JPH0658731A - Pattern inspecting apparatus - Google Patents

Abstract

PURPOSE:To make it possible to inspect efficiently a three-dimensional shape of a pattern of a wiring board as well as a plane shape thereof by applying lights of the three primary colors to the wiring board and by converting an optical image thereof into video signals by a color television camera. CONSTITUTION:Lights of the three primary colors, blue, green and red, are applied one the surface and the rear of a wiring board 10 by three irradiation lamps 31, 32 and 33 emitting the lights of the discrete colors respectively. A color television camera 34 picks up an image of the board 10 and converts the optical image of the surface thereof into video signals of the three primary colors of the lights, inputting the red video signal to a two-dimensional logic circuit 35 and the blue and green video signals to first and second three-dimensional logic circuits 36 and 37 respectively. The circuit 35 calculates the width of a pattern 12 from the red video signal and determines the quality of the pattern, i.e., whether a short-circuit fault 13, a disconnection fault 14 or the like exists or not, on the basis of the calculated width of the pattern. Based on shadow patterns formed by the lamps 31 and 32, the circuits 36 and 37 determine likewise the quality of the three-dimensional shape of the pattern 12, i.e., whether a projection fault 16 or the like exists or not, from the blue or green video signal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern inspection apparatus for inspecting a pattern shape of a transparent wiring board, and more particularly to a pattern inspection apparatus capable of efficiently inspecting not only a plane shape of a pattern but also a three-dimensional shape.

When manufacturing a wiring board, as shown in FIGS. 1 (b) and 2 (b), a pattern deposited on the surface of a base material 11
12, for example, a pattern (wiring pattern) 12 formed by etching a copper plate adhered to the surface of the base material 11 has a short circuit defect between the patterns 12 as shown in FIGS. 1 (b) and 2 (b). 13,
Poor disconnection 14 of pattern 12, scraping defect 15a, 15b in which film thickness of pattern 12 has dropped locally, protrusion defect 16 where pattern 12 is locally raised, width of pattern 12 is locally thick A thickening defect and a constriction defect in which the width of the pattern 12 is locally thin may occur.

Since the patterns of wiring boards of recent years have become finer and denser as electronic devices have become lighter, thinner and smaller, the patterns as described above are inspected visually. It is extremely difficult to detect defects efficiently and accurately.

Therefore, from such a background, there is a strong demand for a pattern inspection apparatus capable of efficiently performing a pattern inspection of a wiring board.

[0005]

2. Description of the Related Art Next, a conventional pattern inspection apparatus for inspecting the quality of a wiring board pattern in plan view and the quality of a three-dimensional shape will be described with reference to FIG.

2A and 2B are views for explaining a conventional pattern inspection apparatus. FIG. 2A is a side view of a main part schematically showing the structure of the pattern inspection apparatus, and FIG. 2B is a wiring diagram. It is a partial top view which shows the surface of a board | substrate typically.

As shown in FIG. 1A, the conventional pattern inspection apparatus has a plurality of irradiation means, for example, the first to third halogen lamps 21, 22, and 23, and an image pickup means, for example, a television camera 24. , Two-dimensional logic circuit 25, three-dimensional logic circuit,
For example, it is configured to include first and second three-dimensional logic circuits 26 and 27.

The third halogen lamp 23 is disposed right below the wiring board 10 whose surface is horizontal and which is directed upward, so that the back surface of the third halogen lamp 23 is vertically irradiated with light. The second halogen lamp 22 is arranged above the wiring board 10 so as to irradiate the surface thereof with light from the upper right, and the second halogen lamp 22 is arranged above the wiring board 10 so as to emit light to the surface thereof. They are arranged so that they are irradiated from the upper left.

The television camera 24 also includes a wiring board 10
The image of the surface of the device is photographed directly in front of it, and the video signal is input to the two-dimensional logic circuit 25 and the first and second three-dimensional logic circuits 26 and 27.

This pattern inspection apparatus will be described in more detail by describing a method of performing a pattern inspection for inspecting the shape of the pattern 12 of the wiring board 10 by this conventional pattern inspection apparatus. The base material 11 of the wiring board 10 has a light-transmitting property as described above.

A pattern 12 formed on the surface of the wiring board 10.
To detect the pattern defect as described above, first,
Only the third halogen lamp 23 is turned on (the first and second halogen lamps 21 and 22 are turned off), the surface of the wiring board 10 is photographed by the television camera 24, and an image as shown in FIG. 3 (a) is taken. The video signal of is input to the two-dimensional logic circuit 25.

Based on this video signal, the two-dimensional logic circuit 25 outputs the pattern width W of the pattern 12 as shown in FIG. 3 (a).
(y) is a predetermined constant interval Δy (pattern length direction = y
Direction), and if Wmin <W (y) <Wmax, the pattern 12 viewed from the planar shape is judged to be good, and if W (y) <Wmin or W (y)> Wmax, the planar shape is determined. The pattern seen is judged to be defective.

Here, Wmin is the minimum allowable pattern width of the pattern, Wmax is the maximum allowable pattern width of the pattern, and the values of Wmin and Wmax are stored in advance in the two-dimensional logic circuit 25. .

Note that W (y) <Wmin corresponds to a disconnection defect 14 and a constriction defect 18 of the pattern 12, and W (y)> Wmax corresponds to a short circuit defect 13 and a thick defect 17 between the patterns 12 ( Figure 1
See (b) and Figure 2 (b)).

Next, only the first halogen lamp 21 is turned on (the second and third halogen lamps 22 and 23 are turned off) and the surface of the wiring board 10 is photographed by the television camera 24.
A video signal for imaging as shown in FIG. 3B is input to the first three-dimensional logic circuit 26.

The first three-dimensional logic circuit 26, based on this video signal, outputs the first halogen lamp as shown in FIG. 3 (b).
The width Wa (y) of the shadow pattern 12a produced on the surface of the wiring board 10 by the irradiation of 21 is calculated according to the above-mentioned procedure. If Wamin <Wa (y) <Wamax, the three-dimensional shape of one side of the pattern 12 is calculated. That is, it is determined that the three-dimensional shape of the second halogen lamp 22 side is a good product, and if Wa (y) <Wamin or Wa (y)> Wamax, the three-dimensional shape of the pattern 12 on the second halogen lamp 22 side is Judge as defective.

Here, Wamin is the minimum allowable width of the shadow pattern 12a, Wamax is the maximum allowable width of the shadow pattern 12a, and the values of Wamin and Wamax are stored in advance in the first three-dimensional logic circuit 26. I am doing it.

Note that Wa (y) <Wamin is the first in the pattern 12
Corresponding to the poor picking of 15a, Wa (y)> Wamax is pattern 12
Corresponding to the defective protrusion 16 of. Further, only the second halogen lamp 22 is turned on (the first and third halogen lamps 21 and 23 are turned off) and the surface of the wiring board 10 is covered with the television camera 24.
Then, the image signal of the image pickup as shown in FIG. 3C is input to the second three-dimensional logic circuit 27.

Based on this video signal, the second three-dimensional logic circuit 27 uses the second halogen lamp as shown in FIG. 3 (c).
The width Wb (y) of the shadow pattern 12b created by the irradiation of 22 on the surface of the wiring board 10 by the irradiation of 22 is calculated according to the procedure described above. If Wbmin <Wb (y) <Wbmax, the three-dimensional shape of one side of the pattern 12 is calculated. That is, it is judged that the three-dimensional shape of the first halogen lamp 21 side is a good product, and if Wb (y) <Wbmin or Wb (y)> Wbmax, the three-dimensional shape of the pattern 12 on the first halogen lamp 21 side is Judge as defective.

Here, Wbmin is the minimum allowable width of the shadow pattern 12b, Wbmax is the maximum allowable width of the shadow pattern 12b, and the values of Wbmin and Wbmax are stored in advance in the second three-dimensional logic circuit 27. I am doing it.

Note that Wb (y) <Wbmin is the second pattern 12
Corresponding to the poor picking of 15b, Wb (y)> Wbmax is pattern 11
Corresponding to the defective protrusion 16 of. Therefore, as described above, the first to third halogen lamps 21, 22, and 23 are sequentially turned on and off so that the surface of the wiring board 10 is covered by the television camera.
If the image signal is photographed by 24 and the image signal is input to the two-dimensional logic circuit 25 and the first and second three-dimensional logic circuits 26 and 27, the pattern of the wiring board 10 can be used even in the conventional pattern inspection apparatus.
Not only the quality of the twelve planar shapes but also the quality of the three-dimensional shape can be determined.

[0022]

By the way, in the conventional pattern inspection apparatus, as described above, the first to third halogen lamps 21, 22 and 23 are sequentially turned on and off.

Therefore, in the conventional pattern inspection apparatus, the first to third halogen lamps 21, 22, 23 are turned on / off.
There is a problem that the turning-off work is complicated and the life of the halogen lamps 21, 22, 23 is shortened by frequently repeating turning on and off.

The present invention has been made to solve such a problem, and its object is to provide a pattern inspection apparatus capable of efficiently inspecting not only the planar shape of the pattern of the wiring board but also the three-dimensional shape. .

[0025]

As shown in FIG. 1, a plurality of irradiation means 31, 32 for irradiating the surface of a wiring substrate 10 having a light-transmitting property with light obliquely from different directions and the wiring are provided. Irradiation means 33 for vertically irradiating the back surface of the substrate 10 and the front surface of the wiring board 10 are photographed from the front side, and the wiring board
Imaging means 34 for outputting the surface of 10 as a video signal, and irradiation means
A two-dimensional logic circuit 35 for inputting a video signal from the image pickup means 34 that has photographed the wiring board 10 illuminated by 33, calculating the width of the pattern 12 of the wiring board 10 from this video signal, and judging whether the pattern 12 is good or bad. Then, a video signal is input from the imaging means 34, which photographs the wiring board 10 irradiated by the plurality of irradiation means 32, 33, and a pattern 12 is formed from the video signal.
The three-dimensional logic circuit 36, 37 for calculating the width of the shadow patterns 12a, 12b created on the surface of the
In the pattern inspection device including
While the colors of light generated by 1,32,33 are different,
This is achieved by a pattern inspection device characterized in that the image pickup means 34 is a color discrimination image pickup means.

[0026]

In the pattern inspection apparatus of the present invention, the irradiation means 31, 32, 33 irradiate the wiring substrate 10 with light of different colors, for example, light of the three primary colors of light, blue, green and red, and The image pickup means 34 for photographing the surface of the wiring board 10 from directly in front thereof and converting the optical image thereof into a video signal is constituted by adopting a color discrimination image pickup means, for example, a color television camera 34.

Therefore, the color television camera 34
In order to capture an image of the surface of the wiring board 10 and to convert an optical image of the surface of the wiring board 10 composed of blue pixels, green pixels and red pixels into a video signal and output the image signal, the irradiation lamp in the pattern inspection apparatus of the present invention. It is not necessary to sequentially switch on / off of 31, 32, and 33.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Similar to the conventional pattern inspecting apparatus described with reference to FIG. 2, a pattern inspecting apparatus according to an embodiment of the present invention for inspecting whether a pattern of a wiring board has a flat shape or a three-dimensional shape is shown below. This will be described with reference to FIG.

FIG. 1 is a diagram for explaining a pattern inspection apparatus according to an embodiment of the present invention, in which FIG. 1 (a) is a side view of a main part schematically showing the structure of the pattern inspection apparatus. b) is a partial plan view schematically showing the surface of the wiring board.

In the present specification, the same reference numerals are given to the same parts and the same materials throughout the drawings. The pattern inspection apparatus according to the embodiment of the present invention is shown in FIG.
As shown in FIG. 1, a first irradiation lamp 31 that irradiates the surface of the wiring board 10 with blue light from the upper right and a second irradiation lamp 31 that irradiates the surface of the wiring board 10 with green light from the upper left. A third irradiation lamp 33 that vertically irradiates red light onto the back surface of the wiring board 32 and the wiring board 10, and an image of the front surface of the wiring board 10 directly in front of the third irradiation lamp 33, and an optical image of the surface of the wiring board 10 is an image of three primary colors of light. Color discrimination imaging means for converting and outputting to a signal, for example, a color television camera 34 and a color television camera 34
A two-dimensional logic circuit that inputs a video signal relating to the red pixels on the surface of the wiring board 10 from the above, calculates the width of the pattern 12 of the wiring board 10 from this video signal, and judges the quality of the pattern 12 based on this pattern width. 35 and the video signal relating to the blue pixel on the surface of the wiring substrate 10 from the color television camera 34, the width of the shadow pattern 12a formed by the pattern 12 on the surface of the base material 11 is calculated from this video signal, and the shadow pattern 12a is calculated. A first three-dimensional logic circuit 36 for judging quality of the three-dimensional shape of the pattern 12 based on the pattern 12a, and a color television camera.
The video signal relating to the green pixel on the surface of the wiring board 10 is input from 34, the width of the shadow pattern 12b formed by the pattern 12 on the surface of the base material 11 is calculated from this video signal, and based on the width of the shadow pattern 12b. It includes a second three-dimensional logic circuit 37 for judging the quality of the three-dimensional shape of the pattern 12.

As described above, in the pattern inspection apparatus of the embodiment of the present invention, the color television camera 34 is used as the image pickup means for photographing the surface of the wiring board 10, and the blue light is used as the irradiation means for irradiating the wiring board 10. The first irradiation lamp 31, which emits light, the second irradiation lamp 32, which emits green light, and the third irradiation lamp 33, which emits red light, are included. The pattern 12 on the wiring board 10 can be inspected by turning on and releasing 33.

In order to inspect the pattern 12 of the wiring board 10 with the pattern inspection apparatus having the above-described structure, first,
The three irradiation lamps 31, 32, 33 are turned on to irradiate the front surface and the back surface of the wiring board 10 with light of respective colors.

The color television camera 34 photographs the wiring board 10 and converts the optical image on the surface into video signals of the three primary colors of light, and the video signals relating to the red pixels on the surface of the wiring board 10 are two-dimensionally logical. In the circuit 35, the video signal related to the blue pixel on the surface of the wiring board 10 is supplied to the first three-dimensional logic circuit 36.
The video signal related to the green pixel on the surface of the second second three-dimensional logic circuit
Enter each in 37.

The two-dimensional logic circuit 35 calculates the width of the pattern 12 of the wiring board 10 from the video signal relating to the red pixel of the pattern 12 of the wiring board 10 input from the color television camera 34 as described above, and this pattern is calculated. Pattern based on width
It is determined whether or not the pattern 12 of the wiring board 10 has a short circuit defect 13, a disconnection defect 14, a fat defect 17, a constriction defect 18, and the like, and the first three-dimensional logic circuit 36 also performs the two-dimensional logic. Similar to the circuit 35, a video signal relating to a blue pixel on the surface of the wiring board 10 is input from the color television camera 34, and the pattern 12 is projected from the video signal on the surface of the base material 11 by irradiation of the first irradiation lamp 31. The width of the shadow pattern 12a to be created (see FIGS. 3 and 4) is calculated, and based on the shadow pattern 12a, the quality of the three-dimensional shape of the pattern 12 is judged, that is, the protrusion defect.
The first existing on the side of the second irradiation lamp 32 of 16 or pattern 12
It is judged whether or not there is a defective picking 15a, etc., and the second three-dimensional logic circuit 37 also similarly has a color television camera.
A video signal relating to a green pixel on the surface of the wiring substrate 10 is input from the 34, and the pattern 12 causes the second irradiation lamp 32
Pattern 12b (Fig. 3) created on the surface of the substrate 11 by irradiation of
The width of the pattern 12) is calculated, and based on this shadow pattern 12b, the quality of the three-dimensional shape of the pattern 12 is determined, that is, the protrusion defect 16 and the second scooping existing on the first irradiation lamp 31 side of the pattern 12. Determine whether there is a defect 15b.

If the judgment of the two-dimensional logic circuit 35 and the judgments of the first three-dimensional logic circuit 36 and the second three-dimensional logic circuit 37 are good, the pattern 12 of the wiring board 10 is a good product,
If at least one of the determinations is defective, the pattern 12 of the wiring board 10 is determined to be defective.

The procedure by which the two-dimensional logic circuit 35, the first three-dimensional logic circuit 36, and the second three-dimensional logic circuit 37 determine the quality of the pattern 12 on the wiring board 10 will be described with reference to FIG. Since the procedure is similar to that of the two-dimensional logic circuit 25, the first three-dimensional logic circuit 26 and the second three-dimensional logic circuit 27 of the conventional pattern inspection apparatus, the description thereof is omitted here.

Further, the first three-dimensional logic circuit 36 and the second three-dimensional logic circuit 37 are respectively connected to the two-dimensional logic circuit 35 by a dotted line 38.
The coordinate data of the edge (contour line) of the pattern 12 calculated by the two-dimensional logic circuit 35 based on the video signal related to the red pixel of the pattern 12 of the wiring board 10 connected from the color television camera 34 as shown in FIG. Are input to the first three-dimensional logic circuit 36 and the second three-dimensional logic circuit 37, respectively.
The three-dimensional logic circuit 36, based on the coordinate data of the edge of the pattern 12 input from the two-dimensional logic circuit 35 and the video signal relating to the blue pixel on the surface of the wiring board 10 input from the color television camera 34, If the width of the shadow pattern 12a formed by the irradiation of the irradiation lamp 31 of No. 1 on the surface of the base material 11 by the pattern 12 is calculated, the boundary between the pattern 12 and the shadow pattern 12a is definitely set, and the calculation result is further improved. The accuracy is improved, and the reliability of the quality judgment of the pattern 12 is significantly improved (see FIG. 4).

Similarly to the first three-dimensional logic circuit 36, the second three-dimensional logic circuit 37 inputs the coordinate data of the edge of the pattern 12 input from the two-dimensional logic circuit 35 and the color television camera 34. If the width of the shadow pattern 12b created by the irradiation of the second irradiation lamp 32 on the surface of the base material 11 by the irradiation of the second irradiation lamp 32 is calculated based on the video signal related to the green pixel on the surface of the wiring board 10, the shadow of the pattern 12 and the shadow of the pattern 12 are calculated. Since the boundary with the pattern 12b is definitely set, the accuracy of the calculation result is further improved, and the reliability of the quality judgment of the pattern 12 is significantly improved.

Next, with reference to FIG. 5, a pattern inspection apparatus according to a third embodiment of the present invention will be described. FIG. 5 is an explanatory view of a pattern inspection apparatus of an embodiment according to claim 3 of the present invention, FIG. 5 (a) is a side view of a main part schematically showing the configuration of the pattern inspection apparatus, and FIG. b) is a plan view of relevant parts schematically showing a shadow pattern of the pattern.

In the pattern inspection apparatus according to the third embodiment of the present invention shown in FIG. 5, the wiring board 10 (in this embodiment, the base material 11 of the wiring board 10 does not need to transmit light). ), The first light, which is one of the three primary colors of light, for example, blue light, is radiated from diagonally above to the right, and the first shadow pattern W ₁ of the pattern 12 is formed on the wiring board 10. (y) The first irradiation lamp 31 to be made and the surface of the wiring board 10 are irradiated with a second light, which is one of the three primary colors of light and is different from the first light, such as green light, from diagonally above and to the left. , A second irradiation lamp for forming a _second shadow pattern W ₂ (y) of the pattern 12 on the wiring board 10.
32, installed directly on the wiring board 10, and the surface of the wiring board 10 is photographed and converted into a color video signal composed of an R (red) video signal, a G (green) video signal and a B (blue) video signal, Color discrimination image pickup means for outputting this color video signal for each pixel,
For example, a CCD color television camera 41 (hereinafter C
A CD camera 41), an inspection logic circuit 42 and a CRT monitor 43.

The inspection logic circuit 42 inputs the video signal from the CCD camera 41 for each pixel and compresses two video signals other than the maximum video signal among the color video signals at a predetermined ratio. Is performed for each pixel and stored in the built-in image memory unit, and the width W ₁ (each of the first and second shadow patterns W ₁ and W ₂ based on the color video signal read from the image memory unit is y), W ₂ (y) are calculated, and the width W ₁ (y) of the first shadow pattern W ₁ and the previously input numerical value A and second
The width of the shadow pattern W ₂ (W ₂ (y) and the value B input in advance are compared, and if W ₁ (y)> A and W ₂ (y)> B, then the wiring board 10 is a good product. If W ₁ (y) <A or W ₂ (y) <B, the wiring board 10 is determined as a defective product.

Note that W ₁ (y) <A or W ₂ (y) <B means that the pattern 12 of the wiring board 10 has a disconnection defect 14 and a scraping defect 18 (first pattern) as shown in FIG. 1 and 2 poor picking 15
(including a, 15b) exists.

With the pattern inspection apparatus according to the third embodiment of the present invention as described above, the pattern 12 of the wiring board 10 is formed.
The method for inspecting will be described in detail. First, the first and second irradiation lamps 31 and 32 are turned on to form shadow patterns of the pattern 12 on the wiring board 10, that is, the first and second shadow patterns W ₁ and W ₂ .

Next, the surface of the wiring substrate 10 forming the first and second shadow patterns W ₁ and W ₂ is photographed by the CCD camera 41, and the R video signal, G video signal and B video signal are recorded as described above.
The color image signal is converted into a color image signal, and this color image signal is input to the inspection logic circuit 42.

As described above, the inspection logic circuit 42, to which the color video signal is input from the CCD camera 41, compresses two video signals other than the maximum video signal of the color video signal for each pixel at a predetermined ratio, For example, in the first pixel, the R video signal and the B video signal are compressed and stored in the built-in image memory unit. After this is sequentially executed for all pixels, all the pixels read from this image memory unit. The widths W ₁ (y) and W ₂ (y) of the first and second shadow patterns W ₁ and W ₂ are calculated on the basis of the color image signal for each pixel (the above-described processing has been performed), and are described above. If W ₁ (y)> A and W ₂ (y)> B, the wiring board 10 is a good product. If W ₁ (y) <A or W ₂ (y) <B, the wiring board 10 is a defective product. To determine.

Since the inspection logic circuit 42 is connected to the CRT monitor 43, the wiring board executed by the inspection logic circuit 43.
It is also possible to immediately know the judgment result of the quality of 10 on the CRT monitor 43, or on the screen of the CRT monitor 43 in a state where the contrast of the shadow patterns W ₁ and W ₂ of the pattern 12 of the wiring board 10 is emphasized. It is also possible to display.

[0047]

As described above, the present invention makes it possible to provide a pattern inspection apparatus capable of efficiently inspecting a three-dimensional shape rather than a plane shape of a wiring board pattern.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a pattern inspection apparatus according to an embodiment of the present invention,

FIG. 2 is a diagram for explaining a conventional pattern inspection apparatus,

FIG. 3 is a diagram showing a photographed image of a wiring board observed by an image pickup means,

FIG. 4 is a diagram for schematically explaining a method of calculating the width of a shadow pattern,

FIG. 5 is an explanatory diagram of a pattern inspection apparatus of an embodiment according to claim 3 of the present invention.

[Explanation of symbols]

 10 is a wiring board, 11 is a base material, 12 is a pattern, 12a and 12b are shadow patterns of the pattern 12, 13 is a short circuit defect, 14 is a disconnection defect, 15a is a first scraping defect, 15b is the second hollowing defect, 16 is the protrusion defect, 17 is the thickening defect, 18 is the constriction defect, 21,22,23 are halogen lamps, 24 is a television camera, 25 is two-dimensional. Logic circuits, 26, 27 are three-dimensional logic circuits, 31, 32, 33 are irradiation lamps (irradiation means), 34 is a color television camera (color discrimination imaging means), 35 is a two-dimensional logic circuit, 36 Reference numerals 37 denote respective three-dimensional logic circuits. 41 is a CCD camera (color discrimination imaging means), 42 is an inspection logic circuit, 43 is a CRT monitor,

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Internal reference number FI Technical indication location H01L 21/66 J 8406-4M H05K 3/00 Q 6921-4E (72) Inventor Yoshinori Sudo Kanagawa 1015 Kamiodanaka, Nakahara-ku, Kawasaki Prefecture, Japan Within Fujitsu Limited

Claims (3)

[Claims] 1. A plurality of irradiation means (31, 3) for irradiating the surface of a wiring substrate (10) having a light-transmitting property with light obliquely from different directions.
2) and the irradiation means (33) for vertically irradiating the back surface of the wiring board (10) and the front surface of the wiring board (10), and the front surface of the wiring board (10) is photographed, and the front surface of the wiring board (10) is imaged. Imaging means to output as a signal (34)
And a video signal is input from the image pickup means (34) that photographs the wiring board (10) irradiated by the irradiation means (33), and the width of the pattern (12) of the wiring board (10) is input from the video signal. And a two-dimensional logic circuit (35) for determining whether the pattern (12) is good or bad, and the image pickup means () for photographing the wiring board (10) irradiated by the plurality of irradiation means (32, 33). 34), input the video signal, calculate the width of the shadow pattern (12a, 12b) created by the pattern (12) on the surface of the wiring board (10) from this video signal, and judge whether the pattern (12) is good or bad. Original logic circuit (36,37)
In a pattern inspecting device comprising, a pattern characterized in that the irradiation means (31, 32, 33) generate different colors of light, and the imaging means (34) is a color discrimination imaging means. Inspection device. 2. The pattern inspection apparatus according to claim 1, wherein the three-dimensional logic circuit (36, 37) receives coordinate data of an edge of the pattern (12) of the wiring board (10) from the two-dimensional logic circuit (35). This can be done by inputting and inputting a video signal from the image pickup means (34) which has photographed the wiring board (10) irradiated by the plurality of irradiation means (32, 33) and irradiated by the irradiation means (32, 33). A pattern inspection method comprising measuring shadows (12a, 12b) of a pattern (12) of the wiring board (10). 3. A first light (31a), which is one of the three primary colors of light, on the surface of a wiring board (10) having a pattern (12).
Irradiation means for irradiating the surface of the wiring board (10) obliquely to form a first shadow pattern (W ₁ ) of the pattern (12).
(31) and one of the three primary colors of light on the surface of the wiring board (10) from a direction different from that of the first irradiation means (31) and different from the first light (31a) Second irradiation means (32) for obliquely irradiating the second light (32a) to form a second shadow pattern (W ₂ ) of the pattern (12) on the surface of the wiring board (10), and the wiring. The surface of the substrate (10) is photographed and converted into a color video signal composed of an R video signal, a G video signal and a B video signal,
Color discrimination imaging means for outputting this color video signal for each pixel
(41), and input the color video signal from the color discrimination image pickup means (41) for each pixel, and compress two video signals other than the maximum video signal of the color video signals at a predetermined ratio. This is performed for each pixel and stored in the image memory unit, and based on the color video signal read from the image memory unit, each of the first and second shadow patterns (W ₁ , W ₂ ) The width (W ₁ (y), W ₂ (y)) is calculated, and the width (W ₁ (y)) of the first shadow pattern (W ₁ ) is input in advance with the numerical value (A) and the second The width (W ₂ (y)) of the shadow pattern (W ₂ ) and the numerical value (B) input in advance are compared to determine the size of the wiring board (1).
Inspection logic circuit (42) to judge pass / fail of pattern (12) of (0)
And a pattern inspection apparatus including an output unit (43) connected to the inspection logic circuit (42) and outputting a quality determination result of the wiring board (10).