JPH07120684B2 - Wire-bonding capillaries- - Google Patents
Wire-bonding capillaries-Info
- Publication number
- JPH07120684B2 JPH07120684B2 JP61235966A JP23596686A JPH07120684B2 JP H07120684 B2 JPH07120684 B2 JP H07120684B2 JP 61235966 A JP61235966 A JP 61235966A JP 23596686 A JP23596686 A JP 23596686A JP H07120684 B2 JPH07120684 B2 JP H07120684B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- capillary
- bonding
- view
- enku
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はワイヤーボンディング用キャピラリーに関し、
特に半導体チップとリードフレームを結線するワイヤー
ボンディングに使用するワイヤーボンディング用キャピ
ラリーに関する。The present invention relates to a capillary for wire bonding,
In particular, the present invention relates to a wire bonding capillary used for wire bonding that connects a semiconductor chip and a lead frame.
第２図（ａ）及び（ｂ）は従来のワイヤーボンディング
用キャピラリーの一例を示す正面図及び縦断面図、第３
図は第２図（ａ）のｂ−ｂ′線における断面図、第４図
は第２図（ｂ）のｃ部の拡大断面図である。2 (a) and 2 (b) are a front view and a vertical sectional view showing an example of a conventional wire bonding capillary, and FIG.
FIG. 4 is a sectional view taken along the line bb 'of FIG. 2 (a), and FIG. 4 is an enlarged sectional view of section c of FIG. 2 (b).
従来、この種のワイヤーボンディング用キャピラリー
は、キャピラリー本体11が先細の円筒状を呈しており、
第４図にｄ〜ｅで示すように、ボンディングワイヤーを
垂直に保持するための狭い直線状の円空部を備えて構成
されていた。Conventionally, in this type of wire bonding capillary, the capillary body 11 has a tapered cylindrical shape,
As shown by d to e in FIG. 4, it was configured to have a narrow linear circular space for holding the bonding wire vertically.
上述した従来のワイヤーボンディング用キャピラリー
は、ボンディングワイヤー保持用の円空部がボンディン
グワイヤーを垂直に保持するために最低限必要な長さを
有しており、これはワイヤリングに於いてはボンディン
グワイヤーとの接触摩擦を大きくすることとなるので、
配線が曲がってしまう等、ワイヤーボンディングに対す
る欠点となっている。The above-described conventional wire bonding capillary has a minimum necessary length for holding the bonding wire in a circular space for holding the bonding wire vertically, and this is the same as the bonding wire in the wiring. Since it will increase the contact friction of
This is a drawback to wire bonding, such as the wiring being bent.
〔問題点を解決するための手段〕 本発明のワイヤーボンディング用キャピラリーは、先細
の円筒状を呈したキャピラリー本体と、該キャピラリー
本体の内壁の一部または全体に円筒長手方向に設けた溝
とを備えている。[Means for Solving the Problems] The wire bonding capillary of the present invention includes a capillary main body having a tapered cylindrical shape, and a groove provided in a part or the whole of an inner wall of the capillary main body in the cylinder longitudinal direction. I have it.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図（ａ）及び（ｂ）は本発明の一実施例の正面図及
び縦断面図、第１図（ｃ）は同図（ａ）のａ−ａ′線に
おける拡大断面図である。1 (a) and 1 (b) are a front view and a vertical sectional view of an embodiment of the present invention, and FIG. 1 (c) is an enlarged sectional view taken along the line aa 'in FIG. 1 (a).
本実施例はキャピラリー本体１及び溝部２を有してな
る。キャピラリー本体１は先細の円筒状を呈しており、
大口径の円空部1aと小口径の円空部1bからなり、ワイヤ
リングするボンディングワイヤーを円空部1aから挿入
し、円空部1bで垂直に保持する。本実施例においては、
この円空部1bに、第１図（ｃ）示すように、縦方向の溝
部２を加工している。この縦方向溝によって垂直に保持
するボンディングワイヤーとの接触面積を少なくするこ
とができる。This embodiment has a capillary body 1 and a groove 2. The capillary body 1 has a tapered cylindrical shape,
Consists Enku portion 1 b of Enku portion 1 a and the small diameter of the large diameter, inserting a bonding wire for wiring from Enku unit 1 a, held vertically in Enku unit 1 b. In this embodiment,
This Enku unit 1 b, as shown FIG. 1 (c), the machining longitudinal grooves 2. This vertical groove can reduce the contact area with the bonding wire that is held vertically.
なお、この縦方向の溝は円空部1bに限らず、ボンディン
グワイヤーの線径より大きい径の円空部1aに設けてもよ
い。円空部1aには径の違いからボンディングワイヤーが
常時接触することはないが、溝を設けておけば当然、接
触時の接触摩擦を減らすことができる。Incidentally, the longitudinal grooves is not limited to Enku portion 1 b, may be provided in Enku portion 1 a of the larger diameter than the diameter of the bonding wire. The bonding wire does not always come into contact with the circular portion 1 a due to the difference in diameter, but it is naturally possible to reduce the contact friction at the time of contact by providing a groove.
以上説明したように、本発明は、少なくともキャピラリ
ー先端のワイヤー垂直保持部に縦方向の溝を備えること
により、ボンディングワイヤーとキャピラリー内壁との
接触摩擦を低減でき、ワイヤリング時の配線曲がり等を
未然に防止できる効果がある。As described above, according to the present invention, by providing a vertical groove in at least the wire vertical holding portion at the tip of the capillary, it is possible to reduce contact friction between the bonding wire and the inner wall of the capillary, and to prevent wiring bending during wiring. There is an effect that can be prevented.
第１図（ａ）及び（ｂ）は本発明の一実施例の正面図及
び縦断面図、第１図（ｃ）は同図（ａ）のａ−ａ′線に
おける拡大断面図、第２図（ａ）及び（ｂ）は従来のワ
イヤーボンディング用キャピラリーの一例を示す正面図
及び縦断面図、第３図は第２図（ａ）のｂ−ｂ′線にお
ける断面図、第４図は第２図（ｂ）のｃ部の拡大断面図
である。 1,11……キャピラリー本体、２……溝部。1 (a) and 1 (b) are a front view and a vertical sectional view of an embodiment of the present invention, and FIG. 1 (c) is an enlarged sectional view taken along the line aa 'in FIG. 1 (a). 1A and 1B are a front view and a vertical sectional view showing an example of a conventional wire bonding capillary, FIG. 3 is a sectional view taken along line bb 'of FIG. 2A, and FIG. It is an expanded sectional view of c section of Drawing 2 (b). 1,11 …… Capillary body, 2 …… Groove.
Claims (1)
と、該キャピラリー本体の内壁の一部または全体に円筒
長手方向に設けた溝とを備えることを特徴とするワイヤ
ーボンディング用キャピラリー。1. A capillary for wire bonding, comprising: a capillary main body having a tapered cylindrical shape; and a groove provided in a longitudinal direction of the cylinder on a part or the whole of an inner wall of the capillary main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61235966A JPH07120684B2 (en) | 1986-10-02 | 1986-10-02 | Wire-bonding capillaries- |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61235966A JPH07120684B2 (en) | 1986-10-02 | 1986-10-02 | Wire-bonding capillaries- |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6390144A JPS6390144A (en) | 1988-04-21 |
| JPH07120684B2 true JPH07120684B2 (en) | 1995-12-20 |
Family
ID=16993848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61235966A Expired - Lifetime JPH07120684B2 (en) | 1986-10-02 | 1986-10-02 | Wire-bonding capillaries- |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07120684B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8834354B2 (en) | 2000-04-03 | 2014-09-16 | Intuitive Surgical Operations, Inc. | Steerable endoscope and improved method of insertion |
-
1986
- 1986-10-02 JP JP61235966A patent/JPH07120684B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8834354B2 (en) | 2000-04-03 | 2014-09-16 | Intuitive Surgical Operations, Inc. | Steerable endoscope and improved method of insertion |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6390144A (en) | 1988-04-21 |
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