JPH0712048B2 - Mold for resin encapsulation molding of semiconductor element - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an improvement in a resin-sealing molding die for manufacturing a semiconductor device by resin-sealing an IC, an LSI, etc. This is an improved mold for resin encapsulation and molding of semiconductor elements, which is suitable for small-scale production of various types, and is used in the field of manufacturing technology industry of this type of device.

(Prior Art) It is widely known today to adopt a transfer resin molding method as a method for manufacturing a semiconductor device. For example, as a mold for resin encapsulation and molding using this method, JP-B-58-39889 is used. There is one described in the publication.

This resin encapsulation molding die is intended mainly for high quality and high efficiency (high volume) production of semiconductor devices, so that the resin molding cavities in the cavity block are all formed in the same shape. At the same time, the cavity block is configured to be fixedly used on the mold base. That is, since the conventional method has a main purpose of molding a larger amount of semiconductor devices having the same shape, a conventional cavity block having a cavity having the same shape and an ejector plate mounted on the cavity block are mounted on a mold base. On the other hand, it is not configured to have a positive exchangeability such that it is frequently replaced with another one for use.

Further, the ejector plate in the resin encapsulation molding die is conventionally attached as follows.

That is, the mounting structure of the lower ejector plate on the lower die side of the resin encapsulation molding die will be described. As shown in FIG. 5, the ejector plate A is hung from the lower portion of the lower die plate B via bolts C. The support D is fitted so as to be slidable up and down with respect to the provided support D, and is suspended from a predetermined position by a stopper bolt E fixed to the plate B.
Between the ejector plate A and the ejector plate A is a spring F for pushing down the ejector plate during mold clamping.
Is provided. Furthermore, ejector plate A
When moved upward by the ejector bar G, the upper end portion H of the ejector pin erected on the plate A is inserted through the inside of the cavity J in the cavity block I fixed to the upper surface of the lower mold plate B and is located above it. It is provided so as to project up to.

(Problems to be Solved by the Invention) In the conventional mold for resin encapsulation molding as described above, there is an improvement in processing technology of the mold itself and complete automation of all resin encapsulation processes. Thus, the objectives of high quality and high efficiency production of semiconductor devices have been sufficiently achieved.

However, at the time of manufacturing a semiconductor device, for example, in the initial stage, since there is a tendency for high-mix low-volume production, in the case where high-mix low-volume semiconductor devices are individually produced, the cavity block and The replacement work of the ejector plate mounted on this is troublesome and the overall production efficiency is reduced.

In addition, in the mounting structure of the ejector plate A described above, the spring F may be different due to the mounting space of each member.
Is restricted, and the vertical sliding action points of the spring F and the ejector bar G with respect to the plate A are different, so that the sliding action of the plate A is poor, and the mounting structure is complicated. Therefore, there is a problem that a high degree of mounting accuracy is required.

An object of the present invention is to provide a mold for resin encapsulation molding which is suitable when a large number of various types of resin encapsulation molded articles of semiconductor elements are produced in small quantities, and in particular, resin encapsulation molding An object of the present invention is to improve the overall production efficiency by promptly and reliably performing the attachment / detachment work of the cavity block and the ejector plate when exchanging them in the mold.

Another object of the present invention is to simplify the overall structure of the resin encapsulation molding die by simplifying the structure of the mounting portion of the ejector plate.

(Means for Solving the Problems) The resin encapsulation molding die of the semiconductor element according to the present invention is the first
As shown in the drawing, the fixed side and movable side ejector plates 22 and 12 are fitted into the fixed side and movable side cavity blocks 7 and 8 through the holders 34 and 27, respectively. The ejector plates 22 and 12 and the respective cavity blocks 7 and 8 are integrally configured to be detachably attached to the fitting attachment portions provided on the fixed-side and movable-side bases, respectively. It is a feature.

(Operation) According to the configuration of the present invention, it becomes easy to attach and detach the fixed side and movable side cavity blocks 7 and 8 to and from the fixed side and movable side mold bases 3 and 4, respectively. The time required for the replacement work of No. 8 is shortened.

The ejector plates 22 and 12 mounted on the cavity blocks 7 and 8 are fitted into the cavity blocks 7 and 8 via the holders 34 and 27, respectively. At the time of attaching / detaching 7/8, it is possible to attach / detach to / from both mold bases 3 and 4 at the same time.

(Example) Next, this invention is demonstrated based on an Example figure.

FIG. 2 shows a schematic structure of a resin encapsulation molding die for a semiconductor element. This resin encapsulation molding die has a fixed upper die fixed to a fixing plate (not shown) at the upper end of the frame. 1 and
A movable lower mold 2 is disposed below the upper mold so as to face each other, and heat sources 5 and 6 such as oil or a heater are respectively arranged on the bases 3 and 4 of the molds 1 and 2.

A fixed side cavity block 7 is removably fitted and mounted on the upper mold base 3 by a kind of dovetail groove fitting, and a movable side cavity block 8 is similarly mounted on the lower mold base 4 as a kind of dovetail. It is detachably fitted and mounted by groove fitting.

Further, a plurality of required pots 9 ... 9 are arranged in the vertical direction in the movable side cavity block 8, and further, a required plurality of lower mold cavities 10 are provided around these pots 9.
・ 10 (two cavities for one pot in the illustrated example) are provided. Further, in the vicinity of the lower mold cavity 10 in the block 8, there are provided heat sources 11 ... Further, below the block 8, a lower ejector plate 12 having ejector pins 12a ... 12a for projecting a resin molded body molded in the lower mold cavity 10 is provided.
And a plunger holder 13 provided with a plunger 13a ... 13a for pressurizing the resin material supplied into the pot 9, and further, each ejector pin 12a is provided in each lower mold cavity 10 portion. Each of the plungers 13a is inserted into the insertion holes 15 and 16 formed in the lower die base 4 and the ejector plate 12, and is inserted into each of the pots 9. Each is fitted. Further, at least one vertical screw hole 17 is formed in the fitting dovetail portion 8a of the block 8, and the screw hole 17 is formed on the lower base of the block 8 as shown in FIG. When they are fitted in predetermined positions of No. 4, they are provided so as to respectively match with the vertical bolt insertion holes 18 formed in the dovetail groove portion 4a of the lower mold base. Therefore, the block 8 can be securely fixed to a predetermined position of the lower die base 4 by screwing the fixing bolt 19 into the screw hole 17 through the insertion hole 18 described above.

Further, the heat source 11 of the movable side cavity block 8 described above ...
11 is configured to be heated by a power source (not shown) arranged on the base 4 side after being fitted and mounted on the lower mold base 4, and further heated by the heat sources 11 ... When the temperature of the cavity 10 in the block reaches an arbitrary set temperature, for example, about 180 degrees, its heat source 11
The active and direct heating and temperature raising action of the cavity 10 by 11 is stopped, and thereafter, only the heating action by the conduction heat of the heat source 6 on the lower die base 4 side is continued. As such a heat source 11 of the heating / adiabatic switching type, for example, an electric heater may be adopted for the heat source 11. That is, in this case, from the side surface of the block 8, the heat source
11 ... 11 are provided with projecting shaft end portions, and an insertion hole serving also as an electrical connection portion with the shaft end portion (that is, a connection portion with the power supply side) is provided on the lower mold base 4 side. (Not shown), and further, the shaft end and the insertion hole are electrically connected to the insertion hole based on a detection signal from the temperature detector of the cavity 10.
A temperature controller (not shown) for shutting off may be arranged and configured. Therefore, in this case, when the room temperature block 8 is fitted into the lower die base 4 at a predetermined position, the controller first heats the long-axis heat sources 11 ... 11, and then the block is heated by the amount of heat. 8 will be heated. Furthermore, the heat sources 11 ...
When 10 parts reach the set temperature, the controller causes the heat source 11 ...
Since the heating / heating action of 11 itself is stopped, heating of the block 8 is conducted only by the conduction heat from the heat source 6 of the lower mold base 4 transmitted from the joint surface with the lower mold base 4 side or the like. At this time, the temperature of the lower mold base 4 is usually set equal to the above-mentioned set temperature (about 180 degrees), so that the cavity 10 in the block is quickly heated to the temperature of the lower mold base 4 side. Since the temperature of the cavity 10 does not rise to a temperature higher than that, the temperature control of the cavity 10 part such as maintaining the cavity 10 part at a preset appropriate resin molding temperature state is ensured.

By the way, when an electric heater is used for the long-axis heat source 11, for example, the calorific value of the intermediate portion and both end portions thereof may not be constant. Therefore, in this case, the block 8
It becomes a factor that causes unevenness in heating of each cavity 10 part in. In order to eliminate such temperature variations during heating, the heat sources 11 ... 11 can evenly generate heat over the entire area thereof, and the amount of heat can evenly heat the respective cavities 10 parts. It is preferable to apply a thermopipe (super heat conduction element).

That is, in this thermopipe, the heat source (11) is, for example, a hollow pipe-shaped container body made of stainless steel or the like,
It is composed of a heat medium such as mercury (not shown) housed in the main body and is heated by a power source on the base 4 side. In this case, the heat source (11) itself is It can be heated in the range of 180 to about 500 degrees. When using such a thermopipe, the heat source (1
1) Since there is no temperature variation in itself, and therefore each cavity 10 of the block 8 can be uniformly heated, there is an advantage that the above-mentioned adverse effect of the temperature gradient in the electric heater can be corrected. In addition, the temperature control of each cavity 10 portion by heating and heat insulation of the thermo pipe itself can be surely performed by a controller similar to the above-mentioned temperature controller. The heat sources 5 and 6 may be oil-based ones.

The arrangement configuration of the lower die base 4, the movable side cavity block 8 and its heat source 11 is substantially the same as the arrangement configuration of the upper die base 3, the fixed side cavity block 7 and its heat source (21). .

That is, the fixed-side cavity block 7 has a plurality of required upper mold cavities 20 ... 20 facing the lower mold cavities 10 ...
Are provided, and long-axis heat / adiabatic switchable heat sources 21 ... 21 are provided in the vicinity of the cavities 20. Further, above the block 7, an upper ejector plate 22 having ejector pins 22a ... 22a,
22b of the plate 22 and a spring 23 for pushing down the plate 22 via the pin 22b are provided. As shown in FIG. 2, the ejector pins 22a are provided with vertical insertion holes 25 ... 25 formed in the cull portion 24 facing the upper mold cavity 20 and the pots 9 ... 9 on the lower mold 2 side. Are fitted to each. The ejector plate 22 is a spring when the mold shown in FIG. 2 is opened.
The resin moldings cured in the upper mold cavity 20 and the cull portion 24 and in the gate portions 26 ... 26 that connect the cavity 20 and the cull portion 24 are pushed out by the elasticity of 23.

At this time, the lower ejector plate 12 is pushed up by the ejector bar 12b, and similarly the resin molded body in the lower mold cavity 10 is projected. However, when the lower mold 2 side is raised and both molds 1 and 2 are clamped in the parting line (P / L) surface, the upper and lower return pins arranged opposite to the upper and lower ejector plates 22 and 12 described above. Both plates (not shown)
22 ・ 12 will be retracted upward and downward respectively.

Therefore, a semiconductor element (not shown) on the lead frame is set at a predetermined position in the upper and lower cavities 20 and 10 by its attaching / detaching mechanism, and then the mold is clamped while the resin material is supplied into the lower mold pots 9 ... Then, when the resin material is pressed by the plungers 13a ... 13a, the resin material is melted and is injected under pressure through the upper mold cull portion 24 and the gate portion 26 into the upper and lower cavities 20 and 10. Transfer resin encapsulation molding such as resin encapsulation of the semiconductor element in the cavity can be performed.

In addition, the fixed side cavity block 7 is provided with the same configuration (7a, 3a) as the dovetail portion 8a and the dovetail groove portion 4a of the movable side cavity block 8 and the lower die base 4, and the screw hole 17 and the screw hole 17 are inserted. The same structure as the fixing means including the hole 18 and the bolt 19 is provided.

Further, the configuration of the heat sources 21 ... 21 of the fixed side cavity block 7, the positional configuration relationship between the heat source 21 and the power source on the side of the upper die base 3 and the temperature control of the upper die cavity 20 in the block 7 are also described above. The configuration (not shown) substantially the same as that on the lower mold 2 side can be adopted.

FIGS. 3 and 4 are holders for supporting the ejector plates 22 and 12 in the cavity blocks 7 and 8 for the purpose of simultaneously attaching and detaching the ejector plates 22 and 12 when attaching and detaching the cavity blocks 7 and 8. It shows a configuration in which is fixed.

Therefore, according to this configuration, the ejector plates 22 and 12 are attached to the cavity blocks 7 and 8 with respect to the bases 3 and 4, respectively.
At the same time, it is easy to attach and detach as a unit.

Next, this structure will be described with reference to the drawings.

A holder 27 for supporting the lower ejector plate 12 is integrally fixed to the lower surface of the lower mold cavity block 8 by a bolt 28. Further, the lower ejector plate 12 is fitted in the space 29 formed by the holder 27 and the block 8, and each ejector pin 12a erected on the plate is the same as that shown in FIG. The blocks 8 are fitted into the insertion holes 14 in the arrangement configuration. Further, a spring 30 for pushing down the plate 12 at the time of mold clamping is arranged at the outer periphery of each pin 12a or at a predetermined position between the block 8 and the plate 12 as shown in the drawing. . In addition, an insertion hole 31 for inserting the ejector bar 12b is provided in the bottom of the holder 27, and an elongated hole 32 for inserting each plunger 13a is formed. Therefore, the block 8 and the plate 12 can be simultaneously and integrally attached / detached by setting the plungers 13a and the ejector bars 12b to be moved downward.

Further, the upper ejector plate 22 is fitted in the space 35 between the upper mold cavity block 7 and the holder 34 fixed to the block with the bolts 33. Therefore, the block 7 and the plate 22 are formed by the upper mold base. It is provided so that it can be attached to and detached from the unit 3 simultaneously and integrally. In this case, a spring 36 for pushing down the plate 22 when the mold is opened is provided between the plate 22 and the holder 34 as shown in FIG.
The attaching / detaching operation can be further simplified. The arrangement and configuration of each ejector pin 22a vertically provided on the plate 22 is the same as that shown in FIG.

As described above, according to the above-described embodiment, it is easy to attach and detach both the fixed side and movable side cavity blocks 7 and 8 to and from the fixed side and movable side bases 3 and 4, respectively.
The time required to replace the cavity blocks 7 and 8 is shortened.

Further, when replacing both the cavity blocks 7 and 8, the blocks and the ejector plates 22 and 12 can be simply and surely mounted at predetermined positions of the mold bases 3 and 4, or can be removed from them. .

(Effect of the invention) According to the configuration of the present invention, since the cavity block and the ejector plate attached to the cavity block are actively exchanged with respect to the mold base,
For resin encapsulation molding of semiconductor elements for the purpose of high-mix low-volume production of semiconductor devices in which both fixed-side and movable-side cavity blocks and ejector plates are frequently replaced with respect to both fixed-side and movable-side mold bases. Most suitable as a mold.

Further, according to the configuration of the present invention, at the time of exchanging the cavity block, the work of attaching and detaching the ejector plate attached to the cavity block can be performed at the same time, easily, quickly and surely, and the structure of the attaching portion is simplified. Thus, the overall structure can be simplified, and thus, the above-described conventional problems can be reliably solved, which is an excellent effect.

[Brief description of drawings]

1 to 4 show an embodiment of the present invention,
FIG. 1 is a partially cutaway front view showing an essential part thereof, FIG. 2 is a partially cutaway vertical front view showing an essential part of a resin encapsulation molding die for a semiconductor element, and FIG. 3 is a lower ejector plate downside. FIG. 4 is a partially cutaway side view showing a state where the mold cavity block is mounted, and FIG. 4 is an exploded partially cutaway side view of the mold cavity block. FIG. 5 is a partially cutaway vertical sectional view showing a structural example of a mounting portion of a conventional ejector plate. (Explanation of symbols) 1 ... fixed upper mold, 2 ... movable lower mold, 3 ... upper mold base,
4 ... Lower mold base, 4a ... Dovetail groove, 5/6 ... Heat source, 7
...... Upper mold cavity block, 8 ...... Lower mold cavity block, 8a ...... Ant part, 9 ...... Pot, 10 ...... Lower mold cavity, 11 ...... Heat source, 12 ...... Lower ejector plate, 12a ...... Ejector pin , 12b …… Ejector bar, 13 …… Plunger holder, 13a …… Plunger, 20 …… Upper mold cavity, 21 …… Heat source, 24 …… Cull part, 26 …… Gate part, 27 …… Holder, 28 ……bolt,
29 …… Space, 30 …… Spring, 31 …… Insertion hole, 32
…… Long hole, 33 …… Bolt, 34 …… Holder, 35 …… Space, 36 …… Spring.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display area // B29L 31:34

Claims (1)

[Claims] 1. The fixed-side and movable-side ejector plates are integrally fitted to the fixed-side and movable-side cavity blocks through the holders, respectively, and the ejector plates and the cavity blocks are separated from each other. A mold for resin encapsulation molding of a semiconductor element, characterized in that the integrated structure is detachably attached to fitting fitting portions provided on the fixed side and movable side bases, respectively.