JPH06252576A - Electronic device - Google Patents

Abstract

PURPOSE:To improve electromagnetic wave shield effect and to improve package density of an electronic part by providing an electromagnetic wave shield substrate integrally to a housing and by arranging an electronic part inside the housing. CONSTITUTION:An inner wall of a lower member 20 is provided with a flexible copper substrate 40. The copper substrate 40 is comprised of a structure wherein a copper layer 42 is provided on a plastic film 41. The copper substrate 40 can be formed integrally by injection molding of the lower member 20 formed of synthetic resin or can be formed integrally by applying adhesion to the plastic film 41 and laminating it on the lower member 20. The copper layer 42 is etched and forms a circuit pattern. Electronic parts 100 such as an IC such as a memory and CPU, a resistor, a capacitor, and a power supply are mounted on the circuit pattern. Electromagnetic wave noise generated inside a housing is cut off by an electromagnetic wave shield substrate and does not escape outside the housing. Malfunction due to noise of an electronic device in a periphery of an electronic device can be prevented in this way.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, and more particularly to an electronic device which prevents electromagnetic wave noise generated from electronic components in the electronic device from going out of the electronic device.

[0002]

2. Description of the Related Art Generally, game software used for a game machine is written in a mask ROM or the like. The mask ROM and the like are incorporated in the game cartridge and connected to the game machine body. Recently, as the game has become more sophisticated, the CPU on the game machine side
Is a memory for mask ROM, SRAM, etc. as a coprocessor or DSP in the game cartridge which controls the game software and functions as I / O, and at the same time performs high-speed calculation for advancing the game and special data processing. It came to be provided with. Therefore, by mounting a high-performance CPU or DSP on the board in the game cartridge itself, the problem of electromagnetic noise interference generated from electronic components in the cartridge has become serious. Such a problem of electromagnetic wave noise occurs not only in game cartridges but also in all electronic devices such as IC cards, electronic notebooks and notebook personal computers. For this reason, conventionally, in order to prevent this electromagnetic noise interference, an aluminum plate is processed to have a thickness of 1 to 5 mm and is attached to the inside of the housing of the electronic device. Further, a printed circuit board is arranged in the housing of the electronic device, and an electronic component such as an IC is mounted on the printed circuit board.

[0003]

Since the conventional electronic device is constructed as described above, it is difficult to re-process the mounting of the aluminum plate for electromagnetic wave shielding on the housing of the electronic device, and the electronic device itself. However, there have been problems such as being heavy and expensive, and not being able to obtain a sufficient electromagnetic wave shielding effect. Further, since a printed circuit board for mounting electronic components such as ICs is required in the electronic device, the packaging density of electronic components is low, and the electronic device itself becomes heavy.
There was a problem that it could not be downsized. The invention of claim 1 is made in order to solve the above-mentioned problems, and by providing an electromagnetic wave shielding substrate integrally with a housing of an electronic device, the electromagnetic wave shielding effect can be easily obtained in processing. The aim is to obtain excellent electronic devices. It is an object of the present invention to obtain an electronic device having an excellent electromagnetic wave shielding effect and a high packaging density of electronic components by integrally providing an electromagnetic wave shielding substrate and a circuit pattern substrate in a housing. And

[0004]

According to another aspect of the present invention, there is provided an electronic device in which a housing is integrally provided with an electromagnetic wave shield substrate, and electronic components are arranged in the housing. In the electronic device according to the invention of claim 2, an electromagnetic wave shield substrate and a circuit board having a circuit pattern formed on the electromagnetic wave shield substrate are integrally provided in a housing, and electronic components are attached to the circuit board. is there. The electronic device according to the invention of claim 3 is one in which a plurality of circuit boards are laminated.

[0005]

In the electronic device according to the present invention, the electromagnetic wave shielding substrate is integrally provided in the housing, so that an IC such as a CPU or a DSP disposed in the housing.
Electromagnetic wave noise generated from the electromagnetic wave shield board is blocked by the electromagnetic wave shield board from escaping to the outside of the housing, and malfunctions due to noise in electronic equipment around the electronic device are prevented. In the electronic device according to the second and third aspects of the invention, the electromagnetic wave shielding substrate and the circuit board are integrally provided in the housing, and the electronic parts are mounted on the circuit board, so that the CPU and the DSP are provided.
Electromagnetic noise generated from electronic components such as ICs is prevented from escaping to the outside of the housing by the electromagnetic wave shielding substrate, and electronic components can be mounted in the housing in high density and compactly. Can be downsized.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The electronic device of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows a housing 10 for a game cartridge. The housing 10 comprises a lower member 20 and an upper member 30. The structure of the lower member 20 is shown in FIG.
They are shown in (1), (2), and (3), respectively. Moreover, the structure of the upper member 30 is as shown in FIG.
It is shown in (3).

In FIG. 2A, the inner wall of the lower member 20 is provided with a flexible copper substrate 40. The copper substrate 4
0 has a structure in which a copper layer 42 is provided on a plastic film 41. The copper substrate 40 may be integrated by injection-molding the lower member 20 made of synthetic resin, or by applying an adhesive to the plastic film 41 and adhering it to the lower member 20. The copper layer 42 is etched to form a circuit pattern. An electronic component 100 such as a memory, an IC such as a CPU, a resistor, a condenser, a power supply, or the like is mounted on the circuit pattern.

In FIG. 2 (2), the inner wall of the lower member 20 is provided with a flexible copper substrate 40. The copper substrate 4
0 has a structure in which a copper layer 43 is provided on a plastic film 41. The copper substrate 40 may be integrated by injection molding the lower member 20 made of synthetic resin, or may be adhered to the lower member by applying an adhesive to a plastic film to be integrated. This copper layer 43 is
It acts as an electromagnetic wave shield that prevents electromagnetic waves from electronic parts such as ICs and power supplies from being emitted to the outside of the housing.

In this case, a printed circuit board 50 on which the electronic component 100 that is normally used is mounted is provided on the copper substrate 40. In FIG. 2C, the inner wall of the lower member 20 has a flexible copper substrate 40. The copper substrate 4
0 has a structure in which copper layers 42 and 43 are provided on both upper and lower surfaces of the plastic film 41, respectively. The copper substrate 40 may be integrated by injection-molding a lower member 20 made of synthetic resin, or may be integrated by applying an adhesive to the lower copper layer 43 and adhering the lower member. . The copper layer 42 of the copper substrate 40 is etched to form a circuit pattern, and a memory, C
An electronic component 100 such as an IC such as PU, a resistor, a capacitor, a power supply, etc. is mounted. On the other hand, the copper layer 43 acts as an electromagnetic wave shield that prevents electromagnetic waves emitted from electronic components such as ICs and power supplies from being emitted to the outside of the housing.

In FIG. 3A, the inner wall of the upper member 30 has a flexible copper substrate 40. The copper substrate 4
0 has a configuration in which a copper layer 42 is provided on a plastic film 41. The copper substrate 40 may be integrated by injection-molding the upper member 30 made of synthetic resin, or may be integrated by applying an adhesive to a plastic film and adhering it to the upper member. The copper substrate 40 is etched to form a circuit pattern, and an electronic component 100 such as a memory, an IC such as a CPU, a resistor, a capacitor, a power supply or the like is mounted on the circuit pattern.

In FIG. 3B, the inner wall 30 of the upper member is shown.
Has a flexible copper substrate 40. The copper substrate 4
0 has a structure in which a copper layer 43 is provided on a plastic film 41. The copper substrate 40 may be integrated by injection molding the upper member 30 made of synthetic resin.
An adhesive may be applied to the plastic film 41, and the plastic film 41 may be attached to and integrated with the upper member 30. The copper layer 43 is
It acts as an electromagnetic wave shield that prevents electromagnetic waves emitted from electronic parts such as ICs and power supplies from being emitted to the outside of the housing.

In FIG. 3C, the inner wall of the upper substrate 30 is provided with a flexible copper substrate 40. The copper substrate 4
0 has a structure in which copper layers 42 and 43 are provided on both upper and lower surfaces of the plastic film 41, respectively. The copper substrate 40 may be integrated by injection-molding the upper member 30 made of synthetic resin, or by applying an adhesive to the lower copper layer 43 and adhering it to the upper member 30. Good. The upper copper layer 42 forms an etched circuit pattern, and an IC such as a memory, a CPU, a resistor, a capacitor, an electronic component 100 such as a power source is formed on the circuit pattern.
Will be implemented. On the other hand, the lower copper layer 43 acts as an electromagnetic wave shield that prevents electromagnetic waves emitted from electronic components such as ICs and power supplies from being emitted to the outside of the housing. Here, the housing 10 includes a lower member 20 shown in FIGS. 2 (1), (2) and (3) and an upper member 3 shown in FIGS. 3 (1), (2) and (3).
It can be configured by taking any combination with 0.
The input / output terminal 50 of the IC card is preferably provided on the lower member 20, but may be provided on the upper member 30.

Next, in the structure of the flexible copper substrate 40 used in FIGS. 2 (1), (2), (3) and FIGS. 3 (1), (2), (3), as the plastic film, Polyester, polyimide, etc. are used. The film thickness is about 6-125 microns. In addition, it is preferable that the film is subjected to glow discharge plasma treatment so that the surface tension is 54 dyne / cm or more to increase the surface tension. A thin film layer of metal (300-3000 ▲ A ▼, preferably 500-2000 ▲ A) is formed on this film by vacuum deposition or sputtering.
A)) is deposited. Further, electrolytic or electroless metal plating is applied on the metal thin film layer to form a 0.5-35 micron metal plating layer. As the metal for forming the metal vapor deposition layer and the metal plating layer in the previous period, nickel, in addition to copper,
Tin or the like and alloys of these metals or the like are used.

Further, the copper substrate has a structure in which one copper layer is provided on a plastic film, but as shown in FIG. 4, a plurality of films 41 and copper layers 42 may be laminated. . In this case, through holes 44 are formed in the plastic film 41 between the copper layers 42 on which the circuit pattern is formed. The substrate thus formed may be provided with a copper layer 43 for acting as an electromagnetic wave shield. The IC mounted on the circuit pattern may be one provided in the package or a bare chip. Further, the electromagnetic wave sealing substrate may be provided only below the electronic component that generates electromagnetic waves, not in the entire housing.

FIG. 5 is a sectional view showing a substrate 60 made of synthetic resin formed in the shape of the lower member 20 and provided with a copper layer 42 and / or 43 on a plastic film. Electronic components such as ICs are mounted on the circuit pattern of the copper layer 43 on this film. The substrate 62 is fitted into the lower member 20.

FIG. 6 is a top view showing an IC mounted on a circuit pattern formed on a copper layer on a plastic film. The IC mounted here includes a memory 101 such as a ROM and a flash memory, a CPU 102, and a controller 10.
It consists of 3 mag. Further, the mounted IC may be only a memory. Further, it may be composed only of wiring.
In the case of only this wiring, it is also possible to mount a device such as an electronic component or a liquid crystal on the wiring. Further, as shown in the figure, the input / output terminals 70 of the IC chip are preferably arranged along each side of the substrate.

Further, a copper layer may be provided on a plastic film to form an antenna, and the antenna may be attached to the housing. In the above embodiment, the case of the game card lid is described as an example, but the IC card,
It can also be applied to a housing of a notebook PC, an electronic notebook mobile phone, or the like.

[0018]

The electronic device according to the first aspect of the present invention has the excellent electromagnetic wave shielding effect of preventing the electromagnetic wave emitted from the electronic component from going out of the housing because the electromagnetic wave shielding substrate is provided integrally with the housing. . Claims 2 and 3
In the electronic device according to the invention, since the circuit board and the electromagnetic wave shielding substrate are provided integrally with the housing, a high packaging density of electronic components can be obtained, and the electromagnetic waves emitted from the electronic components can be completely shielded.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a housing of an electronic device.

2 (1), (2) and (3) are cross-sectional views of a lower member of a housing of an electronic device of the present invention.

3 (1), (2) and (3) are cross-sectional views of the upper member of the housing of the electronic device of the present invention.

FIG. 4 is a sectional view showing another embodiment of the circuit board of the electronic device of the present invention.

FIG. 5 is a cross-sectional view of a substrate that fits into a lower member of the electronic device of the present invention.

FIG. 6 is a top view of the electronic component mounted on the circuit board of the electronic device of the present invention.

[Explanation of symbols]

 10 Housing 20 Lower Member 30 Upper Member 42 Circuit Board 43 Electromagnetic Wave Shielding Board 100 Electronic Component

Claims (3)

[Claims] 1. An electronic device comprising an electromagnetic wave shielding substrate integrally provided in a housing, and an electronic component disposed in the housing. 2. An electronic device comprising an electromagnetic wave shielding substrate and a circuit board having a circuit pattern formed integrally on a housing, and electronic components mounted on the circuit board. 3. The electronic device according to claim 2, wherein a plurality of the circuit boards are stacked and provided.