JPH06163330A - Structure of molded solid electrolytic capacitor - Google Patents
Structure of molded solid electrolytic capacitorInfo
- Publication number
- JPH06163330A JPH06163330A JP4311943A JP31194392A JPH06163330A JP H06163330 A JPH06163330 A JP H06163330A JP 4311943 A JP4311943 A JP 4311943A JP 31194392 A JP31194392 A JP 31194392A JP H06163330 A JPH06163330 A JP H06163330A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- capacitor element
- capacitor
- terminal
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、タンタル固体電解コン
デンサ又はニオブ固体電解コンデンサ或いはアルミ固体
電解コンデンサ等の固体電解コンデンサのうち、その主
要部を、合成樹脂製のモールド部にてパッケージして成
るモールド型固体電解コンデンサの構造に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a solid electrolytic capacitor such as a tantalum solid electrolytic capacitor, a niobium solid electrolytic capacitor, or an aluminum solid electrolytic capacitor, the main part of which is packaged in a synthetic resin mold part. The present invention relates to the structure of a mold type solid electrolytic capacitor.
【0002】[0002]
【従来の技術】従来、この種のモールド型固体電解コン
デンサは、例えば、特開昭63−84010号公報に記
載され、且つ、図7に示すように、コンデンサ素子1か
ら突出する陽極端子2を、左右一対のリード端子3,4
のうち一方のリード端子3に対して固着する一方、前記
コンデンサ素子2を、他方のリード端子4に対して、直
接に電気的に接続するか、或いは安全ヒューズ5を介し
て電気的に接続して、これらの全体を合成樹脂製のモー
ルド部6にてパッケージしたものに構成している。2. Description of the Related Art Conventionally, a mold type solid electrolytic capacitor of this type is described in, for example, Japanese Patent Laid-Open No. 63-84010, and as shown in FIG. 7, it has an anode terminal 2 protruding from a capacitor element 1. , A pair of left and right lead terminals 3, 4
While being fixed to one of the lead terminals 3, the capacitor element 2 is electrically connected directly to the other lead terminal 4 or electrically via a safety fuse 5. All of these are packaged in a synthetic resin mold portion 6.
【0003】[0003]
【発明が解決しようとする課題】しかし、この従来にお
けるモールド型固体電解コンデンサは、その静電容量が
不変であるために、静電容量を二倍する場合には、その
半分の静電容量の固体電解コンデンサを二つ並べて設け
て、その間を並列に接続するようにしなければならず、
また、二つの固体電解コンデンサが必要である場合に
は、これを並べて設けるようにしなければならないか
ら、プリント基板等に対して実装する場合において必要
なスペースの増大を招来すると言う問題がある。However, since the capacitance of the conventional mold type solid electrolytic capacitor is invariable, when the capacitance is doubled, the capacitance of half the capacitance is reduced. Two solid electrolytic capacitors must be installed side by side and must be connected in parallel.
Further, when two solid electrolytic capacitors are required, they must be arranged side by side, which causes a problem that the space required for mounting on a printed circuit board or the like increases.
【0004】しかも、この種の固体電解コンデンサは、
有極性であるにもかかわらず、モールド部6から二つの
リード端子3,4のみを突出する構成にしているから、
プリント基板等に実装に際して、前記両リード端子3,
4の極を逆向きにして実装すると言う逆向き実装するお
それが大きく、この逆向き実装によって、固体電解コン
デンサの破壊を招来することが多発すると言う問題もあ
った。Moreover, this type of solid electrolytic capacitor is
Despite being polar, only the two lead terminals 3 and 4 project from the mold portion 6,
When mounting on a printed circuit board or the like, both lead terminals 3,
There is a large possibility of mounting in the reverse direction by mounting the pole 4 in the reverse direction, and there is also a problem that the reverse mounting frequently causes destruction of the solid electrolytic capacitor.
【0005】本発明は、これらの問題を解消したモール
ド型の固体電解コンデンサを提供することを技術的課題
とするものである。The present invention has an object of providing a mold type solid electrolytic capacitor which solves these problems.
【0006】[0006]
【課題を解決するための手段】この技術的課題を達成す
るため本発明は、第1コンデンサ素子と第2コンデンサ
素子とを、陽極用の第1リード端子と第2リード端子と
の間の部位に配置して、前記第1コンデンサ素子におけ
る陽極端子を前記第1リード端子に、前記第2コンデン
サ素子における陽極端子を前記第2リード端子に各々接
合する一方、前記第1リード端子と前記第2リード端子
との間の部位に、前記第1コンデンサ素子及び第2コン
デンサ素子の両方に導通する陰極用のリード端子を配設
して、これらの全体を、合成樹脂製のモールド部にて、
前記各種リード端子の一部が当該モールド部より突出す
るようにパッケージする構成にした。In order to achieve this technical object, the present invention provides a first capacitor element and a second capacitor element at a portion between a first lead terminal for an anode and a second lead terminal. And an anode terminal of the first capacitor element is joined to the first lead terminal and an anode terminal of the second capacitor element is joined to the second lead terminal, respectively, while the first lead terminal and the second lead terminal are connected to each other. A lead terminal for a cathode, which is electrically connected to both the first capacitor element and the second capacitor element, is arranged in a portion between the lead terminal and the lead terminal, and the whole of them is molded by a synthetic resin.
The lead terminals are packaged so that some of the lead terminals project from the mold portion.
【0007】[0007]
【作 用】この構成において、第1コンデンサ素子
は、陽極用の第1リード端子と陰極用のリード端子との
間に接続されている一方、第2コンデンサ素子は、陽極
用の第2リード端子と陰極用のリード端子との間に接続
されているから、前記第1リード端子と陰極用のリード
端子とを使用することにより、前記第1コンデンサ素子
による静電容量を得ることができ、また、前記第2リー
ド端子と陰極用のリード端子とを使用することにより、
前記第2コンデンサ素子による静電容量を得ることがで
きるのであり、更にまた、陽極用の第1リード端子及び
第2リード端子を合わせてこれと陰極用のリード端子と
を使用することにより、第1コンデンサ素子と第2コン
デンサ素子とを並列に接続した場合の静電容量を得るこ
とができるのである。[Operation] In this configuration, the first capacitor element is connected between the first lead terminal for the anode and the lead terminal for the cathode, while the second capacitor element is the second lead terminal for the anode. And the lead terminal for the cathode, the capacitance of the first capacitor element can be obtained by using the first lead terminal and the lead terminal for the cathode. By using the second lead terminal and the lead terminal for the cathode,
It is possible to obtain the electrostatic capacitance by the second capacitor element, and further, by combining the first lead terminal and the second lead terminal for the anode and using the lead terminal for the cathode, It is possible to obtain the electrostatic capacitance when the one capacitor element and the second capacitor element are connected in parallel.
【0008】しかも、中央に陰極用のリード端子が位置
し、その左右両側に陽極用の第1リード端子と第2リー
ド端子とが位置する形態になっていることにより、プリ
ント基板等に対する実装に際して、左右逆向きにしたと
しても、常に、前記のように中央に陰極用のリード端子
がその左右両側に陽極用の両リード端子が各々位置する
形態を保つことになるから、逆向き実装を招来すること
を防止できるのである。In addition, since the lead terminal for the cathode is located in the center and the first lead terminal and the second lead terminal for the anode are located on the left and right sides of the lead terminal, it is possible to mount it on a printed circuit board or the like. However, even if the left and right are reversed, the cathode lead terminal is always in the center as described above, and both anode and lead terminals are positioned on the left and right sides of the cathode. Can be prevented.
【0009】[0009]
【発明の効果】従って、本発明によると、一つの固体電
解コンデンサを、異なった静電容量を得ることができる
ように使い分けすることができるから、プリント基板等
に対するコンデンサを実装に際して必要なスペースの縮
小化を達成できると共に、逆向き実装による破壊を確実
に防止できる効果を有する。According to the present invention, therefore, one solid electrolytic capacitor can be selectively used so as to obtain different electrostatic capacities, so that a space required for mounting the capacitor on a printed circuit board or the like can be reduced. This has the effects of being able to achieve miniaturization and reliably preventing damage due to reverse mounting.
【0010】また、請求項2によると、前記の効果を有
する固体電解コンデンサに、過電流又は温度に対する保
護機能をも具備することができる効果を有する。According to the second aspect, there is an effect that the solid electrolytic capacitor having the above effect can also be provided with a protection function against overcurrent or temperature.
【0011】[0011]
【実施例】以下、本発明の実施例を図面について説明す
る。図1〜図5は、第1の実施例を示し、この図におい
て符号11は、陽極端子11aを備えた第1コンデンサ
素子を、符号12は、同じく陽極端子12aを備えた第
2コンデンサ素子を各々示。Embodiments of the present invention will now be described with reference to the drawings. 1 to 5 show a first embodiment, in which reference numeral 11 denotes a first capacitor element having an anode terminal 11a, and reference numeral 12 denotes a second capacitor element also having an anode terminal 12a. Show each.
【0012】これら第1コンデンサ素子11及び第2コ
ンデンサ素子12を、金属板製の左右両一対の陽極用リ
ード端子13,14の間の部位に、当該両コンデンサ素
子11,12の各々における陽極端子11a,12aが
外向きになるように並べて配置して、第1コンデンサ素
子11における陽極端子11aを、当該第1コンデンサ
素子11の外側に位置する第1リード端子13に固着・
接続する一方、第2コンデンサ素子12における陽極端
子12aを、当該第2コンデンサ素子12の外側に位置
する第1リード端子13に固着・接続する。The first capacitor element 11 and the second capacitor element 12 are placed at a position between a pair of left and right anode lead terminals 13 and 14 made of a metal plate, and the anode terminals of the respective capacitor elements 11 and 12 are provided. 11a and 12a are arranged side by side so that the anode terminal 11a of the first capacitor element 11 is fixed to the first lead terminal 13 located outside the first capacitor element 11.
Meanwhile, the anode terminal 12a of the second capacitor element 12 is fixed and connected to the first lead terminal 13 located outside the second capacitor element 12 while being connected.
【0013】一方、前記第1リード端子13と、第2リ
ード端子14との間の部位には、金属板製の陰極用のリ
ード端子15を配設して、このリード端子15の上面
に、前記第1コンデンサ素子11及び第2コンデンサ素
子12を固着・接続する。そして、これらの全体を、エ
ポシキ樹脂等の熱硬化性合成樹脂製のモールド部16に
て、前記各種リード端子13,14,15の端部が当該
モールド部16より突出するようにパッケージする。On the other hand, a lead terminal 15 for a cathode made of a metal plate is provided between the first lead terminal 13 and the second lead terminal 14, and an upper surface of the lead terminal 15 is The first capacitor element 11 and the second capacitor element 12 are fixed and connected. Then, all of them are packaged in a mold part 16 made of a thermosetting synthetic resin such as epoxy resin so that the end parts of the various lead terminals 13, 14, 15 project from the mold part 16.
【0014】なお、前記各種リード端子13,14,1
5におけるモールド部16からの突出端部は、モールド
部16に沿ってその下面側に折り曲げられている。この
ような構成することにより、第1コンデンサ素子11
は、陽極用の第1リード端子13と陰極用のリード端子
15との間に接続されている一方、第2コンデンサ素子
12は、陽極用の第2リード端子14と陰極用のリード
端子15との間に接続されているから、前記第1リード
端子13と陰極用のリード端子15とを使用することに
より、前記第1コンデンサ素子11による静電容量を得
ることができ、また、前記第2リード端子14と陰極用
のリード端子15とを使用することにより、前記第2コ
ンデンサ素子12による静電容量を得ることができるの
であり、更にまた、陽極用の第1リード端子13及び第
2リード端子14を合わせてこれと陰極用のリード端子
15とを使用することにより、第1コンデンサ素子11
と第2コンデンサ素子13とを並列に接続した場合の静
電容量を得ることができるのである。The various lead terminals 13, 14, 1
The projecting end portion from the mold portion 16 in 5 is bent to the lower surface side along the mold portion 16. With such a configuration, the first capacitor element 11
Is connected between the first lead terminal 13 for the anode and the lead terminal 15 for the cathode, while the second capacitor element 12 has the second lead terminal 14 for the anode and the lead terminal 15 for the cathode. Since the first lead terminal 13 and the lead terminal 15 for the cathode are used, the capacitance of the first capacitor element 11 can be obtained, and the second lead terminal 13 and the second lead terminal 15 can be used. By using the lead terminal 14 and the lead terminal 15 for the cathode, it is possible to obtain the capacitance by the second capacitor element 12, and further, the first lead terminal 13 for the anode and the second lead. By combining the terminal 14 and the lead terminal 15 for the cathode, the first capacitor element 11
It is possible to obtain the electrostatic capacitance when the and second capacitor elements 13 are connected in parallel.
【0015】しかも、中央に陰極用のリード端子15が
位置し、その左右両側に陽極用の第1リード端子13と
第2リード端子14とが位置する形態になっていること
により、プリント基板等に対する実装に際して、図にお
いて、第1リード端子13が右側に、第2リード端子1
4が左側に位置するように、左右逆向きにしたとして
も、常に、前記のように中央に陰極用のリード端子15
がその左右両側に陽極用の両リード端子13,14が各
々位置する形態を保つことになるから、逆向き実装を招
来することを防止できるのである。Moreover, the lead terminal 15 for the cathode is located in the center, and the first lead terminal 13 and the second lead terminal 14 for the anode are located on the left and right sides of the lead terminal 15. In mounting, the first lead terminal 13 is on the right side in the figure, and the second lead terminal 1 is
Even if the right and left are reversed so that 4 is located on the left side, the lead terminal 15 for the cathode is always provided at the center as described above.
However, since both lead terminals 13 and 14 for the anode are located on the left and right sides thereof, respectively, it is possible to prevent the reverse mounting.
【0016】また、図6は、第2の実施例を示すもので
ある。この第2の実施例は、第1コンデンサ素子11及
び第2コンデンサ素子13を、陰極用のリード端子15
に対して、その間に絶縁板17を介挿する等して絶縁状
態にする一方、この第1第1コンデンサ素子11及び第
2コンデンサ素子13と、陰極用のリード端子15との
間を、過電流によって溶断するか、或いは温度の上昇に
よって溶断するようにした安全ヒューズ18,19を介
して接続したものである。FIG. 6 shows a second embodiment. In the second embodiment, the first capacitor element 11 and the second capacitor element 13 are connected to the lead terminal 15 for the cathode.
On the other hand, an insulating plate 17 is inserted between them to bring them into an insulated state, while the first lead capacitor element 11 and the second lead capacitor element 13 and the lead terminal 15 for the cathode are connected to each other by an excessive force. It is connected through safety fuses 18 and 19 which are blown by an electric current or blown by a rise in temperature.
【0017】このように構成することにより、本発明
を、安全ヒューズ付き固体電解コンデンサに対しても適
用できるのである。With this structure, the present invention can be applied to a solid electrolytic capacitor with a safety fuse.
【図1】本発明における第1の実施例による固体電解コ
ンデンサの縦断正面図である。FIG. 1 is a vertical sectional front view of a solid electrolytic capacitor according to a first embodiment of the present invention.
【図2】図1のII−II視平断面図である。FIG. 2 is a sectional plan view taken along the line II-II of FIG.
【図3】図1のIII −III 視断面図である。FIG. 3 is a sectional view taken along line III-III in FIG.
【図4】図1の底面図である。FIG. 4 is a bottom view of FIG.
【図5】本発明における第1の実施例による固体電解コ
ンデンサの斜視図である。FIG. 5 is a perspective view of a solid electrolytic capacitor according to a first embodiment of the present invention.
【図6】本発明における第2の実施例による固体電解コ
ンデンサの平断面図である。FIG. 6 is a plan sectional view of a solid electrolytic capacitor according to a second embodiment of the present invention.
【図7】従来における固体電解コンデンサの縦断正面図
である。FIG. 7 is a vertical sectional front view of a conventional solid electrolytic capacitor.
11 第1コンデンサ素子 12 第2コンデンサ素子 13 第1リード端子 14 第2リード端子 15 陰極用リード端子 16 モールド部 17 絶縁板 18,19 安全ヒューズ 11 First Capacitor Element 12 Second Capacitor Element 13 First Lead Terminal 14 Second Lead Terminal 15 Cathode Lead Terminal 16 Mold Part 17 Insulation Plate 18, 19 Safety Fuse
Claims (2)
とを、陽極用の第1リード端子と第2リード端子との間
の部位に配置して、前記第1コンデンサ素子における陽
極端子を前記第1リード端子に、前記第2コンデンサ素
子における陽極端子を前記第2リード端子に各々接続す
る一方、前記第1リード端子と前記第2リード端子との
間の部位に、前記第1コンデンサ素子及び第2コンデン
サ素子の両方に導通する陰極用のリード端子を配設し
て、これらの全体を、合成樹脂製のモールド部にて、前
記各種リード端子の一部が当該モールド部より突出する
ようにパッケージしたことを特徴とするモールド型固体
電解コンデンサの構造。1. A first capacitor element and a second capacitor element are arranged at a portion between a first lead terminal for an anode and a second lead terminal, and the anode terminal of the first capacitor element is the first capacitor element. An anode terminal of the second capacitor element is connected to the first lead terminal and the second lead terminal is connected to the first lead terminal, and the first capacitor element and the second capacitor element are connected to a portion between the first lead terminal and the second lead terminal. A lead terminal for the cathode which is electrically connected to both of the two capacitor elements is arranged, and the whole of them is packaged in a synthetic resin mold part such that a part of the various lead terminals projects from the mold part. The structure of the mold type solid electrolytic capacitor characterized by the above.
子と、陰極用のリード端子とを絶縁して、その間を、過
電流又は温度に対する安全ヒューズを介して接続したこ
とを特徴とする「請求項1」に記載したモールド型固体
電解コンデンサの構造。2. The first capacitor element and the second capacitor element are insulated from the lead terminal for the cathode, and the lead terminals are connected to each other through a safety fuse against overcurrent or temperature. The structure of the mold type solid electrolytic capacitor described in 1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4311943A JP2777512B2 (en) | 1992-11-20 | 1992-11-20 | Structure of molded solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4311943A JP2777512B2 (en) | 1992-11-20 | 1992-11-20 | Structure of molded solid electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06163330A true JPH06163330A (en) | 1994-06-10 |
JP2777512B2 JP2777512B2 (en) | 1998-07-16 |
Family
ID=18023306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4311943A Expired - Fee Related JP2777512B2 (en) | 1992-11-20 | 1992-11-20 | Structure of molded solid electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2777512B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005353709A (en) * | 2004-06-09 | 2005-12-22 | Nec Tokin Corp | Chip solid electrolytic capacitor and its manufacturing process |
JP2015216340A (en) * | 2014-05-07 | 2015-12-03 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Tantalum capacitor |
US20180164355A1 (en) | 2014-02-17 | 2018-06-14 | Commscope Technologies Llc | Methods and equipment for reducing power loss in cellular systems |
EP3257115A4 (en) * | 2015-02-11 | 2019-01-02 | Commscope Technologies LLC | Capacitive-loaded jumper cables, shunt capacitance units and related methods for enhanced power delivery to remote radio heads |
US10281939B2 (en) | 2014-02-17 | 2019-05-07 | Commscope Technologies Llc | Methods and equipment for reducing power loss in cellular systems |
US10317634B2 (en) | 2013-09-17 | 2019-06-11 | Commscope Technologies Llc | Capacitive-loaded jumper cables, shunt capacitance units and related methods for enhanced power delivery to remote radio heads |
US10394265B2 (en) | 2014-02-17 | 2019-08-27 | Commscope Technologies Llc | Programmable power supplies for cellular base stations and related methods of reducing power loss in cellular systems |
US10712515B2 (en) | 2013-09-17 | 2020-07-14 | Commscope Technologies Llc | Capacitive-loaded jumper cables, shunt capacitance units and related methods for enhanced power delivery to remote radio heads |
US11333695B2 (en) | 2014-02-17 | 2022-05-17 | Commscope Technologies Llc | Methods and equipment for reducing power loss in cellular systems |
US11818518B2 (en) | 2019-05-01 | 2023-11-14 | Commscope Technologies Llc | Methods and equipment for reducing power loss in cellular systems |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6316432U (en) * | 1986-07-17 | 1988-02-03 | ||
JPS63153515U (en) * | 1987-03-30 | 1988-10-07 | ||
JP3095619U (en) * | 2003-01-30 | 2003-08-15 | アオト印刷株式会社 | Paper mudler |
-
1992
- 1992-11-20 JP JP4311943A patent/JP2777512B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6316432U (en) * | 1986-07-17 | 1988-02-03 | ||
JPS63153515U (en) * | 1987-03-30 | 1988-10-07 | ||
JP3095619U (en) * | 2003-01-30 | 2003-08-15 | アオト印刷株式会社 | Paper mudler |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4587444B2 (en) * | 2004-06-09 | 2010-11-24 | Necトーキン株式会社 | Chip-type solid electrolytic capacitor and manufacturing method thereof |
JP2005353709A (en) * | 2004-06-09 | 2005-12-22 | Nec Tokin Corp | Chip solid electrolytic capacitor and its manufacturing process |
US10317634B2 (en) | 2013-09-17 | 2019-06-11 | Commscope Technologies Llc | Capacitive-loaded jumper cables, shunt capacitance units and related methods for enhanced power delivery to remote radio heads |
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