly of the electronic cooling elements was small, and the efficiency of the cooling effect for electric input could be further improved.

[0030]

As shown in FIG. 6, a concentric heat conductor is further provided on the outer side of the double tube, and an assembly of electronic cooling elements is closely inserted and solder-bonded in this gap. C
Even if the temperature difference on the OLD side is large, the same cooling performance can be exhibited.

[0031]

As shown in FIG. 7, a water jacket of a copper tube is further concentrically attached to the outside of the double tube, so that it is very convenient to use the liquid heat medium with each other, and the surface temperature difference between the heat medium and the electronic cooling element assembly is different. Was smaller, and the efficiency of the cooling effect for electric input could be further improved.

[0032]

[Fig. 8] As shown in Fig. 8, since the fins are closely fixed to the outside of the double pipe, it is very convenient to use it so that the inside of the pipe comes into contact with the liquid and the fin comes into contact with the heat medium of gas to flow through. In addition, the difference in surface temperature between the heat medium and the assembly of the electronic cooling elements was reduced, and the efficiency of the cooling effect for electric input could be further improved.

As described above, the electronic cooling, which has been neglected in practical use up to now, is put into practical use to realize the cooling of CFCs.

[Brief description of drawings]

FIG. 1 is an assembly of semi-finished electronic cooling elements according to the present invention.

FIG. 2 is a processed resin sheet with only a copper strip according to the present invention.

FIG. 3 shows a state in which both are prepared in a normal positional relationship to form an assembly of electronic cooling elements.

FIG. 4 is an assembly of electronic cooling elements having a planar heat transfer surface according to the present invention.

FIG. 5 is an assembly of electronic cooling elements having a cylindrical heat transfer surface according to the present invention.

FIG. 6 is an assembly of electronic cooling elements having a two-layered cylindrical heat transfer surface according to the present invention.

FIG. 7 is an assembly of electronic cooling elements having a liquid-to-liquid heat conductor according to the present invention.

FIG. 8 is an assembly of electronic cooling elements having a heat conductor for gas to liquid according to the present invention.

[Explanation of symbols]

1. Assembly of semi-finished thermoelectric cooling elements 1. Heat resistant polyimide sheet 3. Heat-resistant adhesive layer 4. Copper strip spacing 5. Copper band 6. One of the paired semiconductors 7. 7. The other individual paired semiconductor Interval between paired semiconductor individuals 9. 10. Space between adjacent semiconductor pairs 10. Solder layer 11. Copper band 12. Solder layer 13. Processed polyimide sheet 14. 15. Surfaces of semiconductors to be bonded to be bonded 15. Cream solder 16. Heat conductor on the HOT side having a flat heat transfer surface 17. COLD-side heat conductor having a flat heat transfer surface 18. Bolt 19. Nut 20. 21. Assembly of electronic cooling elements having a flat heat transfer surface 21. Inner copper tube 22. Outer copper tube 23. Assembly of electronic cooling elements having cylindrical heat transfer surface 24. Copper tube on the outside of the assembly of electronic cooling elements having a two-layered cylindrical heat transfer surface 25. 26. Assembly of electronic cooling elements having a two-layer cylindrical heat transfer surface 26. Water jacket made of copper pipe 27. 27. Assembly of electronic cooling element having heat conductor for liquid to liquid 28. Fin 29. Assembly of electronic cooling elements with heat conductors for gas to liquid

Claims (2)

[Claims] 1. A thin copper plate having a certain width is attached in parallel to a thin plate made of a heat-resistant and flexible resin by using a heat-resistant adhesive while keeping an interval narrower than the certain width. Formed by etching, and along the length of the copper strip, a pair of semiconductors that produce a Peltier effect when a DC voltage is applied are arranged in the same direction with a certain interval and welded by soldering or the like. Bonded or etched the same copper strips as above so that the copper strips face each other, and contacted the semiconductor strips so that the copper strips faced each other across the semiconductor and were offset by a half pitch and were parallel. An assembly of electronic cooling elements characterized in that they are arranged in a state, sandwiched by heat conductors from both sides and crimped together, and the semiconductor and copper strips are similarly welded together with solder or the like. 2. The assembly of electronic cooling elements according to claim 1, wherein a plate of a heat conductor is sandwiched between a plurality of assemblies of said electronic cooling elements and assembled as a plurality of layers.