JPH06244539A - Method and apparatus for temporary attachment of anisotropic conductor - Google Patents

Abstract

PURPOSE:To achieve the connection of the conductor with high accuracy and wish high reliability by a method wherein a protective tape for a tapelike anisotropic conductor is separated by an exfoliating operation, while the protective tape is being passed through the back side of an object to be temporarily attached, the protective tape is heated and pressurized in a state that tension is exered together with an exfoliative support tape and the anisotropic conductor is transferred and temporarily attached to a prescribed region face on the object to be temporarily attached. CONSTITUTION:When a tapelike anisotropic conductor 2 one main face of which is supported by an exfoliative support tape 2a and in which a protective tape 2b has been arranged on the other main face is arranged on, and temporarily attached to, e.g. a connecting-pad group region on a circuit board, it is heated and pressurized in a state that the protective tape 2b has been exfoliated in advance, and the anisotropic conductor 2 corresponding to the connecting-pad group region is transferred and temporarily fixed. That is to say, the anisotropic conductor can be transferred and temporarily fixed with high accuracy and surely to a required region face because a complicated operation in which the protective tape 2b only in the region of the anisotropic conductor to be transferred and temporarily fixed is exfoliated is not required and because tension has been exerted on the tapelike anisotropic conductor 2 in a state to transfer and fix it temporarily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for temporarily attaching an anisotropic conductor and a device for temporarily attaching an anisotropic conductor suitable for carrying out the method, and particularly to an electronic component using the anisotropic conductor. The present invention relates to means for electrically / mechanically connecting / mounting on a circuit board surface.

[0002]

2. Description of the Related Art For example, as means for electrically and mechanically connecting and mounting a semiconductor element on a circuit board surface, a low melting point called a bump is formed on a connection pad surface of the circuit board or a terminal surface of the semiconductor element to be mounted. A surface mounting means for arranging a metal and electrically and mechanically connecting corresponding connection pads and terminals to each other is widely known. This surface mounting means is capable of high-density mounting with a simple mounting means, as compared with a case where a semiconductor element is packaged, and outer leads are led out in the plane direction to surface-mount a package type component having a configuration, Many advantages are recognized.

As a modification of the surface mounting means for electrically and mechanically connecting and mounting a semiconductor element on a circuit board surface with a bump interposed on the connection pad surface or terminal surface, the connection pad group surface and the terminal are formed. An anisotropic conductor is integrally interposed between the group surface and the anisotropic conductor region in which the corresponding connection pad surface and the terminal surface are in contact with each other to selectively make the area electrically conductive. Attention is being paid to the implementation means. That is, when the anisotropic conductor is used, reliable electrical connection can be achieved even when the pitch of the connection pads and terminals connecting to each other is relatively small, and mechanical shock This is because electrical and mechanical disengagement is unlikely to occur.

By the way, in mounting using an anisotropic conductor, prior to mounting a semiconductor element or the like on the surface of the circuit board, the surface of the connection pad group of the circuit board or the surface of the semiconductor element and the terminal group is For example, a tape-shaped anisotropic conductor rewound from a reel is cut into a predetermined size, and this cut piece is gripped with, for example, tweezers and placed on the area of the connection pad group area of the circuit board, and then heated with a soldering iron or the like. It is temporarily attached by pressing, that is, an anisotropic conductor of a required size (shape) is temporarily attached to the required area of either the circuit board surface or the semiconductor element surface in advance, and Avoiding simplification or complication.

[0005]

However, in the case of the above-mentioned method of temporarily attaching the anisotropic conductor, the following inconvenient problems are recognized. First of all, the tape-shaped anisotropic conductor must be cut to a predetermined size, and the protective tape must be peeled off from the cut piece when the cut piece is arranged on the connection pad group region surface of the circuit board, for example. For example, the peeling work of the protective tape becomes complicated. Secondly, when the cut pieces from which the protective tape has been peeled off are positioned and arranged, for example, on the connection pad group region surface of the circuit board and then temporarily fixed by heating and pressurizing with a soldering iron or the like, a positional deviation easily occurs. A lot of skill is required to temporarily fix the position with high accuracy and the mass productivity is inferior. Third,
After the temporary fixing, when the peelable support tape on one side of the cut piece of the anisotropically fixed anisotropic conductor is peeled off, the cut piece may be detached from the surface of the circuit board. In any case, the mounting means using an anisotropic conductor is expected to have many advantages and effects, but there are still problems in practical use, and improvement and solution thereof are desired.

The present invention has been made in consideration of the above circumstances, and when surface-mounting a semiconductor element or the like on the surface of a circuit board or the like, highly accurate and highly reliable electrical and mechanical connection can be achieved. An object is to provide a method of temporarily attaching an anisotropic conductor and a temporary attachment device suitable for carrying out the method.

[0007]

A method for temporarily attaching an anisotropic conductor according to the present invention is a tape-like structure in which one main surface is supported by a peelable support tape and the other main surface is provided with a protective tape. A method for temporarily attaching an anisotropic conductor, in which the anisotropic conductor is brought into contact with a predetermined area surface of a temporary attachment object while removing the protective tape, and heated and pressed to transfer and temporarily attach the anisotropic conductor. In, the protective tape of the tape-shaped anisotropic conductor is separated by peeling, and while passing through the back surface side of the temporary attachment target, the peelable support tape is heated and pressed with tension applied to the temporary attachment target. A feature of transferring and temporarily attaching an anisotropic conductor to a predetermined region surface of an object, and a device for temporarily attaching an anisotropic conductor according to the present invention, one main surface of which is supported by a peelable support tape, A tape-shaped anisotropic conductor with a protective tape on the other main surface A first reel for rewinding, a protective tape peeling means for peeling and separating the protective tape of the tape-shaped anisotropic conductor rewound from the first reel, the separated protective tape and peelable support tape A second reel that winds the anisotropic conductor side supported in parallel with each other in parallel, and a side of the anisotropic conductor supported by the protective tape and the peelable support tape that are separated and wound by the second reel. A temporary object mounting table for mounting the temporary object installed in the sandwiched area, and a peelable support tape side facing the temporary object mounting table and supporting an anisotropic conductor. A thermocompression-bonding body for transfer, which is arranged to move forward and backward, and a tension is applied to the anisotropic conductor side supported by the protective tape and the peelable support tape, which are separated in the region where the transfer thermocompression-bonding body moves forward and backward. Tension applying means Characterized by comprising comprises a.

[0008]

According to the temporary attachment method and the temporary attachment device of the present invention, the tape-shaped anisotropic conductor having one main surface supported by the peelable support tape and the other main surface provided with the protective tape. Is placed and temporarily attached to the connection pad group area of the circuit board, for example, the anisotropic conductor corresponding to the connection pad group area is transferred / temporarily applied by heating and pressurizing with the protective tape already removed. Fixed. In other words, not only the complicated work of peeling off the protective tape only in the anisotropic conductor region (corresponding to a cut piece) to be transferred / temporarily fixed, but also in the tape-shaped anisotropic state at the transfer / temporary fixing stage. Since the conductive conductor is provided with tension, highly accurate and reliable transfer / temporary fixing to a required area surface is performed. In addition, after the transfer and temporary fixing of the above, the peelable support tape that partially supports the transfer residual anisotropic conductor and the protective tape peeled for the transfer are again arranged on the other main surface side. Since it is wound up in parallel (in parallel), it is possible to use the partial transfer residual anisotropic conductor.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1, 2 and 3 (a)-(b). FIG. 1 is a cross-sectional view schematically showing a configuration example of a main part of a temporary tacking device suitable for carrying out the method for temporarily tacking an anisotropic conductor according to the present invention, in which one main surface has a peelable support tape 2a. The first reel 3 for winding the tape-shaped anisotropic conductor 2 having the protective tape 2b arranged on the other main surface thereof and the tape-shaped anisotropic conductor 3 rewound from the first reel 1. Protective tape peeling means 4 for peeling and separating the protective tape 2b of the conductor 2 is the second for winding up the separated protective tape 2b and the anisotropic conductor 2c side supported by the peelable support tape 2a. It is a reel. Also,
Reference numeral 5 mounts an object to be attached which is placed in a region sandwiched between the anisotropic conductor 2c supported by the protective tape 2b and the peelable support tape 2a which are separated and wound up by the second reel 4. A mounting table, 6 is a transfer thermocompression-bonding body which is arranged to face the mounting table 5 and which can be moved back and forth on the side of the peelable support tape 2a supporting the anisotropic conductor 2c, and 7 is the transfer thermocompression-bonding body. A pair of tension applying means for applying tension to the anisotropic conductor 2c side supported by the protective tape 2b and the peelable support tape 2a separated in the region where 6 advances and retreats, 8 is the first
It is a support base for supporting the reel 1 and the second reel 4 and supporting the object mounting table 5 like a single beam. Here, the transfer thermocompression-bonding body 6 has a heating unit 6b having a transfer hopper 6a mounted at its tip, a driving unit 6c for moving the heating unit 6b forward and backward (moving up and down), and a downward direction of the driving unit 6c. It is composed of a movement stop portion 6d that controls and stops movement, and the transfer hopper 6a has a size and shape corresponding to the size and shape of the anisotropic conductor 2c to be transferred and temporarily attached, It is configured so that it can be freely attached and detached. The tape-shaped anisotropic conductor 2 includes a peelable support tape 2a made of paper or the like, an anisotropic conductor 2c, and a protective tape 2b made of vinyl or the like, as shown in a sectional view in FIG. It has a structure in which layers are arranged.

Next, an example of carrying out the method for temporarily attaching the anisotropic conductor of the present invention using the anisotropic conductor temporary attachment device having the above-described structure will be described.

First, the reel type tape-shaped anisotropic conductor 2 having the sectional structure shown in FIG.
On the other hand, while being wound (set) around, the protective tape 2b of the tape-shaped anisotropic conductor 2 is peeled off by the protective tape peeling means 3 so as to run under the temporary attachment target mounting table 5 To the second reel 4, and the peelable support tape 2a supporting the separated anisotropic conductor 2c is formed so as to run on the upper side of the temporary attachment target mounting table 5, and the tip end is the second reel. 4 in a state in which they are wound in parallel. Further, a temporary attachment target such as the circuit board 9 is positioned and set on the surface of the temporary attachment target placement table 5, and the heating unit 6b of the transfer thermocompression bonding body 6 is operated to set the transfer hot par 6a. Heat and set to the required temperature (eg 100 ° C). At this time, the transfer hopper 6a is connected to the circuit board 9
Is provided with a tip surface corresponding to the required area surface of. Further, the peelable support tape 2a and the protective tape 2b supporting the anisotropic conductor 2c suspended between the first reel 1 and the second reel 4 are tensioned by a pair of tension applying means 8 to obtain a required tension. To accompany.

In this state, the peelable support tape 2a and the protective tape 2b supporting the anisotropic conductor 2c suspended between the first reel 1 and the second reel 4 are integrally run. By the drive unit 6c of the transfer thermocompression bonding body 6,
Lower the transfer hot par 6a heated to a predetermined temperature,
The anisotropic conductor 2c is transferred to the required area surface of the circuit board 9 by heating and pressurizing at a pressure of about 2 to 3 kgf / cm ^{2 for} a time of about 2 to 3 seconds. FIG. 3 (a) schematically shows this heating / pressurizing / transferring mode, in which the anisotropic conductor 2c supported on the surface of the peelable support tape 2a is the transfer hot par.
With the shape and size separated corresponding to the tip surface of 6a,
It is selectively transferred and temporarily attached to the surface of the circuit board 9. In this way, after the transfer and temporary attachment of the anisotropic conductor 2c is completed,
As schematically shown in FIG. 3 (b), the transfer hopper 6a heated to a predetermined temperature is raised by the drive unit 6c,
While preparing for the next heating / pressurization / transfer, the circuit board 9 on the surface of the object mounting table 5 is replaced or the circuit board 9 is moved (the transferred area is shifted), and then the anisotropic conductor 2c is moved.
Transfer and temporary attachment by heating and pressing. In the step of transferring / temporarily attaching the anisotropic conductor 2c by heating and pressing, a pair of tension applying means arranged on the peelable support tape 2a supporting the anisotropic conductor 2c with the transferred region sandwiched therebetween. Since the required tension is applied by No. 8, it was possible to transfer and temporarily attach the anisotropic conductor 2c to the required area surface with high accuracy without causing positional deviation. It should be noted that the present invention is not limited to the above example, and can be implemented in various modifications without departing from the spirit of the invention described above. For example, the transfer / temporary target of the anisotropic conductor may be a semiconductor element instead of the circuit board.

[0013]

As described above, according to the method for temporarily attaching an anisotropic conductor and the apparatus for temporarily attaching an anisotropic conductor according to the present invention, it is possible to easily, surely, and anisotropically provide a good dimensional accuracy. It is possible to temporarily attach the conductive conductor to the surface of the required area of the circuit board with high accuracy. Therefore, a highly reliable means for utilizing this type of anisotropic conductor for surface mounting and connection,
In addition, it can be said that it greatly contributes to the configuration of a high-density mounted circuit device.

[Brief description of drawings]

FIG. 1 is a cross-sectional view schematically showing a configuration example of a main part of an anisotropic conductor temporary attachment device according to the present invention.

FIG. 2 is a cross-sectional view showing a structural example of a tape-shaped anisotropic conductor used in the method for temporarily attaching an anisotropic conductor according to the present invention.

FIG. 3 schematically shows an example of a method k of temporarily attaching an anisotropic conductor according to the present invention, in which (a) shows a state in which an anisotropic conductor is heated and pressed and transferred onto a circuit board surface. Sectional view showing (b)
FIG. 4B is a cross-sectional view showing a state after the anisotropic conductor is heated and pressed and transferred onto the surface of the circuit board.

[Explanation of symbols]

1 ... First reel 2 ... Tape-shaped anisotropic conductor
2a ... Peelable support tape 2b ... Protective tape 2c ... Anisotropic conductor 3 ... Protective tape peeling means 4 ... Second reel 5 ... Temporary object mounting table 6 ... Transfer thermocompression bonding body 6a ... Transfer hot par 6b … Heating part 6c… Drive part 6d… Movement stop part
7 ... Tension applying means 8 ... Support base 9 ... Circuit board

Claims (2)

[Claims] 1. A tape-shaped anisotropic conductor, one main surface of which is supported by a peelable supporting tape and the other main surface of which is provided with a protective tape, is removed from the protective tape, and a predetermined region of an object to be temporarily attached. In a method of temporarily attaching an anisotropic conductor by bringing the anisotropic conductor into contact with the surface and applying heat and pressure, the protective tape of the tape-shaped anisotropic conductor is separated by peeling and temporarily attached. While passing through the back side of the object, heat and pressure are applied together with the peelable support tape under tension, and an anisotropic conductor is temporarily attached to the surface of a predetermined area of the object to be attached. Temporary attachment method for anisotropic conductor. 2. A first reel for rewinding a tape-shaped anisotropic conductor, one main surface of which is supported by a peelable support tape and the other main surface of which is a protective tape, and the first reel. The tape-shaped anisotropic conductor rewound from the protective tape peeling means for peeling and separating the protective tape, and the anisotropic conductor side supported by the separated protective tape and the peelable support tape are parallel to each other. Second to wind up
And a temporary attachment for placing a temporary attachment object placed in a region sandwiched between the anisotropic conductor side supported by the protective tape and the peelable support tape which are separated and wound up by the second reel. An object mounting table, a transfer thermocompression bonding body that is arranged to face the temporary mounting object mounting table and is movable back and forth on the side of a peelable support tape that supports an anisotropic conductor, and the transfer thermocompression bonding Anisotropic conductive material comprising a protective tape separated in a region where the body advances and retracts and a tension applying means for applying a tension to the anisotropic conductive material side supported by the peelable supporting tape. Temporary body attachment device.