JPH07131173A - Electronic equipment - Google Patents

Abstract

PURPOSE:To contrive to prevent cooling air in guide grooves from leaking by a method wherein the first and second lips of sealing rubbers provided in the guide grooves in guide blocks are compressed and deformed by the first and second sliding surfaces and projected parts of sealing caps capped on both end parts of electronic circuit modules and are brought into contact closely to the first and second sliding surfaces. CONSTITUTION:Sealing rubber 30 is provided around the inner wall of a guide groove 23 and has first slips 31 made to project in the inside direction of the groove 23 and second slips 32, which cover the inner surface of an insertion hole 22 in the groove 23 coupling with the slips 31 and are made to project in the inner peripheral direction of the hole 22. When electronic circuit modules 1 are housed in the interior of a chassis 10, first sliding surfaces 34 of sealing caps 33, which are capped on both end parts 26 of the modules 1, compress and deform the tops of the lips 31 of the rubbers 30 provided in the grooves 23 in guide blocks 21 and come into contact closely to the lips 31, whereby gaps, which are generated in the inner peripheral parts of the grooves 23 and are formed between the grooves 23 and the end parts 26 of the modules 1, are eliminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device for indirectly cooling electronic circuit parts mounted on a large number of printed circuit boards housed in a chassis.

[0002]

2. Description of the Related Art As a cooling method for electronic circuit components, the most popular method has been a direct cooling system in which cooling air is blown directly onto electronic circuit components. However, in recent years, the heat generation density has significantly increased due to the improvement in the degree of integration of electronic circuit parts and the improvement in the mounting density, and the direct cooling method has become insufficient. On the other hand, as the functions in the field of electronic devices have become more decentralized, there is a growing desire to install the electronic devices themselves in places with relatively poor environmental conditions. That is, the electronic device is not always installed in a room where temperature, humidity, dust, etc. are controlled unlike the conventional case. In such a case, the direct cooling method in which the cooling air is directly blown to the electronic circuit component is not preferable in terms of reliability of the electronic device. This is because dust, dust, water, etc. floating in the cooling air may adhere to the electronic circuit parts, and the adhered parts may corrode or cause dielectric breakdown.

As described above, when the reliability required for electronic equipment is high, the heat generation density of electronic circuit parts is high, and the environmental conditions of the place where the electronic equipment is installed are severe, the above-mentioned dust and dust are generated. In order to prevent the decrease in reliability due to moisture, etc., and to cope with the increase in heat generation density, an electronic circuit module equipped with an indirect cooling type electronic circuit module with excellent heat dissipation effect that does not blow cooling air directly to electronic circuit parts A lot of equipment is adopted.

First, a conventional electronic device of this type will be described. 19 is an external view showing a conventional electronic device, FIG. 20 is a view showing a cross section AA in FIG. 19, FIG. 21 is a partial detailed view of a guide portion in FIG. 20, and FIG. 22 is a view showing a cross section BB in FIG. 23 is a partial cross-sectional view of the guide portion in FIG. In the figure, reference numeral 1 denotes an electronic circuit module which is generally called a heat desiccator module and which is of an indirect cooling system and has an excellent heat dissipation effect. The connector 9 and a metal thin film having good thermal conductivity such as an aluminum alloy are corrugated. Spacers 3 are provided on the upper and lower ends of the formed cooling fins 2, and a skin 4 made of a rectangular metal thin plate such as an aluminum alloy having good heat conductivity is joined to both surfaces of the cooling fins 2 and the spacers 3 by brazing or bonding. Ventilation duct 5
And a printed circuit board 8 on which electronic circuit components 7 (for example, IC or LSI) provided on both surfaces of the heat exchanger 6 are mounted. 10
Is a box-shaped chassis for accommodating the electronic circuit module 1, and has an opening 11 for attaching and detaching the electronic circuit module 1 on the upper surface, and cooling air 12 is taken into the chassis 10 on the rear surface. A supply port 13 is provided for Reference numeral 14 designates the supply port 13 to the chassis 10
A box-shaped first air plenum 15 is provided so as to cover the inside of the chassis, and a box-shaped second air plenum 15 is provided inside the chassis 10 so as to form a right angle with the first air plenum 14.
The air plenum forms the first air plenum 14 and the air flow path 16. Reference numeral 17 denotes a box-shaped third air plenum provided inside the chassis 10 so as to face the second air plenum 15. Further, on the surfaces of the second air plenum 15 and the third air plenum 17 which are opposed to each other, opposed vent holes 18 are provided. Reference numeral 19 is a motherboard having a connector seat 20, and the first air plenum 14 and the second air plenum 15 are provided under the chassis 10.
The third air plenum 17 and the third air plenum 17 are fixed at right angles by screws or the like. Reference numeral 21 denotes the second air plenum 15 and the third air plenum 15 so as to cover the ventilation port 18.
With a guide block glued to the air plenum 17 of
A guide groove 23 is formed in the same direction as the insertion direction of the electronic circuit module 1 so as to form a right angle with the opening 11 of the chassis 10 and has an upper portion as an insertion opening 22, and from the ventilation opening 18 in the center. A first air intake 24 for taking in the cooling air 12 is provided. Reference numeral 25 is a cover for covering the opening 11 of the chassis 10, which is fixed to the chassis 10 by screws or the like in the peripheral portion.

Here, in the electronic circuit module 1, both end portions 26 of the electronic circuit module 1 have the second air plenum 1 of the chassis 10.
5 and the guide block 23 provided in the third air plenum 17 is inserted into the chassis 10 along the guide groove 23, and the connector seat 2 on the motherboard 19 is inserted.
0 and the connector 9 of the electronic circuit module 1 are engaged with each other. Further, by removing the cover 12, the cover 12 can be attached and detached upward (direction C in FIG. 19). In addition, the cooling air 12 supplied to the chassis 10
Is supplied from the airframe through the external duct 27 from the supply port 13, flows through the air flow path 16 formed by the first air plenum 14 and the second air plenum 15, and then the second air plenum. From the ventilation port 18 provided in 15 through the first air intake port 24 of the guide block 21,
It is guided to the ventilation duct 5 of the electronic circuit module 1. At this time, heat generated from the electronic circuit component 7 of the electronic circuit module 1 is transferred to the skin 4 via the printed board 8.
After being conducted to the cooling fin 2, the heat is radiated to the cooling air 12 flowing in the ventilation duct 5. The heated cooling air 12 is supplied to the third air plenum 15
First air intake 2 of the guide block 21 provided in the
4. The air passes through the ventilation port 18, and finally is exhausted to the outside of the electronic device from the exhaust port 28 provided in the chassis 10. Therefore, the electronic circuit component 7 can be cooled without directly blowing the cooling air to the electronic circuit component 7, and the cooling fins 2 are provided in the ventilation duct 5, so that the cooling is performed. The heat dissipation area by the air 12 is significantly increased, and the electronic circuit module 1
The heat dissipation effect of is improved.

[0006]

However, the above-mentioned conventional electronic equipment has the following problems. When the electronic circuit module 1 is detached from the chassis 10, the end portion 26 of the electronic circuit module 1 needs to slide in the guide groove 23 provided in the guide block 21 inside the chassis 10. Therefore, a mechanical gap must be provided between the guide groove 23 and the end portion 26 of the electronic circuit module 1. However, when a gap is provided between the guide groove 23 and the end portion 26 of the electronic circuit module 1 and the electronic circuit module 1 is housed inside the chassis 10, the first air intake port 24 of the guide block 21. Therefore, the cooling air 12 flowing into the ventilation duct 5 of the electronic circuit module 1 leaks into the chassis 10 through this gap, and the flow rate of the cooling air 12 supplied into the ventilation duct 5 decreases. As a result, there is a problem that the cooling efficiency of the electronic circuit module 1 is reduced. Further, when the electronic device is installed under severe environmental conditions, if the cooling air 12 leaks into the chassis 10, the cooling air is blown directly to the electronic circuit component 7 and floats in the cooling air 12. Dust, dust, moisture, etc., which have been accumulated, may adhere to the electronic circuit component 7, and the adhered portion may corrode or cause dielectric breakdown. Further, there is a problem that mechanical damage occurs in the end portion 26 of the electronic circuit module 1 and the guide groove 23 due to rattling in the gap portion caused by repeated attachment and detachment of the electronic circuit module 1 and vibration. there were.

On the other hand, conventionally, as an example for solving the problem of this kind of electronic equipment, there is a method of providing a packing 29 made of a rubber material on the inner surface of the guide groove 23. The packing 2 will be described below for convenience of description.
Only the items related to 9 will be described, and other configurations will be omitted. 24 is a partial detailed view showing a conventional electronic device using a packing, and FIG. 25 is a detailed view of a guide block in FIG. In the figure, reference numeral 29 is a packing made of a rubber material and provided around the inner wall of the guide groove 23 provided in the guide block 21. In the electronic device configured as described above, when the electronic circuit module 1 is housed inside the chassis 10, the packing 29
By compressing and deforming the end portion 26 of the electronic circuit module 1 and bringing them into close contact with each other, the gap generated between the end portion 26 of the electronic circuit module 1 and the guide groove 23 is eliminated, and the chassis of the cooling air 12 is removed. It is possible to prevent leakage inside 10. Further, mechanical damage to the end portion 26 of the electronic circuit module 1 and the guide groove 23 caused by repeated attachment / detachment of the electronic circuit module 1 and vibration does not occur due to the packing 29 functioning as a cushioning material. .

However, in the electronic device constructed as described above, the inner peripheral portion of the guide groove 23 is compressed and deformed by the end portion 26 of the electronic circuit module 1 so that the packing 29 is brought into close contact with the cooling air. Although the leakage of 12 is prevented, the insertion opening 22 provided above the guide groove 23
As for the parts, since the attaching / detaching direction of the electronic circuit module 1 is the C direction shown in FIG. 19, the packing 29 has the end portion 26 of the electronic circuit module 1 and the guide groove 23 in the packing 29.
It is not possible to eliminate the gap generated between the cooling air 12 and the cooling air 12 leaking into the chassis 10 through the gap generated in the insertion port 22. Further, the leakage of the cooling air 12 from the gap generated in the insertion port 22 is small, and in the conventional electronic device, this small amount of leakage occurs due to the heat generation density of the electronic circuit components and the environmental conditions of the place where the electronic device is installed. The leakage of cooling air was negligible. However, due to the recent increase in the degree of integration of electronic circuit components and the increase in packaging density,
This small amount of cooling air leakage cannot be ignored in order to cope with the installation under severe environmental conditions due to the decentralization of the functions of electronic devices.

When the packing 29 is provided on the entire inner surface of the guide groove 23 as shown in FIG. 26, the gap between the end portion 26 of the electronic circuit module 1 and the guide groove 23 is omnidirectional. Therefore, the cooling air 12 can be prevented from leaking into the chassis 10. However, since the contact area between the end portion 26 of the electronic circuit module 1 and the packing 29 increases, more force for compressing and deforming the packing 29 is required. As a result, the attachment / detachment force of the electronic circuit module 1 to / from the chassis 10 is increased, which not only lowers the maintainability of the electronic device, but may occur even when a dedicated tool for attaching / detaching the electronic circuit module is required. .

The present invention has been made to solve the above problems, and prevents leakage of cooling air inside the chassis and reduces the attachment / detachment force of the electronic circuit module, thereby improving reliability, maintainability, and The purpose is to obtain an electronic device having an excellent heat dissipation effect.

[0011]

In a first embodiment of an electronic apparatus according to the present invention, a guide block used for guiding when inserting an electronic circuit module is provided with an inner circumference of an inner wall of the guide groove. A first lip that is provided and projects inward of the guide groove, and a first lip that is connected to the first lip and covers the inner surface of the insertion opening of the guide groove, and that projects in the inner circumferential direction of the insertion opening. A seal rubber made of a rubber-based material having two lips is arranged, and further, the first lip has a first sliding surface in close contact with the apex so that the apex of the first lip is compressed and deformed, and the apex of the second lip is A second air intake port is provided at the center of the second slide surface that comes into close contact so as to be compressed and deformed, and of the slopes forming the second lip, the slope on the electronic circuit module insertion direction side is compressed. To transform The box-like sealing cap having projections in contact, is obtained by capped at both ends of the electronic circuit module.

Further, in the second embodiment of the electronic device according to the present invention, the first lip of the seal rubber of the electronic device, which has been subjected to the means in the first embodiment, is inserted into the electronic circuit module. It is provided so as to form a taper portion along the direction, and further, the first sliding surface of the seal cap is formed so as to fit the taper portion of the first lip.

Further, in a third embodiment of the electronic device according to the present invention, the seal cap of the electronic device provided with the means in the first embodiment or the second embodiment is made of a material having a low friction coefficient. (For example, polytetrafluoroethylene).

Further, in a fourth embodiment of the electronic device according to the present invention, the seal cap of the electronic device provided with the means in any one of the first to third embodiments has a low heat resistance. Treatment with a low friction coefficient on the surfaces of the first and second slide surfaces and the projections while molding with an expansive material (for example, impregnating the microscopic holes of the hard anodized film with polytetrafluoroethylene). It is applied.

Further, in a fifth embodiment of the electronic device according to the present invention, the seal cap of the electronic device, which is provided with the means in the first embodiment or the second embodiment, is made of a conductive material. And the above-mentioned seal rubber is molded with an EMI shield material.

Further, in a sixth embodiment of the electronic apparatus according to the present invention, the guide block of the electronic apparatus is provided with the means in any of the first to fifth embodiments. A plurality of first joint holes are formed to penetrate the inner and outer walls of the guide groove, and a plurality of second joint holes are formed on the upper surface of the surface having the first air intake forming the insertion opening of the guide groove. And a first protection portion which is provided to the seal rubber, is connected to the first lip, is filled in the first joint hole of the guide block, and is arranged so as to wrap the inner and outer walls of the guide groove, A second protection part which is connected to the first protection part and the second lip, is filled in the second joint hole of the guide block, and is arranged so as to further wrap around the insertion opening edge part of the guide groove. Also provided It is.

In a seventh embodiment of the electronic device according to the present invention, the guide block of the electronic device is provided with the means of any one of the first to sixth embodiments. A mounting portion is provided on the outer periphery, and further, a seal groove is provided on a surface of the guide block that is in contact with the second and third air plenums so as to surround the outer periphery of the first air intake port, And a gas seal having a pleated protrusion made of a rubber material is arranged in the seal groove,
The mounting portion is mounted on the second and third air plenums with mounting screws.

Further, in the eighth embodiment of the electronic equipment according to the present invention, the electronic circuit module of the electronic equipment is formed by applying the means in any one of the first embodiment to the seventh embodiment. The heat exchanger is made of a damping alloy material.

[0019]

In the first embodiment of the electronic device according to the present invention, when the electronic circuit module is housed inside the chassis, the first and second lips of the seal rubber provided in the guide groove of the guide block are The seal caps attached to both ends of the electronic circuit module are compressed and deformed to come into close contact with the first and second slide surfaces and the protrusions, so that the cooling air in the guide groove can be prevented from leaking into the chassis. In addition, when the electronic circuit module is attached to or detached from the chassis, the contact area between the seal rubber and the seal cap, that is, the area where the seal rubber is subjected to compressive deformation is very small, so the attachment / detachment force of the electronic circuit module can be reduced. Further, the mechanical damage generated in the end portion of the electronic circuit module and the guide groove is eliminated by the seal rubber functioning as a cushioning material.

Further, in the second embodiment of the electronic apparatus according to the present invention, the structure of the first embodiment is further improved. That is, the first of the seal rubber
By forming the lip and the first sliding surface of the seal cap into a taper part that narrows along the insertion direction of the electronic circuit module, the force of compressing and deforming the seal rubber is applied at the initial stage of insertion of the electronic circuit module and at the latter stage of withdrawal. It can be eliminated, and the attaching / detaching force of the electronic circuit module can be further reduced.

In addition, in the third embodiment of the electronic apparatus according to the present invention, the configuration of the first embodiment or the second embodiment is further improved. That is, by molding the seal cap with a low friction coefficient material (for example, polytetrafluoroethylene), the friction resistance at the contact surface between the seal rubber and the seal cap can be reduced, and the attachment / detachment force of the electronic circuit module is further reduced. it can.

Further, in the fourth embodiment of the electronic apparatus according to the present invention, the structure of any one of the first to third embodiments is further improved. That is, the seal cap is formed of a low thermal expansion material, and the first and second slide surfaces of the seal cap and the surfaces of the protrusions have a low friction coefficient (for example, microscopic treatment of a hard anodized film). By impregnating the holes and the like with polytetrafluoroethylene), the frictional resistance at the contact surface between the seal rubber and the seal cap can be reduced, and the attachment / detachment force of the electronic circuit module can be further reduced. Further, in repairing or replacing the electronic circuit component mounted on the electronic circuit module, high temperature environment such as adhesive environment temperature (120 ° C to 150 ° C) and soldering environment temperature (200 ° C to 230 ° C) of the electronic circuit component On the other hand, thermal deformation of the seal cap can be prevented.

Further, in the fifth embodiment of the electronic apparatus according to the present invention, the structure of the first embodiment or the second embodiment is further improved. That is, by forming the seal cap with a conductive material and the seal rubber with an EMI shield material, electrical continuity is obtained at the contact portion between the seal cap and the seal rubber, and an electromagnetic gap is generated. It is possible to prevent the penetration and radiation of electromagnetic energy.

Further, in the sixth embodiment of the electronic apparatus according to the present invention, the structure in any one of the first to fifth embodiments is further improved. That is, the first and second protective portions that fill the plurality of first and second joint holes provided in the guide groove portion of the guide block and cover the inner and outer walls of the guide groove portion and the insertion edge portion are used as seal rubber. By providing the seal rubber, it is possible to prevent the peeling of the seal rubber from the guide groove portion, which occurs when the electronic circuit module is repeatedly attached and detached.

Further, in a seventh embodiment of the electronic apparatus according to the present invention, the structure of any one of the first embodiment to the sixth embodiment is further improved. That is, by providing a gas seal on the surface of the guide block that is in contact with the second and third air plenums, and further by providing a mounting portion on the outer periphery of the guide block, the guide block can be attached and detached with a mounting screw, and the seal rubber The guide block can be easily replaced due to damage or the like. Further, since the guide block can be easily replaced, a guide block in which the opening size of the first air intake provided in the guide block is changed according to the amount of heat generation of the electronic circuit module is used. By doing so, the flow rate of the cooling air supplied to the electronic circuit module can be adjusted.

Further, in the eighth embodiment of the electronic apparatus according to the present invention, the structure of any one of the first embodiment to the seventh embodiment is further improved. That is, by molding the heat exchanger of the electronic circuit module with a damping alloy material having a large internal friction such as aluminum-zinc alloy, the response magnification at the resonance frequency of the electronic circuit module is reduced, It is possible to reduce the vibration stress applied to the electronic circuit component mounted on.

[0027]

EXAMPLES Example 1. 1 to 7 show a first embodiment of an electronic device according to the present invention, and FIG. 1 is an external view,
2 is a view showing a cross section DD in FIG. 1, FIG. 3 is a partial detailed view of a guide portion in FIG. 2, and FIG. 4 is a cross section E in FIG.
FIG. 5 is a view showing E, FIG. 5 is a partial sectional view of the guide portion in FIG. 4, FIG. 6 is a detailed view of the guide block, and FIG. 7 is a detailed view of the seal cap.
Is the same as a conventional electronic device. Reference numeral 30 denotes a seal rubber made of a rubber material disposed inside the guide groove 23 of the guide block 21. The seal rubber 30 is provided around the inner wall of the guide groove 23 and the first lip 31 protruding inward of the guide groove 23. A second lip 32 is provided which is connected to the first lip 31 and covers the inner surface of the insertion opening 22 of the guide groove 23 and which projects in the inner circumferential direction of the insertion opening 22. Reference numeral 33 denotes a box-shaped seal cap that is attached to both ends 26 of the electronic circuit module 1, and has a first sliding surface 34 that is in close contact with the apex of the first lip 31 of the seal rubber 30 so as to be compressed and deformed. Of the slopes forming the second lip 32 and the second slide surface 35 in close contact with each other so that the apex of the second lip 32 is compressed and deformed, on the insertion direction side of the electronic circuit module 1. The slanted surface has a protrusion 37 that comes into close contact with it so as to be compressed and deformed. Further, the first slide block 35 has a first portion of the guide block 21 at the center thereof.
A second air intake 37 for taking in the cooling air 12 from the air intake 24 of the above is provided.

In the electronic device constructed as described above, when the electronic circuit module 1 is housed in the chassis 10, the first ends of the seal caps 33 attached to both ends 26 of the electronic circuit module 1 are provided. Sliding surface 34
However, by compressing and deforming the apex of the first lip 31 of the seal rubber 30 provided in the guide groove 23 of the guide block 21 and bringing them into close contact, the electronic circuit module generated in the inner peripheral portion of the guide groove 23. The gap with the end 26 of No. 1 is eliminated. Further, the second sliding surface 35 of the seal cap 33 is placed on the apex of the second lip 32 of the seal rubber 30, and the protruding portion 3 of the seal cap 33.
Of the slopes forming the second lip 32 of the seal rubber 30, 6 compressively deforms and closely contacts the slope on the insertion side of the electronic circuit module 1.
The gap with the end portion 26 of the electronic circuit module 1 generated at the insertion port 22 of No. 3 is eliminated. Therefore, the gap between the end portion 26 of the electronic circuit module 1 and the guide groove is not in all directions, and the cooling air 12 supplied from the first air intake port 24 of the guide block 21.
Is the second slide surface 3 of the seal cap 33 without leaking into the chassis 10 at the guide groove 23.
The air flows through the second air intake 37 provided in the electronic circuit module 1 to the ventilation duct 5 of the electronic circuit module 1.

When the electronic circuit module 1 is attached to or detached from the chassis 10, the seal cap 33 is used.
The first sliding surface 34, the second sliding surface 35, and the portion where the protruding portion 36 contacts the seal rubber 30 are
Since the tops of the first lip 31 and the second lip 32 and the sloping surface of the second lip 32 are in contact with each other, their contact areas are very small. That is, the area where the seal rubber 30 is subjected to compressive deformation by the seal cap 33 is very small, and the attaching / detaching force of the electronic circuit module 1 is reduced, so that the electronic circuit module 1 can be easily attached / detached to / from the chassis 10. Further, since the seal rubber 30 is made of a rubber material, the first lip 31 of the seal rubber 30 has a function as a cushioning material, and the electronic circuit module 1 is repeatedly attached and detached and vibrated. The mechanical damage due to rattling in the gap between the end portion 26 of the electronic circuit module 1 and the guide groove, which is caused by the above, does not occur.

Example 2. 8 and 9 are partial detailed views showing a second embodiment which is a further improvement of the first embodiment, FIG. 8 is a detailed view of a guide block, FIG. 9 is a detailed view of a seal cap, and the guide block 21 is shown. The first lip 3 of the seal rubber 30 provided around the inner wall of the guide groove 23 of
1 is formed so as to form a tapered portion 38 that narrows along the insertion direction of the electronic circuit module 1, and further the first sliding surface of the seal cap 33 attached to both end portions 26 of the electronic circuit module 1. 34 is formed so as to fit the tapered portion 38. According to such an embodiment, when the electronic circuit module 1 is attached to and detached from the chassis 10, the first slide surface 34 of the seal cap 33 and The apex of the first lip 31 of the seal rubber 30 does not come into contact with the taper portion 38, and as a result, the first end of the seal cap 33 is removed.
The sliding surface 34 does not generate a force for compressively deforming the apex of the first lip 31 of the seal rubber 30. Therefore, the attaching / detaching force of the electronic circuit module 1 is further reduced, and the electronic circuit module 1 can be easily attached / detached to / from the chassis 10.

Example 3. This embodiment shows a third embodiment which is a further improvement of the first embodiment or the second embodiment, and includes the seal caps 33 attached to both ends 26 of the electronic circuit module 1. It is molded with a low friction coefficient material. Here, when the electronic circuit module 1 is attached to or detached from the chassis 10, sliding friction occurs on the contact surface between the seal cap 33 and the seal rubber 30. The frictional resistance generated on this contact surface is the same when the forces pressing against each other on the contact surface (forces that compressively deform the first and second lips of the seal rubber)
It is only related to the material of the contacting object and the state of the contact surface, not to the size of the contact surface, and is proportional to the friction coefficient at the contact surface. Therefore, if the seal cap 33 is formed of a low friction coefficient material as shown in FIG. 10, particularly polytetrafluoroethylene (generally Teflon), the seal cap 33 and the seal rubber 30 are formed.
The frictional resistance on the contact surface of the electronic circuit module 1 can be reduced, the attaching / detaching force of the electronic circuit module 1 can be further reduced, and the electronic circuit module 1 can be easily attached / detached to / from the chassis 10.

Example 4. This example shows a fourth example in which any one of the examples 1 to 3 is further improved, and is attached to both end portions 26 of the electronic circuit module 1. , The seal cap 33
Is formed of a low thermal expansion material, and the surfaces of the first slide surface 34, the second slide surface 35, and the protrusions 36, which are the contact surfaces of the seal rubber 30 of the seal cap 33, have a low friction coefficient. It has been subjected to such processing. According to such an embodiment, the first slide surface 34, the second slide surface 35 and the protrusion 36 of the seal cap 33 are impregnated with polytetrafluoroethylene in the microscopic holes of the hard anodic oxide film. Alternatively, the surface of the seal cap 33 and the seal rubber 30 are treated so that the surface thereof has a low friction coefficient, such as electrolytic deposition of molybdenum disulfide.
The frictional resistance on the contact surface of the electronic circuit module 1 can be reduced, the attaching / detaching force of the electronic circuit module 1 can be further reduced, and the electronic circuit module 1 can be easily attached / detached to / from the chassis 10.

When the electronic circuit component 7 mounted on the electronic circuit module 1 is repaired or replaced, the seal cap 33 is attached to the electronic circuit component 7 at a bonding environment temperature (120 ° C. to 150 ° C.) and a banding environment. Temperature (2
Exposure to 00 ° C to 230 ° C). However, when the seal cap 33 is exposed to such a high temperature environment, thermal deformation occurs due to temperature change, and the size and shape of the seal cap 33 is impaired. For example, when the seal cap 33 is made of polyamide (generally nylon), its linear expansion coefficient is 8.3 × 10 ⁻⁵ / ° C.
Thermal deformation occurs at 6 ° C to 79 ° C. Further, in order to reduce the attachment / detachment force of the electronic circuit module 1, the contact area between the seal cap 33 and the seal rubber 30 is made extremely small, and due to the thermal deformation of the seal cap 33 due to this temperature change, Seal rubber 3 above
There is a possibility that a gap may occur in the contact portion with 0, and when the electronic circuit component 7 is repaired or replaced, the seal cap 33 is removed from the electronic circuit module 1 or
Or it needs to be replaced after the repair is completed. Therefore, seal the cap 33 with an invar (0.1 × 10 ⁻⁵ / ° C.)
By molding with a low thermal expansion material such as or super Invar (0.001 × 10 ⁻⁵ / ° C.), even if the seal cap 33 is exposed to a high temperature environment at the time of repair or replacement of the electronic circuit component 7. There is no thermal deformation, and there is no need to attach or detach or replace the seal cap 33 from the electronic circuit module 1 when repairing or replacing the electronic circuit component 7.

Example 5. This embodiment shows a fifth embodiment which is a further improvement of the first embodiment or the second embodiment, and includes the seal caps 33 attached to both end portions 26 of the electronic circuit module 1. The seal rubber 30 is formed of a conductive material, and the seal rubber 30 provided in the guide groove 23 of the guide block 21 is formed of an EMI shield material. Here, when the contact portion between the seal cap 33 and the seal rubber 30 is an electrically discontinuous portion (non-conductive portion) when the electronic circuit module 1 is housed inside the case 10, this contact portion In this case, an electromagnetic gap and a penetrating portion are formed inside and outside the chassis 10, and intrusion and radiation of electromagnetic energy is generated from the electromagnetic gap and the penetrating portion. Therefore, by forming the seal cap 33 with a conductive material such as a conductive plastic and forming the seal rubber 30 with an EMI shield material such as a conductive gasket, the seal cap 33 is formed.
And electrical continuity at the contact portion between the seal rubber 30 and
The hermeticity can be secured. Therefore, there is no electromagnetic gap or penetrating portion at this contact portion, so that it is possible to prevent intrusion or radiation of electromagnetic energy from inside or outside the chassis 10.

Example 6. 11 and 12 show the first embodiment described above.
~ Fig. 11 shows a sixth embodiment which is a further improvement of any one of the above-mentioned fifth embodiment, Fig. 11 is a detailed view of the guide portion in Fig. 2, and Fig. 12 is a detailed sectional view of the guide portion in Fig. 4. There is a guide groove 23 in the guide block 21.
A plurality of first joint holes 39 penetrating the inner and outer walls of the first groove and a plurality of second joint holes 39 provided on the upper surface of the guide groove 23 having the first air intake port 24 forming the insertion port 22. The joint hole 40 of FIG. The seal rubber 30 is connected to the first lip 31, is filled in the first joint hole 39 of the guide block 21, and is arranged so as to wrap the inner and outer walls of the guide groove 23. Of the first protection portion 41 and the second lip 32, and is filled in the second joint hole 40 of the guide block 21, and further the insertion port 22 of the guide groove 23. The second protective portion 42 is provided so as to wrap around the edge portion.

Here, when the electronic circuit module 1 is attached to or detached from the chassis 10, the force for peeling the seal rubber 30 from the guide groove 23 of the guide block 21 is as shown in FIG. The seal rubber 30 acts directly on the mounting end of the guide groove 23 and the seal rubber 30 such as the edge of the insertion port 22 inside the guide groove 23, and depending on the repeated attachment / detachment of the electronic circuit module 1, the seal rubber 30 may peel off. Therefore, according to the embodiment as shown in the present embodiment, the force for directly peeling off the seal rubber 30 and the seal rubber 30 acting directly on the mounting end of the guide groove 23 is provided to the seal rubber 30. With the above-mentioned first protection portion 41 and the above-mentioned second protection portion 42,
Since the guide groove 23 and the mounting end of the seal rubber 30 are removed from the inside of the guide groove 23, the mounting end of the seal rubber 30 does not act directly, and the electronic circuit module 1 is attached and detached. It is possible to reduce the influence of the force of peeling the seal rubber 30 from the guide groove 23. Further, the first protective portion 41 and the second protective portion 42 of the seal rubber 30 are
Is provided so as to enclose the inner and outer walls of the guide groove 23 portion of the guide block 21 and the edge portion of the insertion opening 22, so that the adhesive area between the seal rubber 30 and the guide groove 23 portion increases. In addition, the plurality of first joint holes 39 and second joint holes 40 provided in the guide groove 23 are also filled, and the first protective portion 41 and the second joint hole 39 are also filled. Since the inside and outside of the protection part 42 are connected, the strength is improved against the force of peeling the seal rubber 30 from the guide groove 23 due to the attachment and detachment of the electronic circuit module 1. Therefore, the seal rubber 3 is generated by repeatedly attaching and detaching the electronic circuit module 1 to and from the chassis 10.
It is possible to prevent the peeling of 0 from the guide groove 23.

Example 7. FIGS. 14, 15 and 16 show a seventh embodiment which is a further improvement of any one of the first to the sixth embodiments, and FIG. 14 is a detailed view of the guide portion in FIG. 15 is a detailed view of the guide block viewed from the F direction in FIG. 4, and FIG. 16 is a mounting state view of the guide block viewed from the G direction in FIG.
3 is a seal groove provided on the surface of the guide block 21 in contact with the second air plenum 15 and the third air plenum 17 so as to surround the outer periphery of the first air intake 24, and 44 is the seal. Gas seal made of rubber material having pleated protrusions 45 arranged in the groove 43, 4
6 is a mounting portion provided on the outer circumference of the guide block 21, and 47 is a mounting screw for mounting the guide block 21 to the second air plenum 15 and the third air plenum 17 at the mounting portion 46. .

Here, the cooling air 12 for cooling the electronic circuit component 7 mounted on the electronic circuit module 1 is
The air is supplied from the ventilation port 18 inside the chassis 10 to the ventilation duct 5 of the electronic circuit module 1 through the first air intake port 24 of the guide block 21.
However, when the opening sizes of the first air intake ports 24 provided in the guide block 21 are the same, the electronic circuit module 1 is irrelevant regardless of the heat generation amount of the electronic circuit module 1. Depending on the storage position inside the chassis 10 and the shape and state of the air flow path 16, the cooling air 12 corresponding to the heat generation amount of each electronic circuit module 1 may not be supplied. Also, the chassis 1 of the electronic circuit module 1
At the time of attachment / detachment to / from the inside, the first lip 3 of the seal rubber 30 by the seal cap 33 at the contact portion between the seal cap 33 and the seal rubber 30.
Since a force for compressing and deforming the apexes of the first lip 2 and the second lip 32 is generated, the seal rubber 30 may be added depending on the repeated attachment and detachment of the electronic circuit module 1.
The first lip 31 and the second lip 32 may be damaged.

However, the seal rubber 30 is bonded to the guide groove 23 of the guide block 21, and the guide block 21 is further attached to the chassis 10.
When the first lip 31 and the second lip 32 of the seal rubber 30 are damaged, they are repaired because they are adhered to the second air plenum 15 and the third air plenum 17 of Replacement is very difficult and in the worst case it may even be necessary to replace the entire chassis 10. Therefore, according to the embodiment as shown in this embodiment, the guide block 21 has the mounting portion 4
6, the mounting screw 47 can be attached to and detached from the second air plenum 15 and the third air plenum 17, and the guide block 21 has a gas seal 44 in its seal groove 43. The leakage of the cooling air 12 into the chassis 10 when the guide block 21 is attached is caused by the pleated projections 45 of the gas seal 44 coming into close contact with the second air plenum 15 and the third air plenum 17. To prevent. As a result, even when the first lip 31 and the second lip 32 of the seal rubber 30 are damaged, only the guide block 21 having the damaged seal rubber 30 needs to be replaced, and the replacement work is easy. it can. Furthermore, by mounting the guide blocks 21 corresponding to the heat generation amounts of the individual electronic circuit modules 1 and having different opening sizes of the first air intake port 24, the individual electronic circuit modules 1
It is possible to adjust the supply of the cooling air 12 corresponding to the calorific value of.

Example 8. This example shows an eighth example in which any one of the examples 1 to 7 is further improved, and a cooling fin forming the heat exchanger 6 of the electronic circuit module 1. 2, the spacer 3 and the skin 4 are molded from a damping alloy material having a large internal friction such as an aluminum-zinc alloy. Here, FIG. 17 shows the electronic device shown in the above-described first embodiment, in which the electronic circuit component 7 in which the strength of the electronic circuit module 1 is weak.
It is data of response magnification and phase at each frequency of the electronic circuit module 1 when vibrating in a direction perpendicular to the mounting surface (X-axis direction shown in FIG. 18). As shown in this data, the resonance frequency of the electronic circuit module 1 is 160 Hz,
The response magnification at that time is 8.6. The chassis 10
The vibration level transmitted from the electronic circuit module 1 to the electronic circuit module 1 serves as an isolator because the seal rubber 30 is molded from a rubber material, and is somewhat attenuated. If there is no rubber-based material such as a seal rubber, a vibration level of 20 times is normally applied to the electronic circuit module 1, and the electronic circuit component 7 mounted on the electronic circuit module 1 has this vibration level. It is necessary to withstand the vibration level. This narrows the marketability of the electronic circuit component 7 and raises the cost. Further, depending on the mounting state of the electronic circuit component 7, the vibration stress may cause lead breakage or cracks in the soldered portion. Here, the response magnification at the resonance frequency of the electronic circuit module 1 can be obtained by the following equation (1).

[0041]

[Equation 1]

Here, A = response magnification ω = input angular frequency (rad / s) ωn = angular frequency of electronic circuit module (rad / s) ζ = damping ratio

At resonance of the electronic circuit module,
Since ω and ωn are equal

[0044]

[Equation 2]

The damping ratio ζ is obtained by the following equation (3).

[0046]

[Equation 3]

Here, δ is a logarithmic decrement, which is obtained by the following equation (4).

[0048]

[Equation 4]

This series of formulas shows that if the internal friction Q ^-1 of the electronic circuit module 1 is increased, the response magnification A at the resonance frequency can be decreased. From the formula (4), When the friction Q ^-1 is increased, the logarithmic damping rate δ is increased, and from the above equation (3), when the logarithmic damping rate δ Guide groove is increased, the damping ratio ζ is increased. Further, when the damping ratio ζ is increased, the response magnification A can be reduced from the above equation (2). For example, a damping ratio of 0.0
The response magnification in the case of 3 is 16.7 times, whereas the response magnification in the case of the attenuation ratio of 0.07 is 7.2 times, and the response magnification can be reduced. Therefore, according to the embodiment as shown in the present embodiment, the cooling fins 2, the spacers 3, and the skins 4 forming the heat exchanger 6 of the electronic circuit module 1 are internally rubbed (general structural aluminum alloy). Has a large internal friction of 0.5 to 2 × 10 ⁻³ ) and is formed from a damping alloy material such as an aluminum-zinc alloy (5 × 10 ⁻³ ). The vibration level transmitted to the electronic circuit component 7 is attenuated inside the electronic circuit module 1,
The response magnification at the resonance frequency of the electronic circuit module 1 is reduced, and the vibration stress applied to the electronic circuit component 7 can be reduced.

[0050]

Since the electronic device according to the present invention is configured as described above, it has the following effects.

According to the present invention, when the electronic circuit module is housed in the chassis, the first and second lips of the seal rubber provided in the guide groove of the guide block are
By compressively deforming and closely contacting the first and second sliding surfaces and the protrusions of the seal caps attached to both ends of the electronic circuit module, cooling air in the guide groove is prevented from leaking into the chassis, and the electronic circuit The heat dissipation effect of the module can be improved. In addition, when the electronic circuit module is attached to or detached from the chassis, the contact area between the seal rubber and the seal cap, that is, the area where the seal rubber is subjected to compressive deformation is very small. Can be easily attached and detached, and maintainability can be improved. Further, the mechanical damage generated in the end portion of the electronic circuit module and the guide groove can be prevented by the seal rubber functioning as a cushioning material. Therefore, it is possible to obtain an electronic device which prevents leakage of cooling air inside the chassis, reduces the attachment / detachment force of the electronic circuit module, and is excellent in reliability, maintainability, and heat dissipation effect.

In addition, according to the present invention, not only the same effect as described above can be obtained, but also the first lip of the seal rubber and the first sliding surface of the seal cap are provided along the insertion direction of the electronic circuit module. By forming the taper part that narrows, the force that compressively deforms the seal rubber does not occur at the initial stage of insertion of the electronic circuit module and at the latter stage of withdrawal, so the attaching / detaching force of the electronic circuit module can be further reduced, and the electronic circuit module can be attached / detached. Can be performed more easily, and an electronic device with improved maintainability can be obtained.

Further, according to the present invention, not only the same effect as described above can be obtained, but the friction resistance at the contact surface between the seal rubber and the seal cap is further reduced by molding the seal cap with a material having a low friction coefficient. Therefore, the attachment / detachment force of the electronic circuit module can be further reduced, and the attachment / detachment of the electronic circuit module can be performed more easily.
An electronic device with improved maintainability can be obtained.

Further, according to the present invention, not only the same effect as described above can be obtained, but also the seal cap is formed of the low thermal expansion material, and the first and second slide surfaces of the seal cap and the protrusions are formed. Since the surface is treated to have a low coefficient of friction, it is possible to prevent thermal deformation of the seal cap against the high temperature environment that is encountered when repairing or replacing the electronic circuit components mounted on the electronic circuit module. Therefore, it is not necessary to attach or detach the seal cap at the time of repairing or exchanging the electronic circuit component, and it is possible to obtain an electronic device with improved maintainability.

Further, according to the present invention, not only the same effect as described above can be obtained, but also by forming the seal cap with a conductive material and further forming the seal rubber with an EMI shield material, a seal cap can be obtained. Electrical continuity and hermeticity can be secured at the contact part with the seal rubber, and intrusion and emission of electromagnetic energy from inside and outside the chassis can be prevented, so electronic devices with excellent electromagnetic shielding effect can be obtained. be able to.

Further, according to the present invention, not only the same effect as described above can be obtained, but also a plurality of first and second joint holes provided in the guide groove portion of the guide block are filled and the inside of the guide groove portion is filled. Since the seal rubber is provided with the first and second protective portions that cover the outer wall and the edge portion of the insertion opening, the strength is improved against the force of detaching the seal rubber from the guide groove portion when the electronic circuit module is attached or detached. Further, it is possible to prevent the peeling of the seal rubber from the guide groove portion, which occurs due to repeated attachment and detachment of the electronic circuit module, and it is possible to obtain a reliable electronic device.

Further, according to the present invention, not only the same effects as described above can be obtained, but also a gas seal is provided on the surface of the guide block which is in contact with the second and third air plenums, and the gas seal is attached to the outer circumference of the guide block. By providing the portion, the guide block can be attached and detached, so that the guide block can be easily replaced due to damage of the seal rubber and the maintainability can be improved.
Further, by using a guide block in which the opening size of the first air intake provided in the guide block is changed according to the amount of heat generation of the electronic circuit module, the cooling air supplied to the electronic circuit module is used. The flow rate can be adjusted. Therefore, it is possible to obtain an electronic device having excellent reliability, maintainability, and heat dissipation effect.

Further, according to the present invention, not only the same effects as described above can be obtained, but also the cooling fins, spacers and skins forming the heat exchanger of the electronic circuit module are made of aluminum-zinc alloy or the like having a large internal friction. By molding with a damping alloy material having, the response magnification at the resonance frequency of the electronic circuit module is reduced, and the vibration stress applied to the electronic circuit components mounted on the electronic circuit module can be reduced. The marketability of circuit components is expanded, and electronic devices with low cost and excellent vibration resistance can be obtained.

[Brief description of drawings]

FIG. 1 is an external view showing an electronic device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a cross-section DD in FIG.

FIG. 3 is a partial detailed view of a guide portion in FIG.

FIG. 4 is a diagram showing a cross section EE in FIG.

5 is a partial cross-sectional view of the guide portion in FIG.

FIG. 6 is a detailed view of a guide block according to the first embodiment of the present invention.

FIG. 7 is a detailed view of the seal cap according to the first embodiment of the present invention.

FIG. 8 is a detailed view of a guide block according to a second embodiment of the present invention.

FIG. 9 is a detailed view of a seal cap according to a second embodiment of the present invention.

FIG. 10 is a table showing the coefficient of friction of each material.

FIG. 11 is a detailed view of a guide unit according to a sixth embodiment of the present invention.

FIG. 12 is a detailed sectional view of a guide portion according to a sixth embodiment of the present invention.

FIG. 13 is a view showing a peeled state of the seal rubber acting on the guide portion according to the first to fifth embodiments of the present invention.

FIG. 14 is a detailed view of a guide unit according to a seventh embodiment of the present invention.

FIG. 15 is an F shown in FIG. 4 according to a seventh embodiment of the present invention.
It is a detailed view of the guide block seen from the direction.

FIG. 16 shows the G shown in FIG. 4 according to the seventh embodiment of the present invention.
It is the mounting state of the guide block viewed from the direction.

FIG. 17 shows an X electronic device according to a first embodiment of the present invention.
It is a graph which shows the vibration condition of an electronic circuit module when it vibrates in the direction of an axis.

18 is a diagram showing a vibration axis of the electronic circuit module in FIG.

FIG. 19 is an external view showing a conventional electronic device.

20 is a diagram showing a cross section AA in FIG.

21 is a detailed view of the guide portion in FIG. 20. FIG.

22 is a diagram showing a cross section BB in FIG. 19. FIG.

23 is a partial cross-sectional view of the guide portion in FIG.

FIG. 24 is a detailed view of a guide unit showing an embodiment for solving the problem of the conventional electronic device.

25 is a detailed view of the guide block in FIG. 24. FIG.

FIG. 26 is a detailed view of a guide unit showing another embodiment for solving the problem of the conventional electronic device.

[Explanation of symbols]

 1 Electronic Circuit Module 2 Cooling Fin 3 Spacer 4 Skin 5 Ventilation Duct 6 Heat Exchanger 7 Electronic Circuit Parts 8 Printed Circuit Board 9 Connector 10 Chassis 11 Opening 12 Cooling Air 13 Supply Port 14 First Air Plenum 15 Second Air Plenum 16 Air Flow Path 17 Third Air Plenum 18 Ventilation Port 19 Motherboard 20 Connector Seat 21 Guide Block 22 Insertion Port 23 Guide Groove 24 First Air Intake 25 Cover 26 End 27 External Duct 28 Exhaust Port 29 Packing 30 Seal Rubber 31 1st lip 32 2nd lip 33 Seal cap 34 1st sliding surface 35 2nd sliding surface 36 Projection part 37 2nd air intake 38 Tapered part 39 1st joint hole 40 2nd joint hole 41 First Protecting Section 42 Second Protecting Section 43 Seal groove 44 Gas seal 45 Folded protrusion 46 Mounting portion 47 Mounting screw

Claims (8)

[Claims] 1. A box shape having a first surface having an opening, a second surface having a cooling air supply port and forming a right angle to the first surface, and the cooling air supply port being covered from the inside. A first air plenum, a third surface perpendicular to the first surface and the second surface, forming an air flow path with the first air plenum, and A box-shaped second air plenum arranged so as to form a right angle with the air plenum, and a box-shaped second air plenum provided inside the fourth surface facing the third surface and facing the second air plenum. A box-shaped chassis having a third air plenum and ventilation openings provided on the relative surfaces of the second and third air plenums, respectively, and inserted into the chassis through the opening to be housed. A heat exchanger with a ventilation duct equipped with electronic circuit components. An electronic circuit module having a printed circuit board, a first air intake port arranged in the chassis so as to cover the ventilation port, and a first air intake port in the center.
Rectangular guide having a guide groove that is provided so as to surround the air inlet of the above and is formed in the same direction as the insertion direction of the electronic circuit module so as to form a right angle with the above-mentioned opening, A block and a first lip that is provided around the inner wall of the guide groove and projects inward of the guide groove, and covers the inner surface of the insertion port continuously with the first lip, A seal rubber made of a rubber material having a second lip projecting in the inner peripheral direction of the mouth, and a seal rubber that is capped at both ends of the electronic circuit module so that the apex of the first lip is compressed and deformed. A second air intake opening is provided at the center of the second slide surface that has a first slide surface that is in close contact with the second lip so that the apex of the second lip compressively deforms. The above electronic times to form the lip It is characterized in that it is composed of a box-shaped seal cap having a protrusion that closely contacts the module insertion direction side so as to be deformed by compression, and a cover arranged so as to cover the opening from the outside with respect to the chassis. And electronic equipment. 2. The first lip of the seal rubber is arranged so as to form a tapered portion that narrows along the insertion direction of the electronic circuit module, and the first sliding surface of the seal cap is fitted to the tapered portion. The electronic device according to claim 1, wherein the electronic device is formed as follows. 3. The electronic device according to claim 1, wherein the seal cap is formed of a low friction coefficient material (for example, polytetrafluoroethylene). 4. The seal cap is molded from a low thermal expansion material, and the surfaces of the first and second slide surfaces and the protrusion are treated to have a low coefficient of friction (for example, a fine hard anodic oxide film is used). The electronic device according to any one of claims 1 to 3, wherein a visual hole or the like is impregnated with polytetrafluoroethylene. 5. The seal cap is formed of a conductive material, and the seal rubber is formed by EMI (Electro).
The electronic device according to claim 1 or 2, wherein the electronic device is formed of a magnetic interference (shielding material). 6. A surface having a plurality of first joining holes penetrating the inner and outer walls of the guide groove in the guide block, and further having the first air intake opening forming an insertion opening of the guide groove. Is provided with a plurality of second joint holes, is connected to the seal rubber with the first lip and is filled in the first joint hole of the guide block, and inner and outer walls of the guide groove. A first protection portion arranged so as to wrap around, the first protection portion and the second protection portion.
A second protection portion which is connected to the lip of the guide block, is filled in the second joint hole of the guide block, and is further provided so as to wrap around the insertion opening edge portion of the guide groove. The electronic device according to claim 1. 7. A mounting portion is provided on the outer periphery of the guide block, and the surface of the guide block on the side in contact with the second and third air plenums surrounds the outer periphery of the first air intake port. And a gas seal having a pleated protrusion made of a rubber-based material is arranged in the seal groove, and a screw is attached to the second and third air plenums at the attachment portion. The electronic device according to claim 1, wherein the electronic device is attached. 8. The heat exchanger of the electronic circuit module is formed of a vibration damping alloy material.
The electronic device according to claim 7.