JPH0691121B2 - Bonding device - Google Patents
Bonding deviceInfo
- Publication number
- JPH0691121B2 JPH0691121B2 JP60036548A JP3654885A JPH0691121B2 JP H0691121 B2 JPH0691121 B2 JP H0691121B2 JP 60036548 A JP60036548 A JP 60036548A JP 3654885 A JP3654885 A JP 3654885A JP H0691121 B2 JPH0691121 B2 JP H0691121B2
- Authority
- JP
- Japan
- Prior art keywords
- swing arm
- bonding
- linear motor
- wire
- magnesium alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明リニアモータを用いたボンデイング装置の改良に
関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to an improvement of a bonding apparatus using a linear motor of the present invention.
半導体装置の製造におけるボンデイング装置としてペレ
ットとリードとを金線などで連結配線するワイヤボンダ
や回路基板にペレットなどを接着剤で固着するチップマ
ウンタなどが知られている。これらの装置の要部は、例
えばペレットを固着したリードフレームとか回路基板と
かを間欠移送する搬送路の傍にXYテーブルを設け、この
上に支持部材を取付けてスイングアームをこの支持部材
で揺動自在に支持して構成し、このスイングアームに、
ワイヤを保持するキャピラリとか、接着剤を噴射して塗
布するデイスペンサなどのようなボンデイング用治具を
取付けて構成されている。そして従来は支持部材やスイ
ングアームはアルミニウム合金からなっていて、スイン
グアームの運動はカム機構により駆動されるのが一般的
である。次にワイヤボンダを例に最近の事情を述べると
近時キャピラリに非常な高速性と複雑な加圧力の制御な
どが要求されている。第２図（イ）は縦軸にキャピラリ
のペレット表面に対する変位をとり、横軸に時間をとっ
た線図で、第２図（ロ）は縦軸にキャピラリの加圧力を
とり、横軸に時間をとったものであるが、先端にボール
が形成されたワイヤを保持したキャピラリは高速下降で
ペレット表面に近づき（曲線ａ）、さらに減速して接近
し（曲線ｂ）、ペレット表面にワイヤを圧接する（曲線
ｃ）。ここでワイヤとペレットとを接合した後、急速に
上昇離間する（曲線ｄ）。次に曲線e,f,g,hに沿って同
様にリードにワイヤを接合して切断する。そして、曲線
c,gの部分では第２図（ロ）に曲線m,nで示すように所定
の加圧力がキャピラリに加えられるようになっている。
上述のようにスイングアームは高速で回動し、かつ複雑
な加圧力をタイミングよく加えるので、カムによる駆動
では十分に作動させることが困難となり、例えば特開昭
56-30735号に開示されているようにリニアモータで駆動
し、その電流により運動を制御すること行なわれるよう
になった。As a bonding device in the manufacture of semiconductor devices, there are known a wire bonder for connecting and connecting a pellet and a lead with a gold wire or a chip mounter for fixing a pellet or the like to a circuit board with an adhesive. The main part of these devices is, for example, an XY table is provided beside a transfer path for intermittently transferring a lead frame to which pellets are fixed or a circuit board, and a supporting member is mounted on the XY table to swing the swing arm with the supporting member. Freely supported and configured, this swing arm,
It is configured by attaching a capillary for holding a wire or a bonding jig such as a dispenser for spraying and applying an adhesive. Conventionally, the support member and the swing arm are made of aluminum alloy, and the movement of the swing arm is generally driven by a cam mechanism. Next, taking a wire bonder as an example, the recent situation is that capillaries have recently been required to have very high speed and complicated pressure control. FIG. 2 (a) is a diagram in which the vertical axis represents the displacement of the capillary with respect to the pellet surface, and the horizontal axis represents time. In FIG. 2 (b), the vertical axis represents the pressure applied to the capillary, and the horizontal axis represents Although it took time, the capillary holding the wire with the ball formed at the tip approaches the pellet surface at a high speed descending (curve a) and further decelerates to approach (curve b), and the wire is attached to the pellet surface. Press contact (curve c). After joining the wire and the pellet here, they are rapidly lifted and separated (curve d). Next, a wire is similarly bonded to the lead and cut along the curves e, f, g, and h. And the curve
A predetermined pressing force is applied to the capillaries at the portions c and g as shown by the curves m and n in FIG.
As described above, since the swing arm rotates at a high speed and a complicated pressing force is applied at a proper timing, it becomes difficult to drive the swing arm sufficiently by a cam.
It was driven by a linear motor as disclosed in Japanese Patent No. 56-30735, and its current was used to control movement.
しかるに、生産性向上に伴う厳しい要求から一方ではリ
ニアモータの可動側は、極力軽く形成し、他方制御電流
は大となりつつあるのが現状で、このため、可動部分を
アルミニウム合金で構成しても負荷が大となりリニアモ
ータのコイルが焼損するという事故がしばしば起り、リ
ニアモータの長所を十分利用できないという不都合があ
った。However, due to the strict demands associated with productivity improvement, on the one hand, the movable side of the linear motor is made as light as possible, and on the other hand, the control current is becoming large, so even if the movable part is made of an aluminum alloy. Accidents often occur in which the load of the linear motor is burned out and the coil of the linear motor is burned, and the advantages of the linear motor cannot be fully utilized.
本発明は上述の事情にかんがみてなされたもので、高速
で作動してもリニアモータの焼損などがなく十分その長
所の発揮できるボンデイング装置を提供することを目的
とする。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a bonding device that can sufficiently exhibit its advantages without causing burnout of a linear motor even when operating at high speed.
本発明はXYテーブルおよびボンデイング用治具をもった
スイングアームをリニアモータで駆動するボンデイング
装置において、少なくともXYテーブル上のスイングアー
ムおよびこれを回動自在に支持する支持部材をマグネシ
ウム合金で構成したことを特徴とするボンデイング装置
である。According to the present invention, in a bonding apparatus for driving a swing arm having an XY table and a bonding jig by a linear motor, at least the swing arm on the XY table and a supporting member for rotatably supporting the swing arm are made of magnesium alloy. Bonding device characterized by.
以下本発明の詳細を第１図に示す一実施例としてのワイ
ヤボンダにより説明する。第１図は本実施例の要部であ
るボンデイングヘッドの主要構成のみを示し、他の部分
は従来のものと同様なので詳細な図示は省略する。第１
図において、（１）はXYテーブルで、図示しないリニア
モータによりＸ方向、Ｙ方向に適宜駆動され、アルミニ
ウム合金からなっている。この上に支持部材（２）が取
付けられている。これは箱状に形成されていて、ペレッ
ト（３），リード（４）などを有する被ボンデイング部
材（５）側の前面およびこれに対向した後面には大きな
開口が設けられており、上面，下面および両側面はほぼ
平坦な取付け面になっている。そしてマグネシウム合
金、例えばJIS規格「MC−９」で構成されている。そし
てこの支持部材（２）の側面を貫通して支持軸（８）が
回転自在に取付けられていて、これにスイングアーム
（９）が固定されている。スイングアーム（９）はマグ
ネシウム合金「MC−９」からなっていて、キャピラリ
（11）を先端に有して超音波発振器をもったボンデイン
グツール（12）が取付けられている。また後部にはリニ
アモータ（13）の可動部が取付けられていて、リニアモ
ータ（13）の固定部が支持部材（２）に取付けられてい
る。このリニアモータ（13）によりスイングアーム
（９）は揺動する。キャピラリ（11）に上方から臨んで
位置検出装置としてのITVカメラ（15）が設けられてい
て、これはブラケット（16）を介して支持部材（２）の
側面に取付けられており、XYテーブル（１）と一体的に
移動する。ブラケット（16）はマグネシウム合金MC−９
で構成されている。その他ワイヤ（17）を繰出すワイヤ
供給部（18）がブラケット（16）に取付けられており、
またワイヤクランパ（19）がスイングアーム（９）に取
付けられている。またスイングアーム（９）はその重心
が支持軸（８）の中心軸線上に位置するように構成され
ており、さらにまた図示しないが、ワイヤガイド，スイ
ングアーム（９）の回転速度を検出するセンサなども取
付けられているが説明を省略する。The details of the present invention will be described below with reference to a wire bonder as an embodiment shown in FIG. FIG. 1 shows only the main structure of the bonding head, which is the main part of this embodiment, and the other parts are the same as the conventional ones, and therefore detailed illustrations thereof are omitted. First
In the figure, (1) is an XY table, which is made of aluminum alloy and is appropriately driven in the X and Y directions by a linear motor (not shown). A support member (2) is mounted on this. It is formed in a box shape, and has a large opening on the front surface on the side of the bonded member (5) having the pellets (3), the leads (4), and the rear surface facing this, and the upper and lower surfaces are formed. And both sides are almost flat mounting surfaces. It is composed of a magnesium alloy, for example, JIS standard "MC-9". A support shaft (8) is rotatably attached through the side surface of the support member (2), and a swing arm (9) is fixed thereto. The swing arm (9) is made of magnesium alloy "MC-9", and has a bonding tool (12) having a capillary (11) at its tip and an ultrasonic oscillator. A movable part of the linear motor (13) is attached to the rear part, and a fixed part of the linear motor (13) is attached to the support member (2). The swing arm (9) swings by the linear motor (13). An ITV camera (15) as a position detection device is provided facing the capillary (11) from above, and this is attached to the side surface of the support member (2) via a bracket (16), and an XY table ( Move integrally with 1). Bracket (16) is magnesium alloy MC-9
It is composed of. The wire supply part (18) for feeding the other wire (17) is attached to the bracket (16),
A wire clamper (19) is attached to the swing arm (9). Further, the swing arm (9) is configured such that its center of gravity is located on the central axis of the support shaft (8). Further, although not shown, a sensor for detecting the rotation speed of the wire guide and the swing arm (9). Etc. are also attached, but the explanation is omitted.
次に作動を略述すると、ITVカメラ（15）を用いて実際
にボンデイングすべき位置が検出されると、図示しない
リニアモータによりXYテーブル（１）が駆動されて、キ
ャピラリ（11）は所定の位置に移動され、第２図（イ）
に示す変位曲線に沿って移動するようにリニアモータ
（13）の電流が制御され、ワイヤ（17）の先端がペレッ
ト（３）上に当接するとリニアモータ（13）の電流制御
により曲線ｍに示すように所定の加圧力が発生してペレ
ット（３）へのボンデイングが終り、続いて同様に曲線
ｅ〜ｈに沿って作業がなされ、リード（４）へのボンデ
イングが終りワイヤを切断して１個所のワイヤボンデイ
ングが完了する。本実施例においてはスイングアーム
（９）はマグネシウム合金で構成され、しかも重心の位
置が支持軸（８）と一致するので慣性モーメントは小さ
く、その揺動運動は従来のものに比べて非常に軽く、リ
ニアモータの負荷が少ない。またブラケット（16），支
持部材（２）もマグネシウム合金で構成したので、XYテ
ーブルのリニアモータにかかる負荷も少なくなり、敏
速、円滑に位置ぎめができる。Next, the operation will be briefly described. When the position to be actually bonded is detected using the ITV camera (15), the XY table (1) is driven by a linear motor (not shown), and the capillary (11) is moved to a predetermined position. Moved to the position, Figure 2 (a)
The current of the linear motor (13) is controlled so that the linear motor (13) moves along the displacement curve, and when the tip of the wire (17) abuts on the pellet (3), the linear motor (13) controls the current to obtain a curve m. As shown, a predetermined pressing force is generated to finish the bonding to the pellet (3), and then work is similarly performed along the curves e to h, the bonding to the lead (4) is completed, and the wire is cut. Wirebonding at one location is completed. In this embodiment, the swing arm (9) is made of magnesium alloy, and the position of the center of gravity coincides with the support shaft (8), so that the moment of inertia is small and its swinging motion is very light compared with the conventional one. The load on the linear motor is low. Further, since the bracket (16) and the support member (2) are also made of magnesium alloy, the load on the linear motor of the XY table is reduced, and quick and smooth positioning is possible.
以上詳述したように、本発明のボンデイング装置は、少
なくともスイングアームとこれを支持する支持部材とを
マグネシウム合金で構成したので、従来のアルミニウム
合金のものに比べスイングアームを制御するリニアモー
タの負荷が著しく小さくなり、スイングアームを大きな
加速度で制御しても事故を起すことは全くない。また支
持部材も非常に軽量化されたので、XYテーブルを制御す
るリニアモータの負荷が軽減され、外部からの指令に対
しても応答性がよく、位置決め速度，精度がともに向上
し、マグネシウム合金の採用により初めてリニアモータ
の長所を十分発揮したボンデイング装置が得られた。As described in detail above, in the bonding apparatus of the present invention, at least the swing arm and the supporting member for supporting the swing arm are made of magnesium alloy. Therefore, compared with the conventional aluminum alloy, the load of the linear motor for controlling the swing arm is increased. Is significantly reduced, and even if the swing arm is controlled with a large acceleration, no accident will occur. In addition, since the supporting member has also been made extremely lightweight, the load on the linear motor that controls the XY table is reduced, the response to external commands is good, the positioning speed and accuracy are both improved, and the magnesium alloy For the first time, the use of a bonding device has brought out the advantages of the linear motor.
なお本実施例においては、スイングアーム，支持部材お
よびブラケットなどをマグネシウム合金で構成したが、
その他の部材をマグネシウム合金で構成してもよいこと
はもちろんである。In this embodiment, the swing arm, the support member, the bracket, etc. are made of magnesium alloy.
Of course, other members may be made of magnesium alloy.
またワイヤボンダにつき詳述したが、チップマウンタで
もよいことはもちろんである。Although the wire bonder has been described in detail, it goes without saying that it may be a chip mounter.
第１図は本発明の一実施例の構成図、第２図（イ），
（ロ）はボンデイング作業を説明するための線図であ
る。 （１）:XYテーブル，（２）：支持部材， （９）：スイングアーム，（13）：リニアモータ。FIG. 1 is a block diagram of an embodiment of the present invention, FIG.
(B) is a diagram for explaining the bonding work. (1): XY table, (2): support member, (9): swing arm, (13): linear motor.
Claims (3)
グ用治具を保持したスイングアームを上記支持部材で揺
動自在に支持しかつ上記XYテーブルおよび上記スイング
アームをリニアモータにより駆動して半導体装置のボン
デイング作業を行なうボンデイング装置において、少な
くとも上記支持部材とスイングアームとをマグネシウム
合金で構成したことを特徴とするボンデイング装置。1. A semiconductor device of a semiconductor device, wherein a swing arm having a supporting member attached to an XY table and holding a bonding jig is swingably supported by the supporting member, and the XY table and the swing arm are driven by a linear motor. A bonding apparatus for performing a bonding work, wherein at least the supporting member and the swing arm are made of a magnesium alloy.
を保持するキャピラリであることを特徴とする特許請求
の範囲第１項記載のボンデイング装置。2. The bonding apparatus according to claim 1, wherein the bonding jig is a capillary for holding a bonding wire.
イスペンサであることを特徴とする特許請求の範囲第１
項記載のボンデイング装置。3. The bonding jig is a dispenser that applies an adhesive agent.
Bonding device according to the item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60036548A JPH0691121B2 (en) | 1985-02-27 | 1985-02-27 | Bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60036548A JPH0691121B2 (en) | 1985-02-27 | 1985-02-27 | Bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61198639A JPS61198639A (en) | 1986-09-03 |
| JPH0691121B2 true JPH0691121B2 (en) | 1994-11-14 |
Family
ID=12472818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60036548A Expired - Fee Related JPH0691121B2 (en) | 1985-02-27 | 1985-02-27 | Bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0691121B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2789543B2 (en) * | 1992-07-30 | 1998-08-20 | 株式会社カイジョー | XY table |
-
1985
- 1985-02-27 JP JP60036548A patent/JPH0691121B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61198639A (en) | 1986-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |