JPH06283874A - Heat dissipating member and heat dissipating auxiliary pin - Google Patents

Abstract

PURPOSE:To efficiently dissipate heat in response to the temperature distribution of a heat generator in a heat dissipating member for adhering the generator to conduct heat generated from the generator to be radiated, thereby reducing a temperature rise of the generator. CONSTITUTION:A heat dissipating auxiliary pin 12 is disposed on a heat conducting flat plate 11 in a disposing density responsive to a temperature distribution of a heat generator thereby to remarkably effectively dissipate heat in response to the distribution of the generator.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Field of Industrial Application Conventional Technology (FIG. 6) Problem to be Solved by the Invention (FIG. 6) Means for Solving the Problem (FIGS. 3 and 6) Action Example (FIGS. 1 to 5) Effect of the Invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating member and a heat radiating auxiliary pin, and is preferably applied to a heat radiating member and a heat radiative auxiliary pin in a heat sink such as an IC.

[0003]

2. Description of the Related Art Conventionally, for example, in an MCM (Multi Chip Module) in which a plurality of IC chips are arranged on the same substrate, a heat radiation fin or a pin is provided on the back surface side of the substrate on which the IC chips are arranged. Thus, the heat generated in the IC chip is radiated and radiated.

That is, as shown in FIG. 6, an IC chip serving as a heating element is adhered and fixed to the front surface 2A side of the substrate 2, and the heat dissipation member 1 is fixed to the rear surface side of the substrate 2. The heat radiating member 1 has a plurality of heat radiation fins 1A formed at equal intervals, and air is sent to the heat radiation fins 1A by an air blower so that the heat radiation fins 1A can be arranged according to the arrangement density. The heat of the IC chip is radiated with heat radiation efficiency.

[0005]

By the way, in the heat dissipating member having such a structure, the I disposed on the surface 2A of the substrate 2 is
A portion having a high temperature and a portion having a relatively low temperature are generated on the substrate 2 depending on the position of the C chip, so that a temperature distribution corresponding to the arrangement of the IC chip is generated.

Generally, in order to increase the heat dissipation efficiency, it is necessary to make the arrangement density of the heat dissipation fins 1A high, but in this case, the heat dissipation fins 1A are spread over the entire heat dissipation member.
When the arrangement density of the heat radiation fins 1A is increased, the heat radiation fin 1A is increased particularly in a portion locally heated to a high temperature depending on the arrangement of the IC chips.
Since it becomes difficult to radiate heat from the space, the air blowing means is used to send the cooling air, or the air blowing amount from the air blowing means is increased. When used or adjusted, there was a problem that complicated troubles could not be avoided.

On the other hand, if the arrangement density of the heat radiation fins 1A is made low, it is possible to make it easier for air to flow from the air blowing means, but in this case, if the arrangement density of the heat radiation fins 1A is made low over the entire heat dissipation member. As the heat conduction from the substrate 2 is reduced and the contact area of the heat radiation fins 1A with the air is also reduced, there is a problem that the heat radiation efficiency is deteriorated.

The present invention has been made in consideration of the above points, and is intended to propose a heat dissipation member and a heat dissipation auxiliary pin capable of efficiently dissipating heat according to the temperature distribution of the substrate.

[0009]

In order to solve such a problem, in the present invention, a heat dissipating member 10 for adhering a heat generating element to reduce the temperature rise of the heat generating element by conducting and radiating heat generated from the heat generating element. In, a plurality of heat radiations including a heat conductive flat plate 11 having a heating element adhered to the front surface and a plurality of small holes 11A formed on the back surface, an engaging portion 12B engaging with the small holes 11A and a heat radiation portion 12A for radiating heat The auxiliary pin 12 is provided.

Further, in the present invention, the heat dissipation auxiliary pin 12 provided on the back surface of the heat conductive flat plate 11 is the heat conductive flat plate 11
According to the temperature distribution of the heat-conducting flat plate 11 due to the heating element bonded to the heat-conducting flat plate 11, the heat-conducting flat plate 11 is arranged at a high density in the area AR where the heat generation amount is large.

In the present invention, a heating element is adhered,
In a heat radiating member 10 that reduces the temperature rise of the heating element by conducting and radiating heat generated from the heating element, a heat conductive flat plate 11 having a heating element bonded to the front surface and a plurality of small holes 11A formed on the back surface, Engagement portion 1 that engages with the small hole 11A
2B and a heat radiating portion 12A that radiates heat, and a plurality of heat dissipation auxiliary pins 12 that are selectively attached to the plurality of small holes 11A.

Further, in the present invention, the heat dissipation auxiliary pin 12 provided on the back surface of the heat conductive flat plate 11 is the heat conductive flat plate 11.
According to the temperature distribution of the heat-conducting flat plate 11 due to the heating element bonded to the heat-conducting flat plate 11, the heat-conducting flat plate 11 is arranged at a high density in the area AR where the heat generation amount is large.

In the present invention, a heating element is adhered,
In the heat radiating member 10 that reduces the temperature rise of the heating element by conducting and radiating the heat generated from the heating element, the heat conducting flat plate 11 having the heating element bonded to the surface thereof and the heating element bonded to the heat conducting flat plate 11 According to the temperature distribution of the heat conductive flat plate 11, a flat plate-shaped heat radiation member arranged at a high density is provided in the region AR of the heat conductive flat plate 11 where the heat generation amount is large.

Further, in the present invention, in the heat radiation auxiliary pin 12 mounted on the heat conductive flat plate 11, the heat radiation portion 12A is formed in a cylindrical shape.

Further, in the present invention, in the heat radiation auxiliary pin 22 mounted on the heat conductive flat plate 11, the heat radiation portion 22A has an elliptic cylindrical shape.

Further, in the present invention, in the heat dissipation auxiliary pin mounted on the heat conductive flat plate 11, the heat radiation part is formed in a flat plate shape.

[0017]

[Function] According to the temperature distribution of the heat-conducting flat plate to which the heating element is adhered, the heat radiation auxiliary pins are mounted in the high temperature portion at high density and the heat radiation auxiliary pin is arranged in the relatively low temperature portion at low density. By mounting it, the cooling air can be easily passed through the low temperature portion, and the heat radiation efficiency in the high temperature portion can be improved. Thus, the heat radiated with high radiation efficiency in the high temperature portion can be radiated by sufficient cooling air.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1 in which parts corresponding to those in FIG. 6 are designated by the same reference numerals, 10 indicates a heat dissipation member as a whole, and a heat conductive flat plate 11 is provided on the back surface side of the substrate 2 on which IC chips and the like are arranged on the front surface 2A side. Is stuck.

In this heat conductive flat plate 11, heat dissipation auxiliary pins 12 are vertically fixed on the back surface side of the bonding surface to the substrate 2. That is, as shown in FIG. 2, the heat conductive flat plate 11 has a plurality of screw holes 11A formed on the back surface side of the substrate fixing surface,
As shown in FIG. 3, the heat dissipation auxiliary pin 1 is provided in the screw hole 11A.
2 are screwed together in the screw portion 12B, whereby the heat dissipation auxiliary pin 12 is fixed to the back surface of the heat conductive flat plate 11 by being planted.

The heat dissipation auxiliary pin 12 is a heat conductive flat plate 11
Cylindrical heat radiating section 1 integrated with screw section 12B screwed into
2A is formed. Therefore, the heat dissipation auxiliary pin 12 screwed to the heat conductive flat plate 11 radiates the heat of the heat conductive flat plate 11 into the air through the heat radiation portion 12A.

Here, the heat radiation auxiliary pin 12 fixed to the conductive flat plate 11 by fixing a predetermined screw hole 11A among the screw holes 11A (FIG. 2) formed in the heat conductive flat plate 11 as necessary. By selecting and screwing the screw portion 12B of the heat dissipation auxiliary pin 12 into the selected screw hole 11A, the temperature distribution on the surface of the substrate 2 to which the heat conductive flat plate 11 is fixed is fixed to the heat conductive flat plate 11. The heat dissipation auxiliary pins 12 can be arranged at a suitable arrangement density.

That is, as shown in FIG. 4 (A), a plurality of heat dissipation auxiliary pins 12 are selectively screwed into the screw holes 11A (FIG. 2) of the heat conductive flat plate 11 on the back surface side of the heat conductive flat plate 11. It has been fixed by planting. This heat dissipation auxiliary pin 12
Are arranged so as to have a particularly high density in a region on the back surface side (hereinafter referred to as a high temperature region AR) of the fixing region of the IC chip serving as a heat source fixed to the front surface side of the heat conductive flat plate 11.

Further, outside the high temperature area AR of the IC chip, the heat dissipation pin 1 fixed to the high temperature area AR by erection.
The heat dissipating pins 12 are arranged at a relatively lower disposition density than the disposition density of No. 2.

In the above-mentioned structure, on the back surface side of the heat conductive flat plate 11, by arranging a large number of the heat radiation auxiliary pins 12 in the high temperature area AR in which the IC chips are fixed on the front surface side and arranging them at high density, The contact area becomes larger. On the other hand, outside the high temperature area AR, the number of the heat dissipation auxiliary pins 12 is reduced and the heat dissipation auxiliary pins 12 are sparsely arranged, so that the wind from the blower provided outside is in the high temperature area AR.
Easier to reach.

Therefore, especially in the high temperature region AR, the radiation efficiency can be increased by the many heat dissipation auxiliary pins 12 and the air from the blowing means can be sufficiently supplied, so that the heat radiation amount in the high temperature region AR is high. Can be a lot. Therefore, the cooling air can be sufficiently sent to the high temperature region AR where the heat radiation amount is large, and the high temperature region AR can be sufficiently cooled.

According to the above-mentioned structure, the heat dissipation auxiliary pins 12 of the heat conductive flat plate 11 are arranged at the arrangement density corresponding to the temperature distribution of the substrate 2, so that the temperature distribution corresponding to the temperature distribution of the substrate 2 is generated. Cooling can be performed.

In the embodiment described above, FIG.
As described above, the case where the heat radiation auxiliary pins 12 are evenly arranged at a predetermined arrangement density in the high temperature region AR and the region outside the high temperature region AR has been described, but the present invention is not limited to this, and for example, FIG. )-(D), I
Various arrangements can be applied depending on the mounting position of the heating element such as the C-chip and the direction of the air from the blowing means.

That is, in FIG. 4B, the heat dissipation auxiliary pins 12 are arranged at a high density in the center of the heat conductive flat plate 11, and the heat dissipation auxiliary pins 12 are arranged in the peripheral area where cooling air blown from the outside easily hits. By lowering it, the cooling air can be sufficiently blown even in the central portion where the cooling air is hard to reach, and the heat radiation amount can be increased as a whole.

Further, FIG. 4C shows the case where cooling air is blown from the direction of arrow a. By lowering the arrangement density of the heat dissipation auxiliary pins 12 as it gets closer to the blowing means, cooling is performed even at a position far from the blowing means. The wind can be blown sufficiently. Further, in this case, the heat dissipation auxiliary pins 12 may be arranged in a high temperature region with high density, and cooling air may be blown from the high temperature region side.

Further, FIG. 4D shows an arrow a in the high temperature region AR corresponding to the position where the heat generating element such as an IC chip is attached.
By disposing the heat dissipation auxiliary pin 12 so as to guide the cooling air from the direction, the cooling air can be sufficiently blown to the high temperature region AR.

Further, in the above-mentioned embodiment, the case where the heat dissipation auxiliary pin 12 is fixed by being screwed into the screw hole 11A of the heat conductive flat plate 11 has been described, but the fixing method is not limited to this, and for example, press fitting or the like may be performed. Various other methods can be applied.

In the above embodiment, the case where the columnar heat dissipation auxiliary pin 12 is vertically fixed to the heat conductive flat plate 11 has been described, but the present invention is not limited to this, and a metal wire such as copper is used. Even if a plurality of heat radiation projections are formed on the heat-conducting flat plate 11 or the formation intervals of the heat radiation fins 1A as shown in FIG. 6 are made coarse and dense, the same effect as the above case can be obtained.

Further, in the above-mentioned embodiment, the case where the heat radiation auxiliary pin 12 having the heat radiation portion 12A having a circular cross section is used, but the present invention is not limited to this, and as shown in FIG. The heat radiation auxiliary pin 22 having the heat radiation portion 22A having an elliptical cross section may be used. With this configuration, the blowing resistance can be reduced by setting the cross-section elliptical direction of the heat radiating portion 22A to be the blowing direction of the cooling air.

Further, in the above-mentioned embodiment, the case where the cooling air is blown by using the air blowing means has been described, but the present invention is not limited to this, and the present invention can be applied when the cooling air is not blown. Is.

Further, in the above-mentioned embodiment, the heat radiating member 10 for radiating the heat generated from the MCM or the like has been described, but the present invention is not limited to this, and radiates the heat generated from other various heating elements. It can be widely applied to the heat dissipation member.

[0037]

As described above, according to the present invention, by disposing the heat dissipation auxiliary pins on the heat conductive flat plate with the arrangement density according to the temperature distribution of the heating element, it is more effective according to the temperature distribution of the heating element. A heat dissipation member capable of radiating heat can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a heat dissipation member according to the present invention.

FIG. 2 is a plan view showing a configuration of a heat conductive flat plate.

FIG. 3 is a partial cross-sectional view showing a mounted state of a heat dissipation auxiliary pin.

FIG. 4 is a plan view showing an arrangement example of heat dissipation auxiliary pins.

FIG. 5 is a perspective view showing another embodiment of the heat dissipation auxiliary pin.

FIG. 6 is a perspective view showing a conventional heat dissipation member.

[Explanation of symbols]

1, 10 ... Heat dissipation member, 2 ... Substrate, 11 ... Thermal conductive flat plate, 11A ... Screw hole, 12, 22 ... Heat dissipation auxiliary pin,
12A, 22A ... Heat dissipation part, 12B, 22B ... Screw part.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Minoru Ishikawa 6-735 Kitashinagawa, Shinagawa-ku, Tokyo Sony Corporation

Claims (8)

[Claims] 1. A heat dissipation member for adhering a heating element to reduce the temperature rise of the heating element by conducting and radiating heat generated from the heating element, wherein the heating element is adhered to the front surface and a plurality of the heating elements are attached to the back surface. The heat radiating member comprising: a heat conductive flat plate having a small hole formed therein; and a plurality of heat radiation auxiliary pins including an engaging portion that engages with the small hole and a heat radiating portion that radiates heat. 2. The heat dissipation auxiliary pin provided on the back surface of the heat conductive flat plate generates heat of the heat conductive flat plate according to a temperature distribution of the heat conductive flat plate by the heating element adhered to the heat conductive flat plate. The heat dissipating member according to claim 1, wherein the heat dissipating member is arranged at a high density in a region having a large amount. 3. A heat dissipation member for adhering a heating element to reduce the temperature rise of the heating element by conducting and radiating the heat generated from the heating element, wherein the heating element is adhered to the front surface and a plurality of the heating elements are attached to the back surface. A heat-conducting flat plate having a small hole formed therein, and a plurality of heat dissipation auxiliary pins which are composed of an engaging portion that engages with the small hole and a heat radiating portion that radiates heat, and that is selectively attached to the plurality of small holes. A heat dissipation member characterized by comprising. 4. The heat dissipation auxiliary pin provided on the back surface of the heat conductive flat plate generates heat of the heat conductive flat plate according to the temperature distribution of the heat conductive flat plate by the heating element adhered to the heat conductive flat plate. The heat dissipating member according to claim 2, wherein the heat dissipating member is arranged at a high density in a region having a large amount. 5. A heat-radiating member for adhering a heat-generating body to reduce the temperature rise of the heat-generating body by conducting and radiating heat generated from the heat-generating body. According to the temperature distribution of the heat-conducting flat plate by the heating element adhered to the heat-conducting flat plate, a heat-radiating member having a flat plate protrusion shape arranged in a high density with respect to a region having a large heat generation amount of the heat-conducting flat plate, A heat-dissipating member comprising: 6. The heat dissipation auxiliary pin to be mounted on the heat conductive flat plate, wherein the heat dissipation part has a cylindrical shape. 7. The heat dissipation auxiliary pin mounted on the heat conductive flat plate, wherein the heat radiating portion has an elliptic cylindrical shape. 8. The heat dissipation auxiliary pin mounted on the heat conductive flat plate, wherein the heat radiating portion has a flat plate shape.