JPH06342736A - Manufacture of laminated type ceramic chip capacitor - Google Patents

Abstract

PURPOSE:To thin a dielectric green sheet layer by a method wherein the dielectric green sheet layer and an inner electrode paste layer are formed alternately on a carrier film, two or more laminated bodies, having a plurality of dielectric green sheet layers, are laminated and they are fired. CONSTITUTION:The laminated type ceramic chip capacitor 1 has a capacitor chip body 10 which constitutes a laminated body having a dielectric green sheet layer 2 of 2 to 50 layers formed by alternately laminating a dielectric green sheet layer 2 and an inner electrode paste layer 3, and the outermost layer in the direction of lamination forms a protective layer made of dielectric layer material. Two or more layers are laminated on the laminated body and they are fired. Besides, an external electrode 4, which is communicated to the inner electrode paste layer 3, is provided on the surface of the capacitor chip body 10. As a result, the dielectric green sheet layer 2 can be thinned and they can also be brought into a multilayer state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic chip capacitor.

[0002]

2. Description of the Related Art With the miniaturization of electronic equipment, various multilayer ceramic chip capacitors are required to be miniaturized and have a large capacity.

A multilayer ceramic chip capacitor is usually manufactured by alternately laminating a paste for a dielectric layer and a paste for an internal electrode layer by a sheet method, a printing method, etc., and integrally firing them.

As a laminating method, a green sheet layer is formed on a carrier film by using a dielectric layer paste by a doctor blade method or the like, and an internal electrode layer paste is printed on the green sheet layer. There is a so-called sheet method in which a laminate is formed by peeling and laminating. In addition, a method of alternately printing a dielectric layer paste and an internal electrode paste on a carrier film using a screen printing method to obtain a laminate, and peeling from the carrier film after completion of lamination to obtain a green chip body Is also used.

As a method of reducing the size and increasing the capacity of the multilayer ceramic chip capacitor, a method of reducing the thickness of each dielectric layer and increasing the number of laminated dielectric layers can be considered. However, there are some problems in manufacturing in order to reduce the thickness of each dielectric layer.

When the above-mentioned sheet method is used, if the thickness of each dielectric green sheet layer is 10 μm or less, the sheet thickness is too thin, so that handling during peeling and lamination is difficult.

When the method for obtaining a laminate on a carrier film, which is described in the example of the printing method, is used, the internal electrode layer is usually printed and the unprinted dielectric green sheet layer only is provided. Causes a step. When the dielectric layers are laminated in multiple layers, the margins of the dielectric green sheet layer are significantly deformed due to the step difference. Due to this deformation, a problem such as a short circuit between the internal electrode layers easily occurs in the laminated ceramic chip capacitor after firing.

For these reasons, it has been conventional to manufacture a multilayer ceramic chip capacitor having a multilayer structure of more than 200 dielectric green sheet layers and a dielectric green sheet layer thickness of 10 μm or less. It was difficult.

Japanese Unexamined Patent Publication (Kokai) No. 61-204921 proposes a method for manufacturing a thin layer type multilayer ceramic chip capacitor. In this method, a carrier film a having an adhesive layer formed on the surface layer thereof and another carrier film b having only a single-layer dielectric green sheet layer are provided on the adhesive layer surface of the carrier film a and the dielectric green sheet. The dielectric green sheet layer is pressure-bonded from the back surface of the carrier film b to the adhesive layer of the carrier film a, and then the carrier film b is peeled off. Then, an internal electrode paste layer is printed on the dielectric green sheet layer on the obtained carrier film a. Further, another single-layer dielectric green sheet layer formed on the carrier film b is similarly adhered on the internal electrode layer, and the carrier film b is peeled off. By repeating such an operation, an alternating laminated structure of the dielectric green sheet layers and the internal electrode paste layers is obtained. In this proposal, the thickness of one layer is about 20.
It is said that lamination with a thickness of 10 μm is possible, but if the thickness of one of the dielectric green sheet layers is about 10 μm or less, the carrier film b cannot be peeled from the dielectric green sheet layer after pressure bonding. It is difficult to manufacture a multilayer ceramic chip capacitor having a multilayer structure and a dielectric green sheet layer having a thickness of about 10 μm or less.

[0010]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a multilayer ceramic chip capacitor, which is capable of making the dielectric green sheet layer thinner than before and further increasing the number of layers. To provide.

[0011]

These objects are achieved by the present invention described in (1) to (8) below. (1) Dielectric green sheet layers and internal electrode paste layers are alternately formed on a carrier film to obtain a laminate having 2 to 50 dielectric green sheet layers, and two or more of the laminates are laminated. A method of manufacturing a multilayer ceramic chip capacitor that is fired by firing. (2) The method for producing a multilayer ceramic chip capacitor according to the above (1), in which the carrier film is peeled from the laminated body and then laminated. (3) The method for manufacturing a multilayer ceramic chip capacitor according to (1) above, in which the carrier film is peeled off after laminating the laminated body. (4) The thickness of the dielectric green sheet layer is 0.5 to 5
The method for producing a multilayer ceramic chip capacitor according to any one of (1) to (3) above, wherein the thickness is 0 μm. (5) The thickness of the dielectric green sheet layer is 0.5 to 1
The method for producing a multilayer ceramic chip capacitor according to (4) above, wherein the thickness is 0 μm. (6) The thickness of the internal electrode paste layer is 0.5 to 5 μm.
The method for manufacturing a multilayer ceramic chip capacitor according to any one of (1) to (5) above, wherein m is m. (7) The area of the internal electrode paste layer is 10% or more of the area of the dielectric green sheet layer.
(6) The method for manufacturing a multilayer ceramic chip capacitor according to any one of (6). (8) A green chip body obtained by laminating two or more laminated bodies has an alternating laminated structure of a dielectric green sheet layer and an internal electrode paste layer, and the outermost layer in the laminating direction is a dielectric green sheet material. Above (1), which is a protective layer
(7) A method for manufacturing a multilayer ceramic chip capacitor according to any one of (7).

[0012]

According to the method of manufacturing the multilayer ceramic chip capacitor of the present invention, the dielectric green sheet layers and the internal electrode paste layers are alternately formed on the carrier film to have two or more dielectric green sheet layers. A first laminated body is obtained. Next, the obtained first laminate is peeled from the carrier film, and two or more of the first laminate are further laminated. Alternatively, the carrier film of the obtained first laminated body is not peeled off, the laminated bodies are made to face each other and pressed from the back surface of the carrier film to be laminated, and then the carrier film is peeled off. By repeating such a process, two or more first laminated bodies are further laminated to obtain a green chip body having an arbitrary number of laminated bodies, and this is fired to manufacture a laminated ceramic chip capacitor.

That is, the first laminated layer having two or more dielectric green sheet layers without peeling the dielectric green sheet layer obtained by printing the internal electrode paste layer on the formed dielectric green sheet layer by only one layer. Since the whole body is peeled off, the total thickness of the sheet laminated body to be peeled off is sufficient, and the difficulty of redepositing on the carrier film due to damage of the green sheet during handling, generation of static electricity, etc. is eliminated.

Further, in the first laminated body, the number of laminated layers is limited in order to prevent an accident such as a short circuit between the internal electrodes due to a step caused by a difference in area between the internal electrode paste layer and the dielectric green sheet layer. To do. Therefore, the occurrence of such an accident after firing can be prevented. Therefore, the dielectric layer can be further thinned and multilayered, and the multilayer ceramic chip capacitor can be downsized and its capacity can be increased.

[0015]

Specific Structure The specific structure of the present invention will be described in detail below.

FIG. 1 shows an example of the structure of a multilayer ceramic chip capacitor manufactured according to the present invention.

[Structure of Multilayer Chip Capacitor] As shown in FIG.
Has a capacitor chip body 10 in which dielectric layers 2 and internal electrode layers 3 are alternately laminated, and the outermost layer in the laminating direction is a protective layer of a dielectric layer material. , And an external electrode 4 that is electrically connected to the internal electrode layer 3. The shape of the capacitor chip body 10 is not particularly limited, but is usually a rectangular parallelepiped shape. Also, the size is not particularly limited, and may be an appropriate size according to the application,
Usually (0.5 to 5.6 mm) x (0.5 to 5.0 mm) x
(0.5 to 1.9 mm). The internal electrode layers 3 are laminated so that their end faces are alternately exposed on the two opposing surfaces of the capacitor chip body 10, and the external electrodes 4 are formed on the two opposing surfaces of the capacitor chip body 10 to form a predetermined capacitor. Make up the circuit.

[Raw Materials and Materials] Raw materials and materials used in the present invention will be described below.

<Carrier Film> As the material of the carrier film, any material may be used as long as it has appropriate flexibility at the time of peeling and rigidity as a support, and is usually polyester such as polyethylene terephthalate (PET). Etc. are preferably used.

<Dielectric Layer Paste> The dielectric layer paste is manufactured by kneading a dielectric material and an organic vehicle.

There is no particular limitation on the composition of the dielectric material, and any material, such as a temperature compensating material or a high dielectric constant material, may be used as long as it is usually used for such a multilayer ceramic chip capacitor 1. The material may be, for example, a barium titanate-based material or a lead-containing perovskite-based material, and the composition thereof is not particularly limited.

For example, as a barium titanate-based material for temperature compensation, BaO--TiO ₂ --Nd ₂ O ₃ --Sm ₂ O is used.
Pb (Mg _1/3 Nb _2/3 ) O ₃ -PbTi is used as a lead-containing perovskite material of ₃ series and other high dielectric constants.
Any of O ₃ and various other compositions are preferably used.

The content of the dielectric material in the dielectric layer paste is usually about 30 to 80% by weight. Further, it is usually used as a powder having an average particle size of about 0.1 to 5 μm.

The organic vehicle is a binder dissolved in an organic solvent. The binder used for the organic vehicle is not particularly limited, and may be appropriately selected from various ordinary binders such as ethyl cellulose. The organic solvent used is not particularly limited, and may be appropriately selected from various organic solvents such as terpineol, butyl carbitol, acetone and toluene.

The content of such an organic vehicle in the paste is not particularly limited, and the usual content may be, for example, 1 to 10% by weight of the binder and 10 to 50% by weight of the solvent. Further, the paste may contain additives selected from various dispersants, plasticizers, dielectrics, insulators and the like, if necessary. The total content of these is 1
It is preferably 0% by weight or less.

<Internal Electrode Layer Paste> The internal electrode layer paste is not particularly limited as long as it is usually used in such a laminated ceramic chip capacitor.
It is sufficient to select an electrode material suitable for the dielectric material used,
A conductive material made of various conductive metals or alloys described below, or various oxides, organometallic compounds, resinates, etc., which become the conductive material described below after firing, and the organic vehicle described above are kneaded to prepare.

The conductive materials used are Ag, Pt,
Examples thereof include metals such as Pd, Au, Ni, Co, Fe and Cu, and alloys thereof. When an alloy is used, the content of the metal in the alloy is preferably 95% by weight or more.

[Lamination Method] The lamination method will be described below.

<First Laminating Step> Using the dielectric layer paste and the internal electrode paste, dielectric green sheet layers and internal electrode paste layers are alternately formed on a carrier film to form two or more dielectric layers. A laminated body having a body green sheet layer and having an alternate laminated structure. The laminated body obtained by the first laminating step is referred to as a first laminated body.
At this time, the thickness of each dielectric green sheet layer is preferably 0.5 to 50 μm. Although the manufacturing method of the present invention can be preferably applied in this thickness,
Further, the effect of the manufacturing method of the present invention becomes more remarkable, and the thickness of each dielectric green sheet layer is 0.5 to 10 μm, and further 0.5 to 8 μm. The dielectric green sheet layer having such a thickness is normally about 30 μm or less, more preferably 0.2 to 5 μm, by firing described later.
The dielectric layer 2 has a thickness of about m. If the thickness of each of the dielectric green sheet layers is too large, the acquisition capacity decreases, which is not suitable for increasing the capacity. On the other hand, if the thickness of the dielectric green sheet layer is smaller than the above range, it becomes difficult to form a uniform dielectric layer, and short-circuit defects frequently occur.

The method of forming each dielectric green sheet layer in the first laminating step is not limited as long as it can uniformly form a layer having such a thickness, and for example, a screen printing method, a doctor blade method, The curtain coater method or the like may be used.

The internal electrode paste layer thickness is 0.5 to 5 μm.
Especially, 0.5 to 3.5 μm is preferable. If the internal electrode paste layer thickness is too thick, the number of layers will have to be reduced, and the acquired capacity will decrease, making it difficult to increase the capacity. Furthermore, when stacking the internal electrodes, there is a step between the printed area and the unprinted margin area. Becomes too large, and short circuit defects are likely to occur. On the other hand, if it is too thin, it is difficult to form a uniform layer, and electrode breakage easily occurs.

The area of the internal electrode paste layer is 10% or more, especially 30% or more of the area of the dielectric green sheet layer. If the area is too small, the acquisition capacity is reduced, and there is no point in making the layer thinner. The area of the internal electrode paste layer is usually 90% of that of the dielectric green sheet layer.
It is about the following.

The method of forming the internal electrode paste layer is not limited as long as it can uniformly form such a layer, but the screen printing method is usually preferably used.

The number of layers in the first laminating step is such that the number of dielectric green sheet layers is 2 to 50 layers, preferably 2 to 20 layers. A single dielectric green sheet layer is the same as the conventional sheet method, and if the number of laminated dielectric green sheet layers is too large, problems such as a short circuit between internal electrode layers tend to occur.

<Second Laminating Step> Two or more of the first laminated bodies thus obtained are used, and the second laminating step is carried out to obtain a required number of laminated green chip bodies.

In the second laminating step, the first laminated body on the carrier film is peeled off from the carrier film, and a normal green sheet laminating method is applied so that the dielectric green sheet layers and the internal electrode paste layers alternate with each other. A second laminated body is obtained by laminating in the same manner. Usually, it may be laminated using a laminating machine or the like.

Further, the outermost layer in the stacking direction is
It is preferable to use a dielectric green sheet material layer thicker than the above-mentioned thickness of the dielectric green sheet layer as the protective layer.

The second laminating step may be carried out as follows. That is, the carrier film of the first laminate is not peeled off, and the two sets of laminates with the carrier film are faced to each other. Then, the back surface of one carrier film is fixed, the back surface of the other carrier film is pressed to laminate the laminates, and then one or both carrier films are peeled off to obtain a laminate unit of the laminate. next,
Another first laminated body or laminated unit is similarly laminated on the surface of the laminated unit obtained by peeling the carrier film, and then the carrier film is peeled off. This stacking and peeling process is repeated to produce a second stacked body, and a green chip body having the desired number of stacked layers having the protective layer is obtained. Even in this step, since the carrier film is peeled from the laminate having two or more dielectric green sheet layers, it is possible to prevent accidents such as damage of the dielectric green sheet layers at the time of peeling. In the method of the present invention, either of these two methods may be used, and it may be selected in consideration of the equipment and equipment to be used.

According to the method of the present invention, it is possible to easily laminate a large number of thin layers, and the total number of laminated dielectric green sheet layers is 4 to 500 layers, particularly about 100 to 500 layers. Can be obtained.

[Binder Removal Treatment] Next, the obtained green chip body is subjected to thermocompression bonding, cut into a predetermined size, and then subjected to binder removal treatment. The binder removal treatment performed before firing may be performed under normal conditions, and may be determined depending on the material used and the purpose. The general conditions are shown below.

Temperature rising rate: 5 to 300 ° C./hour, holding temperature: 200 to 600 ° C., temperature holding time: 0.5 to 24 hours, especially 5 to 20 hours, atmosphere: in air

[Firing] The firing conditions for the green chip body are as follows:
It may be appropriately determined according to the types of conductive materials in the dielectric layer paste and the internal electrode layer paste. Generally, it is performed under the following conditions.

Temperature rising rate: 50 to 500 ° C./hour, holding temperature: 1000 to 1400 ° C., temperature holding time: 0.5 to 8 hours, cooling rate: 50 to 500 ° C./hour

[Formation of External Electrode 4] The capacitor chip body obtained as described above is subjected to end face polishing by, for example, barrel polishing or sandblasting, and the external electrode paste is printed or transferred and baked to form the external electrode 4 To form. The firing conditions for the external electrode paste are, for example, 600
It is preferable to set the temperature to about 800 ° C. for about 10 minutes to 1 hour.

Then, if necessary, on the surface of the external electrode 4,
A coating layer is formed by plating or the like.

The multilayer ceramic chip capacitor 1 thus manufactured is mounted on a printed circuit board or the like by soldering or the like, and is used in various electronic devices or the like.

[0047]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to specific examples of the present invention.

Example 1 The following pastes were prepared.

Dielectric layer paste : BaTiO ₃ , (MgCO ₃ ) ₄ having a particle size of 0.1 to 1 μm
_{· Mg (OH) 2 · 5H} 2 O, MnCO 3, BaCO
Powders of ₃ , CaCO ₃ , SiO ₂ , Y ₂ O _{3 and the} like are fired to obtain 100 mol% as BaTiO ₃ , 2 mol% converted to MgO, 0.2 mol% converted to MnO, BaO
3 mol% in terms of Ca, 3 mol% in terms of CaO, Si
The mixture was mixed so as to have a composition of 6 mol% in terms of O ₂ and 2 mol% as Y ₂ O ₃ , wet-mixed for 16 hours by a ball mill, and then dried by a spray dryer to obtain a dielectric material. 100 parts by weight of this dielectric material, 4.8 parts by weight of acrylic resin, 40 parts by weight of methylene chloride, 20 parts by weight of trichloroethane, 6 parts by weight of mineral spirit and 4 parts by weight of acetone were mixed by a ball mill to form a paste.

Internal electrode layer paste : 100 parts by weight of Ni particles having an average particle size of 0.8 μm, 40 parts by weight of an organic vehicle (8 parts by weight of ethyl cellulose resin dissolved in 92 parts by weight of butyl carbitol) and 10 parts of butyl carbitol. 3 parts by weight were kneaded with 3 parts by weight to form a paste.

External electrode paste 100 parts by weight of Cu particles having an average particle size of 0.5 μm, 35 parts by weight of organic vehicle (8 parts by weight of ethyl cellulose resin dissolved in 92 parts by weight of butyl carbitol) and 7 parts by weight of butyl carbitol The parts were kneaded to form a paste.

Using the above dielectric layer paste and internal electrode layer paste, a dielectric green sheet layer having a thickness of 6 μm was formed on a carrier film by a doctor blade method, and an internal electrode paste layer having a thickness of 3 μm was formed thereon. Printed. This operation was repeated 5 times to obtain a first laminate having 5 dielectric green sheet layers. This first laminated body is peeled off from the carrier film, and the second laminated body is obtained by performing a second laminating step with 40 laminated bodies by a laminating machine, thermocompression-bonded and then cut to obtain a dielectric green. Number of laminated sheet layers 2
A second stack of No. 00 was obtained. When the first laminated body was peeled from the carrier film and the second laminating step was performed by the laminating machine, no laminating failure occurred. Further, as both outermost layers in the laminating direction of the second laminated body, five layers of a dielectric green sheet material having a thickness of 30 μm prepared by a doctor blade method were used as protective layers.

The obtained green chip body was cut and debindered by a conventional method, and then at 1240 ° C. in a reducing atmosphere.
Firing was performed for 2 hours. After firing, annealing treatment was performed for the purpose of reoxidation, and a capacitor chip body 10 was obtained.

After polishing the end surface of the obtained capacitor chip body 10 by sandblasting, the above external electrode paste is transferred to the end surface, and the temperature is set to 800 ° C. in an N ₂ + H ₂ atmosphere.
Then, the external electrodes 4 were formed by firing for 10 minutes to obtain a multilayer ceramic chip capacitor 1.

The obtained sample has two dielectric layers 2 stacked.
00 layers, the thickness of each dielectric layer 2 is 4 μm, the thickness of the internal electrode layer 3 is 2 μm, and the size is 3.2 mm ×
It was 1.6 mm × 1.5 mm. The following evaluation was performed using the obtained sample. Almost no short circuit failure was observed. The results are summarized in Table 1.

<Short circuit failure, insulation resistance> Using a high resistance meter (HP-4329A) manufactured by Hewlett-Packard Co., 10 at room temperature
V was applied and measured. It should be noted that one having an insulation resistance of 1 kΩ or less was regarded as a short circuit failure.

<Capacity and Loss> The capacity and loss (tan δ) were measured using an impedance analyzer (HP-4284A) manufactured by Hewlett-Packard Company.

<Breakdown voltage> It was measured using an automatic booster tester.

<Accelerated life of insulation resistance> 25 at 200 ° C.
An acceleration test was performed under an electric field of V, and the time until the resistance became 2 × 10 ⁵ Ω or less was defined as the life time.

[0060]

[Table 1]

Example 2 A multilayer ceramic chip capacitor 1 was prepared in the same manner as in Example 1 except that the thickness of the dielectric green sheet layer was 3 μm.
Got When the first laminated body was peeled from the carrier film and the second laminating step was performed by the laminating machine, no laminating failure occurred.

In the obtained sample, the number of laminated dielectric layers 2 was 2
00 layers, the thickness of each dielectric layer 2 is 2 μm, the thickness of the internal electrode layer 3 is 2 μm, and the size is 3.2 mm ×
It was 1.6 mm × 1.1 mm. The same evaluation as in Example 1 was performed using the obtained sample. Almost no short circuit failure was observed. The results are summarized in Table 1.

Example 3 As a dielectric layer paste, 100 parts by weight of the same dielectric material as in Example 1, 34 parts by weight of an organic vehicle obtained by dissolving 12 parts by weight of ethyl cellulose resin in 88 parts by weight of butyl carbitol, and terpineol 50 parts by weight was kneaded with a three-roll type kneader to form a paste, and the same internal electrode paste as in Example 1 was used.

A dielectric green sheet layer having a thickness of 3.5 μm and a thickness of 3 were formed on the carrier film by screen printing.
An internal electrode paste layer having a thickness of μm was printed alternately to obtain a first laminate having 10 dielectric green sheet layers. The first laminated body was peeled from the carrier film, and the second laminating step was performed by a laminating machine to obtain a second laminated body having 310 layers of dielectric green sheet layers. The first laminate was peeled from the carrier film, and the
When performing the laminating step of No. 1, no laminating failure occurred. Further, as both outermost layers in the laminating direction of the second laminated body, five layers of a dielectric green sheet material having a thickness of 30 μm prepared by a doctor blade method were used as protective layers. The obtained green chip body was treated in the same manner as in Example 1 to obtain a multilayer ceramic chip capacitor 1.

The obtained sample has a dielectric layer 2 having a thickness of 2.5 μm and an internal electrode layer 3 having a thickness of 2.0 μm.
The size was 3.2 mm × 1.6 mm × 1.6 mm.
The same evaluation as in Example 1 was performed using the obtained sample.
Almost no short circuit failure was observed. The obtained results are summarized in Table 1.

Example 4 Implementation was carried out except that the number of laminated dielectric green sheet layers of the first laminated body was set to 5 and the number of laminated layers of the first laminated body in the second laminating step by the laminating machine was set to 62. A multilayer ceramic chip capacitor 1 was obtained in the same manner as in Example 3. The first laminate was peeled from the carrier film, and the
When performing the laminating step of No. 1, no laminating failure occurred.

The obtained sample had a dielectric layer 2 having a thickness of 2.5 μm and an internal electrode layer 3 having a thickness of 2.0 μm.
The size was 3.2 mm × 1.6 mm × 1.6 mm.
The same evaluation as in Example 1 was performed using the obtained sample.
Almost no short circuit failure was observed. The results are summarized in Table 1.

Example 5 The number of laminated dielectric green sheet layers of the first laminated body was 31.
A multilayer ceramic chip capacitor 1 was obtained in the same manner as in Example 3 except that the number of layers of the first laminated body was 10 in the second laminating step by the laminating machine. When the first laminated body was peeled from the carrier film and the second laminating step was performed by the laminating machine, no laminating failure occurred.

The obtained sample has a dielectric layer 2 having a thickness of 2.5 μm and an internal electrode layer 3 having a thickness of 2.0 μm.
The size was 3.2 mm × 1.6 mm × 1.6 mm.
The same evaluation as in Example 1 was performed using the obtained sample.
Almost no short circuit failure was observed. The results are summarized in Table 1.

Example 6 A first laminate having 10 dielectric green sheet layers was obtained on a carrier film in the same manner as in Example 3.

Two carrier films laminated with this first laminate were prepared, and one carrier film was fixed to a support base. Then, the laminated body on the other carrier film and the laminated body on the one carrier film are arranged at positions facing each other, and pressed from the back surface of the laminated surface of the other carrier film to form the first body of the two bodies. The laminated bodies were laminated. Next, the other carrier film was peeled from the laminate. The operation of laminating the first laminate on the surface of the laminate obtained by peeling by the same method was repeated to obtain a second laminate of 200 dielectric green sheet layers. It should be noted that there was no occurrence of stacking failure due to stacking of the first stacks or peeling work when peeling the carrier film. Further, as both outermost layers in the laminating direction of the second laminated body, five layers of a dielectric green sheet material having a thickness of 30 μm prepared by a doctor blade method were used as protective layers. The obtained green chip body was treated in the same manner as in Example 1 to obtain a multilayer ceramic chip capacitor 1.

The obtained sample had a dielectric layer having a thickness of 2.5 μm and an internal electrode layer having a thickness of 2.0 μm.
The size was 3.2 mm x 1.6 mm x 1.1 mm. The same evaluation as in Example 1 was performed using the obtained sample. Almost no short circuit failure was observed. The results are summarized in Table 1.

Comparative Example 1 A film having a thickness of 4 μm was formed on a carrier film in the same manner as in Example 1.
1 dielectric layer was formed, and then an internal electrode paste layer with a thickness of 4 μm was printed, and then peeling work was performed for lamination, but due to damage to the dielectric green sheet layer during work, etc.,
It was impossible to stack.

Comparative Example 2 The same operation as in Comparative Example 1 was carried out except that the thickness of the dielectric layer was set to 6 μm, but the dielectric green sheet layer was damaged during the operation and the lamination was impossible. .

Comparative Example 3 By the screen printing method as in Example 3, the thickness was 6 μm.
Alternately, the dielectric green sheet layers and the internal electrode paste layers with a thickness of 4 μm are alternately arranged, and the
0 layers were laminated. At this time, the thickness of the outermost protective layer in the stacking direction was 150 μm. Using this as a green chip body, a multilayer ceramic chip capacitor 1 was obtained in the same manner as in Example 1. When the short-circuit failure was evaluated using the obtained sample, 79% of the short-circuit failures occurred.

Comparative Example 4 A multilayer ceramic chip capacitor 1 was obtained in the same manner as in Comparative Example 3 except that the number of laminated layers was 200 as the number of dielectric green sheet layers. When the short-circuit defect was evaluated using the obtained sample, 98% of the short-circuit defects occurred.

Table 2 shows the stacking failure rate and the short circuit failure rate of Comparative Examples 1 to 4.

[0078]

[Table 2]

As is clear from Tables 1 and 2, according to the manufacturing method of the present invention, it is possible to reduce the thickness of the dielectric green sheet layer and further increase the number of layers.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration example of a multilayer ceramic chip capacitor.

[Explanation of symbols]

 1 Multilayer Ceramic Chip Capacitor 10 Capacitor Chip Body 2 Dielectric Layer 3 Internal Electrode Layer 4 External Electrode

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takeshi Nomura 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Corporation

Claims (8)

[Claims] 1. A dielectric green sheet layer and an internal electrode paste layer are alternately formed on a carrier film,
A method for producing a laminated ceramic chip capacitor, comprising: obtaining a laminated body having 0 dielectric green sheet layers; laminating two or more of the laminated bodies and firing them. 2. The method for producing a multilayer ceramic chip capacitor according to claim 1, wherein the carrier film is peeled from the laminate and then laminated. 3. The method for manufacturing a laminated ceramic chip capacitor according to claim 1, wherein the carrier film is peeled off after the laminated bodies are laminated. 4. The method for manufacturing a multilayer ceramic chip capacitor according to claim 1, wherein the dielectric green sheet layer has a thickness of 0.5 to 50 μm. 5. The method of manufacturing a multilayer ceramic chip capacitor according to claim 4, wherein the dielectric green sheet layer has a thickness of 0.5 to 10 μm. 6. The internal electrode paste layer has a thickness of 0.
The method for producing a multilayer ceramic chip capacitor according to any one of claims 1 to 5, wherein the thickness is 5 to 5 µm. 7. The method for manufacturing a multilayer ceramic chip capacitor according to claim 1, wherein the area of the internal electrode paste layer is 10% or more of the area of the dielectric green sheet layer. 8. A green chip body obtained by laminating two or more laminated bodies has an alternating laminated structure of a dielectric green sheet layer and an internal electrode paste layer, and an outermost layer in the laminating direction is a dielectric green sheet. The method for producing a multilayer ceramic chip capacitor according to any one of claims 1 to 7, which serves as a protective layer of a material.