JPH0636613A - Joint material for electronic parts and electronic equipment using the material - Google Patents
Joint material for electronic parts and electronic equipment using the materialInfo
- Publication number
- JPH0636613A JPH0636613A JP21344292A JP21344292A JPH0636613A JP H0636613 A JPH0636613 A JP H0636613A JP 21344292 A JP21344292 A JP 21344292A JP 21344292 A JP21344292 A JP 21344292A JP H0636613 A JPH0636613 A JP H0636613A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- electronic
- electronic parts
- shape memory
- fine particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は熱サイクルが生じる環境
下で使用される電子機器等の接合部に用いられる電子部
品用接合材料およびそれを用いた電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding material for electronic parts used in a bonding part of electronic equipment used in an environment where a heat cycle occurs and an electronic equipment using the same.
【０００２】[0002]
【従来の技術】従来より、電子部品や電子機器の端子等
の接合には、ハンダ等の金属接合材料が用いられてい
る。しかしながら、ハンダ等の金属接合材料は融点が高
いために、３００℃程度の高温作業が必要となる。かか
る高温での作業は、電子部品や電子機器の熱劣化を生じ
させるおそれがある。また、ハンダ等の金属接合材料は
外力に対する柔軟性に欠けるため、製造工程や運搬時に
おいて接合部に衝撃が加わると、接合部が裂けて導通不
良を起こすおそれもある。2. Description of the Related Art Conventionally, a metal joining material such as solder has been used for joining electronic parts and terminals of electronic equipment. However, since a metal bonding material such as solder has a high melting point, a high temperature operation of about 300 ° C. is required. The work at such a high temperature may cause thermal deterioration of electronic components and electronic devices. Further, since a metal bonding material such as solder lacks flexibility with respect to external force, if a shock is applied to the bonding portion during the manufacturing process or during transportation, the bonding portion may be torn and a conduction failure may occur.
【０００３】かかるハンダ等の金属接合材料の問題点を
解決すべく、図４に示すような、膜厚２０μｍ〜３０μ
ｍの熱可塑性樹脂（ポリエステル，ポリエチレン）や熱
硬化性樹脂（エポキシ樹脂）等の絶縁性樹脂基材１２中
に、サイズが５μｍ〜２０μｍの炭素微粒子、ハンダや
ニッケル等の金属微粒子、表面に導電性被膜が形成され
た樹脂ボール等の導電性微粒子１３が分散・含有されて
なる電子部品用接合材料１１が用いられている。In order to solve the problems of the metal bonding material such as solder, the film thickness of 20 μm to 30 μ as shown in FIG.
m thermoplastic resin (polyester, polyethylene), thermosetting resin (epoxy resin), or other insulating resin base material 12, in the size of 5 μm to 20 μm carbon fine particles, metal particles such as solder or nickel, conductive on the surface A bonding material 11 for electronic parts is used in which conductive fine particles 13 such as resin balls having a conductive coating are dispersed and contained.
【０００４】この電子部品用接合材料１１を用いた回路
基板間の接続は、図５に示すように、回路基板１４の配
線パターン１４ａと回路基板１５の配線パターン１５ａ
との間に、この電子部品用接合材料１１を挾み込み、１
５０℃〜１７０℃の温度および１０ｋｇ／ｃｍ2〜３０
ｋｇ／ｃｍ2の圧力で、２０秒〜４０秒間加熱・加圧し
て、導電性微粒子１３を１μｍ〜３μｍに押し潰すこと
により、配線パターン１４ａおよび配線パターン１５ａ
に圧接してその間の導通を確保することによりなされて
いる。しかして、この電子部品用接合材料１１を用いた
回路基板間の接続では、接合部の機械的強度は絶縁性樹
脂基材１２の接着力により得られているので、接合部
は、ハンダ等の金属接合材料による接合部と比較して柔
軟性を有している。そのため、製造工程や運搬時におい
て接合部に衝撃が加わっても、接合部が裂けて導通不良
を起こすおそれはない。As shown in FIG. 5, the connection between the circuit boards using the bonding material 11 for electronic parts is performed by the wiring pattern 14a of the circuit board 14 and the wiring pattern 15a of the circuit board 15.
The bonding material 11 for electronic parts is sandwiched between
Temperature of 50 ° C to 170 ° C and 10 kg / cm 2 to 30
The wiring pattern 14a and the wiring pattern 15a are formed by heating and pressurizing the conductive fine particles 13 to 1 μm to 3 μm at a pressure of kg / cm 2 for 20 seconds to 40 seconds.
It is made by press contacting with each other to secure conduction between them. However, in the connection between circuit boards using the bonding material 11 for electronic parts, since the mechanical strength of the bonding portion is obtained by the adhesive force of the insulating resin base material 12, the bonding portion may be soldered or the like. It is more flexible than the joint made of a metal joining material. Therefore, even if an impact is applied to the joint during the manufacturing process or during transportation, there is no possibility that the joint will be torn and a conduction failure will occur.
【０００５】ところで、前記加圧作業により、導電性微
粒子１３は塑性変形しその復元力を喪失している。した
がって、絶縁性樹脂基材１２は、熱サイクルが生ずる使
用環境で使用されると、温度上昇時に体積が増大する。
しかしながら、絶縁性樹脂基材１２中の導電性微粒子１
３は、前述のごとく復元性を喪失しており、またその熱
膨張率が絶縁性樹脂基材１２のそれよりも小さいため、
図６に示すように、配線パターン１４ａとの配線パター
ン１５ａとの間に微小隙間δｘが発生し、そのため導通
不良が生ずる。また、導電性微粒子１３は、前述のごと
くその復元力を喪失しているので、耐振性にも欠けると
いう問題もある。By the way, by the pressing work, the conductive fine particles 13 are plastically deformed and lose their restoring force. Therefore, when the insulating resin base material 12 is used in a use environment where a heat cycle occurs, the volume thereof increases when the temperature rises.
However, the conductive fine particles 1 in the insulating resin substrate 12
No. 3 has lost the restorability as described above, and its coefficient of thermal expansion is smaller than that of the insulating resin base material 12,
As shown in FIG. 6, a minute gap δx is generated between the wiring pattern 14a and the wiring pattern 15a, which causes a conduction failure. Further, since the conductive fine particles 13 have lost their restoring force as described above, there is also a problem that they lack vibration resistance.
【０００６】[0006]
【発明が解決しようとする課題】本発明はかかる従来技
術の問題点に鑑みなされたものであって、熱サイクルが
生ずる使用環境下で使用されても導体間の隙間発生によ
る導通不良が生ずることがなく、また接合部の耐振性が
向上できる電子部品用接合材料およびそれを用いた電子
部品または電子機器を提供することを主たる目的として
いる。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art. Even if the present invention is used in a usage environment where a thermal cycle occurs, a conduction failure occurs due to a gap between conductors. The main object of the present invention is to provide a bonding material for electronic parts, which is free from the above, and which can improve the vibration resistance of the bonded part, and an electronic part or electronic device using the same.
【０００７】[0007]
【課題を解決するための手段】本発明の電子部品用接合
材料は、絶縁性樹脂基材中に導電性微粒子を分散・含有
してなる電子部品用接合材料において、前記導電性微粒
子として導電性形状記憶合金の微粒子を用いたことを特
徴としている。The bonding material for electronic parts according to the present invention is a bonding material for electronic parts in which conductive fine particles are dispersed and contained in an insulating resin base material, and the conductive fine particles are conductive. It is characterized by using fine particles of shape memory alloy.
【０００８】また、本発明の電子部品または電子機器
は、前記電子部品用接合材料により接合されてなる接合
部を有することを特徴としている。Further, the electronic component or the electronic device of the present invention is characterized by having a joint portion which is joined by the above-mentioned joining material for electronic components.
【０００９】[0009]
【作用】本発明の電子部品用接合材料は、絶縁性樹脂基
材中に導電性形状記憶合金の微粒子を分散・含有してい
るので、熱サイクルが生ずる環境下で使用されても、含
有している形状記憶合金の形状復元力（以下、単に復元
力という）により、絶縁性樹脂基材の体積増大に追従し
て変形し、導体間に隙間が生じたり、亀裂が生じたりす
ることはない。したがって、接合部の良好な導通状態を
維持することができる。また、形状記憶合金は、使用状
態においても伸縮性を有しているので、接合部の耐振性
も向上することができる。Since the bonding material for electronic parts of the present invention contains fine particles of the conductive shape memory alloy dispersed and contained in the insulating resin base material, it does not contain even if it is used in an environment where a thermal cycle occurs. Due to the shape restoring force of the shape memory alloy (hereinafter simply referred to as "restoring force"), the insulating resin base material is not deformed following the increase in volume, and no gaps or cracks are formed between the conductors. . Therefore, it is possible to maintain a good conductive state of the joint portion. Further, since the shape memory alloy has elasticity even in the use state, it is possible to improve the vibration resistance of the joint portion.
【００１０】本発明の電子部品または電子機器（以下、
電子機器で代表する）は、接合部がかかる電子部品用接
合材料により接合されているので、熱サイクルが生ずる
環境下で使用されても導通不良が生ずることはなく、ま
た耐振性にも優れている。そのため、高い信頼性を有す
る。The electronic component or electronic device of the present invention (hereinafter,
(Representative of electronic equipment) has a joint part that is joined by such a joining material for electronic parts, so even if it is used in an environment where a heat cycle occurs, poor conduction does not occur and it is also excellent in vibration resistance. There is. Therefore, it has high reliability.
【００１１】[0011]
【実施例】以下、添付図面を参照しながら本発明を実施
例に基づいて説明するが、本発明はかかる実施例のみに
限定されるものではない。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described based on embodiments with reference to the accompanying drawings, but the present invention is not limited to such embodiments.
【００１２】図１は本発明の電子部品用接合材料の一実
施例の概略図、図２は本発明の電子部品用接合材料の使
用状況の説明図、図３は本発明の電子部品用接合材料に
おける導通確保の原理の説明図である。図において、１
は電子部品用接合材料、２は絶縁性樹脂基材、３は導電
性形状記憶合金の微粒子、４は一方の回路基板、５は他
方の回路基板を示す。FIG. 1 is a schematic view of an embodiment of a bonding material for electronic parts of the present invention, FIG. 2 is an explanatory view of the use state of the bonding material for electronic parts of the present invention, and FIG. 3 is a bonding of electronic parts of the present invention. It is explanatory drawing of the principle of ensuring conduction in a material. In the figure, 1
Is a bonding material for electronic parts, 2 is an insulating resin base material, 3 is fine particles of a conductive shape memory alloy, 4 is one circuit board, and 5 is the other circuit board.
【００１３】本発明の電子部品用接合材料１の絶縁性樹
脂基材２としては、電子機器等の接合部に使用されたと
きに、その接合部にかかる温度で溶融せず、しかも金属
類に対して接着性を有する絶縁性樹脂が広く使用でき
る。その具体例としては、エポキシ樹脂等の熱硬化性樹
脂、ポリエステル，ポリエチレン等の熱可塑性樹脂等の
従来より電子部品用接合材料に用いられている樹脂を挙
げることができる。その中でも、２５〜１７５℃程度の
温度範囲で適度に硬化するものが、電子機器の熱劣化を
生じさせないので好ましい。The insulating resin base material 2 of the bonding material 1 for electronic parts of the present invention does not melt at the temperature applied to the bonding part when used in the bonding part of an electronic device, etc. On the other hand, an insulating resin having adhesiveness can be widely used. Specific examples thereof include thermosetting resins such as epoxy resins and thermoplastic resins such as polyester and polyethylene, which have been conventionally used as bonding materials for electronic components. Among them, those that cure appropriately in the temperature range of about 25 to 175 ° C. are preferable because they do not cause thermal deterioration of the electronic device.
【００１４】導電性形状記憶合金としては、Ｔｉ−Ｎｉ
系、Ａｇ−Ｃｄ系、Ａｕ−Ｃｄ系、Ｃｕ−Ａｕ−Ｚｎ
系、Ｉｎ−Ｔｌ系、Ｉｎ−Ｃｄ系、Ｔｉ−Ｎｉ−Ｃｕ系
の各種の形状記憶合金が好適に用いられる。その中で
も、形状記憶作用の始まる臨界温度（以下、単に臨界温
度という）が２５〜２００℃程度の温度範囲にあるもの
が好ましい。ここでは、この形状記憶合金は微粒子３と
されて、絶縁性樹脂基材２中に分散させられるが、その
粒子径や分散密度については特に限定はなく、適宜選定
され得る。また、その分散は、あらかじめ初期歪を付与
して行ってもよい。この場合、例えば、初期の形状が球
で、その直径がｄであるとし、初期歪付与後にラグビー
ボール状に変形し、そのときの短径がｎであるとすれ
ば、ｎ／ｄが０．２〜０．９、好ましくは０．４〜０．
６、となるようにするのがよい。この微粒子３を絶縁性
樹脂基材２に分散させる場合、その臨界温度は樹脂基材
２の硬化温度と同程度もしくはそれ以上であればよい
が、両者の温度差は３０℃以下であるのが好ましい。両
者の温度差をこの様に設定するのは、臨界温度が樹脂基
材２の硬化温度に比べてあまり高すぎると、樹脂の硬化
がほぼ完了した後に形状記憶合金の形状復元作用が始ま
り、形状記憶合金の微粒子３は充分に復元せず、そのた
め導通不良を生ずるおそれがあるからである。As the conductive shape memory alloy, Ti--Ni is used.
System, Ag-Cd system, Au-Cd system, Cu-Au-Zn
Various shape memory alloys of In-Tl type, In-Cd type, and Ti-Ni-Cu type are preferably used. Among them, it is preferable that the critical temperature at which the shape memory action starts (hereinafter, simply referred to as critical temperature) is in the temperature range of about 25 to 200 ° C. Here, the shape memory alloy is made into the fine particles 3 and dispersed in the insulating resin base material 2. However, the particle diameter and the dispersion density thereof are not particularly limited and can be appropriately selected. Further, the dispersion may be performed by applying an initial strain in advance. In this case, for example, if the initial shape is a sphere and the diameter thereof is d, and the shape is deformed into a rugby ball shape after application of the initial strain, and the short diameter at that time is n, then n / d is 0. 2 to 0.9, preferably 0.4 to 0.
It is better to be 6. When the fine particles 3 are dispersed in the insulating resin substrate 2, the critical temperature thereof may be the same as or higher than the curing temperature of the resin substrate 2, but the temperature difference between the two is 30 ° C. or less. preferable. The temperature difference between the two is set in this way because when the critical temperature is too high compared to the curing temperature of the resin substrate 2, the shape restoring action of the shape memory alloy starts after the curing of the resin is almost completed, This is because the fine particles 3 of the memory alloy are not sufficiently restored, which may cause poor conduction.
【００１５】本発明の電子部品用接合材料の形態は、単
なるテープ状であってもよく、あるいは適用電子機器の
接合部のパターンに合わせてあらかじめ局部に凹部が形
成されたテープであってもよい。さらには、ペースト状
（ゲル状）であってもよい。The form of the bonding material for electronic parts of the present invention may be a simple tape shape, or may be a tape in which recesses are locally formed in advance in accordance with the pattern of the bonding part of the applied electronic equipment. . Further, it may be in paste form (gel form).
【００１６】次に、図２を参照しながら、従来より電子
部品用接合材料による接合がよくなされている、平面型
液晶表示パネルと外部接続回路との接合を、テープ状の
本発明の電子部品用接合材料１によりなす場合について
説明する。なお、ここでは、絶縁性樹脂基材２の膜厚は
２０〜３０μｍ、形状記憶合金の微粒子３の粒径は５〜
２０μｍ程度とされている。Next, referring to FIG. 2, a tape-shaped electronic component of the present invention is used to bond a flat type liquid crystal display panel and an external connection circuit, which has been conventionally well bonded by a bonding material for electronic components. A case of using the bonding material 1 for use will be described. Here, the film thickness of the insulating resin substrate 2 is 20 to 30 μm, and the particle size of the fine particles 3 of the shape memory alloy is 5 to 5.
It is set to about 20 μm.
【００１７】まず、従来と同様に、回路基板４の配線パ
ターン４ａと回路基板５の配線パターン５ａとの間に、
このテープ状の電子部品用接合材料１を挾み込み、所定
時間加熱および加圧する。その際の加熱温度は、絶縁性
樹脂基材２の硬化温度付近の温度、例えば、１５０℃〜
１７０℃とされ、また圧力は１０ｋｇ／ｃｍ2〜３０ｋ
ｇ／ｃｍ2とされる。また、前記所定時間は、例えば、
２０秒〜４０秒間とされている。この加熱・加圧によ
り、導電性形状記憶合金の微粒子３は１μｍ〜３μｍ程
度に押し潰されるとともに、配線パターン４ａと配線パ
ターン５ａとに圧接され両者の導通を確保する。しかる
のち、接続された回路基板４，５を、形状記憶合金の形
状復元作用が開始する温度、例えば、１８０℃程度に加
熱する。First, as in the conventional case, between the wiring pattern 4a of the circuit board 4 and the wiring pattern 5a of the circuit board 5,
The tape-shaped bonding material 1 for electronic parts is sandwiched, and heated and pressed for a predetermined time. The heating temperature at that time is a temperature in the vicinity of the curing temperature of the insulating resin base material 2, for example, 150 ° C to
170 ° C. and pressure is 10 kg / cm 2 to 30 k
It is set to g / cm 2 . Further, the predetermined time is, for example,
It is set to 20 to 40 seconds. By this heating / pressurizing, the fine particles 3 of the conductive shape memory alloy are crushed to about 1 μm to 3 μm and pressed against the wiring pattern 4a and the wiring pattern 5a to ensure electrical continuity between them. Thereafter, the connected circuit boards 4 and 5 are heated to a temperature at which the shape restoring action of the shape memory alloy starts, for example, about 180 ° C.
【００１８】その結果、押し潰された導電性形状記憶合
金の微粒子３は、図３に示すように、元の形状に復帰し
ようとして配線パターン４ａおよび配線パターン５ａに
対して、図中の矢印方向に押圧力を作用させることにな
る。したがって、熱サイクルにより使用環境の温度が上
昇して絶縁性樹脂基材２の体積が増大しても、微粒子３
もその復元力により図中上下方向に増大するように変形
し、常に配線パターン４ａおよび配線パターン５ａとの
接触が確保される。そのため、隙間発生による導通不良
は生じない。また、微粒子３が前記状態にあるので、外
部より加振力が作用しても導通不良を生ずることはな
い。As a result, as shown in FIG. 3, the crushed conductive shape memory alloy fine particles 3 are directed toward the wiring pattern 4a and the wiring pattern 5a in the direction of the arrow in the figure in an attempt to return to the original shape. A pressing force will be applied to. Therefore, even if the temperature of the use environment rises due to the heat cycle and the volume of the insulating resin base material 2 increases, the fine particles 3
Also, the restoring force deforms so as to increase in the vertical direction in the figure, and the contact with the wiring patterns 4a and 5a is always ensured. Therefore, the conduction failure due to the generation of the gap does not occur. In addition, since the fine particles 3 are in the above-mentioned state, the conduction failure does not occur even when the vibration force is applied from the outside.
【００１９】なお、あらかじめ初期歪が付与された微粒
子３が分散されている電子部品用接合材料１を用いると
きは、前述の高い圧力での加圧が不要となり低い圧力で
接合できる。When the bonding material 1 for electronic parts in which the fine particles 3 to which the initial strain has been applied is dispersed is used, it is not necessary to apply the above-mentioned high pressure, and the bonding can be performed at a low pressure.
【００２０】本発明の他の実施例（以下、第２実施例と
いう）においては、絶縁性樹脂基材２はペ−スト状（ゲ
ル状）とされている。この第２実施例においては、絶縁
性樹脂基材２がペ−スト状とされている点を除いては、
絶縁性樹脂基材２の材質、分散・含有されている形状記
憶合金の微粒子３の粒径および分散密度は前記実施例と
同様とされている。In another embodiment of the present invention (hereinafter referred to as the second embodiment), the insulating resin base material 2 is in a paste form (gel form). In the second embodiment, except that the insulating resin base material 2 has a paste shape,
The material of the insulating resin base material 2, the particle size and the dispersion density of the fine particles 3 of the shape memory alloy dispersed and contained are the same as those in the above-mentioned embodiment.
【００２１】次に、この第２実施例により面実装タイプ
等のダイオ−ドやトランジスタ等の電子部品において、
チップをボンディングする場合について説明する。な
お、この場合、チップに過大な圧力が加わると素子破壊
が生じるおそれがあるため、予め形状記憶合金の微粒子
３に初期歪を付与させておくのが好ましい。Next, according to the second embodiment, in an electronic component such as a diode of a surface mounting type or a transistor,
The case of bonding chips will be described. In this case, if excessive pressure is applied to the chip, the element may be destroyed. Therefore, it is preferable to give the shape memory alloy fine particles 3 an initial strain in advance.
【００２２】まず、リ−ドの所定部位にペ−スト状の電
子部品用接合材料１を所定厚みに塗布または印刷する。
この際の厚みは、微粒子３の粒径（初期歪を付与させた
場合は、その付与後の粒径）より大であればよい。つい
でペ−スト状の電子部品用接合材料１が塗布されたリ−
ドをチップ所定位置に位置決めする。この状態で、電子
部品用接合材料１の絶縁性樹脂基材２の硬化温度まで加
熱する。この場合、所望により適度に加圧する。しかる
のち、形状記憶合金の微粒子３の臨界温度まで加熱す
る。この加熱は先の加熱と連続的に行ってもよい。First, a paste-like bonding material for electronic parts 1 is applied or printed in a predetermined thickness on a predetermined portion of the lead.
The thickness at this time may be larger than the particle size of the fine particles 3 (when the initial strain is applied, the particle size after the application). Then, a paste coated with the adhesive material 1 for electronic parts
Position the chip in place. In this state, it is heated to the curing temperature of the insulating resin base material 2 of the bonding material 1 for electronic parts. In this case, the pressure is moderately increased if desired. Then, the shape memory alloy fine particles 3 are heated to the critical temperature. This heating may be performed continuously with the previous heating.
【００２３】この第２実施例の奏する作用・効果も前記
実施例と同様である。ただし、絶縁性樹脂基材２がペー
スト状とされていることにより、その適用範囲は拡大す
る。The operation and effect of the second embodiment is also the same as that of the above embodiment. However, since the insulating resin base material 2 is in a paste form, its application range is expanded.
【００２４】以上、本発明を２つの実施例に基づいて説
明してきたが、本発明の電子部品用接合材料の適用は前
記に限定されるものではなく、各種の電子部品の接合、
あるいは電子機器の実装構造に好適に用いることができ
る。例えば、面実装タイプ、リードタイプ等の電子部品
における半導体素子とリードフレームとの接合、面実装
タイプ、リードタイプ等の電子部品、平面型表示素子、
熱印字ヘッド等を回路基板（フレキシブル基板を含む）
に搭載するときにおける電子部品の電極と回路基板の配
線パターンとの接合、あるいはハイブリッドＩＣ、平面
表示素子、熱印字ヘッド等とコンタクトピンとの接合に
好適に適用することができる。Although the present invention has been described based on two embodiments, the application of the bonding material for electronic parts of the present invention is not limited to the above, and various kinds of electronic parts can be bonded.
Alternatively, it can be suitably used for a mounting structure of an electronic device. For example, surface-mounting type, lead-type or other electronic component bonding of a semiconductor element and a lead frame, surface-mounting type, lead-type or other electronic component, flat display element,
Circuit boards (including flexible boards) such as thermal print heads
It can be suitably applied to joining electrodes of electronic parts and wiring patterns of a circuit board when mounted on a substrate, or joining a hybrid IC, a flat display element, a thermal print head, and the like to a contact pin.
【００２５】[0025]
【発明の効果】以上説明してきたように、本発明の電子
部品用接合材料を用いて接続を行えば、熱サイクルが生
じる環境下や加振力が作用する環境下においても、常に
良好な導通が確保される。また、本発明の電子部品用接
合材料は、比較的低温下で作業できるという効果も奏す
る。As described above, when the bonding material for electronic parts of the present invention is used for connection, good continuity is always maintained even in an environment where a heat cycle occurs or an environment in which an exciting force acts. Is secured. Further, the bonding material for electronic parts of the present invention has an effect that it can be worked at a relatively low temperature.
【００２６】一方、本発明の電子部品用接合材料を用い
た接合部を有する電子機器は、熱サイクルが生じる環境
下や加振力が作用する環境下においても良好な導電性を
有するので、熱印字ヘッド等における製品の信頼性を向
上する。On the other hand, the electronic equipment having the joint part using the jointing material for electronic parts of the present invention has good conductivity even in an environment in which a heat cycle occurs or an environment in which a vibrating force acts. Improve the reliability of products such as print heads.
【図１】本発明の電子部品用接合材料の概略図である。FIG. 1 is a schematic view of a bonding material for electronic parts of the present invention.
【図２】本発明の電子部品用接合材料の使用状況の説明
図である。FIG. 2 is an explanatory view of the usage status of the bonding material for electronic parts of the present invention.
【図３】本発明の電子部品用接合材料における導通確保
の原理の説明図である。FIG. 3 is an explanatory diagram of the principle of ensuring continuity in the bonding material for electronic parts of the present invention.
【図４】従来の電子部品用接合材料の概略図である。FIG. 4 is a schematic view of a conventional bonding material for electronic components.
【図５】従来の電子部品用接合材料の使用状況の説明図
である。FIG. 5 is an explanatory diagram of a usage state of a conventional bonding material for electronic parts.
【図６】従来の電子部品用接合材料における導通不良が
発生する原理の説明図である。FIG. 6 is an explanatory diagram of a principle that a conduction failure occurs in a conventional bonding material for electronic parts.
１ 電子部品用接合材料 ２ 絶縁性樹脂基材 ３ 導電性形状記憶合金の微粒子 ４ 一方の回路基板 ５ 他方の回路基板 1 Electronic Component Bonding Material 2 Insulating Resin Base Material 3 Conductive Shape Memory Alloy Fine Particles 4 One Circuit Board 5 The Other Circuit Board
Claims (2)
・含有してなる電子部品用接合材料において、前記導電
性微粒子として導電性形状記憶合金の微粒子を用いたこ
とを特徴とする電子部品用接合材料。1. A bonding material for electronic parts, comprising conductive fine particles dispersed and contained in an insulating resin base material, wherein fine particles of a conductive shape memory alloy are used as the conductive fine particles. Bonding material for parts.
り電気的に接合されてなる接合部を有することを特徴と
する電子部品または電子機器。2. An electronic component or an electronic device, which has a bonding portion electrically bonded by the bonding material for an electronic component according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21344292A JPH0636613A (en) | 1992-07-16 | 1992-07-16 | Joint material for electronic parts and electronic equipment using the material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21344292A JPH0636613A (en) | 1992-07-16 | 1992-07-16 | Joint material for electronic parts and electronic equipment using the material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0636613A true JPH0636613A (en) | 1994-02-10 |
Family
ID=16639302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21344292A Pending JPH0636613A (en) | 1992-07-16 | 1992-07-16 | Joint material for electronic parts and electronic equipment using the material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636613A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004041951A3 (en) * | 2002-11-04 | 2004-09-16 | Boeing Co | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| US7431981B2 (en) | 2002-11-04 | 2008-10-07 | The Boeing Company | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| JP2008303264A (en) * | 2007-06-06 | 2008-12-18 | Panasonic Corp | Electroconductive adhesive, and conduction connection part |
| CN103172587A (en) * | 2011-12-20 | 2013-06-26 | 天津市国际生物医药联合研究院有限公司 | Benzisothiazole-3-ketone-2-amide compound with Caspase-3 inhibiting activity |
-
1992
- 1992-07-16 JP JP21344292A patent/JPH0636613A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004041951A3 (en) * | 2002-11-04 | 2004-09-16 | Boeing Co | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| WO2004041950A3 (en) * | 2002-11-04 | 2004-09-23 | Boeing Co | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| US6989197B2 (en) | 2002-11-04 | 2006-01-24 | The Boeing Company | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| JP2006505655A (en) * | 2002-11-04 | 2006-02-16 | ザ・ボーイング・カンパニー | Polymer composite structure reinforced with shape memory alloy and manufacturing method thereof |
| US7431981B2 (en) | 2002-11-04 | 2008-10-07 | The Boeing Company | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| US8298656B2 (en) | 2002-11-04 | 2012-10-30 | The Boeing Company | Polymer composite structure reinforced with shape memory alloy and method of manufacturing same |
| JP2008303264A (en) * | 2007-06-06 | 2008-12-18 | Panasonic Corp | Electroconductive adhesive, and conduction connection part |
| CN103172587A (en) * | 2011-12-20 | 2013-06-26 | 天津市国际生物医药联合研究院有限公司 | Benzisothiazole-3-ketone-2-amide compound with Caspase-3 inhibiting activity |
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