JPH06165975A - Washing device for end edge of substrate - Google Patents

Abstract

PURPOSE:To wash away unnecessary thin films from at least either of both front and rear surfaces of the peripheral edges of a square substrate and removing the unnecessary thin films sticking to positioning members. CONSTITUTION:The square substrate 1 formed with the thin films on the surfaces is imposed and held on a substrate holding means. Washing means for the end edges of the substrate for washing away the unnecessary thin films of the end edges of the square substrate 1 are so provided as to act respectively on the opposite two sides of the square substrate 1. In addition, each of these washing means for the end edges of the substrate is constituted of solvent nozzles 24a, 24b for dissolving the unnecessary thin films by discharging solvents to both the front and rear surfaces at the end edges of the square substrate 1 and suction members 23 which are provided on the outer side at the end edges of the square substrate 1 and suck and discharge the solvents from these solvent nozzles 24a, 24b and the unnecessary thin films. The positioning plates 29 are provided within the suction members 23 to position the square substrate 1 by coming into contact with the peripheral end faces of the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer having a thin film such as a photoresist coating solution, a photosensitive polyimide resin or a dyeing agent for a color filter formed thereon, a glass substrate for a liquid crystal display device or a photomask. A substrate such as a glass substrate or a ceramic substrate for manufacturing a thermal head is held at a predetermined position, a solvent is discharged to the edge of the substrate after the thin film is formed, in order to dissolve and remove the unnecessary thin film on the edge of the substrate. Substrate provided with substrate holding means for mounting and holding a square substrate having a thin film formed on its surface, and edge cleaning means for cleaning and removing unnecessary thin films at the edges of the rectangular substrate held by the substrate holding means The present invention relates to an edge cleaning device.

[0002]

2. Description of the Related Art In a substrate edge cleaning device as described above, it is necessary to hold a substrate at a predetermined position by a substrate holding means prior to its cleaning.
Some were disclosed in Japanese Patent No. 55140.

According to this known example, the fixing pins are provided so as to abut on two sides of the four sides of the square substrate, and the square substrate is placed on the fixing pin side on the two opposite sides. A movable pin that moves to press is provided,
The square board is positioned at a predetermined position by bringing the movable pin and the fixed pin into contact with the four sides of the square board.

[0004]

However, in the case of the above-mentioned known example, in the rectangular substrate after the thin film formation,
Since the unnecessary thin film adheres not only to the surface but also to the peripheral end face, the unnecessary thin film adheres to each of the movable pin and the fixed pin as the movable pin and the fixed pin come into contact with the peripheral end face of the rectangular substrate during positioning. .

For this reason, as the positioning is repeated, unnecessary thin films adhere to the movable pin and the fixed pin to increase the pin diameter, and the positioning accuracy decreases when the next rectangular substrate is positioned. was there. Also,
Part of the unnecessary thin film attached to each of the movable pin and the fixed pin may be peeled off to form particles, which may contaminate the surface of the rectangular substrate.

The present invention has been made in view of such circumstances, and the substrate edge cleaning apparatus of the invention according to claim 1 is structurally configured to reduce the positioning accuracy and particle generation due to the positioning. A substrate edge cleaning device according to a second aspect of the present invention is provided with a positioning member for cleaning and removing an unnecessary thin film on at least one of the front and back surfaces of the peripheral edge of a rectangular substrate. The object of the present invention is to remove the unnecessary thin film adhering to the substrate. Further, the substrate edge cleaning apparatus of the invention according to claim 3 favorably removes the solvent and the unnecessary thin film from the peripheral portion of the rectangular substrate and the positioning member. With the aim of being able to
Further, the substrate edge cleaning device of the invention according to claim 4 aims to enable good recovery of the solvent and unnecessary thin film without scattering to the outside, and the substrate edge of the invention according to claim 5. The edge cleaning device has an object to clean and remove the unnecessary thin film on the peripheral end face of the rectangular substrate and to remove the unnecessary thin film attached to the positioning member.

[0007]

In order to achieve the above-mentioned object, a substrate edge cleaning apparatus according to a first aspect of the present invention mounts and holds a square substrate having a thin film formed on its surface. In a substrate edge cleaning device comprising a holding means and an edge cleaning means for cleaning and removing an unnecessary thin film on the edge of the rectangular substrate held by the substrate holding means, the edge cleaning means comprises:
It also has a positioning function of bringing the substrate holding means into contact with the peripheral end face of the rectangular substrate to hold it at a predetermined position.

Further, in the substrate edge cleaning device of the invention according to claim 2, in order to achieve the above-mentioned object, the edge cleaning means according to claim 1 faces at least a rectangular substrate. Provided so as to act on each of the two sides, and each of those edge cleaning means, a solvent nozzle that discharges the solvent to at least one of the front and back surfaces of the edge of the rectangular substrate to dissolve the unnecessary thin film, A suction member that is provided outside the edge of the rectangular substrate and sucks and discharges the solvent and unnecessary thin film from the solvent nozzle, and a positioning member that contacts the peripheral end surface of the rectangular substrate is provided in the suction member. Configure.

As the solvent to be used, in the case of dissolving the photoresist coating solution, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and diisobutyl ketone, ethyl acetate, butyl acetate, acetic acid-n-amyl acetate, Esters such as methyl formate, ethyl propionate, dimethyl phthalate and ethyl benzoate, aromatic hydrocarbons such as toluene, xylene, benzene and ethylbenzene, tetrahydrofuran, diethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl Ethers such as ether acetate, dimethylformamide, dimethylsulfoxide and the like can be used. Further, when the dyeing agent is dissolved, warm water of 30 to 60 ° C., lower alcohol such as methanol, ethanol, propanol, acetone, etc. can be used, and the rectangular substrate is mixed with these liquids. A surfactant may be added to improve wetting.

In order to achieve the above-mentioned object, the substrate edge cleaning apparatus of the invention according to claim 3 dissolves the edge cleaning means according to claim 2 with a solvent from a solvent nozzle. A gas nozzle that blows off the unnecessary thin film outside the edge of the rectangular substrate by discharging gas is configured. As the gas supplied from the gas nozzle, an inert gas such as nitrogen gas or air can be used.

Further, the substrate edge cleaning device of the invention according to claim 4 is the same as that of claim 2 in order to achieve the above object.
Alternatively, the suction means according to any one of 3 and 4 has a narrow suction port facing the peripheral end face of the rectangular substrate and a wide extension continuous with the suction port, and the suction port is located closer to the extension than the tip of the suction port. A positioning member is provided at the position.

The substrate edge cleaning device of the invention according to claim 5 is the same as that of claim 1 in order to achieve the above object.
The edge cleaning means described in (1) is provided so as to act on at least two opposite sides of the rectangular substrate, and the edge cleaning means respectively slidably contacts the peripheral end surface of the rectangular substrate while rotating. And a cleaning tank in which the cleaning tool is immersed in a non-cleaning position where it does not slide on the peripheral edge surface of the rectangular substrate, and the cleaning tool contacts the peripheral edge surfaces of two opposite sides of the rectangular substrate to form a rectangular shape. It is configured to perform positioning with respect to the substrate.

[0013]

According to the structure of the substrate edge cleaning device of the first aspect of the present invention, the rectangular substrate having a thin film uniformly formed on its surface is positioned at a predetermined position by the positioning function also provided by the edge cleaning means. Placed and held on the substrate holding means in the state, after that, by the edge cleaning means, the unnecessary thin film on the edge of the rectangular substrate such as at least one of the front and back surfaces of the peripheral portion of the rectangular substrate or the peripheral edge surface is washed away. In the series of cleaning / removing, the portion in contact with the peripheral end surface of the rectangular substrate can be cleaned by positioning.

According to the structure of the substrate edge cleaning device of the second aspect of the present invention, the rectangular substrate having a thin film uniformly formed on the surface is used as the positioning member provided in the suction member. The substrate is held and held on the substrate holding means in a state of being brought into contact with the end face and positioned at a predetermined position, and thereafter, the solvent is discharged from the solvent nozzle to at least one of the front and back surfaces of the square substrate to end the square substrate. The unnecessary thin film on the edge can be dissolved, and the solvent and unnecessary thin film can be sucked and discharged by the suction member.
Then, the solvent discharged by suction can wash and remove the unnecessary thin film attached to the positioning member at the time of the above-described positioning.

Further, according to the structure of the substrate edge cleaning apparatus of the third aspect of the present invention, the unnecessary thin film dissolved by the solvent is blown outward from the edge of the substrate by discharging gas from the gas nozzle. The gas can promote the removal of the unnecessary thin film from the positioning member, and the suction member can suck and discharge the thin film.

Further, according to the structure of the substrate edge cleaning apparatus of the fourth aspect of the present invention, the linear velocity for exhausting gas at the suction port can be increased.

According to the structure of the substrate edge cleaning device of the fifth aspect of the present invention, the cleaning tool is in contact with the peripheral end surface of the rectangular substrate and positioned at a predetermined position in the substrate holding means. The substrate is placed and held, and then the cleaning tool is rotated and brought into sliding contact with the peripheral edge surface of the rectangular substrate to clean and remove the unnecessary thin film adhering to the peripheral edge surface of the rectangular substrate, and then the cleaning tool is cleaned. It is possible to remove the unnecessary thin film adhering to the cleaning tool during positioning and cleaning by rotation by immersing in a bath.

[0018]

Embodiments of the present invention will now be described in detail with reference to the drawings.

<First Embodiment> FIG. 1 is an overall schematic plan view of a first embodiment of a substrate edge cleaning apparatus according to the present invention, and FIG. 2 is an overall schematic side view of a partly cutaway surface thereof by spin coating. A substrate edge cleaning device 4 is configured by providing substrate edge cleaning tools 3 as edge cleaning means at four locations around a substrate holding means 2 for mounting and holding a rectangular substrate 1 on which a thin film is formed. ing.

A cylinder support base 7 is provided on the base B so as to be able to move up and down through a first air cylinder 5 and a pair of first guides 6 and 6, and a second air cylinder is mounted on the cylinder support base 7. 8 is provided, and the second air cylinder 8 is integrally provided with a substrate placing plate 9 for placing and holding the rectangular substrate 1 by vacuum suction, and the substrate holding means 2 is configured.

The substrate edge cleaning tool 3 comprises a cleaning tool body 10
A moving means 11 for linearly moving the cleaning tool body 10 along the edge of the rectangular substrate 1 and a position adjusting means 12 for displacing the cleaning tool body 10 with respect to the edge of the rectangular substrate 1. There is.

Support base 13 attached to the base B
Then, the rectangular substrate 1 is provided through the pair of second guides 14, 14.
The movable table 15 is provided so as to be movable in the direction along the edge of
A driving pulley 16 and a driven pulley 17 are attached to the support base 13, a belt 18 is wound around the pulleys 16 and 17, and a first electric motor 19 is interlockingly connected to the driving pulley 16. The moving base 15 is integrally attached to the belt 18, and the moving means 11 is configured to linearly move the cleaning tool body 10 along the edge of the rectangular substrate 1.

A pair of third guides 20, 2 are provided on the movable table 15 as shown in the partially cut-away enlarged side view of the main part of FIG.
0 and the third air cylinder 21, the square substrate 1
A supporting member 22 is provided so as to be movable in a direction approaching and away from the cleaning tool body 10 so that the cleaning tool body 10 can be displaced linearly along the edge of the cleaning tool body 10 according to the size of the rectangular board 1. The position adjusting means 12 is configured.

A suction member 23 is attached to the support member 22 so that the fixed position can be adjusted in the vertical direction.
The first solvent nozzle 24a and the first gas nozzle 25a on the upper side in the vertical direction with the suction port portion 23a sandwiched therebetween, and the second solvent nozzle 24b and the second gas nozzle 25b on the lower side.
Are rotatably mounted around their respective horizontal axis, and the fixing positions are adjustable and supported by tightening the screw members (not shown) through the elongated holes H ... with nuts (not shown). It is attached to the member 22.

Although not shown, a vacuum source is connected to the suction member 23 via an exhaust pipe, and the first and second vacuum sources are connected.
A solvent supply pipe for supplying a solvent capable of dissolving the unnecessary thin film applied to the edge of the rectangular substrate 1 is connected to each of the solvent nozzles 24a and 24b of the rectangular substrate 1, and further, the first and second gas nozzles 25a and 25b, respectively. Is connected to a gas supply pipe for supplying nitrogen gas as a gas, and all of the exhaust pipe, the solvent supply pipe, and the gas supply pipe are flexible so as to allow the cleaning tool body 10 to move. Is composed of a material having

The opening area of the suction port portion 23a of the suction member 23 is smaller than the opening cross-sectional area of the extension portion 23b connected to the suction port portion 23a, and the opening cross-sectional area of the extension portion 23b is suction. The range of the predetermined length from the mouth portion 23a is configured to be smaller toward the suction port portion 23a side, and is configured to be constant in the range exceeding the predetermined length range. It is configured so that the linear velocity can be increased to improve the exhaust efficiency.

Vacuum suction holes (not shown) are dispersedly formed in the substrate mounting plate 9, and a vacuum source 27 is connected to these vacuum suction holes via an intake pipe 26 and an electromagnetic opening / closing valve 26a. The rectangular substrate 1 is mounted on the substrate mounting plate 9 and suction-held.

As shown in the perspective view of the main part of FIG. 4, each of the suction members 23 is a rectangular box-shaped member 28.
Two positioning plates 29, 2 spaced apart in the longitudinal direction by a predetermined distance
9 is provided to divide the internal space into three parts, and branch pipes 30 for suction are connected to the respective internal spaces, and the end faces of the positioning plates 29, 29 have the suction port portion 2.
It is configured to be located near 3a.

A stopper 32 is provided at an intermediate position in the displacement direction of the support member 22 so as to be rotationally displaceable by a second electric motor 31 which can be rotated forward and backward between a position contacting the support member 22 and a non-contact position not contacting the support member 22. The stopper 3 is provided and extends to the stroke end by the third air cylinder 21 to displace the suction member 23 to the positioning position.
By displacing 2 to the contact position and shortening the third air cylinder 21 to displace the support member 22 to the stopper 32, the suction member 23 can be positioned at the suction position. ing. 21a in the figure
Shows an adjusting bolt for finely adjusting the stroke end position of the third air cylinder 21, that is, the positioning position.

With the above configuration, as shown in the side view of the main part of FIG. 5A, the rectangular substrate 1 is placed on the substrate mounting plate 9 with the suction member 23 positioned at the origin position. In this state, the third air cylinder 21 is extended to the stroke end, and the suction member 23 is displaced to the positioning position as shown in the side view of the main part of FIG.
The positioning plates 29 are brought into contact with the peripheral end surface of the rectangular substrate 1 for positioning. At this time, the second electric motor 31 is driven to displace the stopper 32 to the contact position.

After the positioning is completed, the electromagnetic opening / closing valve 26a is opened to hold the rectangular substrate 1 on the substrate mounting plate 9 by vacuum suction, and as shown in the side view of the main part of FIG. The air cylinder 21 of No. 3 is shortened, and the support member 22 is displaced to the position where it abuts the stopper 32, and the suction member 23 is positioned at the suction position.

Thereafter, as shown in the side view of the main part of FIG. 5D, the first and second solvent nozzles 24a, 24 are provided.
b, and the first and second gas nozzles 25a, 25
b, the solvent and the gas are discharged to the edge sides of the front and back surfaces of the rectangular substrate 1 and exhausted from the suction member 23, and the unnecessary thin film at the edge of the rectangular substrate 1 and the positioning plate accompanying the above-described positioning. The unnecessary thin film attached to the end surface of 29 and the solvent can be washed and removed through the suction member 23.

<Second Embodiment> FIG. 6 shows a second embodiment.
(A) is a partially cutaway perspective view of the main part, and (b) is a front view of the main part. In the suction member 23, a positioning plate 33 that comes into contact with the end face of the rectangular substrate 1 and has a narrow width in the vertical direction, 33 is provided, a gap is formed between the ceiling surface of the suction member 23 and each of the bottom plate and the positioning plate 33, and one bottom plate of the suction member 23 has a circular cross section and a relatively small diameter. The pipe 34 of is connected. The other structure is the same as that of the first embodiment, and the description thereof is omitted.

<Third Embodiment> FIG. 7A is a perspective view of an essential part showing a third embodiment, in which the rectangular substrate 1 is attached to the bottom plate at a position near the suction port 23a in the suction member 23. Positioning pins 35, 35 are provided so as to abut the end surface of the. The other structure is the same as that of the first embodiment, and the description thereof is omitted.

The positioning plates 29 and 33 in the first and second embodiments and the positioning pin 35 in the third embodiment are collectively referred to as a positioning member.

<Fourth Embodiment> FIG. 7B is a cross-sectional view of an essential part showing a fourth embodiment. The difference from the first embodiment is as follows. That is, the suction opening 3 is provided on the bottom plate of the suction member 23 so as to extend over the positioning plates 29, 29 and to be connected to the three divided internal spaces.
6 is formed. The other structure is the same as that of the first embodiment, and the description thereof is omitted. In the fourth embodiment, the bottom plate of the suction member 23 may be formed as an inclined surface so that it becomes lower toward the opening 36 side.

<Fifth Embodiment> FIG. 7 (c) is a cross-sectional view of an essential part showing a fifth embodiment. The difference from the first embodiment is as follows. That is, the bottom plate of the suction member 23 is formed with the suction openings 37, 37 so as to extend over both sides of each of the positioning plates 29, 29. The other structure is the same as that of the first embodiment, and the description thereof is omitted.
In the fifth embodiment, the bottom plate of the suction member 23 is opened by the opening 3
It may be configured to have an inclined surface so that it becomes lower on the 7 side.

In the above-mentioned embodiment, the solvent is discharged to both the front and back surfaces of the edge of the substrate. For example, the solvent is supplied to the lower side of the rotatably held rectangular substrate 1 to form the rectangular substrate. For a square substrate 1 on which a thin film is formed by spin coating with a back surface cleaning type spin coating device configured to dissolve and remove a thin film formed around the back surface of the substrate 1, Since the unnecessary thin film on the back side has already been removed,
The solvent may be discharged only to the front surface side of the edge of the rectangular substrate 1, or the solvent may be discharged only to the rear surface side of the edge of the rectangular substrate 1 and wrap around to the front surface due to surface tension. The solvent may be discharged to at least one of the front and back surfaces of the edge of the rectangular substrate 1, such as the above.

<Sixth Embodiment>

FIG. 8 is a partially omitted overall side view showing a sixth embodiment, and FIG. 9 is an overall plan view. In these figures,
Reference numeral 41 denotes a substrate holding means that can be raised and lowered and rotated. The substrate holding plate 41a holds the rectangular substrate 1 in a horizontal posture and holds it by vacuum suction, and the first substrate holding plate 41a in the vertical direction. A third electric motor 41b having a variable rotation speed that is driven and rotated around an axis (rotation center) P1.
It consists of and.

A hollow cylindrical first support column 42 is provided upright on the lateral side of each of a pair of opposing sides of the rectangular substrate 1 in a state of being mounted on the substrate mounting plate 41a. Prop 4
The first support member 43 is rotatably fitted around the second vertical axis (swing axis) P2 in the vertical direction, and
Arm portion 44a protruding horizontally to the supporting member 43 of
Is provided so as to be slidable only in the vertical direction by spline fitting. The second support member 44 is provided at the tip end side of the arm portion 44a of the second support member 44 with the second axis P2. Deviated vertical third axis (rotating axis) P
A cleaning tool 45, which constitutes an edge cleaning means, is provided so as to be rotatable (rotatable) about three parts.

As shown in the partial cutaway side view of FIG. 10, the drive shaft 4 of the cleaning tool 45 is provided on the tip side of the arm portion 44a.
6 is rotatably provided around a third axis (rotating axis) P3, and a driven pulley 47 is attached to the drive shaft 46 thereof, while a fourth pulley is provided at an intermediate position of the arm portion 44a.
The electric motor 48 is provided, the driving pulley 50 is attached to the motor shaft 49 of the electric motor 48, the transmission belt 51 is wound around the driving pulley 50 and the driven pulley 47, and cleaning is performed by the fourth electric motor 48 capable of forward and reverse rotation. It is configured so that the tool 45 can be driven and rotated.

As shown in the partially omitted plan views of FIGS. 10 and 11, the arm 52 is integrally rotatably attached to the first support member 43 and is separated from the first and second support members 43 and 44. A tension spring 53 is connected from a predetermined position to the tip side of the arm 52, and the rectangular substrate 1 is moved at a relatively low speed (for example, one rotation in 20 seconds).
While rotating the cleaning tool 45 at a relatively high speed (for example, 10
While rotating at 0 rpm), the second support member 44 is urged by the urging force of the pulling spring 53 to wash the cleaning tool 45.
Is brought into sliding contact with the end face of the rectangular substrate 1 while being brought into contact with the end face with a constant pressure, and an unnecessary thin film such as a coating liquid adhered to the end face of the rectangular substrate 1 can be washed and removed.

In FIGS. 10 and 11, reference numeral 54 denotes a cleaning release arm rotatably provided around a fourth axis P4 in the vertical direction, and a fourth air cylinder 55 is connected to the cleaning release arm 54. On the other hand, on the arm 52,
A roller 56 that comes into contact with the cleaning release arm 54 is attached,
By shortening the fourth air cylinder 55, the cleaning release arm 54 is brought into contact with the roller 56, the arm 12 is rotated against the urging force of the tension spring 53, and the cleaning tool 45 is moved to the end surface of the rectangular substrate 1. It is configured so that the cleaning operation can be canceled by displacing it to a position where it does not slide.

Further, reference numeral 57 in the figure denotes an adhering matter recovery container provided below the moving range of the cleaning tool 45, in which the cleaning tool 45 does not clean the end surface of the rectangular substrate 1. A cleaning tank 58 that constitutes an edge cleaning unit is provided at a position corresponding to the substrate cleaning position. As shown in FIG. 10, a fork member 59 is provided around the horizontal axis P5, and one end of the fork member 59 has a vertical fifth portion.
The air cylinder 60 is connected, the second support member 44 is engaged with the other end side, and the second support member 44 is expanded by the expansion and contraction of the fifth air cylinder 60, that is,
The cleaning tool 45 can be moved up and down.

With the above structure, the cleaning tool 45 is moved up and down between the position where it is slidably contacted with the end face of the rectangular substrate 1 and the position where the cleaning tool 45 is immersed in the cleaning tank 58 at the above-mentioned non-cleaning position, and the positioning and cleaning process is performed. After that, the cleaning tool 45 is immersed in the cleaning liquid in the cleaning tank 58 to remove the coating liquid adhering to the cleaning tool 45, and thereafter, the cleaning tool 45 is slightly elevated to a higher position.
Is positioned at a shake-off position above the liquid level of the cleaning liquid in the cleaning tank 58, and the cleaning tool 45 is rotated at a high speed in this state to shake off the excess cleaning liquid that has soaked into the cleaning tool 45 after cleaning, and an appropriate amount. With the cleaning liquid soaked in,
It is designed to move to the next cleaning.

A cover member 61 is attached to the arm portion 44a so as to cover the upper periphery of the cleaning tool 45, and the peripheral wall of the cleaning tank 58 and the cover member 61 cover the periphery of the cleaning tool 45 at the above-described swing-off position. , It is configured so that the cleaning liquid does not splash outside when shaken off.

The cleaning tool 45 is constructed by attaching felt to the surface, is constructed by implanting bristles made of nylon, mohair, or the like, or is constructed by winding a porous sponge or cloth. It is possible to adopt something that does.

With the above configuration, the substrate mounting plate 41
After the rectangular substrate 1 is placed on a, both cleaning tools 45, 45
On the other hand, the fourth air cylinder 55 is extended to release the action of the cleaning release arm 54, and the cleaning tools 45, 45 are brought into contact with the peripheral end faces of the two opposite sides of the rectangular substrate 1, and the rectangular substrate 1 1 is sandwiched between both sides, and then the vacuum suction is performed to hold the square substrate 1 by vacuum suction. Then, the square substrate 1 is rotated at a relatively low speed, and the square substrate 1 is attached to the peripheral end surface of the square substrate 1. The cleaning tool 45 is slidably contacted while driving and rotating,
By rotating the square substrate 1 by half, the end faces of all four sides of the square substrate 1 can be continuously washed. Thereafter, as described above, the fourth air cylinder 55 is shortened to actuate the cleaning release arm 54, and the cleaning tool 45 is displaced to the non-cleaning position and then lowered to move the cleaning tool 45 to the cleaning tank 58. The unnecessary thin film adhering to the cleaning tool 45 can be washed and removed by immersing in the inside, and positioning and cleaning.

At the time of cleaning the rectangular substrate 1 described above,
In order to prevent the cleaning tool 45 from moving away from the end surface of the rectangular substrate 1 when it goes over the corner of the rectangular substrate 1, the rectangular substrate 1
The rotation speed of No. 1 is reduced as the cleaning tool 45 moves near the corner.

In addition, during the coating process of the coating liquid on the rectangular substrate 1, the amount of the coating liquid adhered to the end face of the rectangular substrate 1 near the corner portion on the rear side in the rotation direction when the coating liquid is shaken off. Tends to increase. In the present embodiment, since the third electric motor 41b having a variable rotational speed is used, in response to this, as the third electric motor 41b approaches the corner side on the rear side in the rotational direction of the rectangular substrate 1, the corner angle is increased. The rotation speed of the die substrate 1 is reduced, and the sliding contact time by the cleaning tool 45 is increased as the amount of the applied coating liquid is increased to carefully wash the portion, and the end surface of the square substrate 1 is covered over the entire circumference. Can be washed satisfactorily and with good time efficiency.

In implementing the present invention, when both the substrate holding means 41 and the cleaning tool 45 are driven in the clockwise direction so that the substrate holding means 41 and the cleaning tool 45 are rotated in the same direction, the cleaning tool is The cleaning tool 45 slides along the circumferential end surface of the rectangular substrate 1 in a state in which the relative sliding speed of the cleaning tool 45 with respect to the end surface of the rectangular substrate 1 is higher than the rotation speed of the cleaning tool 45. Therefore, the cleaning tool 45 and the rectangular substrate 1
Even if the frictional resistance with the end surface of the rectangular substrate 1 is small, and the biasing force applied by the tension spring 53 is small, the force for scraping off the coating liquid adhering to the end surface of the rectangular substrate 1
That is, the force with which the end surface is rubbed by the cleaning tool 45 is increased, and the cleaning effect associated with sliding is improved.

When the substrate holding means 41 and the cleaning tool 45 are driven in the clockwise direction and the cleaning tool 45 in the counterclockwise direction so that the rotation directions of the substrate holding means 41 and the cleaning tool 45 are opposite,
Since the cleaning tool 45 rotates along the direction in which the end surface of the rectangular substrate 1 relatively moves, even if the frictional resistance between the cleaning tool 45 and the end surface of the rectangular substrate 1 is large, the cleaning tool 45 has a rectangular shape. Board 1
Along the end face of the rectangular substrate 1
It is possible to smoothly get over the corners. Further, the force applied to the end surface of the rectangular substrate 1 as an external force by the rotating cleaning tool 45 acts as a moment in the same direction as the rotation of the rectangular substrate 1, so that the rectangular substrate 1 is placed on the substrate mounting plate 41.
It is possible to reduce the inconvenience such as the occurrence of scratches and the like without causing a deviation with respect to a.

The substrate edge cleaning device of the sixth embodiment is as follows:
It may be configured exclusively for cleaning the end surface of the rectangular substrate 1, or may be configured to also serve as an apparatus for applying a coating liquid such as a photoresist liquid.

The present invention is not limited to the rectangular rectangular substrate 1, but can be applied to the case of cleaning a square rectangular substrate.

[0056]

As is apparent from the above description, according to the substrate edge cleaning apparatus of the invention of claim 1, the edge cleaning means also has a positioning function, so that the rectangular substrate by the edge cleaning means is used. In a series of cleaning removal of unnecessary thin film on the edge of
Positioning makes it possible to clean the area of the rectangular substrate that is in contact with the peripheral edge surface, and avoid positioning the next rectangular substrate with the unnecessary thin film attached without using a dedicated cleaning means. It is possible to avoid the deterioration of the positioning accuracy and the generation of particles due to the structurally simple structure.

According to the structure of the substrate edge cleaning device of the second aspect of the present invention, the unnecessary thin film on at least one of the front and back surfaces of the rectangular substrate is cleaned and removed, and the unnecessary thin film attached to the positioning member is cleaned. Since it can be removed, a special configuration for cleaning the positioning member is unnecessary,
It is possible to avoid the deterioration of the positioning accuracy and the generation of particles due to the positioning structurally.

According to the structure of the substrate edge cleaning apparatus of the third aspect of the present invention, the gas discharged from the gas nozzle promotes the removal of the unnecessary thin film from the positioning member, and the solvent adhering to the positioning member and the unnecessary film are removed. The thin film can be removed better.

Further, according to the structure of the substrate edge cleaning device of the fourth aspect of the present invention, since the linear velocity for exhausting gas at the suction port can be increased, the solvent or unnecessary thin film adhering to the positioning member can be increased. Can be removed more satisfactorily.

According to the structure of the substrate edge cleaning apparatus of the fifth aspect of the present invention, the cleaning tool itself for cleaning and removing the unnecessary thin film adhering to the peripheral edge surface of the rectangular substrate by cleaning is used. By making contact with the peripheral edge surface of the substrate, positioning is performed on the rectangular substrate, and the unnecessary thin film attached to the cleaning tool due to the positioning is removed in the cleaning tank along with the solvent and unnecessary thin film attached during edge cleaning. It ’s washed and removed,
It is possible to avoid the deterioration of the positioning accuracy and the generation of particles due to the positioning structurally.

[Brief description of drawings]

FIG. 1 is an overall schematic plan view of a first embodiment of a substrate edge cleaning device according to the present invention.

FIG. 2 is a schematic side view of a partially cutaway whole.

FIG. 3 is a partially cutaway enlarged side view of a main part.

FIG. 4 is a perspective view of a main part.

FIG. 5 is a side view of a main part.

FIG. 6A is a partially cutaway perspective view of a main part showing the second embodiment, and FIG. 6B is a front view of the main part showing the second embodiment.

FIG. 7A is a perspective view of an essential part showing a third embodiment,
(B) is a cross-sectional view of the essential parts showing the fourth embodiment, and (c) is a cross-sectional view of the essential parts showing the fifth embodiment.

FIG. 8 is a partially omitted overall side view showing a sixth embodiment.

FIG. 9 is an overall plan view.

FIG. 10 is a side view of the entire partially cutaway structure.

FIG. 11 is an overall plan view with some parts omitted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Rectangular substrate 2 ... Substrate holding means 3 ... Substrate edge cleaning tool as edge cleaning means 23 ... Suction member 23a ... Suction port 23b ... Extension 24a ... First solvent nozzle 24b ... Second solvent nozzle 25a ... 1st gas nozzle 25b ... 2nd gas nozzle 29 ... Positioning plate 33 ... Positioning plate 35 ... Positioning pin 41 ... Substrate holding means 45 ... Cleaning tool which constitutes edge cleaning means 58 ... Cleaning which constitutes edge cleaning means Tank

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location // G02F 1/13 101 9315-2K 1/1333 500 9225-2K

Claims (5)

[Claims] 1. A substrate holding means for mounting and holding a rectangular substrate having a thin film formed on a surface thereof, and an edge cleaning for cleaning and removing an unnecessary thin film on an edge of the rectangular substrate held by the substrate holding means. In the substrate edge cleaning device including means, the edge cleaning means also has a positioning function of abutting the peripheral end surface of the rectangular substrate and holding the substrate holding means at a predetermined position. Substrate edge cleaning device. 2. The edge cleaning means according to claim 1 is provided so as to act on at least two opposing sides of the rectangular substrate, and the edge cleaning means respectively comprises:
A solvent nozzle that discharges a solvent onto at least one of the front and back surfaces of the edge of the rectangular substrate to dissolve the unnecessary thin film, and the solvent from the solvent nozzle that is provided outside the edge of the rectangular substrate. Consists of a suction member that sucks and discharges unnecessary thin films,
A substrate edge cleaning device, wherein a positioning member that comes into contact with a peripheral end surface of the rectangular substrate is provided in the suction member. 3. The edge cleaning means according to claim 2, further comprising a gas nozzle for blowing out an unnecessary thin film dissolved by the solvent from the solvent nozzle to the outside of the edge of the rectangular substrate by discharging gas. Substrate edge cleaning device. 4. The suction means according to claim 2 or 3, wherein the suction means has a narrow suction port portion facing the peripheral end surface of the rectangular substrate and a wide extension portion continuous with the suction port portion. A substrate edge cleaning device in which a positioning member is provided at a position closer to the extension than the tip of the suction port. 5. The edge cleaning means according to claim 1 is provided so as to act on at least two opposite sides of the rectangular substrate, and the edge cleaning means respectively comprises:
The cleaning tool includes: a cleaning tool that is in sliding contact with the peripheral end surface of the rectangular substrate while rotating, and a cleaning tank that immerses the cleaning tool in a non-cleaning position that does not contact the peripheral end surface of the rectangular substrate. A substrate edge cleaning device for contacting the peripheral end faces of two opposite sides of a substrate to perform positioning with respect to the rectangular substrate.