JPH0686275U - connector - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent damage to solder joints due to thermal fatigue and extend the life of the connector. A connector 5 to which a lower end of a contact 1 is soldered to a substrate, an inner shell housing 2 surrounding and separating the contacts 1 divided into a predetermined number, and an outer shell surrounding and surrounding these inner shell housings 2 are separated. And a shell housing 3. An adhesive rubber-like elastic body 4 is filled between the inner shell housing 2 and the outer shell housing 3.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a connector which is mounted on an electronic device or the like and has a contact to be soldered to a board which is used in an environment where the temperature changes repeatedly.

[0002]

[Prior art]

 Conventionally, as this type of connector, as shown in FIGS. 5 and 6 (a), an insulating housing 7 having a large groove portion formed on one surface, and a plurality of these are arranged at an interval in the groove portion of the housing 7. And the conductive pin contact 8 is provided.

In this connector, as shown in FIG. 6 (b), after the pin contact 8 is housed in the housing 7, the terminal portion 8 a of the pin contact 8 protruding from the bottom of the housing 7 is like a printed wiring board. After being inserted into the through hole formed in the substrate 5, the solder connection portion 6 is formed by connecting the conductive portion of the substrate 5 and the terminal portion 8a by soldering.

[0004]

[Problems to be solved by the device]

However, when the connector is used in an environment where the temperature changes repeatedly, for example, in an environment where it is installed in a device such as a computer, the difference in the thermal expansion coefficient between the housing 7 and the substrate 5 causes The relative displacement Δl ₂ shown occurs, and stress is repeatedly applied to the terminal portion 8 a via the pin contact 8. The relationship between the stress S ₂ and the relative displacement is that the coefficient of thermal expansion of the housing 7 is α ₁ , the coefficient of thermal expansion of the substrate 5 is α ₂ , the distance from the center of the housing 7 to the outermost solder joint 6 is l ₂ , When the temperature difference is ΔT, Δl ₂ = (α ₁ −α ₂ ) × l ₂ × ΔT, which corresponds to the stress S ₂ .

The stress exerted on the solder joint 6 increases as the distance from the center of the housing 7 increases, and the outer solder joint 6 is easily damaged, which eventually causes thermal fatigue damage and lowers the joint strength. Not only that, but in the worst case, it may cause a failure in electrical continuity, leading to the failure of the electronic device itself in which the connector is mounted.

Note that, as shown in FIG. 7, the relationship between the distance from the center of the housing 7 and the crack amount of the solder connection portion 6 is as shown in FIG. The number of cracks is small in the part A), and considerable in other parts (the part B).

It should be noted that the crack amount 1 shown on the vertical axis in FIG. 7 indicates a case where the whole is 1.

Therefore, an object of the present invention is to prevent the terminal portion from being damaged due to thermal fatigue by reducing the stress due to the difference in thermal expansion coefficient between the housing and the substrate, thereby prolonging the life of the connector and mounting the electronic components. It is to provide a connector that can prevent the occurrence of equipment failure.

[0009]

[Means for Solving the Problems]

 According to the present invention, in a connector for soldering a conductive contact to a substrate, a plurality of inner shell housings surrounding the contacts divided by a predetermined number, and an outer shell housing surrounding the inner shell housing. And an elastic body filled between the inner shell housing and the outer shell housing, a connector is obtained.

Further, according to the present invention, in a connector for soldering a terminal portion of a conductive contact to a substrate, a plurality of inner shell housings surrounding the contacts, which are divided into a predetermined number, are provided. There is provided an outer shell housing surrounding and enclosing the shell housing, wherein the inner shell housing is bonded to each other by a double-sided tape.

[0011]

[Action]

 According to the present invention having the above-described configuration, the distance between the contacts arranged at the farthest distance in the inner shell housing becomes small, so that even if the temperature changes repeatedly, the heat generated between the individual inner shell housings and the substrate is reduced. The relative displacement due to the difference in expansion coefficient and the stress acting on the terminals are reduced, and thermal fatigue failure can be prevented.

[0012]

【Example】

 An embodiment of the connector of the present invention will be described below with reference to the drawings.

With reference to FIGS. 1 to 3, the connector includes an inner shell housing 2 surrounding a pin-shaped conductive contact 1 divided into a predetermined number of pieces, and an inner shell housing 2 thereof. It has the outer shell housing 3 which surrounds and is spaced apart.

A space between the inner shell housing 2 and the outer shell housing 3 is filled with an adhesive rubber-like elastic body 4. The terminal portion 1a which is the lower end portion of the contact 1 is to be soldered to the conductive portion of the substrate 5.

For example, 15 contacts 1 arranged in one row are divided into 3 groups of 5 contacts, and the contacts 1 of each of these groups are inner shell housings in which 3 grooves are formed. 2 are respectively arranged. An outer shell housing 3 is provided outside the inner shell housing 2 with a predetermined gap. The elastic body 4 bonds the inner shell housing 2 and the outer shell housing 3 together.

FIG. 3 shows a state in which the connector having the above structure is soldered to the conductive portion of the board 5. In the plurality of through holes formed in the substrate 5, the terminal portions 1a are inserted in one-to-one correspondence with these through holes. After that, the conductive portion of the substrate 5 and the terminal portion 1 a are connected by the solder connecting portion 6.

As described above, when the terminal portion 1 a of the contact 1 is soldered and fixed to the substrate 5 and mounted in a device such as a computer, if the temperature changes repeatedly, the solder connection portion 6 will be affected. Stress S ₁ works. In this case, the relative displacement Δl ₁ due to the difference in thermal expansion coefficient between the inner shell housing 2 and the substrate 5 is as follows: the thermal expansion coefficient of the inner shell housing 2 is α ₁ , the thermal expansion coefficient of the substrate 5 is α ₂ , and the inner shell housing is When the distance from the center of 2 to the outermost solder joint 6 is l ₁ and the temperature difference is ΔT, Δl ₁ = (α ₁ −α ₂ ) × l ₂ × ΔT, which is the stress S It corresponds to ₁ .

Here, l ₁ refers to the longitudinal dimension l ₁ (l ₁ <l ₂ ) of the region (A portion in FIG. 7) in which thermal fatigue cracks are unlikely to occur in the conventional example shown in FIG. It has been decided.

Therefore, as shown in FIG. 3, the relative displacement amount Δ ₁ of the contact 1 is smaller than the conventional relative displacement amount Δ ₂ shown in FIG. 6, and the stress is also reduced accordingly (S ₁ < S ₂ ). As a result, the occurrence of thermal fatigue cracks is suppressed for the entire connector as shown in FIG.

Further, even if the outer shell housing 3 expands and contracts in the longitudinal direction due to temperature change, the elastic body 4 filled in the gap between the outer shell housing 3 and the inner shell housing 2 is relatively soft, so that it is large. No force is generated, and the inner shell housings 2 at both ends are less affected.

It should be noted that the inner shell housing 2 and the outer shell housing 3 may be adhered to each other by a double-sided tape instead of using an adhesive rubber-like elastic body. Good.

[0022]

[Effect of device]

 According to the present invention described above, since the inner shell housing that surrounds the connector pins is divided into a plurality of parts and is made independent, the stress due to the difference in thermal expansion coefficient between each inner shell housing and the board is reduced, and the solder The connection part is protected from damage due to thermal fatigue, the fatigue life is extended, and it is possible to prevent failure of electronic devices and the like.

[Brief description of drawings]

FIG. 1 is a perspective view showing a connector according to an embodiment of the present invention.

FIG. 2 is a plan view of the connector of FIG.

FIG. 3 is a front cross-sectional view of a connector according to an embodiment of the present invention, which is connected to a board by soldering.

FIG. 4 is an explanatory view of a situation where a crack is generated in the connector of the embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional connector.

FIG. 6 (a) is a front sectional view showing a conventional connector,
(B) is an enlarged view of the solder connection portion in (a).

FIG. 7 is an explanatory diagram showing a crack generation situation of a conventional connector.

[Explanation of symbols]

 1 Contact 1a, 8a Terminal part 2 Inner shell housing 3 Outer shell housing 5 Board 6 Solder connection part

Claims (2)

[Scope of utility model registration request] 1. A connector for soldering conductive contacts to a board, comprising: a plurality of inner shell housings surrounding the contacts divided by a predetermined number; and an outer shell housing surrounding the inner shell housings. And an elastic body filled between the inner shell housing and the outer shell housing. 2. A connector for soldering a terminal portion of a conductive contact to a substrate, and a plurality of inner shell housings surrounding and enclosing the contacts divided into a predetermined number,
An outer shell housing surrounding and enclosing the inner shell housing, wherein the inner shell housing is adhered to each other by a double-sided tape.