JPH065928A - Resin-sealed electronic component - Google Patents

Abstract

PURPOSE:To provide the resin-sealed electronic component, sufficiently satisfying reliability on the product and the property of resin demanded in a manufacturing process and low in manufacturing cost. CONSTITUTION:As to a light emitting diode device 30, firstly the first resin 31 for protecting a light emitting diode element 4 or the like from a temperature cycle or the like covers the light emitting diode element 4 and a metal wire 6 in the state where the light emitting diode element 4 is die-bonded with a recessed part 3 formed on a die pad 2 at the tip part of a lead terminal 1 is connected to the tip part of a lead terminal 5. Further, the second resin 32 for protecting the light emitting diode element 4 from moisture covers the first resin 31 and the third resin 33 having the good molding property covers said second resin 32 so as to form a package body. Accordingly, the reliability on the products and the requirements in the manufacturing process are satisfied in the respective resin layers thus enabling a large quantity of the cheap resin 33 to be used so as to reduce the manufacturing cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin in which an internal element and a metal wire connecting the internal element and a lead terminal are sealed with a resin such as an electronic component such as a light emitting diode device or a semiconductor integrated circuit. The present invention relates to a sealed electronic component.

[0002]

2. Description of the Related Art A conventional resin-sealed electronic component of this type will be described with reference to FIGS. 4 and 5 by taking a light emitting diode device as an example. In the light emitting diode device 10 shown in FIG. 4, the light emitting diode element 4 is die-bonded to the recess 3 formed in the die pad 2 at the tip portion of the lead terminal 1, and the light emitting diode element 4 and the tip portion 7 of the lead terminal 5 are connected. Are connected by a metal wire 6 such as a gold wire, and the light emitting diode element 4
The metal wire 6 and the metal wire 6 are sealed with the resin 11. This resin 11 has a glass transition temperature (Tg value) of, for example, a glass transition temperature (Tg value) in order to protect the connection portion of the light emitting diode element 4 and the metal wire 6 from heat cycle and heat during soldering and to improve the reliability of the product. Epoxy resin or the like which is stable at about 115 to 117 ° is used, and its molding is generally performed by a casting method.

Further, the light emitting diode device 20 shown in FIG.
Is the light emitting diode element 4 die-bonded to the recess 3 formed in the die pad 2 at the tip of the lead terminal 1.
First, the light emitting diode element 4 in the recess 3 is made of the resin 2 while the metal wire 6 is connected to the tip portion 7 of the lead terminal 5.
1 is coated, and then the light emitting diode element 4 and the metal wire 6 are sealed with resin 22. The resin 21 protects the light emitting diode element 4 from moisture, and the light emitting diode element 4 is protected from external stress due to expansion and contraction of the resin 22 when a heat cycle is applied.
For example, a silicone resin or the like is used to protect the.

[0004]

However, the conventional example having such a structure has the following problems. That is, the conventional light emitting diode devices 10 and 20
The resin 11 or 22 used for the resin is a resin having predetermined characteristics in order to protect the connection portion of the light emitting diode element 4 and the metal wire 6 from the external environment and pollution and to enhance the reliability of the product. Although used, such a resin has a problem that it is expensive and therefore the manufacturing cost of the product is high. Further, these resins do not have all the characteristics, and in the above-mentioned resins 11 and 22, for example, it is difficult to separate the thermoset resin from the mold by pouring into the mold during resin molding by the casting method. However, there is also a problem in that the characteristics of the resin required for improving the reliability of the product and the work efficiency of the manufacturing process cannot be sufficiently satisfied, such as a problem in the molding characteristics of the resin.

The present invention has been made in view of such circumstances, and sufficiently satisfies the characteristics of the resin required for improving the reliability of the product and the working efficiency of the manufacturing process, and further, the manufacturing cost is reduced. An object is to provide an inexpensive resin-sealed electronic component.

[0006]

The present invention has the following constitution in order to achieve such an object. That is, the present invention is an electronic component in which an internal element and a metal wire connecting the internal element and a lead terminal are resin-sealed, and a first resin layer covering the internal element and the metal wire,
A second resin layer covering the first resin layer, and a third resin layer covering the second resin layer to form a package body,
The first resin layer is a resin having the most stable glass transition temperature among the resin layers, and the second resin layer is a resin having the smallest hygroscopicity among the resin layers. The three resin layers use the resin having the best molding characteristics among the resin layers.

[0007]

The operation of the present invention is as follows. By covering the internal element and the metal wire connecting the internal element and the lead terminal with the first resin layer having a stable glass transition temperature, the internal element and the metal wire are prevented from the heat during the temperature cycle or soldering. To protect the internal elements covered with the first resin layer and the metal wire from moisture by protecting the connection part and the like, and then covering the first resin layer with the second resin layer having a low hygroscopic property. Therefore, the reliability of the product can be improved, and further, by forming the package body by covering the second resin layer with the third resin layer having good molding characteristics, the work efficiency in the resin molding process can be improved. That is, each resin layer can realize the characteristics of the resin required for improving the reliability of the product and the work efficiency of the manufacturing process.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. A configuration of a light emitting diode device according to an embodiment of the present invention will be described with reference to FIG. This light emitting diode device 3
0 is a state in which the light emitting diode element 4 die-bonded to the recess 3 formed in the die pad 2 at the tip of the lead terminal 1 and the tip 7 of the lead terminal 5 are connected by the metal wire 6. One resin 31 covers the light emitting diode element 4 and the metal wire 6, then a second resin 32 covers the first resin 31 covering the light emitting diode element 4 and the metal wire 6, and further a third resin. In this structure, the light emitting diode element 4 and the metal wire 6 are sealed so that 33 covers the second resin 32 to form the package body.

The first resin 31 protects the connection parts of the light emitting diode element 4 and the metal wire 6 from heat during heat cycle and soldering, and enhances the reliability of the product. A stable high-purity epoxy resin or the like is used. Here, the Tg value being stable means that the Tg value of the first resin 31 when cured is approximately 115 to 1 without being affected by the conditions at the time of thermosetting of the first resin 31 described later.
It is constant at about 17 °. This Tg
If the value is higher than the value range, the resin expands and contracts due to heating during soldering, temperature cycle in product testing, etc., and cracks occur, causing breakage of the metal wire 6 and damage to the light emitting diode element 4. On the other hand, if it is too low, the resin softens due to heating at the time of soldering, etc., and the lead terminals 1 and 5 sealed and fixed by the resin wobble, causing disconnection at the connection portion of the metal wire 6. However, both are not preferable.

The second resin 32 is made of, for example, a silicone resin in order to protect the light emitting diode element 4 from moisture and enhance the reliability of the product.

Further, the third resin 33 is the first resin 31,
Since the light emitting diode element 4 covered with the second resin 32 and the metal wire 6 are sealed to form the package body, the molding characteristics are good, for example, polycarbonate, acrylic acid resin, or epoxy resin having good molding characteristics. Is used. Since the light emitting diode element 4 and the metal wire 6 are covered with the first resin 31 and the second resin 32 as described above, the stability of the Tg value, the hygroscopicity, etc. are considered so much as the third resin 33. Since it is not necessary to do so and only the molding characteristics need to be considered, a relatively inexpensive resin can be used.

Next, an example of the manufacturing process of the light emitting diode device 30 will be described with reference to FIG. First, FIG.
A light emitting diode device before resin sealing as shown in (a) is manufactured by a method similar to the conventional method. That is, the LED element 4 is die-bonded to the recess 3 formed in the die pad 2 at the tip of the lead terminal 1, and the LED element 4 and the tip 7 of the lead terminal 5 are wire-bonded to form the metal wire 6. Connect with.

Next, in order to cover the light emitting diode element 4 and the metal wire 6 of this light emitting diode device before resin sealing with the first resin layer, as shown in FIG. The light emitting diode element 4 and the metal wire 6 are dipped and pulled up in the first resin tank 41 containing the resin 31. At this time,
A layer of the first resin 31 is formed around the light emitting diode element 4 and the metal wire 6 by the surface tension of the first resin 31. In this state, the first resin 31 is thermoset.

Next, the first resin 3 produced in FIG. 2 (b)
In order to cover the circumference of layer 1 with the second resin layer, as shown in FIG. 2C, the second resin tank 42 containing the molten second resin 32 is covered with the first resin 31. The light emitting diode element 4 and the metal wire 6 are dipped and pulled up. At this time, the second resin 32 is deposited around the layer of the first resin 31 to form a layer of the second resin 32. In this state, the second resin 3
2. Heat cure 2.

Finally, as shown in FIG. 2D, the package body is formed from the third resin 33 by the casting method. That is, the light emitting diode element 4 covered with the first resin 31 and the second resin 32 and the metal wire 6 are inserted into the mold 43 for molding the package body into which the third resin 33 is injected, and the third resin 33 is inserted. By heat curing the light emitting diode device 30
Is manufactured.

The above-described manufacturing process is an example, and each resin layer of the light emitting diode device 30 may be formed by another method.

Next, the present invention is applied to a DIP (Dual In-Line Pac).
kage) type semiconductor device
Will be described with reference to. In the semiconductor device 50, the semiconductor element 52 die-bonded to the die pad 51 and the tip portion 54 of the lead terminal 53 are connected by the metal wire 55, and the semiconductor element 52 and the metal wire 55 are connected by the first resin 61. The second resin 62 covers the first resin 61,
Further, the package is formed by covering the second resin 62 with the third resin 63. Each of the resins 31 to 33 used in the above-described light emitting diode device 30 needs to have a light-transmitting property.
May be non-translucent. When the package body is molded, the semiconductor element 52 and the metal wire 55 are removed from the first resin 61.
Since it is covered with the second resin, even if the molding conditions (resin injection pressure, speed, etc.) are set severely in order to improve productivity, the semiconductor element 52 and the metal wire 55 are not adversely affected.

The present invention is not limited to the light emitting diode device and the DIP type semiconductor device described above, but can be applied to various resin-sealed electronic parts.

[0019]

As is apparent from the above description, according to the present invention, the internal element and the metal wire connecting the internal element and the lead terminal are made of the first resin layer having a stable glass transition temperature. By covering it, it protects internal elements and metal wire connections from temperature cycling and heat during soldering.
By covering the first resin layer with a second resin layer having low hygroscopicity, the internal element covered with the first resin layer and the metal wire are protected from moisture, and thus the reliability of the product can be improved. Further, by covering the second resin layer with the third resin layer having good molding characteristics to form the package body, the work efficiency of the resin molding process can be improved. That is, each resin layer can realize the characteristics of the resin required for improving the reliability of the product and the work efficiency of the manufacturing process. Further, the highly reliable and expensive first resin layer for protecting the internal elements and the connection portion of the metal wire from the heat at the time of temperature cycling and soldering,
It is used only around the internal elements and metal wires, and the relatively expensive second resin layer for protecting the internal elements from moisture is also used only around the first resin layer to form the package body. As the third resin layer used in a larger amount than the first and second resin layers, a relatively inexpensive one can be selected, so that the cost of the resin as a whole can be reduced and the manufacturing cost can be reduced. ..

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of a light emitting diode device according to an embodiment of the present invention.

FIG. 2 is a drawing for explaining the manufacturing process of the device of the embodiment.

FIG. 3 is a sectional view showing a configuration of a DIP type semiconductor device according to another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a configuration of a light emitting diode device according to a conventional example.

FIG. 5 is a cross-sectional view showing a configuration of a light emitting diode device according to a conventional example.

[Explanation of symbols]

1, 5 ... Lead terminal 2 ... Die pad 3 ... Recess 4 ... Light emitting diode element 6 ... Metal wire 30 ... Light emitting diode device 31 ... First resin 32 ... Second resin 33 ... Third resin 50 ... DIP (Dual In-Line Package) ) Type semiconductor device

Claims (1)

[Claims] 1. An electronic component in which an internal element and a metal wire connecting the internal element and a lead terminal are resin-sealed, a first resin layer covering the internal element and the metal wire, A second resin layer covering the first resin layer; and a third resin layer covering the second resin layer to form a package body, the first resin layer being the most glass of the resin layers. A resin having a stable transition temperature, the second resin layer is a resin having the smallest hygroscopicity among the resin layers, and the third resin layer has the most molding characteristics among the resin layers. A resin-sealed electronic component characterized by being a good resin.