JPH06349892A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To provide a manufacturing method of a semiconductor device wherein a semiconductor element having electrodes of high density and small intervals are uniformly stably connected with a conductor pattern on a semiconductor device circuit board. CONSTITUTION:On a semiconductor device circuit board 6 on which a conductor pattern 7 provided with a plurality of connection terminal parts 8 covered with solder, one or more semiconductor element substrates 2 which have, on the surface, a plurality of electrode parts 4 corresponding with a plurality of connection terminal parts 8 covered with solder are mounted in the manner in which a plurality of the connection terminal parts 8 covered with solder face a plurality of the electrode parts 4 and are in contact with them. A pressing-heating tool 7 is made to abut against the rear of the semiconductor element substrate 2 facing upward, and the pressure and the heat of the pressing.heating tool 7 are applied to solder via the semiconductor element substrate 2. The solder is fused and soldering is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device in which a semiconductor element substrate is soldered onto a semiconductor device circuit board.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and higher functionality of electronic devices, the number of electrodes of semiconductor elements has increased and the distance between them has decreased, and the number of semiconductor elements has also increased. Therefore, there is a demand for a more stable and simpler mounting method for the semiconductor element.

A manufacturing method in the case of manufacturing an LED print head which is a semiconductor device by using an LED array chip as a semiconductor element by a conventional method of manufacturing a semiconductor device will be described with reference to FIG.

In FIG. 25, LE as a semiconductor element
A plurality of D array chips 51 are linearly arranged. In the LED array chip 51, the other conductor type semiconductor regions are linearly arranged on the main surface of the one conductor type semiconductor element substrate, and the protruding electrode portions 52 are provided in the other conductor type semiconductor regions. In the conventional example, the protruding electrode portion 52 is formed of solder.

Further, a semiconductor device circuit board 54 constituting an LED print head as a semiconductor device has a plurality of conductor patterns arranged in a straight line, and at the end portions of these conductor patterns, the projecting electrode portion 52 is provided. There are connection terminal portions 53 facing each other.

To solder the LED array chip 51 on the semiconductor device circuit board 54, first,
LE on the connection terminal portion 53 of the semiconductor device circuit board 54
The protruding electrode portions 52 of the D array chip 51 are brought into contact with each other, and pressure is applied from the back surface of the one-conductor type semiconductor element substrate to linearly mount the LED array chip 51 on the semiconductor device circuit board 54. This semiconductor device circuit board 54 is placed in an electric furnace or the like and left in high temperature air to heat and melt the solder of the projecting electrode portion 52, take it out into the atmosphere and cool it, and solidify the solder for soldering. Complete.

In the conventional example, a plurality of LED array chips 51, which are semiconductor elements, are linearly arranged and soldered on the semiconductor device circuit board 54 by the above-mentioned method to manufacture an LED print head which is a semiconductor device. is doing.

[0008]

However, in the above manufacturing method, since the entire semiconductor device is heated in the high temperature atmosphere to melt the solder, the heat of solder melting transmitted from the air having a small heat conductivity is It depends on air convection or radiation from the furnace. The heat generated by the convection of air and the radiation from the furnace is partially nonuniform due to the shape of the semiconductor device, and the temperature of the solder of the projecting electrodes is not uniform among the projecting electrodes. Therefore, in one semiconductor element or between a plurality of semiconductor elements, the temperature rises excessively and a short circuit due to solder occurs, or the temperature rise is insufficient and soldering is incomplete, resulting in an open problem. There is.

The present invention solves the above problems and provides a method of manufacturing a semiconductor device, which stably connects a semiconductor element having high-density and closely-spaced projecting electrodes to a conductor pattern of a semiconductor device circuit board. The challenge is to provide.

[0010]

In order to solve the above problems, the semiconductor device manufacturing method according to the first invention of the present application is a semiconductor device circuit having a conductor pattern provided with a plurality of solder-covered connection terminal portions. On the substrate, at least one semiconductor element substrate having a plurality of electrode portions corresponding to the connection terminal portions covered with the plurality of solders on the surface, the connection terminal portion coated with the plurality of solders and the plurality of The semiconductor device is placed so that the electrode parts are in contact with each other, and the pressing / heating tool is brought into contact with the back surface of the semiconductor element substrate facing upward so that the pressing / heating of the pressing / heating tool is performed by the semiconductor element. In addition to the solder through the board,
It is characterized in that the solder is melted and soldered.

A method of manufacturing a semiconductor device according to the second invention of the present application is
In order to solve the above problems, on a semiconductor device circuit board having a conductor pattern including a plurality of connection terminal portions, a plurality of solder-corresponding electrode portions corresponding to the plurality of connection terminal portions are provided on the surface. One or more semiconductor element substrates are placed so that the plurality of connection terminal portions and the electrode portions covered with the plurality of solders are in contact with each other, and the upper surface of the semiconductor element substrate is provided with a back surface. It is characterized in that a pressure / heating tool is brought into contact, pressure and heating of the pressure / heating tool are applied to the solder through the semiconductor substrate, and the solder is melted and soldered.

In order to solve the above-mentioned problems, the method for manufacturing a semiconductor device according to the present invention is such that the pressing / heating tool stops heating after the solder has melted and pressurizes until the solder solidifies. Is preferred.

In the method for manufacturing a semiconductor device of the present invention, in order to solve the above-mentioned problems, it is preferable that the pressing / heating tool simultaneously stop pressing and heating after the solder is melted. is there.

In order to solve the above-mentioned problems, the semiconductor device manufacturing method of the present invention has a plurality of pressing / heating tools, and the pressing / heating tools press the semiconductor element substrate in a one-to-one manner. -It is preferable to heat.

In order to solve the above-mentioned problems, the method of manufacturing a semiconductor device of the present invention is such that one pressing / heating tool presses / heats a plurality of semiconductor element substrates. Is preferred.

Further, in the method for manufacturing a semiconductor device of the present invention, it is preferable that the circuit board of the semiconductor device is fixed on a heating stage in order to solve the above problems.

Further, in the method of manufacturing a semiconductor device of the present invention, in order to solve the above problems, it is preferable that the temperature of the heating stage is lower than the melting point of the solder.

[0018]

According to the method of manufacturing a semiconductor device of the present invention, the pressing / heating tool is brought into contact with the back surface of the substrate of the semiconductor element to heat the solder by heat transfer. From the structure of the semiconductor element, the distance and material from the back surface of the substrate of the semiconductor element to the solder are substantially the same, and the resistance to heat conduction from the back surface to the solder is substantially the same. Therefore, the heating temperature of the solder in each portion is made uniform, and the stability of soldering is improved.

Further, since the heat is transmitted through the connecting terminal portions or the electrode portions themselves which are in contact with each other for soldering, the heating temperature and the heating time are easily controlled, and the molten state of the solder is easily controlled.

When the temperature of the semiconductor device substrate is raised by heating the stage, the temperature of the semiconductor device substrate rises relatively uniformly because the temperature of the semiconductor device substrate has a large heat capacity of the stage. Since the temperature rise due to the pressure / heating tool is reduced, the variation in the final heating temperature of the solder is reduced, and uniform soldering can be performed.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a semiconductor device manufacturing method of the present invention will be described with reference to FIGS.

1 to 4 show a manufacturing method in the case of manufacturing an LED print head which is a semiconductor device using an LED array chip as a semiconductor element according to the first embodiment.

In FIG. 1, an LED as a semiconductor element
The array chip 1 has one conductivity type semiconductor substrate 2, and other conductivity type semiconductor regions are linearly arranged on the main surface of the one conductivity type semiconductor substrate 2. A plurality of aluminum electrodes 3 are linearly arranged on the main surface of the LED array chip 1, one end of the aluminum electrode 3 is connected to another conductivity type semiconductor region, and the other end has an electrode portion. . The electrode portion is the protruding electrode 4 formed of gold in this embodiment.

LED print head 5 which is a semiconductor device
Has an insulating substrate 6 transparent to the emission wavelength of the LED array chip 1 as a semiconductor device circuit substrate, and a connecting terminal portion 8 corresponding to the protruding electrode 4 on the main surface of the transparent insulating substrate 6. And the connection terminal portion 8 of the conductor pattern 7 is formed of solder. In particular, in this embodiment, the solder of the connection terminal portion 8 of the conductor pattern 7 has a melting point of 183 ° C.

The manufacturing apparatus of this embodiment has a pressing / heating tool 9 and a stage 10. Stage 10 is the L
The transparent insulating substrate 6 of the ED print head 5 is fixed. The pressing / heating tool 9 horizontally moves and positions with respect to the stage 10, moves vertically and pressurizes one conductive type semiconductor substrate 2 of the LED array chip 1 as shown in FIG. The temperature rise of the tool 9 itself heats the solder of the connection terminal portion 8 through the one conductivity type semiconductor substrate 2. In this case, the pressing / heating tool 9 has a contact surface parallel to the back surface of the transparent insulating substrate 6 of the LED array chip 1, and the dimension of this contact surface is the same as the dimension of the transparent insulating substrate 6. Substantially equal, one-to-one correspondence with the transparent insulating substrate 6 is applied and pressure is applied.

The operation of the first embodiment will be described with reference to FIGS.

First, as shown in FIG. 1, the transparent insulating substrate 6 of the LED print head 5 is placed on the stage 10. The plurality of protruding electrodes 4 of the LED array chip 1 are brought into contact with the solder of the connection terminal portions 8 of the plurality of conductor patterns 7, and L
The ED array chip 1 is pressurized at 0.5 to 1 kgf / chip, and the tip end portion of the protruding electrode 4 is inserted into the solder of the connection terminal portion 8 as shown in FIG. This is repeated for the required number of LED array chips 1, and as shown in FIG.
The ED array chip 1 is linearly arranged on the transparent insulating substrate 6.

In FIG. 2, the pressing / heating tool 9 is lowered and brought into contact with the back surface of the LED array chip 1 for 1-2 k.
The pressure of gf / chip is applied and the temperature of the pressurizing / heating tool 9 is heated to 190 ° C. The heating of the pressurizing / heating tool 9 melts the solder of the connection terminal portion 8 and about 2
After 0 to 60 seconds have elapsed, an alloy is formed in the contact area between the solder of the connecting terminal portion 8 and the gold of the protruding electrode 4, and the solder of the connecting terminal portion 8 adheres to the protruding electrode 4.

In FIG. 3, the heating of the pressurizing / heating tool 9 is stopped, and the temperature of the solder of the connection terminal portion 8 changes to the freezing point 183.
After the temperature falls below the temperature, the pressing / heating tool 9 is lifted from the back surface of the LED array chip 1 to finish the soldering of the LED array chip 1.

As shown in FIG. 4, the steps of FIGS.
Repeated by the number of LED array chips 1 arranged on the transparent insulating substrate 6 of the ED print head 5, and a plurality of L
The mounting of the ED array chip 1 on the LED print head 5 is completed.

FIG. 5 shows the details of the soldering state in the first embodiment.
~ It demonstrates based on FIG.

5 to 9 are enlarged cross-sectional views of the soldering state of the projecting electrodes 4 and the connection terminal portions 8 in the respective manufacturing steps of FIGS.

In FIG. 5, the LED array chip 1 has 0.5
Since the pressure is applied at ~ 1 kgf / chip, the tip portion of the protruding electrode 4 is embedded in the solder of the connection terminal portion 8,
The solder of the protruding electrode 4 and the connection terminal portion 8 are bonded.

In FIG. 6, the pressurizing / heating tool 9 descends and comes into contact with the back surface of one LED array chip 1 to
The pressure is applied at 2 kgf / chip, and the tip portion of the protruding electrode 4 further digs into the solder of the connection terminal portion 8 and is crushed. Here, if the temperature of the pressurizing / heating tool 9 is set to 190 ° C., LE
Heat is transmitted from the D array chip 1 through the aluminum electrode 3 to heat the protruding electrode 4. When the protruding electrode 4 is heated, the solder of the connection terminal portion 8 starts melting from the surface of the solder that is in contact with the protruding electrode 4, and the solder from the peripheral portion of the protruding electrode 4 melts.

In FIG. 7, when the solder of the connection terminal portion 8 begins to melt, the wettability of the solder of the connection terminal portion 8 causes the solder of the connection terminal portion 8 to be sucked up onto the upper portion of the projecting electrode 4, and 20 to 60 seconds after the start of heating, An alloy of gold of the protruding electrode 4 and solder of the connecting terminal portion 8 is formed in the contact area of the protruding electrode 4 and the solder of the connecting terminal portion 8, and the solder of the connecting terminal portion 8 is sufficiently adhered to the protruding electrode 4. .

In FIG. 8, when the heating of the pressurizing / heating tool 9 is stopped, the solder of the connecting terminal portion 8 falls below the freezing point of 183 ° C., and the solder of the connecting terminal portion 8 solidifies, and the connecting terminal portion 8
No more solder is sucked up. Here, the pressurization / heating tool 9 is raised to stop the pressurization.

In FIG. 9, the LED print head 5 is removed from the stage 10 and naturally cooled to complete the mounting of the LED array chip 1.

FIG. 10 shows that in this embodiment, the LED array chip 1 is produced by pressing and heating the pressing / heating tool 9.
3 is a graph showing changes over time in pressure and temperature applied to any of the protruding electrodes 4 of FIG.

First, at t1, 1 is applied by the pressurizing / heating tool 9.
Pressurization of kgf and heating at 190 ° C. are started simultaneously. The protruding electrode 4 is crushed to a required height and the temperature thereof rises. As the temperature of the protruding electrode 4 rises, the temperature of the solder of the connection terminal portion 8 also rises. At t2, the temperature of the protruding electrode 4 is 183
When the temperature reaches ℃, the solder of the connection terminal portion 8 in contact with the protruding electrode 4 starts to melt. The melting of the solder of the connection terminal portion 8 progresses from t2 to t3, and the melting of the solder of the connection terminal portion 8 is sufficiently performed at t3. When the heating is stopped at t3, the temperature of the solder of the connection terminal portion 8 decreases and reaches the freezing point at t4.

Here, after t4, the protruding electrode 4 is fixed by the solder of the connection terminal portion 8 and therefore the position does not change, that is, the plurality of protruding electrodes 4 are fixed, so that the plurality of protruding electrodes 4 are fixed. The LED array chip 1 having the electrode 4 is fixed to the solder of the connection terminal portion 8 of the LED print head 5. Therefore, even if the pressurization is stopped at t5, LE
The displacement of the D array chip 1 does not occur.

As described above, according to the first embodiment, the LED
The pressure / heating tool 9 is brought into contact with the back surface of the array chip 1, and the pressure / heating tool 9 is brought into contact with the back surface of the one conductive type semiconductor substrate 2 of the LED array chip 1 by heat transfer.
The solder is heating. The distance from the back surface of the one-conductivity-type semiconductor substrate 2 of the LED array chip 1 to the solder of the connection terminal portion 8 and the material thereof are substantially the same from the structure of the LED array chip 1.
The resistance to heat conduction from the back surface to the solder is substantially equal. Therefore, the heating temperature of the solder in each portion is made uniform, and the stability of soldering is improved.

Further, since heat is transmitted through the solder of the connection terminal portion 8 to be soldered and the protruding electrodes 4 which are in contact with each other, the heating temperature and the heating time can be easily controlled, and the melting state of the solder can be controlled. It is easy to control and does not melt the solder in unnecessary areas.
It becomes easy to control the amount of adhesion to the solder, and short-circuit defects due to solder are eliminated.

When the solder is melted, the heating of the pressure / heating tool 9 is stopped after the solder is melted, and the pressurization / heating tool 9 is stopped after the temperature of the solder is below the freezing point. Positional deviation of the LED array chip 1 due to fluidity is prevented.

Next, a second embodiment of the present invention will be described with reference to FIGS.
A description will be given based on 0.

11 to 14 show a second embodiment according to the present invention.
1 shows a manufacturing method for manufacturing an LED print head which is a semiconductor device using an LED array chip as a semiconductor element.

In FIG. 11, LE as a semiconductor element
The structure of the D array chip 1 and the structure of the semiconductor device circuit board 6 of the LED print head 5, which is a semiconductor device, are different from those of the first embodiment. The difference lies in which side of the semiconductor element 1 and the semiconductor device circuit board 6 the solder is attached to. In the first embodiment, the solder is attached to the semiconductor device circuit board 6 side.
In the second embodiment, the solder is attached to the semiconductor element 1 side.

LED array chip 1 which is a semiconductor element
Has a semiconductor substrate 2 of one conductivity type, and semiconductor regions of other conductivity type are linearly arranged on the main surface of the semiconductor substrate 2 of one conductivity type.

A plurality of aluminum electrodes 3 are linearly arranged on the main surface of the LED array chip 1, one end of the aluminum electrode 12 is connected to another conductivity type semiconductor region, and the other end has an electrode portion. ing. The electrode portion is the protruding electrode 13 formed of solder in this embodiment. The melting point of the solder of the protruding electrode 13 of this embodiment is 183 ° C.

LED print head 5 which is a semiconductor device
Has an insulating substrate 6 transparent to the emission wavelength of the LED array chip 1 as a semiconductor device circuit substrate, and a conductor pattern connection terminal corresponding to the projecting electrode 13 on the main surface of the transparent insulating substrate 6. There is a section 15.

The manufacturing apparatus of the second embodiment has a pressing / heating tool 9 and a stage 10 as in FIG. 1 of the first embodiment. The stage 10 fixes the transparent insulating substrate 6 of the LED print head 5. Pressure / heating tool 9
Moves horizontally to the stage 10 for positioning, moves vertically and pressurizes the one conductive type semiconductor substrate 2 of the LED array chip 1 as shown in FIG. 2, and raises the temperature of the tool 9 itself. Thus, the solder of the connection terminal portion 8 is heated through the one conductivity type semiconductor substrate 2. In this case, pressurization
The heating tool 9 has a contact surface parallel to the back surface of the transparent insulating substrate 6 of the LED array chip 1, and the dimension of this contact surface is substantially equal to the dimension of the transparent insulating substrate 6 and the transparent insulating substrate 6 is transparent. The pressure and heat are applied in one-to-one correspondence with the flexible substrate 6.

The operation of the second embodiment will be described with reference to FIGS.

In FIG. 11, the solder of the plurality of protruding electrodes 13 of the LED array chip 1 is brought into contact with the plurality of conductor pattern connecting terminal portions 15 of the transparent insulating substrate 6 to form 0.5 to 1 kg.
Since the pressure is applied at f / chip, the tip of the solder of the protruding electrode 13 is temporarily fixed on the conductor pattern connection terminal portion 15. This is repeated for the required number of LED array chips 1, and a plurality of LED array chips 1 are linearly arranged on the transparent insulating substrate 6 of the LED array chips 1.

In FIG. 12, the pressurizing / heating tool 9 descends and comes into contact with the back surface of one LED array chip 1 to
Pressure is applied at 2 kgf / chip and the temperature of the pressurizing / heating tool 9 is heated to 190 ° C. When the solder of the projecting electrode 13 is melted and about 20 to 60 seconds have elapsed from the start of heating, an alloy is formed in the contact area between the solder of the projecting electrode 13 and the conductor pattern connection terminal portion 15, and the solder of the projecting electrode 13 is formed. Adheres to the conductor pattern connection terminal portion 15.

In FIG. 13, pressurization and heating of the pressurizing / heating tool 9 are finished at the same time, and natural cooling is performed to bring the solder of the protruding electrode 13 to a freezing point of 183 ° C. or lower.

In FIG. 14, the steps of FIGS.
The plurality of LED array chips 1 are linearly mounted on the transparent insulating substrate 6 of the LED array chip 1 by repeating the number of ED array chips 1.

The details of the soldering state in the second embodiment are shown in FIG.
This will be described with reference to FIGS.

FIGS. 15 to 19 are enlarged sectional views showing the states of the solder of the protruding electrodes 13 and the conductor pattern connecting terminal portions 15 of the LED print head 5 in the respective manufacturing steps of FIGS. 11 to 14.

In FIG. 15, the LED array chip 1 has a voltage of 0.
Since the pressure is applied at 5 to 1 kgf / chip, the solder of the protruding electrode 13 is bonded to the conductor pattern connecting terminal portion 15.

In FIG. 16, the pressurizing / heating tool 9 is lowered to contact with the back surface of one LED array chip 1 to
By pressurizing at 2 kgf / chip, the contact area between the solder of the protruding electrode 13 and the conductor pattern connecting terminal portion 15 increases.
Here, if the temperature of the pressure / heating tool is set to 190 ° C, L
Heat is transferred from the ED array chip 1 through the aluminum electrode 3, and the solder of the protruding electrode 13 is heated. Protruding electrode 1
When the solder of No. 3 is heated, the solder of the protruding electrode 13 starts to melt.

In FIG. 17, when the solder of the projecting electrode 13 begins to melt, the wettability of the solder spreads the contact area of the solder of the projecting electrode 13 with the conductor pattern connecting terminal portion 15.
When 20 to 60 seconds have passed from the start of heating, the protruding electrode 13
In the contact area between the solder and the conductor pattern connecting terminal portion 15, an alloy of the solder of the protruding electrode 13 and the conductor pattern connecting terminal portion 15 is formed, and the solder of the protruding electrode 13 is sufficiently applied to the conductor pattern connecting terminal portion 15. Adhere to.

In FIG. 18, heating and pressurization of the pressurizing / heating tool 9 are finished at the same time. At this time, in the process of FIG.
The solder of the protruding electrode 13 of the D array chip 1 is temporarily fixed to the conductor pattern connection terminal portion 15 and is displaced, and
When the solder of the plurality of projecting electrodes 13 of the D array chip 1 is deviated from the contacting conductor pattern connecting terminal portion 15, the solder of the plurality of projecting electrodes 13 is transferred to the conductor pattern connecting terminal portion due to the surface tension of the solder. Move to the center of 15 and go to L
The ED array chip 1 is self-aligned. After that, the temperature of the solder of the protruding electrode 13 becomes 183 ° C. or lower of the freezing point, the solder of the protruding electrode 13 solidifies, and the LED array chip 1 is fixed.

In FIG. 19, the transparent insulating substrate 6 which is the semiconductor device substrate is removed from the stage 8, and the mounting of the LED array chip 1 is completed.

FIG. 20 shows that in the second embodiment, the LED array chip 1 is manufactured by pressing and heating the pressing / heating tool 9.
3 is a graph showing changes over time in pressure and temperature applied to solder of any of the protruding electrodes 13 of FIG.

In FIG. 20, first, at t1, pressurization / heating tool 9 starts pressurization of 1 kgf and heating at 190 ° C. at the same time, and the solder of protruding electrode 13 is crushed to a required height and heated, The temperature of the solder of the strip electrode 13 rises. At t2, the temperature of the solder of the protruding electrode 13 is 183
When the temperature reaches ℃, the solder forming the protruding electrodes 13 begins to melt. The melting of the solder of the protruding electrode 13 progresses from t2 to t3, and the melting of the solder of the protruding electrode 13 is sufficiently performed at t3. When the heating and the pressing of the pressurizing / heating tool 9 are stopped at the same time at t3, the temperature of the solder of the projecting electrodes 13 decreases and reaches the freezing point of 183 ° C. at t4. Same L
Plural protruding electrodes 13 provided on the ED array chip 1
When the solder is displaced toward the end of the conductor pattern connecting terminal portion 15, the solder of the plurality of protruding electrodes 13 is self-aligned due to the surface tension of the melted solder from t3 to t4. After that, at t4, the temperature of the solder reaches the freezing point, and after t4, the position of the solder does not change because it is fixed by the solder of the projecting electrodes 13, that is, the solder of the plurality of projecting electrodes 13 is a transparent semiconductor device substrate. The LED array chip 1 is fixed to the solder by being fixed to the conductor pattern connection terminal portion 15 of the insulating substrate 6.

As described above, according to the second embodiment, the pressing and heating of the pressurizing / heating tool 9 are finished at the same time after the melting of the solder, so that the surface tension of the solder is caused by the surface tension of the solder before the temperature becomes lower than the freezing point. Self-alignment is performed, the contact area between the solder of the plurality of projecting electrodes 13 and the conductor pattern connection terminal portion 15 moves to the center of the connection area of the conductor pattern connection terminal portion 15, and the LED array chip 1 is placed on the semiconductor circuit board 6.
It is possible to correct the positional deviation when temporarily fixed to.

Next, a third embodiment of the present invention will be described with reference to FIG.

The third embodiment shown in FIG. 21 differs from the first embodiment only in the pressure / heating head. In the third embodiment, the LED array chip 1 as a semiconductor element is provided with a plurality of pressurizing / heating heads 17 capable of corresponding one-to-one. Therefore, the LE as a semiconductor element can be operated by one operation.
A plurality of D array chips 1 can be mounted on the LED print head 5 which is a semiconductor device.

Since other matters are the same as those in the first embodiment, the description thereof will be omitted.

Next, a fourth embodiment of the present invention will be described with reference to FIG.

The fourth embodiment shown in FIG. 22 differs from the first embodiment only in the pressure / heating head. In the fourth embodiment, since the pressurizing / heating head 27 capable of accommodating a plurality of LED array chips 1 as semiconductor elements is provided, a plurality of LED array chips 1 as semiconductor elements can be operated by one operation. It can be mounted on the LED print head 5, which is a semiconductor device.

Since other matters are the same as those in the first embodiment, the description thereof will be omitted.

A fifth embodiment of the method of manufacturing a semiconductor device according to the present invention will be described with reference to FIGS. 1 to 9, 23 and 24.

In FIG. 1, the stage 10 is not heated in the first embodiment, but the stage 1 is not used in the fifth embodiment.
0 is also heated.

The fifth embodiment differs from the first embodiment only in the heating of the stage 10.

The operation of the fifth embodiment will be described with reference to FIGS. 1 to 9 and 23.

In FIG. 1, an LED array chip 1 as a semiconductor element has a semiconductor substrate 2 of one conductivity type, and semiconductor regions of other conductivity type are linearly arranged on the main surface of the semiconductor substrate 2 of one conductivity type. There is. A plurality of aluminum electrodes 3 are linearly arranged on the main surface of the LED array chip 1, one end of the aluminum electrode 3 is connected to another conductivity type semiconductor region, and the other end has an electrode portion. . The electrode portion is the protruding electrode 4 formed of gold in this embodiment.

LED print head 5 which is a semiconductor device
Has an insulating substrate 6 transparent to the emission wavelength of the LED array chip 1 as a semiconductor device circuit substrate, and a connecting terminal portion 8 corresponding to the protruding electrode 4 on the main surface of the transparent insulating substrate 6. And the connection terminal portion 8 of the conductor pattern 7 is formed of solder. Particularly in this embodiment, the connection terminal portion 8 of the conductor pattern 7 has a melting point of 18
Use 3 ℃ solder.

The LED array chip 1 is soldered to the connection terminal portions 8 of the plurality of conductor patterns 7 on the transparent insulating substrate 6.
A plurality of protruding electrodes 4 of the LED array chip 1
Is applied at 0.5 to 1 kgf / chip and the protruding electrode 4
The tip end of is inserted into the solder of the connection terminal portion 8. This is repeated for the required number of LED array chips 1 to obtain a plurality of L
The ED array chip 1 is linearly arranged on the transparent insulating substrate 6, and the transparent insulating substrate 6 is placed at a predetermined position of the stage 10 heated to 170 ° C. with the main surface facing upward.
The temperature of the solder of the connection terminal portion 8 is set to 170 ° C.

In FIG. 2, the pressurizing / heating tool 9 is lowered and brought into contact with the back surface of the LED array chip 1, and 1-2 kg.
The pressure of f / chip is applied and the temperature of the pressurizing / heating tool 9 is heated to 190 ° C. The solder of the connection terminal portion 8 melts within 20 seconds from the start of the heating of the pressurizing / heating tool 9, and 20 to 60
After the elapse of sec, the solder of the connection terminal portion 8 adheres to the projecting electrodes 4, and an alloy of solder and gold is formed.

In FIG. 3, the heating of the pressing / heating tool 9 is stopped, and after the temperature of the solder of the connection terminal portion 8 reaches the temperature 170 ° C. of the stage 10, the pressing / heating tool 9 is raised.
The pressure / heating tool 9 is released from the back surface of the LED array chip 1.

In FIG. 4, the steps of FIGS. 1 to 3 are repeated,
A plurality of LED array chips 1 are mounted on the circuit board 4.

The principle of the fifth embodiment will be described with reference to FIGS.
It will be described with reference to FIG.

5 to 9 are enlarged sectional views showing the soldering state of the projecting electrodes 4 and the connection terminal portions 8 in the respective manufacturing steps of FIGS.

In FIG. 5, the LED array chip 1 has 0.5
Since the pressure is applied at ~ 1 kgf / chip, the tip portion of the protruding electrode 4 is embedded in the solder of the connection terminal portion 8,
It is crushed.

In FIG. 6, the temperature of 170 ° C. of the stage 10 is transmitted to the solder of the connecting terminal portion 8 through the transparent insulating substrate 6 and the conductor pattern 7, and the solder having the melting point of 183 ° C. is in the state just before melting.

In FIG. 7, the pressurizing / heating tool 9 is lowered to contact with the back surface of one LED array chip 1 to
The pressure is applied at 2 kgf / chip, and the tip portion of the protruding electrode 4 further digs into the solder of the connection terminal portion 8 and is crushed. Here, if the temperature of the pressurizing / heating tool 9 is set to 190 ° C., L
Heat is transferred from the ED array chip 1 through the aluminum electrode 3 to heat the protruding electrode 4. When the projecting electrode 4 is heated, the solder of the connection terminal portion 8 starts melting from the surface of the solder that is in contact with the projecting electrode 4, and the solder around the projecting electrode 4 melts.

In FIG. 8, the LED array chip 1 heated only by the pressurizing / heating tool 9 has a high temperature in the central portion and a low temperature in the end portions. However, heating the stage 10 causes the entire LED array chip 1 to
Since the solder of the connection terminal portion 8 is heated to 70 ° C. and all of the solder in the connection terminal portion 8 is in a state immediately before melting, when the pressure / heating tool 9 is heated to 190 ° C., the temperature of the connection terminal portion 8 rises by 13 ° C. The solder melts. Therefore, there is almost no time difference between the central portion and the end portion of the LED array chip 1 at which the solder of the connection terminal portion 8 starts melting the solder. Therefore, within a few seconds from the start of heating of the pressurizing / heating tool 9, the protruding electrode 4 is heated to a temperature higher than the melting point of the solder of the connecting terminal portion 8, and when the solder of the connecting terminal portion 8 begins to melt The solder of the connection terminal portion 8 is the protruding electrode 4
Wicks to the top of the. After 20 to 60 seconds have passed from the start of heating, the solder of the connection terminal portion 8 is sufficiently attached to the protruding electrodes 4 at the central portion and the end portion of the LED array chip 1. When the heating of the pressurizing / heating tool 9 is stopped, the solder of the connection terminal portion 8 becomes below the freezing point of 183 ° C., the solder of the connection terminal portion 8 solidifies, and the suction of the solder of the connection terminal portion 8 stops. Further, the solder of the connection terminal portion 8 has a stage temperature of 170 ° C. Here, the pressurization / heating tool 9 is raised to stop the pressurization. In FIG. 9, the transparent insulating substrate 6 is removed from the stage 10 and naturally cooled to complete the mounting of the LED array chip 1.

FIG. 23 shows the pressure and temperature time applied to an arbitrary protruding electrode 4 of the LED array chip 1 by heating the stage 10 and pressing and heating the heating tool 9 in the fifth embodiment. It is a graph which shows change.

First, at t1, the transparent insulating substrate 6 is set to 170
When it is placed on the stage 10 heated to 0 ° C., the solder of the connection terminal portion 8 is heated, and the temperature of the solder reaches 170 ° C. at t2. At t3, the pressurization / heating tool 9 starts pressurization of 1 kgf and heating at 190 ° C. at the same time, and the protruding electrode 4 is crushed and heated to a required height, and the temperature of the solder is also increased as the protruding electrode 4 is heated. To rise. In this case, the solder temperature only changes from 170 ° C to 190 ° C, so t3
To 183 ° C within a short time of several seconds from time t4 to t4, and the same L
Plural protruding electrodes 4 provided on the ED array chip 1
However, there is almost no difference between the central portion and the end portion at the time t4 when reaching 183 ° C. For this reason, the variation in the time from t4 to t5 when the solder of the plurality of connecting terminal portions 8 in contact with the plurality of protruding electrodes 4 is melted is reduced.
The difference in the connection state between the plurality of protruding electrodes 4 in the ED array chip 1 and the solder of the connection terminal portion 8 becomes small, and the soldering state becomes uniform. At t5, the solder has been sufficiently melted, so heating is stopped at t5. The temperature of the solder drops and reaches the freezing point at t6.

After t6, the protruding electrode 4 is connected to the connection terminal portion 8
Since it is fixed by soldering, the position does not change, that is, because the plurality of protruding electrodes 4 are fixed,
The LED array chip 1 having a plurality of protruding electrodes 4 is fixed to a transparent insulating substrate 6 by soldering. Therefore, even if the pressurization is stopped at t7, the LED array chip 1 is not displaced. Further, at t8, the transparent insulating substrate 6 on which the plurality of LED array chips 1 are linearly mounted is removed from the stage 8 and cooled.

FIG. 24 shows connection terminals of a plurality of conductor patterns on the transparent insulating substrate 6 when the LED array chip 1 is heated by the pressing / heating tool 9 in the first and fifth embodiments. 7 is a graph showing a temperature distribution of solder in a portion 8.

In FIG. 24, the vertical axis shows the temperature, and the horizontal axis shows the position of the transparent insulating substrate 6 on which the LED array chip 1 shown in the upper part of the graph is installed.

In FIG. 24, a curve L indicates a plurality of transparent insulating substrates 6 when the LED array chip 1 is heated to 190 ° C. by the pressing / heating tool 9 in the manufacturing method of the first embodiment. 3 is a temperature distribution of the solder of the connection terminal portion 8 at an arbitrary time.

The curve M indicates that the insulating substrate 6 which is transparent by the stage 10 is 170 by the manufacturing method of the fifth embodiment.
LED is heated by pressurizing / heating tool 9 while heating to ℃
It is the temperature distribution of the solder of the some connection terminal part 8 of the transparent insulating substrate 6 at any time when the array chip 1 is heated to 190 degreeC.

Here, at the position A on the transparent insulating substrate 6 in contact with the protruding electrode 4 at the center of the LED array chip 1, the point o on the curve L and the point q on the curve M are At the position B on the transparent insulating substrate 6 which has reached the same temperature but is in contact with the protruding electrode 4 at the end of the LED array chip 1, the point p on the curve L and the point on the curve M are shown. With respect to r, the point r when heated by the stage 10 reaches almost the same temperature as the point q, but the point p where there is no heating by the stage 10 has a large temperature difference from the point o.

As described above, according to the fifth embodiment, the transparent insulating substrate 6 is placed on the heated stage 10,
By heating the solder of the connection terminal portion 8 to the state immediately before melting by the stage 10, the connection between the protruding electrode 4 and the solder of the connection terminal portion 8 due to the temperature difference between the central portion and the end portion of the LED array chip 1 The difference between the states becomes smaller.

[0097]

According to the method for manufacturing a semiconductor device of the present invention, a pressing / heating tool is brought into contact with the back surface of a semiconductor element, and pressing and heating are performed by the tool to form high-density and closely-spaced protruding electrodes. The effect that the connection between the semiconductor element and the conductor pattern of the semiconductor device circuit board can be made stable and uniform is achieved.

If the stage for fixing the semiconductor device circuit board is heated to raise the temperature of the semiconductor device circuit board to near the melting temperature of the solder, the temperature rise due to the pressing / heating tool becomes small. The effect that the variation in the final heating temperature of the solder is reduced and more uniform soldering is possible is achieved.

[Brief description of drawings]

FIG. 1 is an LE according to a first embodiment or a fifth embodiment of the present invention.
FIG. 8 is a diagram showing an operation of the method for manufacturing the D print head.

FIG. 2 is an LE according to the first or fifth embodiment of the present invention.
FIG. 8 is a diagram showing an operation of the method for manufacturing the D print head.

FIG. 3 is an LE according to the first or fifth embodiment of the present invention.
FIG. 8 is a diagram showing an operation of the method for manufacturing the D print head.

FIG. 4 LE according to the first or fifth embodiment of the present invention
FIG. 8 is a diagram showing an operation of the method for manufacturing the D print head.

FIG. 5 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the first embodiment or the fifth embodiment of the present invention.

FIG. 6 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the first embodiment or the fifth embodiment of the present invention.

FIG. 7 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the first embodiment or the fifth embodiment of the present invention.

FIG. 8 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the first or fifth embodiment of the present invention.

FIG. 9 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the first embodiment or the fifth embodiment of the present invention.

FIG. 10 is a graph showing changes with time of pressure and temperature applied to the protruding electrodes in the first example of the present invention.

FIG. 11 is a view showing an operation of the method for manufacturing the LED print head according to the second embodiment of the present invention.

FIG. 12 is a view showing the operation of the method for manufacturing the LED print head according to the second embodiment of the present invention.

FIG. 13 is a diagram showing an operation of the method for manufacturing the LED print head according to the second embodiment of the present invention.

FIG. 14 is a view showing an operation of the method for manufacturing the LED print head according to the second embodiment of the present invention.

FIG. 15 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the second embodiment of the present invention.

FIG. 16 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the second embodiment of the present invention.

FIG. 17 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the second embodiment of the present invention.

FIG. 18 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the second embodiment of the present invention.

FIG. 19 is a cross-sectional view of the protruding electrode and the solder of the connection terminal portion in the manufacturing process of the second embodiment of the present invention.

FIG. 20 is a graph showing changes over time in pressure and temperature applied to the protruding electrodes in the second example of the present invention.

FIG. 21 is a view showing the operation of the method for manufacturing the LED print head according to the third embodiment of the present invention.

FIG. 22 is a view showing an operation of the method for manufacturing the LED print head according to the fourth embodiment of the present invention.

FIG. 23 is a diagram showing changes over time in pressure and temperature applied to the protruding electrodes in the fifth example of the present invention.

FIG. 24 is a diagram showing a temperature distribution on the semiconductor device circuit board in the first and fifth embodiments of the present invention.

FIG. 25 is a diagram showing an operation of a conventional method for manufacturing an LED print head.

[Explanation of Codes] 1 LED array chip (semiconductor element) 2 One-conductor type semiconductor substrate (semiconductor element substrate) 3 Aluminum electrode 4 Protruding electrode (electrode part) 5 LED print head (semiconductor device) 6 Transparent insulating substrate ( Semiconductor device circuit board) 7 Conductor pattern 8 Connection terminal 9 Pressurization / heating tool 10 Stage 13 Aluminum electrode 15 Conductor pattern 17 Pressurization / heating tool 27 Pressurization / heating tool

Claims (8)

[Claims] 1. A plurality of electrode portions corresponding to the connection terminal portions covered with the plurality of solders are formed on a surface of a semiconductor device circuit board having a conductor pattern having the connection terminal portions covered with the plurality of solders. Having one or more semiconductor element substrate, the connection terminal portion covered with the plurality of solder and the plurality of electrode portions are placed so as to face each other, on the back surface of the semiconductor element substrate facing upward, Apply pressure / heating tool
A method of manufacturing a semiconductor device, wherein pressurization and heating of a heating tool are applied to the solder via the semiconductor element substrate, and the solder is melted and soldered. 2. A semiconductor device circuit board having a conductor pattern provided with a plurality of connection terminal portions, and at least one electrode surface covered with a plurality of solder portions corresponding to the plurality of connection terminal portions. A semiconductor element substrate is placed so that the plurality of connection terminal portions and the electrode portions covered with the plurality of solders face each other, and a pressing / heating tool is placed on the back surface of the semiconductor element substrate facing upward. And applying pressure and heat of a pressing / heating tool to the solder via the semiconductor element substrate, and melting and soldering the solder. 3. The pressurizing / heating tool stops heating after the solder is melted and pressurizes until the solder is solidified.
Alternatively, the method for manufacturing the semiconductor device according to the item 2. 4. The method of manufacturing a semiconductor device according to claim 1, wherein the pressing / heating tool simultaneously stops pressing and heating after the solder is melted. 5. The method of manufacturing a semiconductor device according to claim 1, wherein there are a plurality of pressing / heating tools, and the pressing / heating tools press and heat the semiconductor element substrate in a one-to-one manner. . 6. The method of manufacturing a semiconductor device according to claim 1, wherein the pressing / heating tool presses / heats a plurality of semiconductor element substrates by one pressing / heating tool. 7. The method for manufacturing a semiconductor device according to claim 1, 2, 3, 4, 5, or 6, wherein the semiconductor device circuit board is fixed on a heating stage. 8. The method of manufacturing a semiconductor device according to claim 7, wherein the temperature of the heating stage is lower than the melting point of the solder.