JPH0666170B2 - Chip component transfer device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a chip-shaped component conveying device that conveys an end face of a small chip-shaped component by adhering it to a conveying tape having an adhesive surface.

[Prior Art] In response to the recent trend of miniaturization, weight reduction, and high frequency of various electronic devices, the amount of small chip-less electronic components used in these electronic devices has a remarkable speed. Is increasing. Therefore, the manufacturing line of chip-shaped electronic components is also variously devised to reflect various policies.

Therefore, first, an example of a manufacturing process of a chip-shaped electronic component which is conventionally performed normally will be briefly described. As for the chip resistor, the chip resistor is a cylindrical insulative ceramic body placed in a carburizing barrel and heated, and while rotating the barrel, carbon is sprayed on the surface to form a resistance coating. To make a resistance element. Place the same resistance element on the vacuum chuck arm that rotates freely by the supply feeder,
A cylinder is a cylinder in which an insulating paint is applied while rotating, a resistance element coated with the insulating paint is supplied to a transport tape, the insulating paint is dried while being transported, and the dried resistance element is transported and removed. It is a chip-shaped resistor. Of course,
Although there are other steps such as terminal electrode mounting and color code display, the above steps are taken.
The shape is also a square plate shape, a prism shape, etc., but the process of the protective outer cover for applying an insulating coating is almost the same. The same applies to chip capacitors and chip inductors. Therefore, the following description will be made by taking the cylindrical chip resistor as a typical example.

Here, a conventional example of the step of forming the insulating film in the manufacturing process of the cylindrical chip resistor (hereinafter referred to as a chip component) will be described in detail with reference to FIGS. 6 to 9. FIG. 6 is a perspective view showing an outline of a step of transporting a chip-shaped component by a transport tape having an adhesive surface, drying the insulating coating material applied to the peripheral surface of the central portion thereof, and then removing the insulating paint from the transport tape. . 1 is a drying furnace, 2 is a ventilation duct, and 3 is a carrier tape having an adhesive surface for carrying the chip-shaped component 4. The chip-shaped component 4 is supplied to a vacuum chuck arm (not shown), and one end of the chip-shaped component 4 is held. Then, while rotating the central axis of the vacuum chuck arm as a rotation axis, the chip-shaped component 4 is attached to a transfer roller that also applies an insulating paint (not shown).
Apply the insulating paint by contacting the central peripheral surfaces of. FIG. 7 shows the chip-shaped component 4 after applying the insulating paint 6. Sixth
In the figure, thereafter, the vacuum chuck arm is rotated to drop the chip-shaped component 4 on the carrier tape 3 in an upright manner, and one end surface of the chip-shaped component 4 is adhesively fixed. Then, the chip-shaped component 4 is transferred in the direction of the arrow while being bonded and aligned with the transport tape 3. Further, the product was passed through the dryer 1 to cure the insulating coating material to obtain a product.

In FIG. 6 described above, the chip-shaped component 4 surrounded by the alternate long and short dash line
The portion A where the tape is peeled from the transport tape 3 is enlarged and shown in FIGS. 8 and 9. Transport tape 3 that has passed through the drying oven 1
Is moved in the direction of the arrow along the slit 8 of the separation plate 7 formed by facing a pair of plates, and the chip-shaped component 4 is peeled off from the carrier tape 3 at the edge portion of the slit 8 and placed on the pedestal 9. It is falling.

[Problems to be Solved by the Invention] In the above conventional technique, a carrier tape having an adhesive surface is used as a carrier belt for a chip-shaped component. In this case, after the insulating paint is applied, the heat treatment is immediately followed by the step of peeling the chip-shaped component from the carrier tape, and the adhesive of the carrier tape softened due to heat in the drying oven becomes the entire chip-shaped component. May adhere to the surface and stain the chip-shaped parts. This is because one end of the chip-shaped component is adhered to the adhesive surface of the carrier tape, and when the chip-shaped component standing upright from the same surface hits the tip of the separating plate, the chip-shaped component is temporarily removed before the chip-shaped component is peeled off. This is because it may be fallen down by the adhesive surface. If the entire chip-shaped component is soiled with the adhesive, for example, if a plating process is performed in the subsequent step, a favorable plating film cannot be formed, resulting in a problem.

Further, the chip-shaped component, while being adhered to the adhesive surface of the transport tape and running at the same speed as the adhesive surface, hits the tip of the stationary separation plate. Therefore, the chip-shaped component may be damaged by being subjected to a strong impact.

In view of the above-mentioned problems of the prior art, an object of the present invention is to provide a chip-shaped component transporting device that can separate the chip-shaped component from the transport tape without damaging or damaging the chip-shaped component.

[Means for Solving the Problem] The above-mentioned object of the present invention is to provide a tape conveying means for adhering an end surface of a chip-shaped component to an adhesive surface of a conveying tape and conveying the same, and a chip shape adhered to the adhesive surface of the conveying tape. In a chip-shaped component transfer device including a component separation unit that separates a component from the adhesive surface, the component separation unit sandwiches a position where a chip-shaped component conveyed while standing up from the adhesive surface of the transfer tape passes through. And a pair of driving bodies having elastic surfaces facing each other, the facing distance of the elastic surfaces is substantially equal to the diameter of the chip-shaped component, and these elastic surfaces are in the same direction as the traveling direction of the transport tape. This is achieved by a chip-shaped component carrier characterized by moving at a speed faster than that of the tape.

[Operation] According to the transport device as described above, the chip-shaped component standing on the adhesive surface of the transport tape is peeled off from the transport tape while the chip-shaped component is sandwiched from both sides by the pair of elastic surfaces. Sometimes chip-shaped parts do not fall on the adhesive surface of the carrier tape. Therefore, the entire chip-shaped component is not contaminated with the adhesive.

Further, since the chip-shaped component is sandwiched between the elastic surfaces of the driving body and the chip-shaped component is peeled from the carrier tape while moving in the same direction as the carrier tape at a speed faster than the tape, the impact given to the chip-shaped component at the time of peeling It is small and does not damage the chip component.

[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Since the outline of the manufacturing process of the chip-shaped component is the same as that described in the conventional example, the description thereof is omitted here. The present invention relates to a chip-shaped component transporting device in a chip-shaped component manufacturing process. In the figure, 3 is a transport tape having adhesiveness on one surface thereof.
The transport tape 3 is moved in the direction indicated by the arrow by a tape drive means (not shown). Reference numeral 4 denotes a chip-shaped component, which is conveyed while being adhered to the adhesive surface of the above-mentioned conveying tape 3. Reference numeral 10 denotes a roller-shaped driving body as a component separating means for separating the chip-shaped component 4 from the transport tape 3.

The separating means is composed of a pair of roller-shaped driving bodies 10 having elastic surfaces facing each other across a position where the chip-shaped component 4 conveyed while standing from the adhesive surface of the conveying tape 3 passes. The opposing distance between the elastic surfaces of the driving body 10 is set to be approximately equal to the diameter of the chip-shaped component 4. Further, as shown by the arrow, these elastic surfaces move in the same direction as the running direction of the transport tape 3 and at a speed V higher than the speed v of the tape 3, a drive device not shown. Is controlled by.

That is, it is driven in the direction indicated by the arrow so that the peripheral speed V> the belt speed v. Then, the chip-shaped component 4
Is separated by being sandwiched between the elastic surfaces of the pair of roller-shaped driving bodies 10, the chip-shaped component 4 is not damaged, and the chip-shaped component 4 falls on the adhesive of the transport tape 3. Also, the entire chip-shaped component is not contaminated with the adhesive. Therefore, the chip-shaped parts are not contaminated or damaged due to them, and the productivity is improved.

Next, another embodiment of the present invention will be described with reference to FIGS. The embodiment of FIG. 1 is an example in which the chip-shaped component 4 is conveyed from the upper side to the lower side by the conveyor belt 3 as in the conventional example, but FIG. 3 is an example in the case of being conveyed from the lower side to the upper side. Is. FIG. 3 is a perspective view of a main part, and FIG. 4 is a plan view of the main part. Also in this case, the pair of roller-shaped driving bodies 10 are driven in the same direction as the conveyor belt 3 at a speed V higher than the speed v of the conveyor belt 3 as indicated by an arrow. The chip-shaped component 4 is the same as the embodiment of FIG. 1 except that the conveying direction is different. In other words, the effect of the present invention is the same regardless of the chip-component conveying direction.

FIG. 5 shows still another embodiment of the present invention.
The separating means for separating the chip-shaped component 4 has an elastic portion on the surface that is rotated by the pair of roller-shaped driving bodies 10 and is separated belt 1.
This is the case when it consists of 1. The separation belt 11 is arranged so as to sandwich the conveyance path of the chip-shaped component 4 to be conveyed, and the gap is approximately equal to the diameter of the chip-shaped component 4 and is symmetrical. Then, as shown by the arrow, the belt 11 rotates in the same direction as the traveling direction of the transport tape 3 at a speed V higher than the speed v of the transport tape 3. Since the chip-shaped component 4 is sandwiched between the elastic surfaces of the separation belt 11 and separated from the conveyor belt 3, the chip-shaped component 4 may be damaged or adhesive may be attached, as in the other embodiments. There is nothing to do.

[Effects of the Invention] As can be seen from the above description, according to the present invention, since the chip-shaped component is separated from the conveyor belt by being sandwiched between the elastic surfaces, the entire chip-shaped component is soiled with the adhesive. Or
Do not damage. Therefore, the defects of the chip-shaped parts are eliminated,
This has the effect of improving productivity.

[Brief description of drawings]

FIG. 1 is a side view showing an essential part of an embodiment of a chip-shaped component conveying device of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is another embodiment of the chip-shaped component conveying device of the present invention. FIG. 4 is a perspective view showing the main part of an example, FIG. 4 is a plan view thereof, FIG. 5 is a side view showing the main part of still another embodiment of the chip-shaped component transfer device of the present invention, and FIG. FIG. 7 is a perspective view showing a main part of the chip-shaped component carrying device, FIG. 7 is an enlarged view showing a carrying state of the chip-shaped component, and FIG. 8 is a perspective view showing an enlarged part A in FIG. 6, and FIG. FIG. 9 is a side view showing the separating means portion of FIG. 8 in an enlarged manner. 3 ... Conveyor belt, 4 ... Chip-shaped parts, 7 ... Separation plate, 10 ... Driving body, 11 ... Separation belt

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takumi Tanaka 1197 Shimada, Innan-cho, Hidaka-gun, Wakayama Nakada Seiki Co., Ltd. (72) Ikuo Higashi 1197 Shimada, Innan-cho, Hidaka-gun, Wakayama Prefecture Nakaki Seiki Co., Ltd.

Claims (1)

[Claims] Claim: What is claimed is: 1. A tape conveying means for adhering an end face of a chip-shaped component to an adhesive surface of a conveying tape for conveying, and a chip-separating device for separating the chip-shaped component adhered to the adhesive surface of the conveying tape from the adhesive face. In a chip-shaped component transporting device, wherein the component separating means has a pair of drives having elastic surfaces facing each other across a position where a chip-shaped component transported while standing upright from the adhesive surface of the transport tape passes. It is composed of a body, the facing distance of the elastic surface is substantially equal to the diameter of the chip-shaped component, and these elastic surfaces move in the same direction as the traveling direction of the transport tape at a speed faster than the tape. Chip-shaped component transfer device.