JPH07106466A - Printed-wiring board for mounting of multichip module - Google Patents

Printed-wiring board for mounting of multichip module

Info

Publication number
JPH07106466A
JPH07106466A JP5269853A JP26985393A JPH07106466A JP H07106466 A JPH07106466 A JP H07106466A JP 5269853 A JP5269853 A JP 5269853A JP 26985393 A JP26985393 A JP 26985393A JP H07106466 A JPH07106466 A JP H07106466A
Authority
JP
Japan
Prior art keywords
mcm
wiring board
printed wiring
board
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5269853A
Other languages
Japanese (ja)
Inventor
Hiroki Watanabe
弘樹 渡邊
Taketo Tsukamoto
建人 塚本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP5269853A priority Critical patent/JPH07106466A/en
Publication of JPH07106466A publication Critical patent/JPH07106466A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To reduce the occurrence rate of a connection defect and to easily perform an alignment operation when a multichip-module substrate is mounted on a printed-wiring board by a method wherein a recessed part into and to which the multichip-module substrate can be fitted and fixed is formed on the surface of the printed-wiring board. CONSTITUTION:A recessed part 2 into which a multichip-module substrate(MCM) 52 is fitted is formed in a single-layer or multilayer base board 1, and external terminal parts 3 to which connecting terminals for external continuity of the MCM 52 are installed around the recessed part 2. Then, when the MCM 52 is mounted on the printed-wiring board 1, an adhesive layer 4 is formed on the bottom part in the recessed part 2, and the MCM 52 is fitted and fixed. Terminals 52a for external continuity on the surface of the MCM 52 are connected to the external terminal parts 3 by bonding wires 54. Thereby, a multichip module can be aligned extremely easily, the thickness of the MCM 52 becomes substantially thin, and the length of the wires 54 can be made short.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、複数の半導体チップを
一つの配線基板に搭載したマルチチップモジュール（以
下、ＭＣＭと称する）がプリント配線基板に実装されて
いる構造を有する半導体装置の当該プリント配線基板に
関する。より詳しくは、ＭＣＭを構成する配線基板（以
下ＭＣＭ基板と称する）を実装するためのプリント配線
基板であって、ＭＣＭ基板を実装する際に接続不良が発
生せず、しかも容易にＭＣＭ基板と位置合わせすること
ができるプリント配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to printing of a semiconductor device having a structure in which a multi-chip module (hereinafter referred to as MCM) having a plurality of semiconductor chips mounted on one wiring board is mounted on a printed wiring board. Regarding the wiring board. More specifically, it is a printed wiring board for mounting a wiring board (hereinafter, referred to as an MCM board) that constitutes an MCM, in which a connection failure does not occur when the MCM board is mounted, and moreover, it can be easily positioned with respect to the MCM board. The present invention relates to a printed wiring board that can be matched.

【０００２】[0002]

【従来の技術】近年、複数の半導体チップを配線基板に
直接搭載したＭＣＭが、より大きなプリント配線基板に
実装されている構造の半導体装置が使用されている。こ
のような半導体装置の製造に際しては、半導体チップを
ＭＣＭ基板に搭載した後に、予めＭＣＭ基板をプリント
配線基板に電気的に接続しつつ固定することがなされて
いる。2. Description of the Related Art Recently, a semiconductor device having a structure in which an MCM having a plurality of semiconductor chips directly mounted on a wiring board is mounted on a larger printed wiring board has been used. In manufacturing such a semiconductor device, after mounting a semiconductor chip on an MCM board, the MCM board is fixed in advance while electrically connecting to the printed wiring board.

【０００３】例えば、図５（ａ）に示すように、プリン
ト配線基板５１の表面に、複数の半導体チップが搭載さ
れているＭＣＭ基板５２を銀ペースト５３などで接着
し、ＭＣＭ基板５２の外部導通用の端子５２ａとプリン
ト配線基板５１の端子５１ａとをワイヤーボンディング
法によりワイヤー５４で接続したり、あるいは図５
（ｂ）に示すように、ＭＣＭ基板５２の裏面に外部導通
用のバンプ５２ｂを形成し、そのバンプ５２ｂをプリン
ト配線基板５１の端子５１ａに位置合わせして加熱加圧
することにより溶融接合している。For example, as shown in FIG. 5A, an MCM substrate 52 on which a plurality of semiconductor chips are mounted is adhered to the surface of a printed wiring board 51 with a silver paste 53 or the like, and an external conductor of the MCM substrate 52 is provided. The common terminal 52a and the terminal 51a of the printed wiring board 51 are connected by a wire 54 by a wire bonding method, or as shown in FIG.
As shown in (b), bumps 52b for external conduction are formed on the back surface of the MCM substrate 52, and the bumps 52b are aligned with the terminals 51a of the printed wiring board 51 and heated and pressed for fusion bonding. .

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、ＭＣＭ
基板５２をプリント配線基板に搭載する際にワイヤーボ
ンディング法を利用した場合、図５（ａ）に示したよう
に、ＭＣＭ基板５２の外部導通用の端子５２ａとプリン
ト配線基板５１の端子５１ａとを結ぶワイヤー５４の長
さが、ＭＣＭ基板５２の厚さに相当する分だけで更に必
要となり、このため、ワイヤー５４が振動や衝撃のため
に切れたりはずれたりするといった接続不良の問題があ
った。[Problems to be Solved by the Invention] However, the MCM
When the wire bonding method is used to mount the board 52 on the printed wiring board, the external conduction terminal 52a of the MCM board 52 and the terminal 51a of the printed wiring board 51 are connected as shown in FIG. 5A. The length of the wire 54 to be tied is further required because it corresponds to the thickness of the MCM substrate 52. Therefore, there is a problem of connection failure such that the wire 54 is cut or detached due to vibration or impact.

【０００５】また図５（ｂ）に示したように、ＭＣＭを
基板５２をプリント配線基板に搭載する際にバンプ法を
利用した場合、外部導通用のバンプ５２ｂの形成コスト
が高価であるという問題があった。また、バンプ５２ｂ
はＭＣＭ基板５２の裏面に形成されているので、プリン
ト配線基板５１の端子５１ａとの接合の際には接合箇所
を直接観察することができず、そのため位置合わせに誤
差が生じやすいという問題があった。Further, as shown in FIG. 5B, when the bump method is used when the MCM is mounted on the printed wiring board, the cost of forming the bump 52b for external conduction is high. was there. Also, the bump 52b
Since it is formed on the back surface of the MCM substrate 52, it is not possible to directly observe the joint portion at the time of joining with the terminal 51a of the printed wiring board 51, so that there is a problem that an error in alignment is likely to occur. It was

【０００６】本発明は以上のような従来技術の問題点を
解決しようとするものであり、ＭＣＭ基板をプリント配
線基板に搭載する際に、接続不良の発生率を著しく低減
させ、しかも容易に位置合わせをできるようにすること
を目的とする。The present invention is intended to solve the problems of the prior art as described above, and when mounting the MCM board on the printed wiring board, the incidence of connection failure is significantly reduced and the position is easily adjusted. The purpose is to be able to match.

【０００７】[0007]

【課題を解決するための手段】本発明者らは、プリント
配線基板にＭＣＭ基板を嵌入固定させることができる凹
部を設けることにより上述の目的が達成できることを見
出し、本発明を完成させるに至った。The present inventors have found that the above object can be achieved by providing a concave portion into which a MCM board can be fitted and fixed to a printed wiring board, and have completed the present invention. .

【０００８】即ち、本発明は、ＭＣＭを実装するための
プリント配線基板において、その表面にＭＣＭを嵌入固
定できるような凹部が形成されていることを特徴とする
ＭＣＭ搭載用プリント配線基板を提供する。That is, the present invention provides a printed wiring board for mounting an MCM, characterized in that a concave portion into which the MCM can be fitted and fixed is formed on the surface of the printed wiring board. .

【０００９】[0009]

【作用】本発明のＭＣＭ搭載用プリント配線基板には、
その表面にＭＣＭ基板を嵌入固定できる凹部が形成され
ている。従って、この凹部がＭＣＭとプリント基板とを
接合する際のガイドの役目を果たすので、ＭＣＭの位置
合わせが極めて容易となる。また、ＭＣＭ基板を凹部に
嵌入させると、プリント配線基板の表面を基準として考
えた場合にＭＣＭ基板の厚みが実質的に薄くなる。従っ
て、ＭＣＭ基板とプリンと配線基板とを接続するワイヤ
ーの長さを短くすることが可能となる。The function of the printed wiring board for mounting the MCM of the present invention is as follows.
A concave portion into which the MCM substrate can be fitted and fixed is formed on the surface. Therefore, since the concave portion serves as a guide when joining the MCM and the printed board, the alignment of the MCM becomes extremely easy. Further, when the MCM board is fitted in the recess, the thickness of the MCM board becomes substantially thin when the surface of the printed wiring board is taken as a reference. Therefore, it is possible to shorten the length of the wire that connects the MCM board, the pudding, and the wiring board.

【００１０】また、側面に外部導通用リードを突出させ
たＭＣＭ基板を使用した場合に、プリント配線基板の凹
部の深さを、ＭＣＭ基板の底面からその外部導通用リー
ドまでの高さ以上とすることにより、外部導通用リード
をプリント配線基板の表面に無理なく接触させることが
でき、従って、そのＭＣＭ基板の外部導通用リードとプ
リント配線基板とを電解メッキ法やハンダディップ法、
ハンダリフロー法などにより、確実に接続することが可
能となる。Further, when the MCM substrate having the external conduction leads projecting from the side surface is used, the depth of the concave portion of the printed wiring board is set to be not less than the height from the bottom surface of the MCM substrate to the external conduction leads. As a result, the external conduction lead can be brought into contact with the surface of the printed wiring board without difficulty, and therefore, the external conduction lead of the MCM board and the printed wiring board can be electroplated or soldered,
A solder reflow method or the like enables reliable connection.

【００１１】また、ＭＣＭ搭載用プリント配線基板の凹
部の底部に放熱部材を設けることにより、ＭＣＭが発生
させた熱を効果的に放熱することが可能となる。Further, by providing a heat dissipation member at the bottom of the recess of the MCM mounting printed wiring board, it becomes possible to effectively dissipate the heat generated by the MCM.

【００１２】[0012]

【実施例】以下、本発明の接合方法を図面に基づいて詳
細に説明する。なお、各図において同じ番号は同じ又は
同等の構成要素を示している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The joining method of the present invention will be described in detail below with reference to the drawings. In addition, in each figure, the same reference numeral indicates the same or equivalent component.

【００１３】まず、本発明のＭＣＭ搭載用プリント配線
基板の基本的態様の断面図を図１に示す。このプリント
配線基板には、単層又は多層のベース基板１にＭＣＭ基
板を嵌入固定できるような凹部２が形成され、凹部２の
周囲にはＭＣＭ基板の外部導通用接続端子を接続するた
めの外部端子部３が設けられている構造を有する。この
ような凹部２を設けることにより、ＭＣＭ基板の位置合
わせが極めて容易となる。First, FIG. 1 shows a sectional view of a basic mode of a printed wiring board for mounting an MCM of the present invention. In this printed wiring board, a recess 2 is formed so that the MCM board can be fitted and fixed to a single-layer or multi-layer base board 1, and an external portion for connecting an external conduction connection terminal of the MCM board is formed around the recess 2. It has a structure in which the terminal portion 3 is provided. By providing such a concave portion 2, the alignment of the MCM substrate becomes extremely easy.

【００１４】このＭＣＭ搭載用プリント配線基板にＭＣ
Ｍ基板を搭載する場合には、図２に示すように、ＭＣＭ
搭載用プリント配線基板の凹部２の底部に銀ペーストや
異方性導電性接着剤などの接着剤層４を形成しておき、
そこへ複数の半導体チップを公知の方法により搭載した
ＭＣＭ基板５２を嵌入固定する。そして、ＭＣＭ基板５
２の表面の外部導通用の端子５２ａと、ＭＣＭ搭載用プ
リント配線基板の外部端子部３とをボンディングワイヤ
ー５４で結線する。このように、ＭＣＭ基板５２を凹部
２に嵌入させると、プリント配線基板の表面を基準とし
て考えた場合にＭＣＭ基板５２の厚みが実質的に薄くな
るので、ＭＣＭ基板５２とプリント配線基板の外部端子
部３とを接続するワイヤー５４の長さを短くすることが
できる。The printed wiring board for mounting the MCM has an MC
When mounting the M board, as shown in FIG.
An adhesive layer 4 such as a silver paste or an anisotropic conductive adhesive is formed on the bottom of the recess 2 of the mounting printed wiring board.
An MCM board 52 having a plurality of semiconductor chips mounted therein by a known method is fitted and fixed therein. And the MCM board 5
The terminal 52a for external conduction on the surface of 2 and the external terminal portion 3 of the MCM mounting printed wiring board are connected by a bonding wire 54. When the MCM board 52 is fitted into the recess 2 in this way, the thickness of the MCM board 52 becomes substantially thin when the surface of the printed wiring board is taken as a reference, so that the MCM board 52 and the external terminals of the printed wiring board are provided. The length of the wire 54 connecting to the portion 3 can be shortened.

【００１５】図３に、ＭＣＭ基板５２として、その側面
に外部導通用リード５５を突出させたＭＣＭ基板５２を
ＭＣＭ搭載用プリント配線基板の凹部２に嵌入固定した
例を示す。この場合、プリント配線基板の凹部２の深さ
を、ＭＣＭ基板５２の底面からその外部導通用リード５
５までの高さｄ以上とすることにより、外部導通用リー
ド５５をプリント配線基板の表面に無理なく接触させる
ことができるので、ＭＣＭ基板５２とプリント配線基板
の外部端子部３とを電解メッキ法やハンダディップ法、
ハンダリフロー法などにより、確実に接続することがで
きる。FIG. 3 shows an example of the MCM board 52 in which the leads 55 for external conduction are projected on the side surface of the MCM board 52, and the MCM board 52 is fitted and fixed in the recess 2 of the MCM mounting printed wiring board. In this case, the depth of the recessed portion 2 of the printed wiring board is set from the bottom surface of the MCM board 52 to the lead 5 for external conduction.
By setting the height d up to 5 or more, the external conduction lead 55 can be brought into contact with the surface of the printed wiring board without difficulty, so that the MCM board 52 and the external terminal portion 3 of the printed wiring board are electroplated. Or solder dip method,
The solder reflow method or the like can be surely connected.

【００１６】この後は、必要に応じて樹脂モールドを行
う。これによりＭＣＭがプリント配線基板に実装されて
いる構造の半導体装置を得ることができる。After that, resin molding is performed if necessary. This makes it possible to obtain a semiconductor device having a structure in which the MCM is mounted on the printed wiring board.

【００１７】ところで、ＭＣＭは複数の半導体チップを
搭載しているので、それらが発する熱量も大きなものと
なる。従って、ＭＣＭ搭載用プリント配線基板の放熱特
性を高めることが必要となる。このためには、図４に示
すようにベース基板１に設けられた凹部２の底部の少な
くとも一部に、放熱部材５を設ければよい。放熱部材５
としては、銅板やアルミニウム板などを好ましく使用す
ることができる。By the way, since the MCM is equipped with a plurality of semiconductor chips, the amount of heat generated by them is also large. Therefore, it is necessary to improve the heat dissipation characteristics of the MCM mounting printed wiring board. For this purpose, as shown in FIG. 4, the heat dissipation member 5 may be provided on at least a part of the bottom of the recess 2 provided on the base substrate 1. Heat dissipation member 5
As the material, a copper plate, an aluminum plate or the like can be preferably used.

【００１８】なお、放熱部材５として金属板を使用した
場合には、ＭＣＭのグランド層としても使用することが
できる。When a metal plate is used as the heat dissipation member 5, it can also be used as a ground layer of the MCM.

【００１９】以上、説明した本発明のＭＣＭ搭載用プリ
ント配線基板は、当業者に周知の手段を使用することに
より製造することができる。The MCM mounting printed wiring board of the present invention described above can be manufactured by using means well known to those skilled in the art.

【００２０】[0020]

【発明の効果】本発明によれば、ＭＣＭ基板をＭＣＭ搭
載用プリント配線基板に容易に位置合わせして確実に搭
載することができる。According to the present invention, the MCM board can be easily aligned with the printed wiring board for mounting the MCM and mounted reliably.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のＭＣＭ搭載用プリント配線基板の断面
図である。FIG. 1 is a cross-sectional view of an MCM mounting printed wiring board of the present invention.

【図２】本発明のＭＣＭ搭載用プリント配線基板にＭＣ
Ｍ基板を搭載した状態を示す説明図である。FIG. 2 shows a printed wiring board for mounting an MCM of the present invention which has an MC
It is explanatory drawing which shows the state which mounted the M board | substrate.

【図３】本発明のＭＣＭ搭載用プリント配線基板にＭＣ
Ｍ基板を搭載した状態を示す説明図である。FIG. 3 shows a printed wiring board for mounting an MCM of the present invention, which has an MC
It is explanatory drawing which shows the state which mounted the M board | substrate.

【図４】本発明のＭＣＭ搭載用プリント配線基板の断面
図である。FIG. 4 is a cross-sectional view of a printed wiring board for mounting an MCM of the present invention.

【図５】従来における、ＭＣＭ搭載用プリント配線基板
にＭＣＭ基板を搭載した状態を示す説明図である。FIG. 5 is an explanatory view showing a state in which an MCM board is mounted on a conventional MCM mounting printed wiring board.

【符号の説明】[Explanation of symbols]

１ ベース基板 ２ 凹部 ３ 外部端子部 ４ 接着剤層 ５ 放熱部材 1 base substrate 2 concave portion 3 external terminal portion 4 adhesive layer 5 heat dissipation member

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 マルチチップモジュールを実装するため
のプリント配線基板において、その表面にマルチチップ
モジュールを嵌入固定できるような凹部が形成されてい
ることを特徴とするマルチチップモジュール搭載用プリ
ント配線基板。1. A printed wiring board for mounting a multi-chip module, wherein a concave portion is formed on the surface thereof so that the multi-chip module can be fitted and fixed therein. 【請求項２】 凹部の底部に放熱部材が設けられている
請求項１記載のマルチチップモジュール搭載用プリント
配線基板。2. The printed wiring board for mounting a multi-chip module according to claim 1, wherein a heat dissipation member is provided on the bottom of the recess.
JP5269853A 1993-09-30 1993-09-30 Printed-wiring board for mounting of multichip module Pending JPH07106466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5269853A JPH07106466A (en) 1993-09-30 1993-09-30 Printed-wiring board for mounting of multichip module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5269853A JPH07106466A (en) 1993-09-30 1993-09-30 Printed-wiring board for mounting of multichip module

Publications (1)

Publication Number Publication Date
JPH07106466A true JPH07106466A (en) 1995-04-21

Family

ID=17478115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5269853A Pending JPH07106466A (en) 1993-09-30 1993-09-30 Printed-wiring board for mounting of multichip module

Country Status (1)

Country Link
JP (1) JPH07106466A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6730551B2 (en) 2001-08-06 2004-05-04 Massachusetts Institute Of Technology Formation of planar strained layers
US6900094B2 (en) 2001-06-14 2005-05-31 Amberwave Systems Corporation Method of selective removal of SiGe alloys
JP2017059812A (en) * 2015-09-16 2017-03-23 旭徳科技股▲ふん▼有限公司 Package carrier and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900094B2 (en) 2001-06-14 2005-05-31 Amberwave Systems Corporation Method of selective removal of SiGe alloys
US6730551B2 (en) 2001-08-06 2004-05-04 Massachusetts Institute Of Technology Formation of planar strained layers
JP2017059812A (en) * 2015-09-16 2017-03-23 旭徳科技股▲ふん▼有限公司 Package carrier and method for manufacturing the same

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